iLumi MeshTek-H51 User manual

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© ilumi Solutions Inc www.ilumisolutions.com P a g e 1 | 12
MeshTek-H51
Bluetooth®4.0 Low Energy Module
FEATURES
Simple & fast integration with development
kits and sample iOS & Android API
Built-in reliable Connection based mesh to
support large data packets, Mesh Network
(Node and Bridge) for Android
Long-range, module connectivity up to 120
meters
Compact form factor 17.4mm X 20.4mm X
3mm
Castellated SMT pads for easy and reliable
PCB mounting
Over the Air firmware update from one
device to an entire network
32-bit ARM® Cortex™ M0 nRF51822 CPU
Proximity support for beacon and location
based services
No. of GPIOs available for user - 26
Configurable I/O mapping for analog and
digital
Simultaneous master and slave operation
Certifications: FCC, IC, CE and BT SIG
RoHS compliant
OPERATIONAL
Operating voltage range: 1.8V to 3.6VDC
Temperature range: -25°C to 75°C
Low-power consumption
Interface: SPI, UART, I2C and 8/9/10bit ADC
256KB flash and 32KB RAM
APPLICATIONS
Health & Fitness Equipment
Lighting –bulbs and fixtures
Automotive
Home Automation
Power plugs, routers
Internet of Things (IoT) Sensor tag
AV consoles, game controllers
Industrial Control
DESCRIPTION
With the smartest and most robust Bluetooth
Mesh Network technology on the market, ilumi’s
MeshTek provides an elegant and affordable
solution for manufacturers looking to quickly and
reliably bring BLE enabled IoT products to market.
The MESHTEK-H51 Smart Mesh Module reduces
development time, lowers manufacturing costs,
saves board space, eases certification and
minimizes the RF expertise required. This complete
platform solution includes software drivers,
sample applications, API guide, user
documentation, and a world-class support.
The MESHTEK-H51 internal controller to be used
for applications up to 16KB/32KB flash without the
need for external host MCU or software
development tools.
MESHTEK-H51 Bluetooth 4.0 Low
Energy Module

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TABLE OF CONTENTS
1. DEVICE OVERVIEW.................................................................................................................................3
2. GENERAL SPECIFICATIONS...................................................................................................................5
3. PHYSICAL DIMENSIONS.........................................................................................................................6
4. SOLDER REFLOW PROFILE....................................................................................................................8
5. REGULATORY APPROVAL .....................................................................................................................9
5.1. EUROPEAN UNION REGULATORY COMPLIANCE ..................................................................................9
5.2. FCC AND IC COMPLIANCE ........................................................................................................................9
5.2.1. FCC STATEMENT...........................................................................................................................................9
5.2.2. IC COMPLIANCE..........................................................................................................................................10
5.2.3. CONFORMITÉ AUX NORMS D´IC ................................................................................................................10
5.2.4. OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS.........................10
5.2.5. OEM LABELING REQUIREMENTS FOR END PRODUCT................................................................................11
6. ORDERING INFORMATION.................................................................................................................11
Table 1: PINOUT DRESCPTION ........................................................................................................ 4
Table 2: ELECTRICAL SPECIFICATIONS............................................................................................. 5
Table 3: MESHTEK-H51 EUROPEAN COMPLIANCE TESTING........................................................... 9
Table 4: MESHTEK-H51 FCC and IC Conformity.............................................................................. 9
Table 5: ORDERING INFORMATION ............................................................................................ 111
Figure 1: MESHTEK-H51 BLOCK DIAGRAM ..................................................................................... 3
Figure 2: MESHTEK-H51 PINOUT .................................................................................................... 3
Figure 3: MESHTEK-H51 MODULE TOP AND BOTTOM VIEW ......................................................... 6
Figure 4: MESHTEK-H51 RECOMMENDED PCB FOOTPRINT........................................................... 6
Figure 5: MESHTEK-H51 MODULE MOUNTING DETAILS ................................................................ 7
Figure 6: REFLOW PROFILE ............................................................................................................. 8
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use
of your ilumi Solutions Inc products. To this end, we will continue to improve our publications to better suit your
needs. Our publications will be refined and enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications
Department via E-mail at [e-mail] we welcome your feedback.
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds,
may exist for current devices. As device/documentation issues become known to us, we will publish an errata
sheet. The errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
•Do contact to ilumi team
•Your local ilumi sales representative
When contacting a sales office, please specify which device, revision of MESHTEK-H51 and data sheet (include
literature number) you are using

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1. DEVICE OVERVIEW
The MESHTEK-H51 Bluetooth Low Energy RF module integrates Bluetooth 4.0 radio baseband, 32-bit MCU,
digital analog I/O, onboard stack. Figure 1 shows the module’s Block diagram. Figure 2 shows the module’s
pinout and the description is shown in Table 1.
Figure 1: MESHTEK-H51 BLOCK DIAGRAM
Figure 1: MESHTEK-H51 PINOUTFigure 2:MESHTEK-H51 BLOCK
DIAGRAM
Figure 2: MESHTEK-H51 PINOUT

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Note: For more details, check out nRF51822 (Package: QFAC) Cortex ARM M0 controller specifications
Sr No.
Pin out
Pin Function
Description
1
P0.29
Digital I/O
General purpose I/O pin
2
P0.30
Digital I/O
General purpose I/O pin
3
P0.00
AREF0
Digital I/O
Analog input
General purpose I/O pin
ADC/LPCOMP input 1
4
P0.02
AIN3
Digital I/O
Analog input
General purpose I/O pin
ADC/LPCOMP input 3
5
P0.04
AIN5
Digital I/O
Analog input
General purpose I/O pin
ADC/LPCOMP input 5
6
P0.01
AIN2
Digital I/O
Analog input
General purpose I/O pin
ADC/LPCOMP input 2
7
P0.03
AIN4
Digital I/O
Analog input
General purpose I/O pin
ADC/LPCOMP input 4
8
P0.05
AIN6
Digital I/O
Analog input
General purpose I/O pin
ADC/LPCOMP input 6
9
P0.06
AIN7
AREF1
Digital I/O
Analog input
Analog input
General purpose I/O pin
ADC/LPCOMP input 7
ADC/LPCOMP reference input 1
10
P0.07
Digital I/O
General purpose I/O pin
11
P0.08
Digital I/O
General purpose I/O pin
12
P0.09
Digital I/O
General purpose I/O pin
13
P0.11
Digital I/O
General purpose I/O pin
14
P0.10
Digital I/O
General purpose I/O pin
15
P0.13
Digital I/O
General purpose I/O pin
16
P0.14
Digital I/O
General purpose I/O pin
17
P0.15
Digital I/O
General purpose I/O pin
18
P0.16
Digital I/O
General purpose I/O pin
19
SWDIO/RESET#
Digital I/O
System reset (active low). Also hardware debug and
flash programming I/O.
20
SWDCLK
Digital I/O
Hardware debug and flash programming I/O
21
P0.12
Digital I/O
General purpose I/O pin
22
P0.17
Digital I/O
General purpose I/O pin
23
GND
Power
Ground (0 V)
24
GND
Power
Ground (0 V)
25
GND
Power
Ground (0 V)
26
GND
Power
Ground (0 V)
27
3V3
Power
Power Supply
28
3V3
Power
Power Supply
29
3V3
Power
Power Supply
30
3V3
Power
Power Supply
31
P0.21
Digital I/O
General purpose I/O pin
32
P0.24
Digital I/O
General purpose I/O pin
33
P0.25
Digital I/O
General purpose I/O pin
34
P0.26
AIN0
XL2
Digital I/O
Analog input
Analog output
General purpose I/O pin.
ADC/LPCOMP input 0.
Connection for 32.768 kHz crystal
35
P0.27
AIN1
XL1
Digital I/O
Analog input
Analog input
General purpose I/O pin.
ADC/LPCOMP input 1.
Connection for 32.768 kHz crystal or external 32.768
kHz clock reference
36
P0.28
Digital I/O
General purpose I/O pin
Table 1: PINOUT DRESCPTION

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2. GENERAL SPECIFICATIONS
Table 2 provides the general specifications for the module and current consumption.
Table 2: ELECTRICAL SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
Description
Min
Nom
Max
Notes
VDD - Supply Voltage
1.8V
3.0V
3.6V
Operating Temperature Range
-25 °C
75 °C
ESD - Human Body Model Class 2
4 kV
Built-in Crystal Frequency
16 MHz
Crystal Frequency Tolerance
+/- 10ppm
Reset pin time for successful reset at
VDD = 3.0V
605 us
Radio Operating Frequencies
2402 MHz
2480 MHz
Radio On-Air Data Rate
250 kbps
2 Mbps
Radio Output Power
+16 dBm
RF output power
configured to +16dBm
using external PA
Receiver Sensitivity @ BLE
-93 dBm
Ideal transmitter
Radio RSSI Accuracy
+/- 6 dB
UART Baud Rate
1.2 kbps
1000 kbps
SPI Bit Rate
0.125 Mbps
8 Mbps
TWI Bit Rate
100 kbps
400 kbps
ADC Internal Reference Voltage
1.182V
1.2V
1.218V
8/9/10-bit ADC
ADC External Reference Voltage
0.83V
1.2V
1.3V
VIH –Input High Voltage
0.7 * VDD
VDD
VIL –Input Low Voltage
VSS
0.3 * VDD
VOH –Output High Voltage
VDD –0.3
VDD
VOL –Output Low Voltage
VSS
VSS + 0.3
Output standard drive current
20 mA
Pull-up resistance / Pull-down
resistance
11k
13k
16k
Transmit Current
66mA
+18.9dBm output
Power
Receive Current
24.84mA
Radio RX Active
ARM CPU Running Current
4.1mA
No Radio Active
ARM CPU Ideal Current
2.6uA
No Radio and GPIO
active

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3. PHYSICAL DIMENSIONS
Figure 3 shows the Top and Bottom for MESHTEK-H51 module. Figure 4 shows the recommended PCB layout.
Figure 3: MESHTEK-H51 MODULE TOP AND BOTTOM VIEW
Figure 4: MESHTEK-H51 RECOMMENDED PCB FOOTPRINT
All dimensions are in mm
Top View
Bottom View
17.1990

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When laying out the carrier board for the MESHTEK-H51 module, the areas under the antenna, RF text point
(semi-circular pad) and shielding connections should not have surface traces, ground planes, or exposed vias.
Figure 5 shows the recommended mounting details and acceptable positioning of the MESHTEK-H51 on the
host PCB. For optimal radio performance, the MESHTEK-H51 module’s antenna end should protrude at least
30 mm beyond any metal enclosure.
Figure 5: MESHTEK-H51 MODULE MOUNTING DETAILS
All dimensions are in mm

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4. SOLDER REFLOW PROFILE
The solder profile is described below in Figure 6.
Figure 6: REFLOW PROFILE
A. Zone A: Preheat: This raises the temperature at a controlled rate, typically 0.5 - 2C/s. This will preheat the
component to 120°C to 150°C to distribute the heat uniformly to the PCB.
B. Zone B: Equilibrium1: In this zone, the flux becomes soft and uniformly spreads solder particles over the
PCB board, preventing re-oxidization. The recommended temperature for this zone is 150°C to 200°C for
60s to 120s.
C. Zone C: Equilibrium2: This is optional and in order to resolve the upright component issue. Temperature is
210°C to 217°C for 20s to 30s.
D. Zone D: Reflow zone: The temperature should be high enough to avoid wetting but low enough to avoid
component deterioration. The recommended peak temperature is 230°C to 250°C. The soldering time
should be 30s to 90s when the temperature is above 217°C.
E. Zone E: Cooling: The cooling rate should be fast to keep the solder grains small which will give a longer
lasting joint. A typical cooling rate is 4°C/s

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5. REGULATORY APPROVAL
5.1. European Union regulatory compliance
The MESHTEK-H51 module conforms to the product specifications listed in below Table 3.
Table 3: MESHTEK-H51 European Compliance Testing
Certification
Standards
Article
Laboratory
Report
Date
Number
Safety
EN 60950-1:2006 (2ND Edition) & IEC 60950-1:2005
[3.1(a)]
ELECTRO
MAGNETIC
TEST, INC., USA
M150417S1
April 17, 2015
Health
EN 62479:2010
M150417E2
April 17, 2015
EMC
EN 301 489-1 & EN 301 489-17
[3.1(b)]
M150407D2
April 23, 2015
EN 55022 Class B, EN 61000-3-2 Class A,
EN 61000-3-3, & EN 55024
M150406D1
April 23, 2015
Radio
ETSI EN 300 328 V1.9.1 (2015-02)
(3.2)
M150417E1
April 17, 2015
5.2. FCC and IC Compliance
The MESHTEK-H51 module conforms to the product specifications listed in below Table 4.
Table 4: MESHTEK-H51 FCC and IC Conformity
Standard
FCC
FCC part 15 modular certification
MESHTEK-H51 FCC ID: 2AEHU-ILUMIBLEH
IC
Industry Canada RSS-210 modular certification
MESHTEK-H51 IC: 20059-ILUMIBLEH
Bluetooth
RF-PHY Component (Tested); QDID: 71365
5.2.1. FCC Statement
This device has been tested and found to comply with part 15 of the FCC rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
This device may not cause harmful interference, and
This device must accept any interference received, including interference that may cause undesired
operation.

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FCC CAUTION: Any changes or modifications NOT explicitly APPROVED by ilumi could cause the module to
cease to comply with FCC rules part 15, and thus void the user's authority to operate the equipment.
5.2.2. IC compliance
This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired operation
of the device.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and
maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its gain should be chosen in such a way that the equivalent
isotropically radiated power (e.i.r.p.) is not more than that is necessary for successful communication.
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and
your body.
5.2.3. Conformité aux norms d´IC
Cet appareil est conforme à la(aux) norme(s) RSS sans licence d’Industry Canada. Son utilisation est soumise
aux deux conditions suivantes:
1. Cet appareil ne doit pas causer d’interférences et
2. il doit accepter toutes interférences reçues, y compris celles susceptibles d’avoir des effets indésirables
sur son fonctionnement.
Conformément aux réglementations d’Industry Canada, cet émetteur radio ne peut fonctionner qu’à l’aide
d’une antenne dont le type et le gain maximal (ou minimal) ont été approuvés pour cet émetteur par Industry
Canada. Pour réduire le risque d’interférences avec d’autres utilisateurs, il faut choisir le type d’antenne et son
gain de telle sorte que la puissance isotrope rayonnée équivalente (p.i.r.e) ne soit pas supérieure à celle requise
pour obtenir une communication satisfaisante.
Cet équipement respecte les limites d’exposition aux rayonnements IC RSS-102 définies pour un
environnement non contrôlé. Il doit être installé et utilisé en maintenant une distance minimum de 20 cm entre
le radiateur et votre corps.
5.2.4. OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS
The MESHTEK-H51 Module has been certified for integration into products only by OEM integrators under the
following conditions:
This device is granted for use in configurations in which the antennas used for this transmitter must be installed
to provide a separation distance of at least 20cm from all person and not be co-located with any other
transmitters except in accordance with FCC and Industry Canada multi-transmitter product procedures.
As long as the two conditions above are met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed (for example, digital device emissions, PC peripheral
requirements, etc.).

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IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location
with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and
the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM
integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate FCC and Industry Canada authorization.
5.2.5. OEM Labeling requirements for end product
For an end product using the MESHTEK-H51 module there must be a label containing, at least, the following
information:
This device contains
FCC ID: 2AEHU-ILUMIBLEH
IC: 20059-ILUMIBLEH
The label must be affixed on an exterior surface of the end product such that it will be visible upon inspection
in compliance with the modular approval guidelines developed by the FCC.
In accordance with 47 CFR § 15.19, the end product shall bear the following statementin a conspicuous location
on the device: "This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions;
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired
operation."
When the device is so small or for such use that it is not practicable to place the statement above on it, the
information shall be placed in a prominent location in the instruction manual or pamphlet supplied to the user
or, alternatively, shall be placed on the container in which the device is marketed.
In case, where the final product will be installed in locations where the end-user is not able to see the FCC ID
and/or this statement, the FCC ID and the statement shall also be included in the end-product manual.
6. ORDERING INFORMATION
Table 4 provides ordering information for the MESHTEK-H51 module.
Table 5: ORDERING INFORMATION
Part Number
Description
MESHTEK-H51
Bluetooth High Power Module
Note: For custom applications, contact ilumi Solutions Inc. representative

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APPENDIX A: REVISION HISTORY
Revision
Date
Status / Comments
1.0
Feb 2016
Initial Release
1.1
July 2016
Corrected error in block diagram on Page no. 3
1.2
Dec 2016
Corrected dimension of the board on Page no. 1
Corrected operating temperature range of the module on Page no. 1
1.3
Feb 2017
Updated certification information (Section 5)
Updated Table of Contents
Updated Table 2 Electrical specification

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