Intel BLKDG33FBC Configuration guide

May 2007
Order Number: D88105-001US
The Intel®Desktop Board DG33FB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG33FB Specification Update.
Intel® Desktop Board
DG33FB
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DG33FB Technical Product
Specification
May 2007
This product specification applies to only the standard Intel®Desktop Board DG33FB with BIOS
identifier DPP3510A.86A.
Changes to this specification will be published in the Intel Desktop Board DG33FB Specification
Update before being incorporated into a revision of this document.
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to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copyright © 2007, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DG33FB. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DG33FB and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
 NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DG33FB Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1, 073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel®G33 Express Chipset............................................................... 19
1.6.1 Intel G33 Graphics Subsystem ............................................... 19
1.6.2 Intel®Viiv™ Processor Technology.......................................... 21
1.6.3 USB ................................................................................... 21
1.6.4 Serial ATA Interfaces ............................................................ 21
1.7 Parallel IDE Controller ...................................................................... 22
1.8 Real-Time Clock Subsystem .............................................................. 22
1.9 Legacy I/O Controller....................................................................... 23
1.9.1 Serial Port Interface.............................................................. 23
1.9.2 Parallel Port Interface ........................................................... 23
1.9.3 Diskette Drive Interface ........................................................ 23
1.9.4 PS/2 Keyboard and Mouse Interface........................................ 23
1.10 Audio Subsystem............................................................................. 24
1.10.1 Audio Subsystem Software .................................................... 24
1.10.2 Audio Connectors and Headers ............................................... 25
1.11 LAN Subsystem............................................................................... 26
1.11.1 Intel®82566DC Gigabit Ethernet Controller.............................. 26
1.11.2 LAN Subsystem Software....................................................... 27
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27
1.12 Hardware Management Subsystem .................................................... 28
1.12.1 Hardware Monitoring and Fan Control...................................... 28
1.12.2 Fan Monitoring..................................................................... 28
1.12.3 Chassis Intrusion and Detection.............................................. 28
1.12.4 Thermal Monitoring .............................................................. 29
1.13 Power Management ......................................................................... 30
1.13.1 ACPI .................................................................................. 30
1.13.2 Hardware Support ................................................................ 33

Intel Desktop Board DG33FB Technical Product Specification
vi
2Technical Reference
2.1 Memory Map................................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.2 Connectors and Headers................................................................... 40
2.2.1 Back Panel Connectors .......................................................... 41
2.2.2 Component-side Connectors and Headers ................................ 42
2.3 Jumper Block .................................................................................. 50
2.4 Mechanical Considerations ................................................................ 51
2.4.1 Form Factor......................................................................... 51
2.5 Electrical Considerations................................................................... 52
2.5.1 Power Supply Considerations ................................................. 52
2.5.2 Fan Header Current Capability................................................ 53
2.5.3 Add-in Board Considerations .................................................. 53
2.6 Thermal Considerations.................................................................... 54
2.7 Reliability ....................................................................................... 56
2.8 Environmental ................................................................................ 57
3Overview of BIOS Features
3.1 Introduction ................................................................................... 59
3.2 BIOS Flash Memory Organization....................................................... 60
3.3 Resource Configuration .................................................................... 60
3.3.1 PCI* Autoconfiguration.......................................................... 60
3.3.2 PCI IDE Support................................................................... 61
3.4 System Management BIOS (SMBIOS)................................................. 61
3.5 Legacy USB Support ........................................................................ 62
3.6 BIOS Updates ................................................................................. 63
3.6.1 Language Support ................................................................ 63
3.6.2 Custom Splash Screen .......................................................... 64
3.7 BIOS Recovery................................................................................ 64
3.8 Boot Options................................................................................... 65
3.8.1 CD-ROM Boot ...................................................................... 65
3.8.2 Network Boot....................................................................... 65
3.8.3 Booting Without Attached Devices........................................... 65
3.8.4 Changing the Default Boot Device During POST ........................ 65
3.9 Adjusting Boot Speed....................................................................... 66
3.9.1 Peripheral Selection and Configuration..................................... 66
3.9.2 BIOS Boot Optimizations ....................................................... 66
3.10 BIOS Security Features .................................................................... 67
4Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes ............................................................................ 69
4.3 BIOS Error Messages ....................................................................... 69
4.4 Port 80h POST Codes ....................................................................... 70

Contents
vii
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 75
5.1.1 Safety Standards.................................................................. 75
5.1.2 European Union Declaration of Conformity Statement................ 76
5.1.3 Product Ecology Statements................................................... 78
5.1.4 EMC Regulations .................................................................. 82
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel Configuration and DIMM Configuration........................ 18
4. Back Panel Audio Connector Options .................................................. 25
5. LAN Connector LED Locations............................................................ 27
6. Thermal Sensors and Fan Headers ..................................................... 29
7. Location of the Standby Power Indicator LED....................................... 36
8. Detailed System Memory Address Map ............................................... 38
9. Back Panel Connectors ..................................................................... 41
10. Component-side Connectors and Headers ........................................... 42
11. Connection Diagram for Front Panel Header ........................................ 47
12. Connection Diagram for Front Panel USB Headers ................................ 49
13. Location of the Jumper Block............................................................. 50
14. Board Dimensions ........................................................................... 51
15. Localized High Temperature Zones..................................................... 55
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. Audio Jack Support.......................................................................... 24
5. LAN Connector LED States ................................................................ 27
6. Effects of Pressing the Power Switch .................................................. 30
7. Power States and Targeted System Power........................................... 31
8. Wake-up Devices and Events ............................................................ 32
9. System Memory Map ....................................................................... 39
10. Component-side Connectors and Headers Shown in Figure 10................ 43
11. Serial ATA Connectors...................................................................... 44
12. Chassis Intrusion Header.................................................................. 44
13. Serial Port Header ........................................................................... 44
14. Front and Rear Chassis Fan Headers .................................................. 44
15. Processor Fan Header ...................................................................... 44
16. Front Panel Audio Header ................................................................. 45
17. Auxiliary Front Panel Power/Sleep LED Header..................................... 45
18. Processor Core Power Connector........................................................ 46

Intel Desktop Board DG33FB Technical Product Specification
viii
19. Main Power Connector...................................................................... 46
20. Front Panel Header .......................................................................... 47
21. States for a One-Color Power LED...................................................... 48
22. States for a Two-Color Power LED...................................................... 48
23. Auxiliary Front Panel Power LED Header.............................................. 48
24. BIOS Setup Configuration Jumper Settings.......................................... 50
25. Recommended Power Supply Current Values ....................................... 52
26. Fan Header Current Capability........................................................... 53
27. Thermal Considerations for Components ............................................. 56
28. Desktop Board DG33FB Environmental Specifications............................ 57
29. BIOS Setup Program Menu Bar.......................................................... 60
30. BIOS Setup Program Function Keys.................................................... 60
31. Acceptable Drives/Media Types for BIOS Recovery ............................... 64
32. Boot Device Menu Options ................................................................ 65
33. Supervisor and User Password Functions............................................. 67
34. Beep Codes .................................................................................... 69
35. BIOS Error Messages ....................................................................... 69
36. Port 80h POST Code Ranges.............................................................. 70
37. Port 80h POST Codes ....................................................................... 71
38. Typical Port 80h POST Sequence........................................................ 74
39. Safety Standards............................................................................. 75
40. Lead-Free Board Markings ................................................................ 81
41. EMC Regulations ............................................................................. 82
42. Product Certification Markings ........................................................... 84

9
1Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.6 Intel®G33 Express Chipset............................................................... 19
1.7 Parallel IDE Controller ...................................................................... 22
1.8 Real-Time Clock Subsystem .............................................................. 22
1.9 Legacy I/O Controller....................................................................... 23
1.10 Audio Subsystem............................................................................. 24
1.11 LAN Subsystem............................................................................... 26
1.12 Hardware Management Subsystem .................................................... 28
1.13 Power Management ......................................................................... 30

Intel Desktop Board DG33FB Technical Product Specification
10
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DG33FB.
Table 1. Feature Summary
Form Factor ATX (11.60 inches by 9.60 inches [294.64 millimeters by 243.84 millimeters])
Processor Support for the following:
•Intel®Core™2 Quad processor in an LGA775 socket with a 1066 MHz
system bus
•Intel®Core™2 Duo processor in an LGA775 socket with a 1333 or 1066 or
800 MHz system bus
•Intel®Pentium®Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
•Intel®Celeron®processor in an LGA775 socket with an 800 MHz system bus
Memory •Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR2 667 or DDR2 800 MHz DIMMs
•Support for up to 8 GB of system memory
Chipset Intel®G33 Express Chipset, consisting of:
•Intel®82G33 Graphics and Memory Controller Hub (GMCH)
•Intel®82801IH I/O Controller Hub (ICH9DH)
Video Intel® Graphics Media Accelerator (Intel®GMA) 3100 onboard graphics
subsystem
Audio 6-channel (5.1) audio subsystem using the Realtek* ALC888 audio codec
Legacy I/O Control Legacy I/O controller for diskette drive, serial, and PS/2* ports
Peripheral
Interfaces
•12 USB 2.0 ports
•Four Serial ATA interfaces
•One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
•One diskette drive interface
•One IEEE 1394a port
•PS/2 keyboard and mouse ports
•One serial port header (may require specialized chassis or cable for use)
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DC
Gigabit Ethernet Controller
BIOS •Intel®BIOS (resident in the SPI Flash device)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
•Support for PCI* Local Bus Specification Revision 2.3
•Support for PCI Express* Revision 1.1
•Suspend to RAM support
•Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
continued

Product Description
11
Table 1. Feature Summary (continued)
Expansion
Capabilities
•Three PCI Conventional bus connectors
•Three PCI Express x1 bus add-in card connector
•One PCI Express x16 bus add-in card connector
Hardware Monitor
Subsystem
•Intel®Quiet System Technology implemented through the Intel®Management
Engine in ICH9DH
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Four fan headers
•Three fan sense inputs used to monitor fan activity
For information about Refer to
Available configurations for the Desktop Board DG33FB Section 1.2, page 15

Intel Desktop Board DG33FB Technical Product Specification
12
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.

Product Description
13
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1
Description
A PCI Conventional bus add-in card connector
B Auxiliary rear chassis fan header
C PCI Express x1 connector
D PCI Express x1 connector
E PCI Conventional bus add-in card connector
F Front panel audio header
G PCI Conventional bus add-in card connector
H PCI Express x1 connector
I Speaker
J PCI Express x16 connector
K Back panel connectors
L Processor core power connector (2 X 2)
M Rear chassis fan header
N LGA775 processor socket
O Intel 82G33 GMCH
P Processor fan header
Q DIMM Channel A sockets
R Serial port header
S DIMM Channel B sockets
T Main Power connector (2 X 12)
U Diskette drive connector
V Chassis intrusion header
W Battery
X Front chassis fan header
Y BIOS Setup configuration jumper block
Z Auxiliary front panel power LED header
AA Front panel header
BB Serial ATA connectors [4]
CC Parallel ATA IDE connector
DD Front panel USB headers [3]
EE Intel 82801IH I/O Controller Hub (ICH9DH)
FF IEEE 1394a header

Intel Desktop Board DG33FB Technical Product Specification
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram

Product Description
15
1.2 Legacy Considerations
This board differs from other Intel®Desktop Board products, with specific changes
including (but not limited to) the following:
•No parallel port
•The location of the floppy drive connector has moved
•No serial port on the back panel
•The serial port header is located between the memory sockets and may require a
specialized chassis or cabling solution to use
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DG33FB http://www.intel.com/products/motherboard/DG33FB/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the
Desktop Board DG33FB
http://www.intel.com/products/motherboard/DG33FB/index.htm
Supported processors http://www.intel.com/go/findcpu
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.4 Processor
The board is designed to support the following processors:
•Intel Core 2 Quad processor in an LGA775 socket with a 1066 MHz system bus
•Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
•Intel Pentium Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
•Intel Celeron processor in an LGA775 socket with an 800 MHz system bus
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W. The processors listed above are only
supported when falling within the wattage requirements of the DG33FB board. See
the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://www.intel.com/go/findcpu
CAUTION
#INTEGRATOR’S NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.2.2.4, page 46

Intel Desktop Board DG33FB Technical Product Specification
16
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
•1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
•8 GB maximum total system memory. Refer to Section 2.1.1 on page 37 for
information on the total amount of addressable memory.
•Minimum total system memory: 512 MB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR2 667 or DDR2 800 MHz SDRAM DIMMs
•DDR2 667 DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)
•DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This enables the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Type
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
DDR2 667 512 Mbit 256 MB 1 GB 4 GB
DDR2 667 1 Gbit 512 MB 2 GB 8 GB
DDR2 800 512 Mbit 256 MB 1 GB 4 GB
DDR2 800 1 Gbit 512 MB 2 GB 8 GB
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm

Product Description
17
1.5.1 Memory Configurations
The Intel 82G33 GMCH supports the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
•Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm

Intel Desktop Board DG33FB Technical Product Specification
18
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM 0 sockets of both channels are blue. The DIMM 1 sockets of both channels
are black.
Figure 3. Memory Channel Configuration and DIMM Configuration
#INTEGRATOR’S NOTE
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
Intel Management Engine in ICH9DH.

Product Description
19
1.6 Intel®G33 Express Chipset
The Intel G33 Express chipset consists of the following devices:
•Intel 82G33 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
•Intel 82801IH I/O Controller Hub (ICH9DH) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D, and display capabilities. The ICH9DH is a centralized controller for
the board’s I/O paths.
The chipset supports the following features:
•Onboard Graphics
•Dynamic Video Memory Technology
•USB
•Serial ATA
•Parallel IDE
For information about Refer to
The Intel G33 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 Intel G33 Graphics Subsystem
The Intel G33 Express chipset contains two separate, mutually exclusive graphics
options. Either the Intel Graphics Media Accelerator 3100 (Intel GMA 3100) graphics
controller (contained within the 82G33 GMCH) is used, or a PCI Express x16 add-in
card can be used. When a PCI Express x16 add-in card is installed, the Intel GMA
3100 graphics controller is disabled.
1.6.1.1 Intel®Graphics Media Accelerator 3100 Graphics
Controller
The Intel GMA 3100 graphics controller features the following:
•400 MHz core frequency
•High quality texture engine
⎯DX9.0c* and OpenGL* 1.4 compliant
⎯Hardware Pixel Shader 2.0
⎯Vertex Shader Model 2.0
•3D Graphics Rendering enhancements
⎯1.6 dual texture GigaPixel/sec max fill rate
⎯16-bit and 32-bit color
⎯Vertex cache
•Video
⎯Software DVD at 30 fps full screen
⎯DVMT support up to 256 MB

Intel Desktop Board DG33FB Technical Product Specification
20
•Display
⎯Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯Dual independent display support
⎯DDC2B compliant interface with Advanced Digital Display 2 card or Media
Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display
connections
1.6.1.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory
installed. DVMT returns system memory back to the operating system when the
additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.1.3 Configuration Modes
The video modes supported by this board are based on the Extended Display
Identification Data (EDID) modes of the monitor to which the system is connected.
Standard monitors are assumed.
1.6.1.4 Advanced Digital Display (ADD2/MEC) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
225 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC card is
detected, the Intel GMA 3100 graphics controller is enabled and the PCI Express x16
connector is configured for SDVO mode. SDVO mode enables the SDVO ports to be
accessed by the ADD2/MEC card. An ADD2/MEC card can either be configured to
support simultaneous display with the primary VGA display or can be configured to
support dual independent display as an extended desktop configuration with different
color depths and resolutions. ADD2/MEC cards can be designed to support the
following configurations:
•Low Voltage Differential Signaling (LVDS)
•Single device operating in dual channel mode
•HDTV output
•HDMI support (when used with the HD Audio Link)