HP Chromebook x2 12 Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Chromebook x2 12
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
M/B, Dock/B
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries Main Battery
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps 12.3"
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw Driver
#1
Description #2 Screw Driver
#2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. separate the machine into two parts : slate and chassis
2. use jig to separate glass assy and cover assy
3. pull out touch control board , touch fpc , LVDS cable
4. remove battery screw*5 , pull out battery cable
5. remove mb support metal screw*3 , speaker L screw*2 , MB screw*1 , wi-lan card screw*1
6. pull out mb support metal , speaker L ,MB sub-assy,wi-lan module
7. remove antenna R/L screw*4 , antenna module,front camera,rear camera,rear mic fpc , front mic fpc
8. remove speaker R screw*2 , usb bkt screw*2 ,volume button , usb board ,usb fpc , usb bkt,speaker R
9. remove pogo-pin fpc screw*2,audio-jack fpc screw*1 , power btn,power board,audio-jack fpc,pogo-pin fpc
10. remove base rubber, base screw*4, base assy
11. remove tp support bkt screw*3 , tp holder screw*3 , tp support bkt , tp holder bkt, pull out tp ffc ,
12. remove hinge screw*4 , hinge cover, hinge bar,pull out pogo-pin cable
13. remove docking board screw*2 , pogo-pin board screw*1 , pogo-pin board ,docking board , pull out docking ffc
14. remove hinge bar mylar , hinge bar screw*6 , hinge bar up , hinge screw*4 , hinge R/L ,pogo-pin cable
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Separate the machine into two parts : slate and chassis
3.22 Separate glass assy and cover assy

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.23 Pull out touch control board , touch fpc , LVDS cable
3.24 Remove battery screw*5 , pull out battery cable

EL-MF877-00 Page 4
Template Revision B
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3.25/26 Remove mb support metal screw*3 , speaker L screw*2 , MB screw*1 , wi-lan card screw*1 ,pull out mb
support metal , speaker L ,MB sub-assy,wi-lan module
3.27 remove antenna R/L screw*4 , antenna module,front camera,rear camera,rear mic fpc , front mic fpc
3.28 remove speaker R screw*2 , usb bkt screw*2 ,volume button , usb board ,usb fpc , usb bkt,speaker R

EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.29 Remove pogo-pin fpc screw*2,audio-jack fpc screw*1 , power btn,power board,audio-jack fpc,pogo-pin fpc
3.30 remove base rubber, base screw*4, base assy

EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.31 Remove tp support bkt screw*3 , tp holder screw*3 , tp support bkt , tp holder bkt, pull out tp ffc ,
3.32 Remove hinge screw*4 , hinge cover, hinge bar,pull out pogo-pin cable
3.33 Remove docking board screw*2 , pogo-pin board screw*1 , pogo-pin board ,docking board , pull out docking ffc
3.34 Remove hinge bar mylar , hinge bar screw*6 , hinge bar up , hinge screw*4 , hinge R/L ,pogo-pin cable