Intel BOXD945GCZL Configuration guide

May 2005
Order Number: D14068-001US
The Intel®Desktop Board D945GCZ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D945GCZ Specification Update.
Intel®Desktop Board
D945GCZ
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board D945GCZ Technical Product
Specification.
May 2005
This product specification applies to only the standard Intel Desktop Board D945GCZ with BIOS
identifier NT94510J.86A.
Changes to this specification will be published in the Intel Desktop Board D945GCZ Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN
MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
All Intel desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or
embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may
not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not
provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
Intel®desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries.
* Other names and brands may be claimed as the property of others.
Copyright ©2005, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the Intel®Desktop Board D945GCZ. It
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board D945GCZ
and its components to the vendors, system integrators, and other engineers and technicians who
need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D945GCZ
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings

NOTE
Notes call attention to important information.
#
INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.

Intel Desktop Board D945GCZ Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Board D945GCZ, and X is the instance of the
particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbits/sec Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Power Connector Terminology Change ......................................................................... 9
1.2 Overview ...................................................................................................................... 10
1.2.1 Feature Summary.......................................................................................... 10
1.2.2 Manufacturing Options .................................................................................. 11
1.2.3 Board Layout ................................................................................................. 12
1.2.4 Block Diagram ............................................................................................... 14
1.3 Online Support ............................................................................................................. 15
1.4 Processor ..................................................................................................................... 15
1.5 System Memory ........................................................................................................... 16
1.5.1 Memory Configurations ................................................................................. 17
1.6 Intel®945G Chipset ..................................................................................................... 21
1.6.1 Intel 945G Graphics Subsystem.................................................................... 21
1.6.2 USB ............................................................................................................... 23
1.6.3 IDE Support ................................................................................................... 24
1.6.4 Real-Time Clock, CMOS SRAM, and Battery................................................ 25
1.7 PCI Express* Connectors ............................................................................................ 26
1.8 IEEE-1394a Connectors (Optional).............................................................................. 26
1.9 Legacy I/O Controller ................................................................................................... 27
1.9.1 Serial Port...................................................................................................... 27
1.9.2 Parallel Port ................................................................................................... 27
1.9.3 Diskette Drive Controller................................................................................ 27
1.9.4 Keyboard and Mouse Interface ..................................................................... 27
1.10 Audio Subsystem ......................................................................................................... 28
1.10.1 Audio Subsystem Software ........................................................................... 28
1.10.2 Audio Connectors .......................................................................................... 28
1.10.3 8-Channel (7.1) Audio Subsystem................................................................. 28
1.10.4 6-Channel (5.1) Audio Subsystem................................................................. 30
1.11 LAN Subsystem ........................................................................................................... 31
1.11.1 LAN Subsystem Software.............................................................................. 31
1.11.2 10/100 Mbits/sec LAN Subsystem................................................................. 32
1.11.3 Gigabit LAN Subsystem ................................................................................ 33
1.11.4 Intel®Active Management Technology (Optional)......................................... 34
1.11.5 Alert Standard Format (ASF) Support (Optional) .......................................... 35
1.12 Hardware Management Subsystem............................................................................. 36
1.12.1 Hardware Monitoring and Fan Control ASIC ................................................. 36
1.12.2 Chassis Intrusion and Detection.................................................................... 36
1.12.3 Fan Monitoring............................................................................................... 36
1.12.4 Thermal Monitoring........................................................................................ 37
1.13 Power Management ..................................................................................................... 38
1.13.1 ACPI .............................................................................................................. 38
1.13.2 Hardware Support ......................................................................................... 40
1.14 Trusted Platform Module (Optional) ............................................................................. 43

Intel Desktop Board D945GCZ Technical Product Specification
vi
2Technical Reference
2.1 Introduction .................................................................................................................. 45
2.2 Memory Resources ...................................................................................................... 45
2.2.1 Addressable Memory..................................................................................... 45
2.2.2 Memory Map.................................................................................................. 47
2.3 DMA Channels ............................................................................................................. 47
2.4 Fixed I/O Map............................................................................................................... 48
2.5 PCI Configuration Space Map...................................................................................... 49
2.6 Interrupts ......................................................................................................................50
2.7 PCI Conventional Interrupt Routing Map ..................................................................... 51
2.8 Connectors................................................................................................................... 53
2.8.1 Back Panel Connectors ................................................................................. 53
2.8.2 Component-side Connectors......................................................................... 56
2.9 Jumper Block ............................................................................................................... 64
2.10 Mechanical Considerations .......................................................................................... 65
2.10.1 Form Factor ................................................................................................... 65
2.10.2 I/O Shield....................................................................................................... 66
2.11 Electrical Considerations.............................................................................................. 68
2.11.1 DC Loading.................................................................................................... 68
2.11.2 Add-in Board Considerations......................................................................... 68
2.11.3 Fan Connector Current Capability ................................................................. 69
2.11.4 Power Supply Considerations ....................................................................... 69
2.12 Thermal Considerations ............................................................................................... 70
2.13 Reliability...................................................................................................................... 72
2.14 Environmental .............................................................................................................. 73
2.15 Regulatory Compliance................................................................................................ 74
2.15.1 Safety Regulations ........................................................................................ 74
2.15.2 EMC Regulations........................................................................................... 74
2.15.3 European Union Declaration of Conformity Statement.................................. 75
2.15.4 Recycling Considerations .............................................................................. 76
2.15.5 Product Certification Markings (Board Level) ................................................ 77
3Overview of BIOS Features
3.1 Introduction .................................................................................................................. 79
3.2 BIOS Flash Memory Organization ...............................................................................80
3.3 Resource Configuration ............................................................................................... 80
3.3.1 PCI Autoconfiguration.................................................................................... 80
3.3.2 PCI IDE Support ............................................................................................ 80
3.4 System Management BIOS (SMBIOS) ........................................................................ 81
3.5 Legacy USB Support.................................................................................................... 81
3.6 BIOS Updates .............................................................................................................. 82
3.6.1 Language Support ......................................................................................... 82
3.6.2 Custom Splash Screen.................................................................................. 82
3.7 Boot Options ................................................................................................................ 83
3.7.1 CD-ROM Boot ............................................................................................... 83
3.7.2 Network Boot ................................................................................................. 83
3.7.3 Booting Without Attached Devices ................................................................ 83
3.7.4 Changing the Default Boot Device During POST .......................................... 83

Contents
vii
3.8 Adjusting Boot Speed................................................................................................... 84
3.8.1 Peripheral Selection and Configuration ......................................................... 84
3.8.2 BIOS Boot Optimizations............................................................................... 84
3.9 BIOS Security Features ............................................................................................... 85
4Error Messages and Beep Codes
4.1 Speaker ....................................................................................................................... 87
4.2 BIOS Beep Codes........................................................................................................ 87
4.3 BIOS Error Messages .................................................................................................. 87
4.4 Port 80h POST Codes ................................................................................................. 88
Figures
1. Board Components ...................................................................................................... 12
2. Block Diagram.............................................................................................................. 14
3. Memory Channel and DIMM Configuration.................................................................. 17
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs .............................. 18
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................ 18
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs.............................. 19
7. Single Channel (Asymmetric) Mode Configuration with One DIMM............................. 20
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs ........................20
9. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem .... 29
10. 8-channel (7.1) Audio Subsystem Block Diagram........................................................ 29
11. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem .... 30
12. 6-Channel (5.1) Audio Subsystem Block Diagram....................................................... 30
13. LAN Connector LED Locations .................................................................................... 32
14. LAN Connector LED Locations .................................................................................... 33
15. Thermal Sensors and Fan Connectors ........................................................................ 37
16. Location of the Standby Power Indicator LED ............................................................. 43
17. Detailed System Memory Address Map....................................................................... 46
18. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem ................................... 54
19. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem ................................... 55
20. Component-side Connectors ....................................................................................... 56
21. Connection Diagram for Front Panel Connector .......................................................... 61
22. Connection Diagram for Front Panel USB Connectors................................................ 63
23. Connection Diagram for IEEE 1394a Connectors........................................................ 63
24. Location of the Jumper Block.......................................................................................64
25. Board Dimensions........................................................................................................ 65
26. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem............ 66
27. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem............ 67
28. Processor Heatsink for Omni-directional Airflow.......................................................... 70
29. Localized High Temperature Zones ............................................................................. 71

Intel Desktop Board D945GCZ Technical Product Specification
viii
Tables
1. Feature Summary ........................................................................................................ 10
2. Manufacturing Options ................................................................................................. 11
3. Board Components Shown in Figure 1 ........................................................................ 13
4. Supported Memory Configurations .............................................................................. 16
5. LAN Connector LED States ......................................................................................... 32
6. LAN Connector LED States ......................................................................................... 33
7. Effects of Pressing the Power Switch .......................................................................... 38
8. Power States and Targeted System Power ................................................................. 39
9. Wake-up Devices and Events ...................................................................................... 40
10. System Memory Map ................................................................................................... 47
11. DMA Channels ............................................................................................................. 47
12. I/O Map ........................................................................................................................ 48
13. PCI Configuration Space Map...................................................................................... 49
14. Interrupts ......................................................................................................................50
15. PCI Interrupt Routing Map ........................................................................................... 52
16. Back Panel Connectors Shown in Figure 18................................................................ 54
17. Back Panel Connectors Shown in Figure 19................................................................ 55
18. Component-side Connectors Shown in Figure 20 ....................................................... 57
19. Front Panel Audio Connector.......................................................................................58
20. Chassis Intrusion Connector ........................................................................................ 58
21. Serial ATA Connectors................................................................................................. 58
22. Processor Fan Connector ............................................................................................ 58
23. Front and Rear Chassis Fan Connectors..................................................................... 58
24. Main Power Connector................................................................................................. 59
25. Processor Core Power Connector ............................................................................... 59
26. Auxiliary Front Panel Power/Sleep LED Connector ..................................................... 60
27. Front Panel Connector ................................................................................................. 61
28. States for a One-Color Power LED .............................................................................. 62
29. States for a Two-Color Power LED .............................................................................. 62
30. BIOS Setup Configuration Jumper Settings................................................................. 64
31. DC Loading Characteristics ......................................................................................... 68
32. Fan Connector Current Capability................................................................................ 69
33. Thermal Considerations for Components .................................................................... 72
34. Environmental Specifications ....................................................................................... 73
35. Safety Regulations ....................................................................................................... 74
36. EMC Regulations ......................................................................................................... 74
37. Product Certification Markings ..................................................................................... 77
38. BIOS Setup Program Menu Bar................................................................................... 80
39. BIOS Setup Program Function Keys............................................................................ 80
40. Boot Device Menu Options .......................................................................................... 83
41. Supervisor and User Password Functions ................................................................... 85
42. Beep Codes ................................................................................................................. 87
43. BIOS Error Messages .................................................................................................. 87
44. Port 80h POST Code Ranges...................................................................................... 88
45. Port 80h POST Codes ................................................................................................. 89
46. Typical Port 80h POST Sequence ............................................................................... 92

9
1Product Description
What This Chapter Contains
1.1 Power Connector Terminology Change ......................................................................... 9
1.2 Overview ...................................................................................................................... 10
1.3 Online Support ............................................................................................................. 15
1.4 Processor ..................................................................................................................... 15
1.5 System Memory ........................................................................................................... 16
1.6 Intel®945G Chipset ..................................................................................................... 21
1.7 PCI Express* Connectors ............................................................................................ 26
1.8 IEEE-1394a Connectors (Optional).............................................................................. 26
1.9 Legacy I/O Controller ................................................................................................... 27
1.10 Audio Subsystem ......................................................................................................... 28
1.11 LAN Subsystem ........................................................................................................... 31
1.12 Hardware Management Subsystem............................................................................. 36
1.13 Power Management ..................................................................................................... 38
1.14 Trusted Platform Module (Optional) ............................................................................. 43
1.1 Power Connector Terminology Change
Technical Product Specifications for ATX and microATX desktop boards referred to the 2 x 2
power connector as the ATX12V connector. With the arrival of BTX form factor desktop boards,
this connector will henceforth be referred to as the Processor Core Power connector.
For information about Refer to
The BTX form factor http://www.formfactors.org

Intel Desktop Board D945GCZ Technical Product Specification
10
1.2 Overview
1.2.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor microBTX Form Factor (10.40 inches by 10.50 inches [264.16 millimeters by
266.70 millimeters])
Processor Support for an Intel®Pentium®4 processor in an LGA775 socket with a 1066, 800,
or 533 MHz system bus
Memory •Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR2 667, DDR2 533, or DDR2 400 MHz DIMMs
•Support for up to 4 GB of system memory
Chipset Intel®945G Chipset, consisting of:
•Intel®82945G Graphics Memory Controller Hub (GMCH)
•Intel®82801G I/O Controller Hub (ICH7)
Video Intel® GMA950 onboard graphics subsystem
Audio Refer to Table 2 on page 11 for a description of audio subsystem options
Legacy I/O Control Legacy I/O controller for diskette drive, serial, parallel, and PS/2* ports
USB Support for USB 2.0 devices
Peripheral
Interfaces
•Eight USB ports
•One serial port
•One parallel port
•Four Serial ATA interfaces
•One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
•One diskette drive interface
•PS/2 keyboard and mouse ports
LAN Support Refer to Table 2 on page 11 for a description of LAN subsystem options.
BIOS •Intel®BIOS (resident in the SPI Flash device)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Expansion
Capabilities
•Two PCI Conventional* bus connectors
•One PCI Express* x1 bus add-in card connector
•One PCI Express x16 bus add-in card connector
Instantly Available
PC Technology
•Support for PCI Local Bus Specification Revision 2.3
•Support for PCI Express Revision 1.0a
•Suspend to RAM support
•Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
continued