HP EliteDesk 800 G3 Installation instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 800 G3 Small Form Factor Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Chicony EPA85 HV
1
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
Include the cartridges, print heads, tubes, vent

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including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T-15
Micro shear
170II
Screwdriver
PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Slide the latch and remove access panel.(see Figure 1-2 below)
2. Rotate the driver cage form the hook on slide rail.(see Figure 3 below)
3. Disconnect power cable from the MB.(see Figure 4 below)
4. Disconnect SATA cables from the MB.(see Figure 5 below)
5. Disconnect speaker cable from the MB.(see Figure 6 below)
6. Disconnect other PSU cables from the MB.(see Figure 7-8 below)
7. Remove the fan duct (see Figure 9-10 below)
8. Disconnect P3 cable from MB.(see Figure 11 below)
9. Remove HDD/ODD from chassis.(see Figure 12-19 below)
10. Remove the heatsink from MB.(see Figure 20-21 below)
11. Separate the fan from CPU heatsink.（see Figure 22 below）
12. Remove the memory card from the MB.(see Figure 23 below)
13. Remove the CPU from the MB.(see Figure 24-25 below)
14. Remove M/B from chassis .(see Figure 26-27 below)
15. Remove the battery from MB.(see Figure 28 below)
16. Remove LED holder from MB.(see Figure 29 below)
17. Remove front panel from chassis.(see Figure 30 below)
18. Remove Speaker from chassis.(see Figure 31 below)
19. Unscrew the PSU and disconnect all PSU cables from chassis.(see Figure 32-35 below)
20. Remove PSU cover and remove the Electrolytic Capacitors.(see Figure 36-41 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1Slide the latch and remove access panel
Figure 2 Remove the access panel
Figure 3 Rotate the driver cage from the hook
Figure 4 Disconnect Power SATA cable from MB
Figure 5 Disconnect All SATA cables from MB
Figure 6 Disconnect Speaker cable from MB

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Figure 7 Disconnect P1 power cable from the MB
Figure 8 Disconnect P2 power cable from MB
Figure 9 press the hook and pull up the fan duct
Figure 10 Remove the fan duct
Figure 11 Disconnect P3 Power cable from MB
Figure 12 Pull the HDD latch and rotate the HDD up

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Figure 13 Disconnect power cable from HDD
Figure 14 Disconnect SATA cable from HDD
Figure 15 Remove the HDD from HDD cage
Figure 16 Disconnect power cable from ODD
Figure 17 Disconnect SATA cable from ODD
Figure 18 Press the ODD latch and remove it

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Figure 19 Remove ODD from ODD cage
Figure 20 Disconnect CPU fan cable from MB
Figure 21 Use T15 screwdriver to unscrew the screw and
remove the heatsink
Figure 22 Use PH1 screwdriver to break up the heatsink
into fan and cooler
Figure 23 Remove memory from MB
Figure 24 Rotate the handle and pull it up

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Figure 25 Remove CPU from the socket
Figure 26 Use T15 screwdriver to remove all MB screws
from MB
Figure 27 Remove MB from chassis
Step 28. Remove battery from MB
Step 29 Remove LED cover from MB
Step 30 Remove the front bezel

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Step 31 Use T15 screwdriver remove speaker from the
front wall
Step 32 Use T15 screwdriver to remove the PSU screws
from rear wall
Step 33 Remove all the power cables from the hook
Step 34 Press the latch and slide the PSU out
Step 35 Remove the PSU from chassis
Figure 36 Use Micro shear 170II to cut the cable tie

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Figure 37 Use PH1 screwdriver to de-screw from the
external cover top
Figure 38 Use PH1 screwdriver to de-screw from the
external cover bottom
Figure 39 Removed out the side cover
Step 40 Use PH1 screwdriver to de-screw from the PCBA
its bottom side four corners
Step 41 Remove the bigger electrolyte capacitor “C1”
Step 42 Remove the main PCB

EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01