Intel YA810E Configuration guide

Intel®Desktop Board YA810E
Technical Product Specification
December 1999
Order Number A00984-001
The Intel®Desktop Board YA810E may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized
errata are documented in the Intel Desktop Board YA810E Specification Update.

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board YA810E Technical Product
Specification. December 1999
This product specification applies to only standard YA810E boards with BIOS identifier
YA810E10A.86A.
Changes to this specification will be published in the Intel®Desktop Board YA810E Specification
Update before being incorporated into a revision of this document.
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and
Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied
warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The YA810E board may contain design defects or errors known as errata that may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
†Third-party brands and names are the property of their respective owners.
Copyright 1999, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the YA810E desktop board. It describes
the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the YA810E board and its
components to the vendors, system integrators, and other engineers and technicians who need this
level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on this board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
✏NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions which, if not observed, can cause personal injury.

Intel Desktop Board YA810E Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the YA810E board, and X is the instance of the particular part at
that general location. For example, J5J1 is a connector, located at 5J. It is the first connector in
the 5J area.
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
GB Gigabyte (1,073,741,824 bytes)
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
†This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1 Product Description
1.1 Overview ................................................................................................................... 12
1.1.1 Feature Summary ....................................................................................... 12
1.1.2 Manufacturing Options................................................................................ 13
1.1.3 YA810E Board Layout................................................................................. 14
1.1.4 Block Diagram............................................................................................. 15
1.2 Online Support........................................................................................................... 16
1.3 Design Specifications ................................................................................................ 16
1.4 Processor.................................................................................................................. 19
1.5 System Memory......................................................................................................... 20
1.6 Intel®810E Chipset ................................................................................................... 21
1.6.1 Direct AGP.................................................................................................. 22
1.6.2 USB............................................................................................................. 22
1.6.3 IDE Support................................................................................................. 23
1.6.4 Real-Time Clock, CMOS SRAM, and Battery.............................................. 24
1.7 I/O Controller............................................................................................................. 25
1.7.1 Serial Port (Optional)................................................................................... 25
1.7.2 Parallel Port (Optional)................................................................................ 26
1.7.3 PS/2 Keyboard and Mouse (Optional)......................................................... 26
1.8 Graphics Subsystem ................................................................................................. 27
1.9 Audio Subsystem....................................................................................................... 28
1.9.1 AD1881 Analog Codec................................................................................ 28
1.9.2 Audio Connectors........................................................................................ 29
1.10 Hardware Monitor Component................................................................................... 29
1.11 LAN Subsystem......................................................................................................... 30
1.11.1 Intel®82559 PCI LAN Controller ................................................................. 30
1.11.2 LAN Subsystem Software............................................................................ 31
1.11.3 RJ-45 LAN Connector LEDs........................................................................ 31
1.12 Power Management Features.................................................................................... 32
1.12.1 ACPI............................................................................................................ 32
1.12.2 Hardware Support....................................................................................... 34
2 Technical Reference
2.1 Introduction................................................................................................................39
2.2 Memory Map ............................................................................................................. 39
2.3 I/O Map ..................................................................................................................... 40
2.4 DMA Channels .......................................................................................................... 42
2.5 PCI Configuration Space Map ................................................................................... 42
2.6 Interrupts...................................................................................................................43
2.7 PCI Interrupt Routing Map......................................................................................... 44

Intel Desktop Board YA810E Technical Product Specification
vi
2.8 Connectors................................................................................................................ 45
2.8.1 Back Panel Connectors............................................................................... 46
2.8.2 Midboard Connectors.................................................................................. 50
2.8.3 Front Panel Connector ................................................................................ 55
2.9 Jumper Block............................................................................................................. 58
2.10 Mechanical Considerations........................................................................................ 60
2.10.1 FlexATX Form Factor.................................................................................. 60
2.10.2 I/O Shield.................................................................................................... 61
2.11 Electrical Considerations ........................................................................................... 62
2.11.1 Power Consumption.................................................................................... 62
2.11.2 Power Supply Considerations...................................................................... 63
2.11.3 Standby Current Requirements................................................................... 63
2.11.4 Fan Power Requirements............................................................................ 63
2.12 Thermal Considerations............................................................................................. 64
2.13 Reliability................................................................................................................... 65
2.14 Environmental............................................................................................................ 66
2.15 Regulatory Compliance ............................................................................................. 67
2.15.1 Safety Regulations...................................................................................... 67
2.15.2 EMC Regulations ........................................................................................ 67
2.15.3 Certification Markings.................................................................................. 68
3 Overview of BIOS Features
3.1 Introduction................................................................................................................69
3.2 BIOS Flash Memory Organization............................................................................. 70
3.3 PCI IDE Support........................................................................................................ 70
3.4 System Management BIOS (SMBIOS)...................................................................... 71
3.5 BIOS Upgrades ......................................................................................................... 72
3.5.1 Language Support....................................................................................... 72
3.5.2 Custom Splash Screen................................................................................ 72
3.6 Recovering BIOS Data .............................................................................................. 73
3.7 Boot Options.............................................................................................................. 74
3.7.1 CD-ROM and Network Boot........................................................................ 74
3.7.2 Booting Without Attached Devices .............................................................. 74
3.8 USB Legacy Support................................................................................................. 75
3.9 BIOS Security Features............................................................................................. 76
4 BIOS Setup Program
4.1 Introduction................................................................................................................77
4.2 Maintenance Menu.................................................................................................... 78
4.2.1 Extended Configuration Submenu............................................................... 79
4.3 Main Menu................................................................................................................. 80
4.4 Advanced Menu......................................................................................................... 81
4.4.1 Boot Configuration Submenu ...................................................................... 82
4.4.2 Peripheral Configuration Submenu.............................................................. 83
4.4.3 IDE Configuration Submenu........................................................................ 84
4.4.4 IDE Configuration Sub-Submenus............................................................... 85
4.4.5 Event Log Configuration Submenu.............................................................. 86

Contents
vii
4.5 Security Menu............................................................................................................ 87
4.6 Power Menu.............................................................................................................. 88
4.7 Boot Menu................................................................................................................. 89
4.7.1 IDE Drive Configuration Submenu............................................................... 90
4.8 Exit Menu .................................................................................................................. 91
5 Error Messages and Beep Codes
5.1 BIOS Error Messages................................................................................................ 93
5.2 Port 80h POST Codes............................................................................................... 95
5.3 Bus Initialization Checkpoints.................................................................................... 99
5.4 Speaker................................................................................................................... 100
5.5 BIOS Beep Codes................................................................................................... 101
5.6 Enhanced Diagnostics............................................................................................. 102
Figures
1. YA810E Board Components...................................................................................... 14
2. Block Diagram........................................................................................................... 15
3. Intel 810E Chipset Block Diagram............................................................................. 21
4. Block Diagram of Audio Subsystem with AD1881 Codec........................................... 28
5. Connector Groups..................................................................................................... 45
6. Back Panel Connectors............................................................................................. 46
7. Midboard Connectors ................................................................................................ 50
8. Front Panel Connector............................................................................................... 55
9. Location of the BIOS Setup Jumper Block................................................................. 58
10. Board Dimensions ..................................................................................................... 60
11. I/O Shield Dimensions............................................................................................... 61
12. High Temperature Zones........................................................................................... 64
13. Memory Map of the Flash Memory Device ................................................................ 70
14. Enhanced Diagnostic LEDs..................................................................................... 102
Tables
1. Feature Summary...................................................................................................... 12
2. Manufacturing Options............................................................................................... 13
3. Specifications ............................................................................................................ 16
4. Supported Processors............................................................................................... 19
5. System Memory Configuration................................................................................... 20
6. Supported Graphics Refresh Rates........................................................................... 27
7. LAN Connector LED States....................................................................................... 31
8. Effects of Pressing the Power Switch........................................................................ 32
9. Power States and Targeted System Power............................................................... 33
10. Wake Up Devices and Events ................................................................................... 34
11. Fan Connector Descriptions ...................................................................................... 35
12. System Memory Map................................................................................................. 39
13. I/O Map ..................................................................................................................... 40
14. DMA Channels .......................................................................................................... 42
15. PCI Configuration Space Map ................................................................................... 42

Intel Desktop Board YA810E Technical Product Specification
viii
16. Interrupts...................................................................................................................43
17. PCI Interrupt Routing Map......................................................................................... 44
18. PS/2 Mouse/Keyboard (Optional).............................................................................. 47
19. USB Ports 0, 1, and 2................................................................................................ 47
20. Serial Port (Optional)................................................................................................. 47
21. Parallel Port (Optional) .............................................................................................. 48
22. VGA Port................................................................................................................... 48
23. LAN........................................................................................................................... 49
24. Audio Line In.............................................................................................................. 49
25. Audio Line Out........................................................................................................... 49
26. Front Panel Audio (J2D1).......................................................................................... 51
27. Fan 2, Processor (J7J1) ............................................................................................ 51
28. Primary IDE (J7E1).................................................................................................... 51
29. Secondary IDE, Slimline, ATA-5 (J8E1)..................................................................... 52
30. ATAPI CD-ROM (J7C1)............................................................................................. 52
31. Power (J8B1)............................................................................................................. 53
32. USB Front Panel, Optional (J7A1)............................................................................. 53
33. Fan 1, Chassis (J6A1)............................................................................................... 53
34. Speaker (J2C1) ......................................................................................................... 53
35. Serial Port, Optional (J1G2)....................................................................................... 54
36. Front Panel Connector (J8C1)................................................................................... 56
37. States for a Single-Colored Power LED..................................................................... 56
38. States for a Dual-Colored Power LED ....................................................................... 56
39. BIOS Setup Configuration Jumper Settings (J7A1) ................................................... 59
40. Power Usage............................................................................................................. 62
41. Fan DC Power Requirements.................................................................................... 63
42. Thermal Considerations for Components .................................................................. 65
43. Environmental Specifications..................................................................................... 66
44. Safety Regulations .................................................................................................... 67
45. EMC Regulations....................................................................................................... 67
46. Supervisor and User Password Functions................................................................. 76
47. BIOS Setup Program Menu Functions....................................................................... 77
48. BIOS Setup Program Function Keys ......................................................................... 78
49. Maintenance Menu.................................................................................................... 78
50. Extended Configuration Submenu............................................................................. 79
51. Main Menu................................................................................................................. 80
52. Advanced Menu......................................................................................................... 81
53. Boot Configuration Submenu..................................................................................... 82
54. Peripheral Configuration Submenu............................................................................ 83
55. IDE Configuration...................................................................................................... 84
56. IDE Configuration Sub-Submenus............................................................................. 85
57. Event Log Configuration Submenu............................................................................ 86
58. Security Menu............................................................................................................ 87
59. Power Menu .............................................................................................................. 88
60. Boot Menu................................................................................................................. 89
61. IDE Drive Configuration Submenu............................................................................. 90
62. Exit Menu .................................................................................................................. 91
63. BIOS Error Messages................................................................................................ 93

Contents
ix
64. Uncompressed INIT Code Checkpoints..................................................................... 95
65. Boot Block Recovery Code Check Points.................................................................. 95
66. Runtime Code Uncompressed in F000 Shadow RAM ............................................... 96
67. Bus Initialization Checkpoints.................................................................................... 99
68. Upper Nibble High Byte Functions............................................................................. 99
69. Lower Nibble High Byte Functions........................................................................... 100
70. Beep Codes............................................................................................................. 101
71. Diagnostic LED Codes............................................................................................. 103

Intel Desktop Board YA810E Technical Product Specification
x

11
1 Product Description
What This Chapter Contains
1.1 Overview ................................................................................................................... 12
1.2 Online Support........................................................................................................... 16
1.3 Design Specifications ................................................................................................ 16
1.4 Processor.................................................................................................................. 19
1.5 System Memory......................................................................................................... 20
1.6 Intel®810E Chipset ................................................................................................... 21
1.7 I/O Controller............................................................................................................. 25
1.8 Graphics Subsystem ................................................................................................. 27
1.9 Audio Subsystem....................................................................................................... 28
1.10 Hardware Monitor Component................................................................................... 29
1.11 LAN Subsystem......................................................................................................... 30
1.12 Power Management Features.................................................................................... 32

Intel Desktop Board YA810E Technical Product Specification
12
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the YA810E board’s major features.
Table 1. Feature Summary
Form Factor FlexATX (9.0 inches by 7.5 inches)
Processor Support for either an:
•Intel®Pentium®III processor with 512 KB L2 cache (in an FCPGA package)
•Intel®Celeron™processor with 128 KB L2 cache (in a PGA package)
Memory •Two 168-pin dual inline memory module (DIMM) sockets
•Supports up to 512 MB of 100 MHz non-ECC synchronous DRAM (SDRAM)
•Support for serial presence detect (SPD) and non-SPD DIMMs
Chipset Intel®810E chipset, consisting of:
•Intel®
82810E Graphics/Memory Controller Hub (GMCH)
•Intel®
82801AA I/O Controller Hub (ICH)
•Intel®
82802AB 4 Mbit Firmware Hub (FWH)
Direct AGP Video •Intel
82810E DC-133 GMCH
•VGA port connector on back panel
Audio Audio Codec ’97 (AC’97) compatible audio subsystem, consisting of the
following:
•Intel 82801AA ICH (AC link output)
•Analog Devices AD1881 analog codec
I/O Control LPC47B277 Low Pin Count (LPC) I/O controller
Peripheral Interfaces •Three back-panel mounted universal serial bus (USB) ports
•Two IDE interfaces with Ultra DMA support
BIOS •Intel/AMI BIOS stored in an Intel 82802AB 4 Mbit firmware hub (FWH)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and
Play, and SMBIOS
LAN Controller Intel®82559 local area network (LAN) controller
Instantly Available PC •Support for
PCI Local Bus Specification , Revision 2.2
•Suspend-to-RAM support
•Wake from USB ports
✏NOTE
The YA810E board is designed to support only USB-aware operating systems.
For information about Refer to
The board’s compliance level with ACPI, Plug and Play, and SMBIOS Table 3, page 16

Product Description
13
1.1.2 Manufacturing Options
Table 2 describes the YA810E board’s manufacturing options. Not every manufacturing option is
available in all marketing channels. Please contact your Intel representative to determine which
manufacturing options are available to you.
Table 2. Manufacturing Options
Legacy I/O
Connectors •One back panel 9-pin serial port connector, or one internal serial port connector
•One back panel 25-pin parallel port connector
•PS/2 keyboard and mouse connectors
Diagnostic LEDs Extended diagnostics back-panel four-LED set
USB Two internal USB ports are available for front panel access
Slimline IDE ATA-5 compliant connector
Enhanced Video 4 MB SDRAM display cache (optional)
Management
Level 4 Hardware monitor

Intel Desktop Board YA810E Technical Product Specification
14
1.1.3 YA810E Board Layout
Figure 1 shows the location of the major components on the YA810E board.
OM08944
BA
O
P
Q
K
J
L
M
ND
C
E
I H G F
A Diagnostic LEDs J Battery
B Back panel connectors K Speaker
C Intel 82810E GMCH (Graphics/Memory Controller Hub) L Intel 82801AA ICH (I/O Controller Hub)
D Processor socket M Intel 82802AB FWH (Firmware Hub)
E DIMM sockets N 4 MB display cache (optional)
F Primary IDE connector O SMSC LPC47B277 I/O Controller
G Secondary IDE connector (Slimline) P Intel 82559 Ethernet Controller
H Front panel connector Q AD1881 Audio Codec
I Power connector
Figure 1. YA810E Board Components

Product Description
15
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the YA810E board.
810E Chipset
Processor
Connector
DIMM Banks
0 and 1
Primary/
Secondary IDE
Interface
LPC I/O
Controller
Serial Port A
(Optional)
ATA33/66
(Back Panel)
Port 0
USB
66/100/133
MHz Host Bus
AC Link AD1881
Analog
Codec
LAN
Subsystem
Hardware
Monitor
(Optional)
10/100
Mbps
Ethernet
82801AA I/O Controller Hub
(ICH)
82810E
Graphics Memory
Controller Hub
(GMCH)
82802AB
Firmware Hub
(FWH)
100 MHz
SDRAM
Bus
AHA
Bus
Display
Interface
VGA
Port
4 MB
Display
Cache
(Optional)
OM09092
Line Out
Line In
CD-ROM
Port 2
(Back Panel)
Port 1
USB Hub
LPC
Bus
Port 4
Parallel Port
(Optional)
Diagnostic
LEDs
(Optional)
(Front Panel)
Port 3
PCI
Bus
PS/2 Keyboard
(Optional)
PS/2 Mouse
(Optional)
SMBus
Figure 2. Block Diagram

Intel Desktop Board YA810E Technical Product Specification
16
1.2 Online Support
Find information about YA810E desktop boards under “Product Info” or “Customer Support” at
these World Wide Web sites:
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
1.3 Design Specifications
Table 3 lists the specifications applicable to the YA810E board.
Table 3. Specifications
Reference
Name Specification Title Version, Revision Date, and Ownership This specification is available from:
AC ‘97 Audio Codec ‘97 Version 2.1,
May 1998,
Intel Corporation.
ftp://download.intel.com/
pc-supp/platform/ac97
ACPI Advanced Configuration
and Power Interface
Specification
Version 1.0b,
July 1, 1998,
Intel Corporation,
Microsoft Corporation,
and Toshiba Corporation.
http://www.teleport.com/~acpi/
AGP Accelerated Graphics Port
Interface Specification
(2X only)
Version 2.0,
May 4, 1998,
Intel Corporation.
the Accelerated Graphics
Implementers Forum at:
http://www.agpforum.org/
AMI BIOS American Megatrends
BIOS Specification
AMIBIOS 99,
1999
American Megatrends, Inc.
http://www.amibios.com, or
http://www.ami.com/download/
amibios99.pdf
ATA-3 Information Technology -
AT Attachment-3 Interface,
X3T10/2008D
Version 6,
October 1998,
ASC X3T10.
ATA Anonymous FTP Site:
ftp://www.dt.wdc.com/ata/
ata-3/
ATA-5 Information Technology -
AT Attachment-3 Interface,
X3T10/2008D
Version 6,
October 1998,
ASC X3T10.
ATA Anonymous FTP Site:
ftp://www.dt.wdc.com/ata/
ata-3/
ATAPI Information Technology AT
Attachment with Packet
Interface Extensions
T13/1153D
Version 18,
August 19, 1998,
Contact: T13 Chair,
Seagate Technology.
T13 Anonymous FTP Site:
ftp://fission.dt.wdc.com/
x3t13/project/
d1153r18.pdf
ATX ATX Specification Version 2.01,
February 1997,
Intel Corporation.
http://developer.intel.com/
design/motherbd/atx.htm
El Torito Bootable CD-ROM format
specification
Version 1.0,
January 25, 1995,
Phoenix Technologies Ltd.
and IBM Corporation.
the Phoenix Web site at:
http://www.ptltd.com/
techs/specs.html
continued

Product Description
17
Table 3. Specifications (continued)
Reference
Name Specification Title Version, Revision Date and Ownership This specification is available from:
LPC Low Pin Count
Interface Specification
Version 1.0,
September 29, 1997,
Intel Corporation.
http://www.intel.com/
design/chipsets/industry/
lpc.htm
FlexATX FlexATX Addendum to
the microATX
Specification,
Version 1.0
Version 1.0
March 1999,
Intel Corporation.
http://www.teleport.com/
~ffsupprt/spec/
FlexATXaddn1_01.pdf
MicroATX microATX
Motherboard Interface
Specification
Version 1.0, December 1997,
Intel Corporation. http://www.teleport.com/
~ffsupprt/spec/
SFX Power Supply
Design Guide
Version 1.0, December 1997,
Intel Corporation. http://www.teleport.com/
~ffsupprt/spec/microatx/
sfx11_ps.pdf
PCI PCI Local Bus
Specification
Version 2.2,
December 18, 1998,
PCI Special Interest Group.
http://www.pcisig.com/
PCI Bus Power
Management Interface
Specification
Version 1.1,
December 18, 1998,
PCI Special Interest Group.
http://www.pcisig.com/
Plug and Play Plug and Play BIOS
Specification
Version 1.0a,
May 5, 1994,
Compaq Computer Corp.,
Phoenix Technologies Ltd., and
Intel Corporation.
ftp://download.intel.com/
ial/wfm/bio10a.pdf
SDRAM
DIMMs
(64-and 72-bit)
PC SDRAM
Unbuffered DIMM
Specification
Version 1.0, February 1998,
Intel Corporation. http://www.intel.com/ design/chipsets/memory/
PC SDRAM DIMM
Specification
Version 1.5, November 1997,
Intel Corporation. http://www.intel.com/ design/chipsets/memory/
PC Serial Presence
Detect (SPD)
Specification
Version 1.2A, December 1997,
Intel Corporation. http://www.intel.com/ design/chipsets/memory/
SMBIOS System Management
BIOS
Version 2.3.1,
August 12, 1998,
Award Software International Inc.,
Dell Computer Corporation,
Hewlett-Packard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
American Megatrends Inc.,
SystemSoft Corporation, and
Compaq Computer Corporation.
http://developer.intel.com/
ial/wfm/design/smbios
continued

Intel Desktop Board YA810E Technical Product Specification
18
Table 3. Specifications (continued)
Reference
Name Specification Title Version, Revision Date and Ownership This specification is available from:
UHCI Universal Host Controller
Interface Design Guide
Version 1.1,
March 1996,
Intel Corporation.
http://www.usb.org/
developers
USB Universal Serial Bus
Specification
Version 1.1,
September 23, 1998,
Compaq Computer Corporation,
Intel Corporation, Microsoft
Corporation, and NEC.
http://www.usb.org/
developers
WfM Wired for Management
Baseline
Version 2.0,
December 18, 1998,
Intel Corporation.
http://developer.intel.com/
ial/WfM/wfmspecs.htm

Product Description
19
1.4 Processor
CAUTION
The YA810E board supports processors that draw a maximum of 22 A. Using a processor that
draws more than 22 A can damage the processor, the board, and the power supply. See the
processor’s data sheet for current usage requirements.
CAUTION
Before installing or removing the processor, make sure that AC power has been removed by
unplugging the power cord from the computer. Failure to do so could damage the processor and
the board.
The YA810E board supports either an Intel Pentium III processor (FCPGA package), or an Intel
Celeron processor (PGA package) as shown in Table 4. The host bus speed is automatically
selected.
Table 4. Supported Processors
Processor Type Processor Designation Host Bus Speed (MHz) L2 Cache Size (KB)
Pentium III processors 500E, 550E, and 600E 100 512
533B and 600B 133 512
533EB, 600EB, 667, and 733 133 256
Celeron processors 300A, 333, 366, 400, 433, 466,
500, and 533 66 128
All supported onboard memory can be cached, up to the cachability limit of the processor.
For information about Refer to
Processor support for the YA810E board http://support.intel.com/support/motherboards/desktop
Processor data sheets http://www.intel.com/design/litcentr

Intel Desktop Board YA810E Technical Product Specification
20
1.5 System Memory
CAUTION
To be compliant with applicable Intel®SDRAM memory specifications, the YA810E board should
be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. If your
memory modules do not support SPD, the BIOS will attempt to configure the memory controller for
normal operation; however, the DIMMs may not function at their optimum speed.
CAUTION
Before installing or removing memory, make sure that AC power has been removed by unplugging
the power cord from the computer. Failure to do so could damage the memory and the board.
CAUTION
Because the main system memory is also used as video memory, the board requires 100 MHz
SDRAM DIMMs even though the processor’s host bus speed is 66 MHz. It is highly recommended
that SPD DIMMs be used, since this allows the BIOS to read the SPD data and program the
chipset to accurately configure memory settings for optimum performance. If non-SPD memory is
installed, the BIOS will attempt to correctly configure the memory settings, but performance and
reliability may be impacted.
The YA810E board has two DIMM sockets. The minimum memory size is 16 MB and the
maximum memory size is 512 MB. The BIOS automatically detects memory type, size, and
speed. Memory can be installed in one or both sockets. Memory size can vary between sockets.
The YA810E board supports the following memory features:
•3.3 V, 168-pin DIMMs with gold-plated contacts
•100 MHz SDRAM
•Serial Presence Detect (SPD) or non-SPD memory (BIOS recovery requires SPD DIMMs)
•Non-ECC (64-bit) memory
•Unbuffered single- or double-sided DIMMs
The board is designed to support DIMMs in the configurations listed in Table 5 below.
Table 5. System Memory Configuration
DIMM Size Non-ECC Configuration
16 MB 2 Mbit x 64
32 MB 4 Mbit x 64
64 MB 8 Mbit x 64
128 MB 16 Mbit x 64
256 MB 32 Mbit x 64
For information about Refer to
The
PC Serial Presence Detect Specification Table 3, page 16
Obtaining copies of PC SDRAM specifications http://www.intel.com/design/pcisets/memory