HTC confidential
© 2004, HTC Corporation. All rights reserved. TOTAL 111 CONT.ON. 4 PAGE NO. 3
Table of contents
1. INTRODUCTION······················································································4
1.1 PRODUCT SPECIFICATION ···························································4
2. EXPLODED DIAGRAM ···········································································10
3. ASSEMBLING AND DISASSEMBLING························································11
3.1 DISASSEMBLING ······································································11
3.2 ASSEMBLING ···········································································30
4. DIAGNOSTICS PROGRAM AND WINCE TEST ITEM ·································45
4.1 TOOLS REQUIRED ····································································45
4.2 HOW TO ENTER DIAGNOSTIC·····················································45
4.3 LIST OF DIAGNOSTICTEST / WIN CE TEST ITEM ························45
4.4
TEST ITEM OPERATION ·····························································46
5. MAIN BATTERY RE-CERTIFY PROCEDURE··············································48
5.1 FLOW CHART ··········································································49
5.2 MEASUREMENT PROCEDURE ····················································49
5.3 BATTERY RUNDOWN TEST ······················································53
6. LEAKAGE CURRENT MEASUREMENT·······················································55
7. COSMETIC INSPECTION CRITERIA ·························································59
7.1 DEFINITION OF COSMETIC STANDARD········································59
7.2 VISUAL INSPECTION REQUIREMENTS ·········································59
7.3 DEFINITON OF INSPECTION DEFECTS AND AREAS ·······················59
7.4 COSMETIC CRITERIA TABLE······················································60
8. OS, GSM ROM IMAGE REFLASH PROCEDURE·····································62
8.1 EXECUTE RUU TO RE-FLASH THE MASTER UNIT ·······················62
8.2 UPLOAD ROM CODE FROM MASTER UNIT TO SD CARD ··················68
8.3 USE PRE-LOADED SD CARD TO RE-FLASH UNIT ·······················74
9. FTA (FAULTY TREE ANALYSIS)·····························································75
10. SPARE PART LIST··············································································81
11PHOTO OF SPARE PART·······································································83
APPENDIX·······························································································88
A. CUSTOMER, RETAILER MISJUDMENT··········································88
B. GENERIC LABELING PLAN ·························································90
C. RF ANTENNA TEST SPECIFICATION ···········································97
D. BOARD LEVEL 2.5 REPAIRS ·····················································97
