HopeRF CMT2310A User manual

Features
Frequency range: 113 – 960 MHz
Modulation/demodulation: OOK, 2 (G)FSK, 4 (G)FSK
Data rate: 0.1 - 1000 kbps
Sensitivity: 2 FSK, -122 dBm DR=2.4 kbps, 433.92 MHz
4 FSK, -88 dBm DR=1 Mbps,433.92 MHz
OOK, -94 dBm DR= 300 kbps, 433.92 MHz
Adjacent channel rejection : 62 dBc, BW = 4.8 kHz,
Channel space = 12.5 kHz
Blocking: 76 dBc , ±1 MHz offset, BW = 4.8 kHz
Operating voltage range: 1.8 - 3.6 V
Tx current: 30 mA @ 13 dBm, 433.92 MHz, FSK
82 mA @ 20 dBm, 433.92 MHz, FSK
Rx current: 9.6 mA (DCDC) @433.92 MHz, FSK
No extra RF switching components required in single antenna mode
Multiple super-low power (SLP) Rx modes available
Sleep current
400 nA, Duty Cycle = OFF
800 nA, Duty Cycle = ON
Special features:
Quick and stable automatic frequency control (AFC)
3 varied clock data recovery systems (CDR)
Quick and accurate valid signal detection (PJD, RSSI)
Super-low power (SLP) and Duty Cycle receiving
Fast Tx or Rx frequency hopping
Carrier sense multiple access (CSMA)
Automatic ACK and re-sending
Antenna diversity
4-wire SPI interface
Supporting both direct and packet modes, with configurable
packet handler and 128-Byte FIFO
NRZ format, Manchester, whiten data coding, FEC
Application
Automatic meter reading
Home security and building automation
ISM-band data communication
Industrial monitoring and control
Remote control and security system
Remote key entry
Wireless sensor node
Tag reader and writer
Ordering Information
Product Model Frequency Package
Minimum
Order
CMT2310A-EQR 113 - 960 MHz QFN24 3,000 pcs
Refer to Table 22 for more ordering information.
Description
The CMT2310A is an ultra-low power, high-performance, OOK /
2(G)FSK / 4(G)FSK based RF transceiver, applicable to various
applications within the 113 - 960 MHz frequency band. The product
is part of the CMOSTEK NextGenRFTM product family which covers
a complete product line consisting of transmitters, receivers and
transceivers. The high-density integration of CMT2310A simplifies
the required BOM in system design. With Tx power reaching +20
dBm and sensitivity reaching -122 dBm, it can achieve optimized
performance of application RF links. Through providing multiple
data packet formats and code methods, this product ensures the
flexible supporting of various applications. Besides, the CMT2310A
provides functions such as 128-byte Tx/Rx FIFO, multiple GPIO
and interrupt configurations, Duty-Cycle mode, LBT (listen before
talk), high-precision RSSI, LBD, power on reset, low-frequency
clock output, quick frequency hopping, squelch, etc., which allows
more flexible application design and gains more product
differentiation capability.
High-performance Sub-1GHz RF Transceiver
CMT2310A Top View
Copyright © By HOPERF
QF24 (4X4)
CMT2310A

Table of Contents
1Electrical Specifications ........................................................................................................................................................................... 4
1.1 Recommended Operating Conditions .................................................................................................................................................. 4
1.2 Absolute Maximum Ratings ................................................................................................................................................................. 4
1.3 RF Power Consumption........................................................................................................................................................................ 4
1.4 Receiver ............................................................................................................................................................................................... 5
1.5 Transmitter .......................................................................................................................................................................................... 7
1.6 RF Frequency Synthesizer .................................................................................................................................................................... 8
1.7 Settling Time ........................................................................................................................................................................................ 8
1.8 Crystal Oscillator .................................................................................................................................................................................. 9
1.9 Low-frequency Oscillator ..................................................................................................................................................................... 9
1.10 Low Battery Detection ....................................................................................................................................................................... 10
1.11 Digital Interface.................................................................................................................................................................................. 10
1.12 Typical Parameter Chart..................................................................................................................................................................... 10
1.12.1 Rx Current Vs. Data rate ............................................................................................................................................................ 10
1.12.2 Rx Sensitivity Vs. Data rate ........................................................................................................................................................ 11
1.12.3 Tx Power Vs. Supply Power Voltage........................................................................................................................................... 11
1.12.4 Tx Phase Noise .......................................................................................................................................................................... 12
2Pin Descriptions..................................................................................................................................................................................... 13
3Typical Application Schematic................................................................................................................................................................ 14
3.1 Direct Tie Schematic Diagram ............................................................................................................................................................ 14
4Function Description ............................................................................................................................................................................. 17
4.1 Transmitter ........................................................................................................................................................................................ 18
4.2 Receiver ............................................................................................................................................................................................. 18
4.3 Additional Functions .......................................................................................................................................................................... 18
4.3.1 Power-On Reset (POR) .............................................................................................................................................................. 18
4.3.2 Crystal Oscillator ....................................................................................................................................................................... 19
4.3.3 Temperature Compensated Crystal Oscillator (TCXO)................................................................................................................... 19
4.3.4 Sleep Timer.................................................................................................................................................................................... 20
4.3.5 Low Battery Detection................................................................................................................................................................... 20
4.3.6 Received Signal Strength Indicator (RSSI) ...................................................................................................................................... 20
4.3.7 Phase Jump Detector (PJD)............................................................................................................................................................ 20
4.3.8 Automatic Frequency Control (AFC) .............................................................................................................................................. 21
4.3.9 Clock Data Recovery (CDR) ............................................................................................................................................................ 21
4.3.10 Fast Frequency Hopping ............................................................................................................................................................... 21
5Chip Operation ...................................................................................................................................................................................... 21
5.1 SPI Interface....................................................................................................................................................................................... 21
5.1.1 Read/Write Register.................................................................................................................................................................. 21
5.1.2 Read/Write Register in Batch Mode (BURST) ............................................................................................................................ 23
5.2 FIFO.................................................................................................................................................................................................... 24
5.2.1 FIFO Read Operation ..................................................................................................................................................................... 25
5.2.2 FIFO Associated Interrupt.............................................................................................................................................................. 25
5.3 Operation State, Timing and Power Consumption............................................................................................................................. 27

5.3.1 Startup Timing............................................................................................................................................................................... 27
5.3.2 Operation State ............................................................................................................................................................................. 27
5.4 GPIO and Interrupt ............................................................................................................................................................................ 30
6Data Packet and Packet Handler ............................................................................................................................................................ 33
6.1 Direct Rx Mode .................................................................................................................................................................................. 33
6.2 Packet Mode ...................................................................................................................................................................................... 33
6.2.1 Rx processing ............................................................................................................................................................................ 34
6.2.2 Tx processing............................................................................................................................................................................. 34
7Low Power Operating ............................................................................................................................................................................ 35
7.1 Duty Cycle Operating Mode............................................................................................................................................................... 35
7.2 Super-low Power (SLP) Rx Mode........................................................................................................................................................ 35
7.3 Rx Automatic Frequency Hopping (RX AUTO HOP) ............................................................................................................................ 37
7.4 TX Automatic Frequency Hopping (TX AUTO HOP) ............................................................................................................................ 38
7.5 Automatically Re-sending (TX AUTO RESEND) ................................................................................................................................... 39
7.6 Carrier Sensing Multi-path Accessing (CSMA).................................................................................................................................... 39
7.7 Antenna Diversity .............................................................................................................................................................................. 41
8User Register ......................................................................................................................................................................................... 43
9Ordering Information............................................................................................................................................................................. 44
10 Packaging Information...................................................................................................................................................................... 45
11 Top Marking ..................................................................................................................................................................................... 46
12 Revise History................................................................................................................................................................................... 47
13 Contacts ........................................................................................................................................................................................... 49

1 Electrical Specifications
The measurement conditions are: VDD= 3.3 V，TOP= 25 °C，FRF = 433.92 MHz, sensitivity is measured by receiving a PN9 sequence,
matching to 50 Ω impedance and 0.1% BER if nothing else stated. All measurement results are obtained using the evaluation board
CMT2310A-EM if nothing else stated.
1.1Recommended Operating Conditions
Table 1. Recommended Operating Conditions
Parameter Symbol Condition Min. Typ. Max. Unit
Operating supply voltage
VDD 1.8 3.6 V
Operating temperature
TOP -40 85 ℃
Supply voltage slope
1 mV/us
1.2Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings[1]
Parameter Symbol Condition Min. Typ. Max.
Supply voltage VDD
-0.3 3.6 V
Interface voltage VIN
-0.3 3.6 V
Junction temperature TJ
-40 125 ℃
Storage temperature TSTG
-50 150 ℃
Soldering temperature TSDR
Last for at least 30 seconds
Human body model (HBM)
255 ℃
ESD rating[2] Human body model (HBM) -2 2 kV
Latch-up current
@ 85 ℃-100 100 mA
Notes:
[1]. Exceeding the Absolute Maximum Ratings may cause permanent damage to the equipment. This value is a pressure
rating and does not imply that the function of the equipment is affected under this pressure condition, but if it is exposed to
absolute maximum ratings for extended periods of time, it may affect equipment reliability.
[2]. The CMT2310A is a high performance RF integrated circuit. The operation and assembly of this chip should only be
performed on a workbench with good ESD protection.
1.3RF Power Consumption
Table 3. RF Power Consumption
Parameter Symbol Condition
Typ.
(Disable DCDC)
Typ.
(Enable DCDC)
Unit
Sleep current[1] ISLEEP
In sleep mode with sleep timer disabled 400 nA
In sleep mode with sleep timer enabled 800 nA
Ready current[1] IReady 2.1 1.9 mA
RFS current
[1]
IRFS
315 MHz
7.5
5.2
mA
Caution! ESD sensitive device.Precaution should be used when handlingthe device in order to
prevent performance degradation or loss of functionality.

Parameter Symbol Condition
Typ.
(Disable DCDC)
Typ.
(Enable DCDC)
Unit
433 MHz
7.8
5.6
mA
868 MHz
8.4
5.9
mA
915 MHz
8.5
5.9
mA
TFS current[1] ITFS
315 MHz
7.5
5.2
mA
433 MHz
7.8
5.6
mA
868 MHz
8.4
5.9
mA
915 MHz
8.5
5.9
mA
RX current [1] IRx DR = 10 kbps
Dev =10 kHz
315 MHz
13.5
8.8
mA
433 MHz
13.6
9.4
mA
868 MHz
14.3
9.9
mA
915 MHz
14.3
9.9
mA
TX current [1] ITx
20 dBm[2]
315 MHz
74
/
mA
433 MHz
82
81
mA
868 MHz
88
87
mA
915 MHz
88
87
mA
13 dBm [3]
315 MHz
26.7
/
mA
433 MHz
30
29
mA
868 MHz
33
32
mA
915 MHz
34
33
mA
10 dBm [3]
315 MHz
21
15
mA
433 MHz
25
24
mA
868 MHz
27
26
mA
915 MHz
27
26
mA
-10 dBm [3]
315 MHz
10.3
7
mA
433 MHz
11
10
mA
868 MHz
12
11
mA
915 MHz
12
11
mA
Notes:
[1]. 2FSK, DR = 10 kbps, FDEV = 5 kHz, Vbat = 3.3 V.
[2]. Apply 20 dBm matching network.
[3]. Apply 13 dBm matching network.
1.4Receiver
Table 4. Receiver Specifications
Parameter Symbol Condition Min. Typ. Max. Unit
Data rate DR
OOK 0.1 300 kbps
2 (G)FSK
0.1
500
kbps
4(GFSK 0.1 1000
kbps
Deviation (RX)
FDEV
(G)FSK, 4(G)FSK
[1]
0.5
350
kHz
Sensitivity
@ 433 MHz
(direct
tiematching
network)
S433
FSK[2]
DR = 2.4 kbps, FDEV = 1.2 kHz,BW= 4.8kHz -122
dBm
DR = 10 kbps,FDEV = 5 kHz -114
dBm
DR = 20 kbps, FDEV = 10 kHz -112
dBm
DR = 50 kbps, FDEV = 25 kHz
-109
dBm
DR =100 kbps, FDEV = 50 kHz -106
dBm
DR =200 kbps, FDEV = 100 kHz -104
dBm
DR =500 kbps, FDEV = 250 kHz
-98
dBm
OOK[2]
5 kbps -110
dBm
50 kbps -101 dBm
100 kbps
-97
dBm
200 kbps -95
dBm

Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
300 kbps -94
dBm
4FSK[2]
DR = 10 kbps, FDEV
[3]
= 10kHz
-109
dBm
DR = 100 kbps, FDEV[3] =100kHz -99
dBm
DR = 1 Mbps, FDEV[3] = 250 kHz -88 dBm
Sensitivity
@ 868 MHz
(direct tie
matching
network)
S868
FSK[2]
DR = 2.4 kbps, FDEV = 1.2 kHz, BW=4.8kHz
-120
dBm
DR = 10 kbps,FDEV = 5 kHz -111
dBm
DR = 20 kbps, FDEV = 10 kHz -110 dBm
DR = 50 kbps, FDEV = 25 kHz
-107
dBm
DR =100 kbps, FDEV = 50 kHz -104
dBm
DR =200 kbps, FDEV = 100 kHz -102 dBm
DR =500 kbps, FDEV = 250 kHz -96
dBm
OOK[2]
5 kbps -106
dBm
50 kbps
-98
dBm
100 kbps
-94
dBm
200 kbps -93
dBm
300 kbps
-92
dBm
4FSK[2]
DR = 10 kbps, FDEV[3] = 10kHz -106
dBm
DR = 100 kbps, FDEV[3] = 100kHz -96
dBm
DR = 1 Mbps, FDEV
[3]
= 250 kHz
-85
dBm
Notes:
[1]. BT = 0.5 by default for Gaussian modulation.
[2]. In case of unspecified BW value, a crystal of 10 ppm is used and the BW value is automatically calculated by RFPDK.
[3]. For 4 FSK, FDEV represents the frequency difference between the frequency points at the far ends (left and right) and the
centered frequency point.
Receiver
channel
bandwidth
BW Receiver channel bandwidth 1.3 1168 kHz
Saturation input
signal level PLVL 20 dBm
RSSI range RSSI By a step of 1 dB -127 20 dBm
Co-channel
rejection
@ 433 MHz，
868 MHz
CCR DR = 2.4 kbps; FDEV = 1.2 kHz; BW=4.8 kHz
CW interference, BER<0.1% -7 dBc
Adjacent
channel
rejection
@ 433 MHz
ACR-
I433
DR = 2.4 kbps; FDEV = 1.2 kHz;
BW= 4.8 kHz, Channel Space = 12.5 kHz，
CW interference, BER<0.1% 62 dBc
Adjacent
channel
rejection
@ 868 MHz
ACR-
I868
DR = 2.4 kbps；FDEV = 1.2 kHz;
BW= 4.8 kHz, Channel Space = 12.5 kHz，
CW interference, BER<0.1% 56 dBc
Blocking
@ 433 MHz BI433 DR = 2.4 kbps; FDEV = 1.2 kHz;
BW=4.8 kHz,
CW interference, BER<0.1%
±1 MHz offset 76 dBc
±2 MHz offset 80 dBc
±10 MHz offset 84 dBc
Blocking
@ 868 MHz BI868 DR = 2.4 kbps; FDEV = 1.2 kHz;
BW=4.8 kHz,
CW interference, BER<0.1%
±1 MHz offset 66 dBc
±2 MHz offset 76 dBc
±10 MHz offset 83 dBc

Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Image Rejection
@ 433 MHz IMR433 DR = 2.4 kbps; FDEV = 1.2 kHz;
BW=4.8 kHz
CW interference, BER<0.1%
Before calibration 30 dBc
After calibration 56 dBc
Image Rejection
@ 868 MHz IMR868 DR = 2.4 kbps; FDEV = 1.2 kHz;
BW=4.8 kHz
CW interference, BER<0.1%
Before calibration 26 dBc
After calibration 51 dBc
Input 3rd order
intercept point
@ 433 MHz
IIP3433 DR = 2.4 kbps; FDEV = 1.2 kHz;
two-tone test with 10 MHz and 20 MHz deviations. -13 dBm
Input 3rd order
intercept point
@ 868 MHz
IIP3868 DR = 2.4 kbps; FDEV = 1.2 kHz;
two-tone test with 10 MHz and 20 MHz deviations. -12 dBm
Receiver input
impedance Zin RXP and RXN Differential input impedance
433MHz 150Ω// 0.8pF
868MHz 134Ω// 1.0pF
1.5Transmitter
Table 5. Transmitter Specifications
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Output power POUT Specific peripheral components are
required according to different frequency
bands.
-10 +20 dBm
Output power step PSTEP 1 dB
GFSK Gaussian filter
coefficient
BT 0.3 0.5 1.0 -
Output power change in
differenttemperature
POUT-TOP Temperature range: -40 to +85 °C 1 dB
Spurious emissions POUT = +13 dBm,433 MHz, FRF<1 GHz -54 dBm
1 GHz to 12.75 GHz, including Harmonic -36 dBm
Harmonic output[1]
for FRF= 315 MHz
H2315 2ndharmonic, +20 dBm POUT -57 dBm
H3315 3rd harmonic,+20 dBm POUT -75 dBm
Harmonic output[1]
for FRF= 433 MHz
H2433 2nd harmonic, +20 dBm POUT -56 dBm
H3433 3rd harmonic,+20 dBm POUT -71 dBm
Harmonic output[1]
for FRF= 868 MHz
H2868 2nd harmonic,+20 dBm POUT -47 dBm
H3868 3rd harmonic, +20 dBm POUT -72 dBm
Harmonic output[1]
for FRF= 915 MHz
H2915 2ndharmonic,+20 dBm POUT -47 dBm
H3915 3rd harmonic,+20 dBm POUT -73 dBm
Harmonic output[1]
for FRF= 315 MHz
H2315 2nd harmonic, +13 dBm POUT -51 dBm
H3315 3rd harmonic,+13 dBm POUT -72 dBm
Harmonic output[1]
for FRF= 433 MHz
H2433 2nd harmonic, +13 dBm POUT -44 dBm
H3433 3rd harmonic, +13 dBm POUT -58 dBm
Harmonic output[1]
for FRF= 868 MHz
H2868 2ndharmonic, +13 dBm POUT -50 dBm
H3868 3rd harmonic,+13 dBm POUT -71 dBm
Harmonic output[1]
for FRF= 915 MHz
H2915 2nd harmonic, +13 dBm POUT -54 dBm
H3915 3rd harmonic,+13 dBm POUT -73 dBm

Parameter Symbol Condition Min. Typ. Max. Unit
Notes:
[1]. The harmonic levelmainly depends on the quality of matching network. The parameters a
bove are measured based on
CMT2310A-EM.
1.6RF Frequency Synthesizer
Table 6. RF Frequency Synthesizer
Parameter Symbol Condition Min. Typ. Max. Unit
Frequency range FRF Require different matching networks.
675 960 MHz
338 640 MHz
113 320 MHz
Frequency deviation
range FDEV_RNG
[1]
675 ~ 960 MHz 600 kHz
450 ~ 640 MHz 400 kHz
338 ~ 450 MHz 300 kHz
225 ~ 320 MHz 200 kHz
169 ~ 225 MHz 150 kHz
135 ~ 169 MHz 120 kHz
113 ~ 135 MHz 100 kHz
Frequency resolution FRES 60 Hz
Frequency tuning time tTUNE 60 us
Phase noise
@ 433 MHz PN433
10 kHz Frequency Offset -101 dBc/Hz
100 kHz Frequency Offset -114 dBc/Hz
1MHz Frequency Offset -129 dBc/Hz
10 MHz Frequency Offset -134 dBc/Hz
Phase noise
@ 868 MHz PN868
10 kHz Frequency Offset -100 dBc/Hz
100 kHzFrequency Offset -109 dBc/Hz
1MHz Frequency Offset -126 dBc/Hz
10 MHz Frequency Offset -129 dBc/Hz
Notes:
[1]. For 2FSK and 4FSK, FDEV represents the frequency difference between the frequency points at the far ends (left and
right) and the centered frequency point.
1.7Settling Time
Table 7. Settling Time
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Settling time
TSLP-RX From Sleep to RX 660 us
TSLP-TX From Sleep to TX 660 us
TSTB-RX From Standby to RX 160
us
TSTB-TX From Standby to TX 160 us
TRFS-RX From RFS to RX 16 us
TTFS-RX From TFS to TX 16 us
TTX-RX From TX to RX
(Ramp down requires 2Tsymbol time)
2Tsymbol
+168
us

Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
TRX-TX From RX to TX 220 us
Notes:
[1]. TSLP-RX and TSLP-TX mainly depend on crystal oscillating, which is largely related to crystal itself.
1.8Crystal Oscillator
Table 8. Crystal Specification
Parameter Symbol Condition Min. Typ. Max. Unit
Crystal frequency
[1]
FXTAL
32
MHz
Crystal frequency precision
[2]
ppm_XTAL
0
20
100
ppm
Load resistance CLOAD_XTAL 15 pF
Crystal equivalent resistance
RmXTAL
60
Ω
Crystal startup time
[3]
tXTAL
200
us
Notes:
[1]. The CMT2310A can utilize external reference clock to directly drive XIN pin through the coupling capacitor. The peak-to-
peak value of external clock signal is required between 0.3 and 0.7 V.
[2]. It involves:(1) initial tolerance, (2) crystal loading, (3) aging, and (4) temperature changing. The acceptable crystal
frequency tolerance is subject to the bandwidth of the receiver and the RF tolerance between the receiver and its paired
transmitter.
[3]. This parameter is to a large degree crystal dependent.
1.9Low-frequency Oscillator
Table 9.Low-frequencyOscillatorSpecifications
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Calibration frequency
[1]
FLPOSC 32 kHz
Frequency accuracy
After calibration
±1
%
Temperature coefficient
[2]
-0.02 %/°C
Supply voltage coefficient
[3]
+0.5 %/V
Initial calibration time
tLPOSC-CAL
4
ms
Notes:
[1].The low-frequency oscillator is automatically calibrated to the crystal oscillator frequency at the PUP stage.
[2].After calibration,the frequency will drift with temperature.
[3].After calibration,the frequency will drift with the change of the supply voltage.

1.10 Low Battery Detection
Table10. Low Battery Detection Specifications
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Detection accuracy
LBDRES
50
mV
1.11 Digital Interface
Table 11. Digital Interface Specifications
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Digital input high level
V
IH
Vdd-0.4
V
DD
Digital input low level
VIL
0.2
VDD
Digital output high level
V
OH
@I
OH
= -0.5 mA
Vdd-0.4
V
Digital output low level
V
OL
@I
OL
= 0.5 mA
0.4
V
SCLK frequency
FSCL
10
MHz
SCLK high time
T
CH
50
ns
SCLK low time
T
CL
50
ns
SCLK rising edge time
TCR
10
ns
SCLK falling edge time
T
CF
10
ns
1.12 Typical Parameter Chart
1.12.1 Rx Current Vs. Data rate
Test condition: Freq = 434 MHz, ppm = 10.
0
5
10
15
20
25
30
2.4 4.8 10 20 50 100 200 300 400 500
mA
2 FSK : Current VS Data Rate
kbps