Infinion EVAL KIT HPD G1 SiC Instruction manual

Application Note Please read the Important Notice, the Safety precautions and the Warnings <Revision 1.0>
www.infineon.com <2022-05-27>
AN-HPDKIT-SiC-G1-QUICKSTART
Quickstart Manual for EVAL KIT HPD G1 SiC
About this document
Scope and purpose
This application note describes how to operate the evaluation kit “EVAL KIT HPD G1 SiC”.
Intended audience
Experienced engineers evaluating HybridPACK™ Drive CoolSiC™ power modules.
Evaluation Kit
This Evaluation Kit is to be used during the design-in process for evaluating and measuring characteristic
curves, and for checking datasheet specifications in designing inverter applications with the HybridPACK™
Drive CoolSiC™ power module and gate driver EiceDRIVERTM.
An evaluation kit is not intended to be an optimal design for every specific requirement. But it gives a good
starting point and useful design hints for serial development. Furthermore, practical experience from the
power module switching characteristic as well as the gate driver features can be obtained in the lab at a
minimum effort by using such evaluation tools.
Note: PCB and auxiliary circuits are NOT optimized for a final customer design.

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Important notice
Quickstart Manual for EVAL KIT HPD G1 SiC
Important notice
“Evaluation Boards and Reference Boards” shall mean products embedded on a printed circuit board
(PCB) for demonstration and/or evaluation purposes, which include, without limitation, demonstration,
reference and evaluation boards, kits and design (collectively referred to as “Reference Board”).
Environmental conditions have been considered in the design of the Evaluation Boards and Reference
Boards provided by Infineon Technologies. The design of the Evaluation Boards and Reference Boards
has been tested by Infineon Technologies only as described in this document. The design is not qualified
in terms of safety requirements, manufacturing and operation over the entire operating temperature
range or lifetime.
The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional
testing only under typical load conditions. Evaluation Boards and Reference Boards are not subject to the
same procedures as regular products regarding returned material analysis (RMA), process change
notification (PCN) and product discontinuation (PD).
Evaluation Boards and Reference Boards are not commercialized products, and are solely intended for
evaluation and testing purposes. In particular, they shall not be used for reliability testing or production.
The Evaluation Boards and Reference Boards may therefore not comply with CE or similar standards
(including but not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other
requirements of the country in which they are operated by the customer. The customer shall ensure that
all Evaluation Boards and Reference Boards will be handled in a way which is compliant with the relevant
requirements and standards of the country in which they are operated.
The Evaluation Boards and Reference Boards as well as the information provided in this document are
addressed only to qualified and skilled technical staff, for laboratory usage, and shall be used and
managed according to the terms and conditions set forth in this document and in other related
documentation supplied with the respective Evaluation Board or Reference Board.
It is the responsibility of the customer’s technical departments to evaluate the suitability of the
Evaluation Boards and Reference Boards for the intended application, and to evaluate the completeness
and correctness of the information provided in this document with respect to such application.
The customer is obliged to ensure that the use of the Evaluation Boards and Reference Boards does not
cause any harm to persons or third party property.
The Evaluation Boards and Reference Boards and any information in this document is provided "as is"
and Infineon Technologies disclaims any warranties, express or implied, including but not limited to
warranties of non-infringement of third party rights and implied warranties of fitness for any purpose, or
for merchantability.
Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation
Boards and Reference Boards and/or from any information provided in this document. The customer is
obliged to defend, indemnify and hold Infineon Technologies harmless from and against any claims or
damages arising out of or resulting from any use thereof.
Infineon Technologies reserves the right to modify this document and/or any information provided
herein at any time without further notice.

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Safety precautions
Quickstart Manual for EVAL KIT HPD G1 SiC
Safety precautions
Note: Please note the following warnings regarding the hazards associated with development systems.
Table 1 Safety precautions
Warning: The DC link potential of this board is up to 500 VDC. When measuring voltage
waveforms by oscilloscope, high voltage differential probes must be used. Failure to do
so may result in personal injury or death.
Warning: The evaluation or reference board contains DC bus capacitors which take
time to discharge after removal of the main supply. Before working on the drive
system, wait five minutes for capacitors to discharge to safe voltage levels. Failure to
do so may result in personal injury or death. Darkened display LEDs are not an
indication that capacitors have discharged to safe voltage levels.
Warning: The evaluation or reference board is connected to the grid input during
testing. Hence, high-voltage differential probes must be used when measuring voltage
waveforms by oscilloscope. Failure to do so may result in personal injury or death.
Darkened display LEDs are not an indication that capacitors have discharged to safe
voltage levels.
Warning: Remove or disconnect power from the drive before you disconnect or
reconnect wires, or perform maintenance work. Wait five minutes after removing
power to discharge the bus capacitors. Do not attempt to service the drive until the bus
capacitors have discharged to zero. Failure to do so may result in personal injury or
death.
Caution: The heat sink and device surfaces of the evaluation or reference board may
become hot during testing. Hence, necessary precautions are required while handling
the board. Failure to comply may cause injury.
Caution: Only personnel familiar with the drive, power electronics and associated
machinery should plan, install, commission and subsequently service the system.
Failure to comply may result in personal injury and/or equipment damage.
Caution: The evaluation or reference board contains parts and assemblies sensitive to
electrostatic discharge (ESD). Electrostatic control precautions are required when
installing, testing, servicing or repairing the assembly. Component damage may result
if ESD control procedures are not followed. If you are not familiar with electrostatic
control procedures, refer to the applicable ESD protection handbooks and guidelines.
Caution: A drive that is incorrectly applied or installed can lead to component damage
or reduction in product lifetime. Wiring or application errors such as undersizing the
motor, supplying an incorrect or inadequate AC supply, or excessive ambient
temperatures may result in system malfunction.
Caution: The evaluation or reference board is shipped with packing materials that
need to be removed prior to installation. Failure to remove all packing materials that
are unnecessary for system installation may result in overheating or abnormal
operating conditions.

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Table of Contents
Quickstart Manual for EVAL KIT HPD G1 SiC
Table of Contents
About this document....................................................................................................................... 1
Important notice ............................................................................................................................ 2
Safety precautions.......................................................................................................................... 3
Table of Contents ........................................................................................................................... 4
1How to order HybridKit Drive.......................................................................................... 5
2Feature and Limitations Overview................................................................................... 6
2.1 Block Diagram .........................................................................................................................................6
2.2 Recommended Operating Conditions....................................................................................................7
2.3 Key Features ............................................................................................................................................7
2.4 Limitations of the Evaluation Kit ............................................................................................................8
2.5 Key Components List ..............................................................................................................................8
3Quickstart Guide............................................................................................................ 9
3.1 Recommended equipment for evaluation.............................................................................................9
3.2 Connect the Evaluation Kit to power supply and load ..........................................................................9
3.3 Connect the Evaluation Kit to a cooling system ..................................................................................10
4Advanced Features .......................................................................................................11
4.1 Double Pulse Testing.............................................................................................................................11
5References and Revision History ....................................................................................12

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Quickstart Manual for EVAL KIT HPD G1 SiC
How to order HybridKit Drive
1How to order HybridKit Drive
The evaluation kit EVAL KIT HPD G1 SiC can be ordered via Infineon sales partners:
SAP ordering number for EVAL KIT HPD G1 SiC: SP005594933.
The evaluation kit is also available at the webshop: http://www.ehitex.com
The shipping content of the EVAL KIT HPD G1 SiC include the:
HybridPACK™Drive power module FS03MR12A6MA1B (SP001720764)
Reference aluminium cooler + recommended sealing ring
Gate driver board HPD GD BOARD G1 SIC (SP005592047)
DC-Link capacitor
The typical appearance of the evaluation kit is shown in Figure 1.
Figure 1 Typical appearance of the evaluation kit EVAL KIT HPD G1 SiC SP005594933.

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Quickstart Manual for EVAL KIT HPD G1 SiC
Feature and Limitations Overview
2Feature and Limitations Overview
The evaluation kit EVAL KIT HPD G1 SiC is a partial inverter system including B6 bridge power module, gate driver
board, DC-link capacitor and cooler. The evaluation kit supports the customers in their first steps in designing
applications with the HybridPACK™ Drive CoolSiC™.
2.1 Block Diagram
Figure 2 shows the block diagram with simplified signal and power flow connections as well as the implemented
key components.
Power
Supply
EiceDRIVER
U_HS
Supply
Connector X1
Interface PCB
EiceDRIVER
U_LS
Supply
EiceDRIVER
V_HS
Supply
EiceDRIVER
V_LS
Supply
EiceDRIVER
W_HS
Supply
EiceDRIVER
W_LS
Supply
PressFIT Signal connectors
Gate Driver Board
U_HS
Switch
U_LS
Switch
NTC_U
V_HS
Switch
V_LS
Switch
NTC_V
W_HS
Switch
W_LS
Switch
NTC_W
M
HybridPACKTM Drive CoolSiCTM
Liquid Cooling System
DC Link Cap
HV Supply
8..18VHybridKIT Drive SiC
Figure 2 Simplified Block Diagram

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Quickstart Manual for EVAL KIT HPD G1 SiC
Feature and Limitations Overview
2.2 Recommended Operating Conditions
The following recommended operating conditions describe the targeted lab testing environment.
The evaluation kit is not designed for a fixed specification and it cannot be regarded as a protected system, as it
would require strict shutdown routines and would limit the main evaluation purpose. Therefore, please respect
the specifications of individual parts and especially the thermal limits.
Please see also section 2.4 to understand the limitations.
Table 2 Operating Conditions
Type
Symb
Min
Max
Conditions
Gate Driver Board Supply
Vsupply
8V
18V
Working Voltage
(DC-Link Voltage)
VDC
0V
500V
Gate driver board’s creepage
and clearance distances
comply with norm IEC-60664-
1 for 500V.
Transient Phase Current
Iph
-800A
+800A
limited by Tvj,op_max
HybridPACKTM Drive CoolSiCTM
module
Junction Temperature
Tvj,op
-40°C
150°C
PCB Temperature
TPCB
150°C
Ambient Temperature
Tamb
75°C
Limited by TPCB. A higher Tamb
is achievable at active cooling
like a fan
Switching frequency
fsw
20 kHz
Limited by TPCB. A higher fsw is
achievable at low ambient
temperature or active cooling
like a fan
2.3 Key Features
The key features can be summarized:
Inverter evaluation kit for xEV main inverter applications (up to 200 kW).
Automotive power module HybridPACK™Drive CoolSiCTM FS03MR12A6MA1B.
Automotive gate driver solution based on EiceDRIVER™1EDI3033AS.
SiC MOSFET desaturation (short circuit) detection.
NTC temperature measurement featured by ADC of EiceDRIVER™.
DC-Link voltage measurement featured by ADC of EiceDRIVER™.
Gate driver board’s creepage and clearance distances comply with norm IEC-60664-1 for 500V working
voltage.

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Quickstart Manual for EVAL KIT HPD G1 SiC
Feature and Limitations Overview
2.4 Limitations of the Evaluation Kit
The evaluation kit should not be regarded as a protected system. It was designed for evaluation under lab
conditions with minimum automatic shutdown routines. The design was intended to be usable also under
extreme conditions where protection mechanisms would limit the evaluation possibilities. The evaluation kit is
not protected against:
Over- & under- voltages on the signal connectors.
Overvoltages of the HV working voltage
(>500V should be avoided)
Overtemperature of the PCB and Module.
The power module NTC temperature info is read as a digital signal, but no shutdown limit is set.
Testing at higher switching frequencies than 20 kHz may require active cooling of the gate driver board
at high ambient temperature.
Please read and understand the manual and the safety precautions.
Please note that the list are giving examples and should not be seen as exhaustive.
2.5 Key Components List
Some key components can be found in Table 3. The evaluation kit uses more active and passive components
which are not listed here.
Table 3 Key components list.
Part Number
Manufacturer
Description / Implementation
FS03MR12A6MA1B
Infineon
Automotive HybridPACK™Drive CoolSiC™ power module
with 1200V SiC MOSFET
1EDI3033AS
Infineon
Automotive Isolated Gate Driver EiceDRIVER™
TLE8386-2EL
Infineon
Automotive SMPS controller used in 500kHz SEPIC converter
B25655P8307K351
TDK
Automotive PCC DC-Link Capacitor 855V, 300μF
P301085-A2
(B78308-A2387-A003)
TDK
Automotive Transformer 1:1.07 with 10mm creepage
distance

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Quickstart Manual for EVAL KIT HPD G1 SiC
Quickstart Guide
3Quickstart Guide
This chapter explains briefly the recommended lab equipment and how to connect the evaluation kit. Please
ensure an appropriate current/power/voltage limit of the source. It can happen at any time that the inverter
changes the output conditions and/or stops immediately.
3.1 Recommended equipment for evaluation
To perform evaluation tests with the EVAL KIT HPD G1 SiC, following equipment is minimum recommended.
Logic Supply: 8-18V, 2A.
Pulse generator: 0V…5V
Power Source: minimum 30V/2A.
up to 500V/600A depending on evaluation tests.
Load: passive 3-phase inductive load or alternative
3-phase asynchronous (induction) machine.
Scope: 4 channel scope.
Cooling system: Optional for light load tests.
For high power tests use cooling with 10L/min and <2bar absolute pressure
operation.
3.2 Connect the Evaluation Kit to power supply and load
The right connection of power supplies and load is shown in Figure 3a. The high voltage DC source has to be
connected to the capacitor. Depending on the required currents for the evaluation tests it can be required to
mount a busbar over all DC-, DC+ connections. Some busbar examples for high power load tests are shown in
Figure 3b and c. For low loads and high power short-term operation it is typically enough to connect the high
voltage DC source only at the center DC-Link connections with the cable shoes included in the standard shipping
content of the evaluation kit.
Refer to [2] Infineon Application Note AN-HPDKIT-SiC-G1-GATEDRIVE, “User Manual for HPD GD BOARD G1 SiC”
for logic supply connection on gate driver board.

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Quickstart Manual for EVAL KIT HPD G1 SiC
Quickstart Guide
a)
b)
c)
Figure 3 Typical appearance of the evaluation kit and required supplies and load connections (a). For long-
term high power load tests a busbar with appropriate current carrying capability may be required at the DC
terminals. Concepts with additional external busbars are shown in (b), this example shows solutions from
TDK/Epcos [3]. Concepts with busbars integrated in the capacitor is shown in (c), this example shows a
solution from SB Electronics [4].
3.3 Connect the Evaluation Kit to a cooling system
The cooler can be connected via the ½ inch G series British standard pipe interface as shown in Figure 4. Please
use as cooling fluid 50% water / 50% ethylene glycol and ensure that the cooling fluid corrosion protection is
compatible with aluminium cooler and Ni plated baseplate (like typical released automotive cooling mixtures).
Do not use pure water cooling fluids as it might damage the power module and reference cooler.
Figure 4 Typical appearance of the evaluation kit and the cooling system interface.

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Quickstart Manual for EVAL KIT HPD G1 SiC
Advanced Features
4Advanced Features
4.1 Double Pulse Testing
For a deeper investigation of the corresponding switching characteristics, it is sometimes useful to perform
double pulse tests rather than inverter tests. Such tests can be easily performed by using the following sequence:
1. Connect supplies, load and pulse generator properly
2. Turn on the logic supply (8..18V)
3. Activate and enable gate driver EiceDRIVERTM
4. Turn on the high voltage supply and perform double pulse tests
Refer to [2] Infineon Application Note AN-HPDKIT-SiC-G1-GATEDRIVE, “User Manual for HPD GD BOARD G1 SiC”
for gate driver board configuration detail, such as logic supply connection, enabling gate driver EiceDRIVERTM,
etc.
The pulse generator can be connected to test pads on the gate driver board as shown in Figure 5.
Figure 5 Example how test pads on the gate driver board can be utilized for double pulse test.

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Quickstart Manual for EVAL KIT HPD G1 SiC
References and Revision History
5References and Revision History
The referenced application notes can be found at http://www.infineon.com
[1] Infineon Application Note AN-HPD-ASSEMBLY, “Assembly Instructions for the HybridPACK Drive”
[2] Infineon Application Note AN-HPDKIT-SiC-G1-GATEDRIVE, “User Manual for HPD GD BOARD G1 SiC”
[3] TDK/Epcos Capacitor “B25655P5507K***”
[4] SBE Electronics Capacitor “700D50794-204” OR “700D50795-186”
Revision History
Date
Version
Changed By
Change Description
2022-May
1.0
Dehuai Jiang
(IFAG ATV HP HMD TM)
Initial Version

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Edition <2022-05-27>
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2022 Infineon Technologies AG.
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Document reference
AN-HPDKIT-SiC-G1-QUICKSTART
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