Hp X2401 Installation instructions

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP x2401 24-inch LED Backlit Monitor

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cable *1 \ signal cable - DP *1 & HDMI*1 \

Adapter *1.

All are inside monitor carton box

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

Hexagonal inserted handle box wrench

Diagonal cutting nippers

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Push release button by hand to separate monitor head and stand.

2. Pull out hinge cover by hand to separate from monitor head.

3. Use tool to release screws and get hinge part.

4. Use tool to release screws and disassemble the rear cover by hand

5. Use tool to separate LED-LEN parts from rear cover

6. Tear Al-tape and acrylic adhesive tape off and separate FFC wire from connecter

7. Use tool to release screws at top and bottom. Then get panel, assy-BZL, main-SHD parts.

8. Take FFC wire off from panel.

9. Take Ctrl BD off from assy-BZL.

10. Use tool to separate OSD-BTN, PWR-BTN, PWR-LEN parts from BZL. And use pin at back side to separate the logo.

11. Use tool to release screws on PCBs. Then tear down the gaskets on main-BKT and separate all connector on PCBs.

12. Release the screw by hand to disassemble stand.

13. Tear all rubbers and release screws on base

14. Release screws to disassemble assy-column.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).