HP Compaq V3000 Series Assembly instructions

HP-00007-01, Appendix 3 09-April-2006
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
Compaq V3000 Series Notebook PC Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10 square cm 3
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
1
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords Adapter Power Cord 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case plastics only. 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials 0

HP-00007-01, Appendix 3 09-April-2006
HP Restricted
Page 2
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver Type-Phillip #1
Screwdriver Type-Phillip #0
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment: Vega PA
1 Remove 6 cell battery.
2 Replace one M2.5*6L screw on ODD bracket, then Remove ODD module.
3 Replace two M2*4.2L screws on HDD door and two M2.5*3L screws on HDD bracket,
then Remove HDD module.
4 Replace three M2.5*6L screws behind the keyboard.
5 Replace four M2.5*8L and one M2.5*4L screws behind middle cover assy.
6 Replace M2.0*4.2L screw on Mini PCI door, then remove wireless card.
7 Reverse the system, then Remove keyboard and middle cover assy.
8 Separate the cables from connectors.
9 Remove two M2.5*4L and two M2.5*6L screws on LCD R/L hinges, then remove LCD
assy.
10 Disassemble LCD assy and remove mercury bulb for selective treatment
11 Remove six M2.5*8L、two M2.0*3L and three M2.0*4L on lower case, then reverse it.
12 Remove four M2.5*3L and one M2.5*10L on upper case.
13 Remove upper case assy.
14 Remove two M2.5*4L screws on Audio board and two M2.0*3L screws on wireless board.
15 Remove Audio board and wireless board.
16 Remove M2.5*3L screw on R/L speaker, then separate the cables from connector.
17 Remove M2.5*4L on IO/L and MB, then Remove MB assy.
18 Remove coin cell battery from MB assy for selective treatment

HP-00007-01, Appendix 3 09-April-2006
HP Restricted
Page 3
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below: