Intel H61 Express User manual

USER'S MANUAL
Of
Intel H61 Express Chipset
Based
M/B for Intel LGA 1155 Processors
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
NO. G03-TI61AG-F
Rev: 1.0
Release date: July, 2011

i
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in any
area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request of
the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact malfunction
and crackles due to constant thermal expansion and contraction from the welding
spots’ that connect components and PCB. Computer should go through an adaptive
phase before it boots when it is moved from a cold environment to a warmer one to
avoid condensation phenomenon. These water drops attached on PCB or the surface
of the components can bring about phenomena as minor as computer instability
resulted from corrosion and oxidation from components and PCB or as major as short
circuit that can burn the components. Suggest starting the computer until the
temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer. Using
the close case may decrease the life of other device because the higher temperature in
the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.

ii
CHAPTER 1 INTRODUCTION OF INTEL H61 MOTHERBOARDS ........................1
1-1 FEATURES OF MOTHERBOARD................................................................1
1-1.1 SPECIAL FEATURES OF MOTHERBOARD .................................1
1-2 ISPECIFICATION..........................................................................................2
1-3 LAYOUT DIAGRAM......................................................................................3
CHAPTER 2 HARDWARE INSTALLATION ............................................................4
2-1 CPU INSTALLATION ..................................................................................4
2-2 MEMORY MODULE INSTALLATION...........................................................5
2-3 EXPANSION SLOTS.....................................................................................6
CHAPTER 3 CONNCTORS, HEADERS & JUMPERS SETTING............................6
3-1 MOTHERBOARD INTERNAL CONNECTORS ..................................................6
3-2 I/O BACK PANEL CONNECTORS.....................................................................8
3-3 HEADERS...........................................................................................................9
3-4 JUMPER SETTING.............................................................................................12
CHAPTER 4 USEFUL HELP....................................................................................13
4-1 HOW TO UPDATE BIOS ....................................................................................13
4-2 TROUBLE SHOOTING.......................................................................................13
CHAPTER 5 THUNDER PROTECTION FEATURE.................................................14
TABLE OF CONTENT

1
Chapter 1
Introduction of Intel H61 Motherboards
1-1 Features of Motherboard
The Intel H61 Express chipset based motherboard series are based on Intel H61
Express chipset technology which supports the innovative Intel LGA 1155 socket
Intel® Core™ i7, Intel® Core™ i5, Core™ i3.
The Intel H61 Express chipset based motherboard series comes with an integrated
DDRIII memory controller for dual channel DDRIII 1066 /DDRIII 1333 MHz system
memories which are expandable to 8 GB capacity.
The motherboard provides four serial ATA2 interfaces of 3.0 Gb / s data transfer rate
for four serial ATA devices.
The H61 Express chipset Based motherboard provides Gigabit LAN function by using
megabit LAN chip which support 10M / 100M /1000M/S data transfer rate. Embedded
6-channel HD CODEC is fully compatible with Sound Blaster Pro®standards that
offer you with the home cinema quality and absolutely software compatibility.
The H61 Express chipset based motherboard series offer one PCI-Express 2.0 x16
graphics slot and three PCI Express 2.0 x1 I/O slots to guarantee the rich connectivity
for the I/O of peripherals.
Embedded USB controllers as well as capability of expanding to 10 of USB functional
ports these motherboards meet the future USB demands which are also equipped
with hardware monitor function on system to monitor and protect your system and
maintain your non-stop business computing.
Features like OC-CON Solid Capacitors also provide extra protection to the
motherboard to extend product life and ensure system stability.
1-1-1 Special Features of motherboard
CPU Vcore Input and Output adopt OC-CON solid capacitors. (High-polymer
Solid Electrolysis Aluminum Capacitors)
OC-CON solid capacitors make it possible for motherboard to work from 55 degrees
Centigrade below zero to 125 degrees centigrade.OC-CON capacitors possess
superior physical characteristics to prolong product life ten times than corresponding
motherboard without capacitors every time working temperature increases 20
degrees. Life of product of motherboard with solid capacitors declines only 10% of
those without solid capacitors as well under same conditions.

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1-2 Specification
Spec Description
Design zATX form factor; PCB size:29.5CMx20.0 cm
Chipset zIntel H61 Express Chipset
CPU Socket
zsupports the innovative Intel LGA 1155 socket Intel®
Core™ i7, Core™ i5, Core™ i3 Processor
* For more detailed CPU support information please visit our website
Memory Sockets
zDDRIII module slot x 2
zSupport 2pcs DDRIII 1066/DDRIII 1333 memory modules
expandable to 8 GB
zSupport dual channel function
Expansion Slots z1pcs* PCI-Express2.0 x16by16 lane slot
z3pcs* PCI-Express2.0 x1 slots
Serial ATA2 zThe Intel H61chipset supports four internal Serial ATA
ports for four SATA devices providing 3.0 Gb/sec data
transfer rate
LAN Chip
zIntegrated PCI-E Gigabit LAN chip
zSupports Fast Ethernet LAN function provide
10Mb/100Mb/1000Mb/s data transfer rate
6-CH HD Audio z6-channel HD Audio Codec integrated
zAudio driver and utility included
BIOS zAMI 32MB SMT Flash ROM
Multi I/O
zPS/2 keyboard connector x1
zPS/2 mouse connector x1
zVGA connector x1
zDVI connector x1
zHDMI connector x1
zUSB 2.0 port x6 (for TI61AG series)
zUSB 2.0 port x4 and USB 3.0 port x 2 (for TI61AG3 series)
zUSB 2.0 header x2
zRJ-45 LAN connector x1
zAudio connector x1 (6-CH Audio)
zFront panel audio header x1
zHDMI-SPDIF header x1
zFront panel header x1
zPWRLED header x1
zSpeaker header x1
zSerial Port headerx1
zLPC_CON header x1
Item Checklist
zMotherboard
zDVD for motherboard utilities
zUser’s Manual
zSATA Cable(s)
zI/O back panel shield

3
1-3 Layout Diagram
CPU Socket ATX Power Conn.
CPU FAN1 Header
Front Panel Audio Header
USB 2.0 Headers
SYSFAN1 Header
ATX 12V
Power Connector
Line-IN
MIC-IN
PS/2 Keyboard
Port
VGA Port
DDRIII Slot x 2
Optional USB 2.0 or
USB 3.0 ports
JBAT1
SATAII Connecto
r
(SATA 1, 2, 3, 4)
Audio Connector
COM Header
PCI Express 2.0 x16 by 16 Lane slot
Line-OUT
KB/MS Powe
r
on
(
JP1
)
HDMI port
6-CH HD Audio Chip
HDMI-SPDIF Header
Front Panel Header
Intel H61 Chipset
PCI Express 2.0 x1 slots
Gigabit LAN Chip
DVI Port
VGA port over
DVI port
Power LED Header
Speaker Header
USB 2.0 Ports
LPC_CON Header
RJ-45 LAN Port
RJ-45 over
USB 2.0
p
orts
PS/2 Mouse
Port
HDMI Port
Optional
USB 2.0 /3.0 Ports
PS/2 MS over
PS/2 KB port
USB 2.0 ports

4
Chapter 2
Hardware Installation
WARNING! Turn off your power when adding or removing expansion cards or
other system components. Failure to do so may cause severe
damage to both your motherboard and expansion cards.
2-1 CPU Installation
This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,
referred to as the LGA 1155 socket.
The CPU that comes with the motherboard should have a cooling FAN attached to
prevent overheating. If this is not the case, then purchase a correct cooling FAN
before you turn on your system.
NOTED! Be sure that there is sufficient air circulation across the processor’s
heat sink and CPU cooling FAN is working correctly, otherwise it
may cause the processor and motherboard overheat and damage,
you may install an auxiliary cooling FAN, if necessary.
To install a CPU, first turn off your system and remove its cover. Locate the LGA
1155 socket and open it by first pulling the level sideways away from the socket then
upward to a 135-degree angle. Insert the CPU with the correct orientation as shown
below. The notched corner should point toward the end of the level. Because the
CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation
as shown.
When you install the CPU into the LGA 1155 socket, there’s no force required CPU
insertion; then presses the level to locate position slightly without any extra force.
Pin-1 Indicator
Ali
g
nment ke
y

5
2-2 Memory Module Installation
This motherboard provides two 240-pin DDR III DUAL INLINE MEMORY MODULES
(DIMM) socket for DDR III memory expansion available to maximum memory volume
of 8 GB DDRIII SDRAM.
Valid Memory Configurations
Bank 240-Pin DIMM PCS Maximum Capacity
DIMM1 DDR III 1066/ DDR III1333 X1 4GB
DIMM2 DDR III 1066/ DDR III1333 X1 4GB
Total System Memory (Max 4GB) 2 8GB
Recommend DIMM Module Combination ：
1. One DDRIII Memory Module ----Plug in DIMMM1.
2. Two DDRIII Memory Modules---Plug in DIMM1 & DIMM2 for Dual channel function
Dual channel Limited!
1. Dual channel function only supports when 2 DIMM Modules plug in either both DIMM1
& DIMM2.
2. Memory modules plugged in the same color DIMM must be of the same type, same
size, and same frequency for dual channel function.
Install DDR SDRAM modules to your motherboard is not difficult, you can refer to
figure below to see how to install DDRIII 1066/DDRIII 1333 SDRAM module.
DIMM2(BANK2+BANK3) DIMM1(BANK0+BANK1)
DIMM1 & DIMM2: Dual Channel
NOTE! When you install DIMM module fully into the DIMM socket the eject
tab should be locked into the DIMM module very firmly and fit into its
indention on both sides.
Installation Tips：
Open the two plastic clips of memory slots then push down the module
vertically into the slot. See to it that the hole of the module fit into the notch of
the slot;
The two plastic clips will automatically close if the memory module is fitted in a
proper way.

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2-3 Expansion Slots
The H61 Express chipset based motherboard series offer one PCI-Express2.0 x16
graphics slot and three PCI Express 2.0 x1 I/O slots guarantee the rich connectivity
for the I/O of peripherals.
Chapter 3
Connectors, Headers &Jumper Setting
3-1 Motherboard Internal Connectors
(1) Power Connector (24-pin block): ATXPWR1
ATX Power Supply connector: This is a new defined 24-pins connector that
usually comes with ATX case. The ATX Power Supply allows using soft power
on momentary switch that connect from the front panel switch to 2-pins Power
On jumper pole on the motherboard. When the power switch on the back of the
ATX power supply turned on, the full power will not come into the system board
until the front panel switch is momentarily pressed. Press this switch again will
turn off the power to the system board.
** We recommend that you use an ATX 12V Specification 2.0-compliant power
supply unit (PSU) with a minimum of 350W power rating. This type has 24-pin
and 4-pin power plugs.
** If you intend to use a PSU with 20-pin and 4-pin power plugs, make sure that the
20-pin power plug can provide at least 15A on +12V and the power supply unit
has a minimum power rating of 350W. The system may become unstable or may
not boot up if the power is inadequate.
** If you are using a 20-pin power plug, please refer to Figure1 for power supply
connection. Power plug form power supply and power connectors from
motherboard both adopt key design to avoid mistake installation. You can insert
the power plug into the connector with ease only in the right direction. If the
direction is wrong it is hard to fit in and if you make the connection by force if is
possible.
PCI-E 2.0 x1 Slot
PCI-E 2.0 x1 6 by 16 Lane Slot

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Figure1：20-pinpowerplug Figure2：24-pin power plug
(2) ATX 12V Power Connector (8-pin block) : ATX12V1
This is a new defined 8-pin connector that usually comes with ATX Power
Supply. The ATX Power Supply which fully supports LGA 1155 processor must
including this connector for support extra 12V voltage to maintain system power
consumption. Without this connector might cause system unstable because the
power supply can not provide sufficient current for system.
Pin 1
(3) SATA2 Port connectors: SATAII-1~SATAII-4
These connectors support the provided SATA hard disk cable to connect the
motherboard and SATA2 hard disk drives.