Infineon Easy 1B User manual

Application Note Please read the Important Notice and Warnings at the end of this document Revision 1.0
www.infineon.com 2023-07-12
AN2023-07
Assembly Instructions for the Easy Modules
About this document
Scope and purpose
This application note provides a guideline on how to use and implement Easy modules. The values and
recommendations provided in this document should not be considered as datasheet values.
Intended audience
This document is intended for all experts using Infineon Easy modules.

Application Note 2 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
Table of contents
Table of contents
About this document....................................................................................................................... 1
Table of contents............................................................................................................................ 2
1General information....................................................................................................... 4
1.1 General information on power module handling ..................................................................................5
2Requirements for printed circuit boards........................................................................... 7
2.1 PCB requirements for the PressFIT technology .....................................................................................7
2.2 PCB requirements for soldering the PressFIT modules.........................................................................9
2.3 PCB requirement for solder pin ..............................................................................................................9
3The press-in process......................................................................................................10
3.1 Introduction...........................................................................................................................................10
3.2 General press-in procedure ..................................................................................................................10
3.2.1 General press-in process for one module on a PCB........................................................................10
3.2.2 Press-in process of a module with thermal interface material (TIM).............................................11
3.2.3 General press-in process for several modules on PCBs..................................................................13
3.2.3.1 Press-in only Easy3B and Easy4B modules into a PCB..............................................................15
3.3 Press-in process parameter ..................................................................................................................16
3.3.1 Press-in behavior .............................................................................................................................16
3.3.1.1 Press-in curve example of standard PressFIT pin module ........................................................17
3.3.1.2 Press-in curve example of high-current PressFIT pin module ..................................................18
3.3.2 Press-in force and speed..................................................................................................................19
3.4 Press-in tools.........................................................................................................................................20
3.4.1 Press-in tools for Easy modules without pre-applied TIM..............................................................20
3.4.2 Press-in tools for Easy modules with thermal interface material (TIM).........................................21
4The press-out process ...................................................................................................22
4.1 Press-out tools.......................................................................................................................................22
4.2 Press-out forces.....................................................................................................................................23
5Quality of PressFIT contacts...........................................................................................24
6Soldering process for pressfit pin and solder pin ..............................................................26
7Mounting a PCB to the module .......................................................................................27
8Condition of the heat sink for module assembly...............................................................29
9Applying the thermal grease ..........................................................................................30
10 Assembling the module on heat sink...............................................................................31
10.1 Assembling Easy1B/2B module on heat sink .......................................................................................31
10.2 Assembling Easy3B and Easy4B module on heat sink.........................................................................33
11 System considerations regarding mechanical robustness .................................................35
11.1 Module is pressed into a PCB by contacting the stand-offs with the PCB ..........................................35
11.2 Module is pressed into a PCB at a certain distance .............................................................................35
11.3 Multi-modules on a PCB........................................................................................................................36
11.4 Module assembly sequence..................................................................................................................37
12 Clearance and creepage distances ..................................................................................39
12.1 Pin-to-Pin creepage distance................................................................................................................39
12.1.1 Creepage distance for standard PressFIT and solder pin...............................................................39
12.1.2 Creepage distance for High-Current PressFIT.................................................................................40
12.2 Pin to pin Clearance ..............................................................................................................................40
12.3 Pin to heatsink clearance and creepage distance ...............................................................................40

Application Note 3 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
Table of contents
Revision History ............................................................................................................................42

Application Note 4 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
General information
1General information
Easy module is baseplate-less module with pin connection to PCB. It is widely used in industrial and
automotive applications. The whole family contains four packages, they are Easy 1B, Easy 2B, Easy3B and
Easy4B as shown in Figure 1.
Figure 1 Easy Family
Beside the traditional solder pin, PressFit pin is also provided in Easy package. Pressfit contact is a kind of cold
welding, it complies with requirements on high durability, high temperatures, RoHs conformity and simple
handing. Infineon uses two types of PressFIT pins in the Easy product series. Depending on power density and
performance, a distinction is made between standard and high-current PressFIT pins. The differences are in the
material properties as well as in the PressFIT zones.
The high-current pin is equipped with an eye-of-the-needle (EoN) PressFIT zone. The material of the pin
provides a higher electrical and thermal conductivity compared to the standard PressFIT pin. For this reason,
the high-current PressFIT pin exhibits a higher current capability, and heat dissipation. The benefit of this
PressFIT pin is to reduce the thermal load of the printed circuit board within high current applications.
However, the printed circuit board requirements are the same for both PressFIT pin types.
(a)
(b)
Figure 2 Typical appearance of modules with PressFIT contacts as a standard PressFIT pin (a) or high-
current PressFIT pin (b)

Application Note 5 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
General information
Easy PressFIT contacts have a contact zone of approximately 1.7 mm length that adapts itself to the hole in the
PCB during the press-in process. It results in a plastic deformation of the pressfit zone. This deformation is
intended to accommodate the tolerance, and provides the basis for the cold welding.
Figure 3 and Figure 4 show various sections and REM images that provide a view of the gas-tight bonded
materials resulting from the press-in force.
Figure 3 Easy standard PressFIT contact sections
Figure 4 Easy High-Current PressFIT contact sections
1.1 General information on power module handling
The power module is not designed to withstand forces on the module housing as shown in the example of
Figure 5. The module pins are located here on a flat table. Forces on the module housing (Fp) are pushing the
DCB out of the housing. Therefore, forces (Fp) applied on the module housing must be avoided during
handling. Please note that this is a different case compared to the normal press-in process, where the DCB is
fully supported in the press tool, and the press-in forces affect the DCB, and not the housing.

Application Note 6 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
General information
Figure 5 Forces on the housing during module handling should be avoided to prevent a push-out of the
DCB
Some modules will have quite low DCB push-out forces (Fp), the minimum value of which is not a confirmed
property of the power module. This is not critical for real applications, because the housing is later mounted on
the cooling system by the integrated clamps. Thus, the housing will not be moved in a critical way.
Furthermore, the sealant between the module frame and the DCB only serves to seal the module when the
isolating gel is filled during our production process. After the filling process, the liquid gel is heated and
becomes soft but solid. The sealing has no gluing function in the final product.

Application Note 7 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
Requirements for printed circuit boards
2Requirements for printed circuit boards
2.1 PCB requirements for the PressFIT technology
The PressFIT technology used in the Easy modules has been inspected and qualified by Infineon Technologies
AG for standard FR4 PCBs according to the IEC 60352-5 and IEC 60747-15 with “chemical tin” and a hot-air-
leveling (HAL) surface. Infineon recommends the use of chemical tin metallization. The qualification tests were
done on standard FR4 material, which is complaint with the requirements of IEC 61249-2-7.
If other handling technologies are to be used in the production of PCBs, they have to be checked, tested and
qualified.
Table 1 Requirements for a PCB
Minimum
Typical
Maximum
Hole drill diameter
1.12 mm
1.15 mm
Copper thickness in hole
> 25 µm
< 50 µm
Metallization in hole
< 15 µm
End hole diameter
0.99 mm
1.09 mm
Copper thickness of
conductive layers
35 µm
70 µm
105 µm
400 µm
Metallization of circuit
board
Tin (chemical) recommended
Metallization of pin
Tin (galvanic)
In order to ensure that the PressFIT contact sits securely in the PCB, the specification of the hole given in Table
1 must be adhered to.
If the specification of PressFIT holes is limited to only the finished dimension (i.e., the metallized hole), different
drill sizes could be used depending on the PCB manufacturer and production philosophy, and also different
metallization thicknesses could be provided. This would lead to results that would have to be rejected for
quality assurance reasons. The end hole diameter is a function of the drill hole, the copper thickness and the
metallization in the hole. If the end hole diameter is too small, the press-in force can be too high. The FR4
material can also have an influence on the press-in force.
The recommendation still applies that the hole in the PCB is to be drilled during manufacturing with a drill size
of 1.15 mm, and should not be milled. Experience has shown that a drill hole diameter between 1.12 mm and
1.15 mm is obtained under consideration of the runout tolerances of the spindles after drilling due to shrinking
of the FR4 material.
With a copper thickness of 30 µm to 50 µm in the hole and a tin layer of about 1 µm for tin applied chemically,
an end hole diameter is obtained as the test dimension. Due to the thinner tin layer thickness, this diameter is
always higher than the value of 1 mm stated in the standard (IEC 60352-5). The final hole diameter, considering
the drilling diameter, copper thickness and a chemical tin layer, is typically between 1.02 mm and 1.09 mm.

Application Note 8 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
Requirements for printed circuit boards
Figure 6 Structure of a PCB
The PressFIT technology has been qualified for FR4 PCB material.
After a reflow soldering process is carried out on a PCB, the module can be pressed into the board without
difficulty. The retention forces of the press-fitted pins are not diminished.
Depending on the applied press tools, a certain distance from the middle of the pins to other components must
be observed. A distance of 5 mm is recommended.
A PressFIT module can be replaced up to two times. This means that a PCB can be used in total three times.
Correct handling of the components is essential.
A module that has been pressed in, and the contact pressed out again, can no longer be pressed back in again.
Instead, the module can only be attached to a new PCB via soldering. The plastic deformation of the PressFIT
area does not permit a further PressFIT process.
Drill hole
Copper in drill hole
Final hole diameter
1.15 -0.03 mm
Annular ring min. 0.2 mm
1.15 -0.03 mm
min. 25 µm Cu ; max. 50 µm Cu
max. 15 µm tin
chemical tin typ. 1 µm
min. 0.99 mm ; max 1.09 mm
Min. 0.99 mm
Max. 1.09 mm

Application Note 9 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
Requirements for printed circuit boards
2.2 PCB requirements for soldering the PressFIT modules
The Easy PressFIT pin is qualified for solderability according to the IEC standard 60068-2-20, allowing the
assemblies of the EasyPIM™and EasyPACK products to be soldered to the PCB.
Soldering can be used as an alternative mounting option to the PressFIT technology. This is the case, for
example, when a solder pin module is replaced by the Easy PressFIT pin module, as a production line for solder
assembly is already in place. The advantages of the PressFIT technology compared to soldering should be
considered in terms of its higher reliability and short process time.
The final minimum diameter of the through hole is determined considering the pin circumference and
tolerances. In order to mechanically fit the module into the printed circuit board, a final minimum hole
diameter of 1.25 mm is recommended for soldering the PressFIT pin modules.
The final hole diameter of the plated through holes for the standard PressFIT and the high-current PressFIT pin
is defined as “D=1.25 mm + X” as shown in Figure 7. “X” has to be choosen according IPC2220 Series.
D = 1.25 mm + X
Figure 7 Cross-section of the standard PressFIT and the high-current pin
Due to the interdependence of several factorssuch as PCB type, thickness, plating, production tolerances, solder
process, and solder alloy, the parameter X must be determined by the customers to ensure a good soldering
result and a reliable long-term connection.
The final hole size must be defined carefully. If the hole is too large, it may be difficult to ensure a solid electrical
and mechanical connection between the pin and the board.
2.3 PCB requirement for solder pin
Easy modules with solder pin are designed to be soldered to the PCB with a thickness of up to 2 mm. The solder
pin geometry is provided in the module datasheet. The PCB though hole diameter should be determined
similar to the procedure as described in chapter 2.2.

Application Note 10 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
3The press-in process
This section deals with the press-in process including the necessary tools and parameters for inserting the Easy
family modules into the printed circuit board.
3.1 Introduction
The PressFIT modules are inserted into a printed circuit board by using the press-in technology. PressFIT can be
performed by using a toggle lever press or a machine. A press-in tool that records the appield force and the
travel distance is strongly recommended to monitor the press-in process. Consistent quality and
reproducibility are assured in this way.
The press-in force is related to the retention force and the quality of the press-fit connection (electrical
resistance and reliability). The PressFIT speed for standard tests is between 25-50 mm/min according to IEC
60352-5. A PressFIT speed of under 25 mm/min can lead to increased press-in forces and a deformation of the
pins, or to a connection that is not gas-tight. Infineon recommends a press-in speed of about 100 mm/min. The
typical press-in speed for automated assembly lines is up to 450 mm/min.
Note that during the press-in process, the position of the PCB and the pressing area of the pressure plate must
be parallel to each other. The pressure plate should be mechanically fixed in position without any tolerance.
The module is then pressed into the PCB in a regular motion.
The module pins should penetrate the PCB during press-in until the four stand-off holes of the module, or
optional distance spacers, as described in Multi-modules on a PCB (chapter 11.3), contact the board.
To limit the force at the end of the press-in process, distance spacers such as dowel pins can be implemented at
the bottom tool of the press-in tool.
If the principles listed above are adhered to, a smooth insertion process for the two components can be
achieved.
3.2 General press-in procedure
The press-in procedure can be carried out manually, semi-automatically or fully automatically. We differentiate
between two applications:
a) one module on a PCB
b) several modules on a PCB, the modules can be pressed individually or together in one press-in process.
In the following sections, both methods will be described in detail.
3.2.1 General press-in process for one module on a PCB
Figure 8 shows the general press-in process for a Easy2B module on a PCB as carried out in the laboratory. This
procedure represents case a), one module on a PCB. The process is completed when the module stand-off
holes come in contact with the PCB surface. Further information about the placement of the distance pieces
between PCB and heat sink can be found in Chapter 11.1.
The Easy3B/4B modules should be pressed into the PCB using a distance keeper, e.g. at the recommended
distance. Please refer to Section 11 for more details about the distance piece.

Application Note 11 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
1.
2.
3.
4
The press is aligned so
that all parts of the tool
are directly above the
other.
The printed circuit board
is placed on the tool and
held in place by the
guiding pins on the tool.
The module is placed on
the tool and positioned
by using the guiding pins
on the tool.
The module contacts are
pressed into the PCB by
pressing the upper tool
part downwards.
Figure 8 General press-in process of an Easy module on a PCB
Note! We recommend that the backside of the IGBT module be protected against damage during the press-in
process.
3.2.2 Press-in process of a module with thermal interface material (TIM)
The press-in process of the PressFIT TIM module requires different press-in tools than the process described
above. This is due to the pre-applied TIM honeycombs and the restricted narrow area between TIM on the
direct copper bonded (DCB).
During the entire press-in process of the Easy modules with TIM, damaging the TIM honeycombs must be
avoided. Therefore, the press-in tools have to be designed with respect to the position of the TIM material on
the module’s base plate. The press-in force is to be exerted on the area of the DCB between the honeycombs. In
Section 3.4.2, the press-in tools are described in more detail.
All other instructions concerning the positioning of the press-in tools and printed circuit board are similar to
the press-in process without TIM, as described in Section 3.2.1. Figure 9 shows the press-in process of the
Easy2B with TIM as it is implemented in the laboratory.
1)
2)
3)
4)
The bottom tool is
aligned to the upper tool
by using the two long
alignment pins and the
slow-motion function of
the press machine.
The printed circuit board
is placed on the tool and
held in place by the four
pins on the
tool.
The module is placed on
the tool and positioned
using the four pins on the
tool.
The module contacts are
pressed into the PCB by
pressing the upper tool
part downwards.
Figure 9 Press-in process of an Easy2B module with pre-applied TIM

Application Note 12 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
Figure 10 shows the imprint of an Easy2B module with TIM before and after the press-in process.
Figure 10 Easy2B with TIM before (shown left) and after (shown right) the press-in process
The structure of the presented TIM surface is shown as an example only, and is different for the products within
the Easy family.
Note: After the press-in process of the pre-applied TIM module, optical changes may appear on the copper
substrate between the TIM honeycomb structure, which can only be observed under certain angles. These
imprints of the press-in tool do not have a negative impact on the substrate and can be regarded as a purely
optical effect. This effect is highlighted in the following Figure 11 (green circle).
Figure 11 Optical changes on the copper substrate highlighted in green

Application Note 13 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
3.2.3 General press-in process for several modules on PCBs
Pressing several power modules onto a large PCB requires a special procedure due to the manufacturing-
related tolerances of the modules and the PCB. This procedure is necessary to address the deviations in height
between the modules from the DCB and the PCB surface, which could have a significant impact on the thermal
performance and the lifetime of the modules. The target is to minimize the deviations in order to prevent a
mechanical deformation of the PCB or unwanted forces on the modules and PressFIT pins.
For this reason, the modules should not be pressed completely into the PCB, but only down to a defined
distance. One simple solution would be to use U-shaped distance pieces or additional guiding spacers mounted
to the top insert tool. In this case, the distance piece would touch the PCB before the module housing.
Ensure that there is sufficient space on the PCB surface for the spacers between the neighboring modules.
Figure 12 shows the press-in process of the power modules on the PCB, which are pressed into the PCB one
after the other. It is also possible to insert several modules into a PCB at the same time. This presents a greater
challenge to ensure a consistent quality of the press-in process. A process control is only possible for all
modules together with the corresponding press-in curve.
This picture shows the bottom side of
the press tool with guiding domes, which
are useful for pre-alignment.
In the next step the PCB is placed into
the bottom tool, whereby the correct
placement is obtained by the guiding
domes of the bottom tool.
This picuture shows the press tool with
the PCB ready for module assembly.

Application Note 14 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
The module is then placed on the
guiding elements and the module pins
are inserted into the PCB.
The module is now placed flush with the
press tool after the pins have been
inserted into the PCB. The pin touches
the PCB at the beginning of the active
press zone, which starts at about 2.5 mm
from the top of the pin. If the module is
not flush with the press tool, or pins are
not inserted (module about 2.5 mm
higher than the normal case shown
here), then mounting should be
corrected before the pins are damaged
in the later press-in process.
After the pre-alignement of the module
onto the bottom tool, the distance
keeper can be used. Set the height of the
distance keeper to 12,4 (+/- 0,05) mm as
shown in this view. This enables a
compensated height of the modules.
The last step shows the controlled path-
force press-in process. The pressing
process stops by the increasing force
between the PCB and the distance
keeper. It is correct when the press-in
process is stopped before the PCB is on
the module housing. Thus, the distance
from the back side of the module to the
PCB is independent of the module
height.
Figure 12 Press-in of the power modules at a defined distance

Application Note 15 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
3.2.3.1 Press-in only Easy3B and Easy4B modules into a PCB
If only Easy3B and Easy4B modules are used in the system, in principle a shorter distance keeper can be
applied. The general principle should be kept as described in the previous section 3.2.3.
Figure 13 Typical distance keeper for Easy3B/4B modules

Application Note 16 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
3.3 Press-in process parameter
This section deals with the press-in process parameter, which is useful for obtaining a highly reliable and
mechanically stable PressFIT connection between the modules and the printed circuit boards.
3.3.1 Press-in behavior
The monitoring of the press-in process is of great importance. For this reason, a press-in machine with a
controlled force-distance method is recommended for serial production in order to ensure a consistent quality
and reproducibility of the press-in process.
A module can be pressed into a PCB either via a defined path-controlled displacement or by using appropriate
distance keepers. Optionally, the four stand-off holes of the module can also be used for pressing in a single
module into a PCB as a stop criterion. After a significant slope change of the press-in force at the end of the
curve, the process is in principle completed, since the effective part of the press-in process is done.
Further pressing increases the force on the housing. It is therefore beneficial to detect the changing point of the
slope, and to stop the press-in process as soon as the point is detected.
There is no significant difference between the methods of using distance keepers or module stand-offs as a
stop criterion. A slight change could still present on the rising trail at the end in the slope of the curve due to the
different material rigidities.
Instead of that, there is a difference in the curve progression between the press-in process used with distance
keepers and the path-controlled procedure, in which a gap is set between the module and the PCB at the end of
the process. In the path-controlled procedure, there will not be a rising trail at the end of the curve, due to the
lack of contact with the PCB surface. These two methods are displayed in the following Figure 14 and Figure 15.
Depending on the choice of the PressFIT pin and other factors such as the hole diameter, metallization and
stiffness of the PCB, the press-in curve of the standard PressFIT, and of the high-current pins can pose some
differences in the progression and in the total press-in forces.
In general, the press-in curve is related to the different phases of the press-in path. It can be divided into three
main phases.
In the following, these phases will be illustrated and described in the next subchapters.

Application Note 17 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
3.3.1.1 Press-in curve example of standard PressFIT pin module
Figure 14 displays a typical press-in curve of an Easy2B module, which is equipped with 33 standard PressFIT
pins.
Figure 14 A typical press-in curve of Easy2B with 33 standard PressFIT pins
The first phase (1a) is the beginning of the PressFIT process. The PressFIT zone first comes in contact with the
plated through hole of the PCB. While the module is pressed down, the press-in force increases evenly. At this
moment, the PressFIT zone is deformed to a certain extent by the plated through hole of the PCB.
The second phase is caused by the additional sliding effect of some PressFIT pins into the rivets of the DCB, due
to the available air gap between the PressFIT pins and the DCB within rivets. The final diameter of the plated
through holes of the PCB has a significant impact on this behavior. The smaller the holes, the more pronounced
this effect is in the curve. In case this second phase is not detected during the control of the press-in curve,
there will be a low sliding effect of the PressFIT pins into the DCB rivets.
Note! The sliding effect of the PressFIT pins into the DCB rivets does not have any mechanical or electrical
impact on the module or the PressFIT quality, and can be regarded as non-critical. After sliding has ended, the
pin will connect to the rivet again via cold welding.
The subsequent phase (1b) is basically a continuation of the first phase. The PressFIT pins are pressed into the
plated through holes of the PCB to the final position.
After the distance keepers have touched the PCB surface, the third phase is reached. The press-in process is in
this example successfully completed at a slope change, at about z = 1.85 mm. The module has been subjected
to a total force of approximately 3300 N.

Application Note 18 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
3.3.1.2 Press-in curve example of high-current PressFIT pin module
An Easy 4B module with 75 high-current PressFIT pins is chosen as an example to show press-in progress. Its
typical press-in progression is displayed in Figure 15. The progression of this curve may differ from the Easy4B
press-in curve with standard PressFIT pins. This is mainly due to the geometric shape of the pin in combination
with the printed circuit board properties.
Figure 15 A typical press-in curve of Easy4B with high-current PressFIT pins
The first phase indicates the beginning of the PressFIT zone within the plated trough holes of a PCB. The
PressFIT zone first comes in contact with the plated through hole of the PCB, and is then deformed to a certain
extent by the plated through holes when the module is pressed down. At this moment, the press-in force
increases evenly.
The first curve peak is caused by the geometry of the PressFIT zone. Depending on the metallization, stiffness
and especially the final diameter of the PCB hole, this peak is more or less pronounced in the curve. The smaller
the holes, the more visible this peak will be. Furthermore, a small diameter hole leads to a steep rise in the
press-in force.
In the second phase, the press-in force decreases until the second peak is reached. At this point, the PressFIT
pins are pressed to the final position with the widest circumference of the PressFIT pin, and subjected to the
maximum permissible deformation. The press-in contact zone is then completely within the plated through
hole of the PCB.
The subsequent third phase is generated by the contact of the distance keeper with the PCB. In this example,
the effective part of the press-in process is successfully completed at the slope change, at about z = 2.7 mm.

Application Note 19 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
However, this value does not apply for all press-in processes, and is used for reference only. It may vary
depending on the zero level. The module has been subjected to a total force of 5050 N in this case.
3.3.2 Press-in force and speed
The total press-in force is generated by the number of pins, and can vary depending on several factors such as
the type of PCB, the hole diameter or the metallization used in the PCB.
Depending on the module, a distinction is made between two different PressFIT pins. For insertion of the
module into a PCB using the standard PressFIT pin, a force of approximately 60 N to 100 N can be applied for
each pin in the module. In comparison, modules with the high-current PressFIT pins require a lower press-in
force of approximately 50 N to 80 N per pin.
Table 2 shows the PressFIT speed and the maximum PressFIT force per pin.
Standard PressFIT Pin
high-current PressFIT Pin
Press-in force per pin
Typically, 85 N
< 100 N max.
Typically, 60 N
< 80 N max.
Press-in speed
>25 mm/min according to IEC 60352-5 qualification
100 mm/min recommended
Table 2 PressFIT speed and force per pin
Note! The maximum applied force per module for Easy1B and Easy2B during pressing should not exceed 4 kN.
The maximum applied force should not exceed 8 kN for Easy3B, and 12 kN for Easy4B.
The press-fitting speed should not be lower than 25 mm/min according to IEC 60352-5. Infineon recommends a
press-in speed of about 100 mm/min. The typical press-in speed for automated assembly lines is up to 450
mm/min.

Application Note 20 Revision 1.0
2023-07-12
Assembly Instructions for the Easy Modules
The press-in process
3.4 Press-in tools
For the three Easy B Series modules, the following press-in tools are recommended for pressing the modules in
and out.
3.4.1 Press-in tools for Easy modules without pre-applied TIM
Figure 16 shows these pressing tools for the two housing types, Easy 1B and Easy 2B. The pressing tools for
Easy3B housing are shown in Figure 17.
Each of the tools has two parts. The first part presses against the underside of the module, and the second part
holds the PCB in place to be pressed against.
No components can be placed in the mounting areas of this special type of press-fitting tool. This prevents
damage during the press-fitting process.
When press-fitting multiple modules onto a PCB, arrange the press-in tool in such a way that the modules are
on the same level after pressing. In this way, the modules can be mounted on the heat sink with a good thermal
connection. The detailed mounting sequence of multiple module into a PCB, please refer to chapter 3.2.3
Figure 16 Standard press-in tools for Easy1B (left shown) and Easy2B (right shown) modules
Figure 17 Press-fitting tools for Easy3B from HARTING Electronics GmbH
The drawing can be adjusted according to different requirements (e.g. module pinning and top side assembly
of other parts) and the tools produced by a manufacturer of choice.