JVC GR-D200US User manual

SERVICE MANUAL
COPYRIGHT © 2003 VICTOR COMPANY OF JAPAN, LIMITED No.YF001
2003/8
DIGITAL VIDEO CAMERA
YF00120038GR-D200US
For disassembling and assembling of MECHANISM ASSEMBLY, refer to the SERVICE MANUAL No.86700 (MECHANISM ASSEMBLY).
TABLE OF CONTENTS
1 PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
2 SPECIFIC SERVICE INSTRUCTIONS. . . . . . This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS.
3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
5 TROUBLE SHOOTING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17
GR-D200US [M3D2S9]

1-2 (No.YF001)
SPECIFICATION

(No.YF001)1-3
SECTION 1
PRECAUTIONS
1.1 SAFTY PRECAUTIONS
Prior to shipment from the factory, JVC products are strictly
inspected to conform with the recognized product safety and
electrical codes of the countries in which they are to be
sold.However,in order to maintain such compliance, it is equally
important to implement the following precautions when a set is
being serviced.
1.1.1 Precautions during Servicing
(1) Locations requiring special caution are denoted by labels
and inscriptions on the cabinet, chassis and certain parts of
the product.When performing service, be sure to read and
comply with these and other cautionary notices appearing
in the operation and service manuals.
(2) Parts identified by the symbol and shaded ( ) parts
are critical for safety.
Replace only with specified part numbers.
NOTE :
Parts in this category also include those specified to
comply with X-ray emission standards for products
using cathode ray tubes and those specified for
compliance with various regulations regarding
spurious radiation emission.
(3) Fuse replacement caution notice.
Caution for continued protection against fire hazard.
Replace only with same type and rated fuse(s) as
specified.
(4) Use specified internal wiring. Note especially:
• Wires covered with PVC tubing
• Double insulated wires
• High voltage leads
(5) Use specified insulating materials for hazardous live parts.
Note especially:
• Insulation Tape
• PVC tubing
•Spacers
• Insulation sheets for transistors
•Barrier
(6) When replacing AC primary side components (transformers,
power cords, noise blocking capacitors, etc.) wrap ends of
wires securely about the terminals before soldering.
Fig.1-1-1
(7) Observe that wires do not contact heat producing parts
(heatsinks, oxide metal film resistors, fusible resistors, etc.)
(8) Check that replaced wires do not contact sharp edged or
pointed parts.
(9) When a power cord has been replaced, check that 10-15
kg of force in any direction will not loosen it.
Fig.1-1-2
(10) Also check areas surrounding repaired locations.
(11) Products using cathode ray tubes (CRTs)In regard to such
products, the cathode ray tubes themselves, the high
voltage circuits, and related circuits are specified for
compliance with recognized codes pertaining to X-ray
emission. Consequently, when servicing these products,
replace the cathode ray tubes and other parts with only the
specified parts. Under no circumstances attempt to modify
these circuits.Unauthorized modification can increase the
high voltage value and cause X-ray emission from the
cathode ray tube.
(12) Crimp type wire connectorIn such cases as when replacing
the power transformer in sets where the connections
between the power cord and power trans former primary
lead wires are performed using crimp type connectors, if
replacing the connectors is unavoidable, in order to prevent
safety hazards, perform carefully and precisely according
to the following steps.
•Connector part number :E03830-001
•Required tool : Connector crimping tool of the proper
type which will not damage insulated parts.
•Replacement procedure
a) Remove the old connector by cutting the wires at a
point close to the connector.Important : Do not
reuse a connector (discard it).
Fig.1-1-3
b) Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
Fig.1-1-4
c) Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
Fig.1-1-5
d) AsshowninFig.1-1-6, use the crimping tool to crimp
the metal sleeve at the center position. Be sure to
crimp fully to the complete closure of the tool.
Fig.1-1-6
e) Check the four points noted in Fig.1-1-7.
Fig.1-1-7
Power cord
cut close to connector
15 mm
Connector
Metal sleeve
1.25
2.0
5.5
Crimping tool
Not easily pulled free Crimped at approx. cente
r
of metal sleev
e
Conductors extended
Wire insulation recessed
more than 4 mm

1-4 (No.YF001)
1.1.2 Safety Check after Servicing
Examine the area surrounding the repaired location for damage
or deterioration. Observe that screws, parts and wires have been
returned to original positions, Afterwards, perform the following
tests and confirm the specified values in order to verify
compliance with safety standards.
(1) Insulation resistance test
Confirm the specified insulation resistance or greater
between power cord plug prongs and externally exposed
parts of the set (RF terminals, antenna terminals, video and
audio input and output terminals, microphone jacks,
earphone jacks, etc.).See table 1 below.
(2) Dielectric strength test
Confirm specified dielectric strength or greater between
power cord plug prongs and exposed accessible parts of
the set (RF terminals, antenna terminals, video and audio
input and output terminals, microphone jacks, earphone
jacks, etc.). See Fig.1-1-11 below.
(3) Clearance distance
When replacing primary circuit components, confirm
specified clearance distance (d), (d') between soldered
terminals, and between terminals and surrounding metallic
parts. See Fig.1-1-11 below.
Fig.1-1-8
(4) Leakage current test
Confirm specified or lower leakage current between earth
ground/power cord plug prongs and externally exposed
accessible parts (RF terminals, antenna terminals, video
and audio input and output terminals, microphone jacks,
earphone jacks, etc.).
Measuring Method : (Power ON)Insert load Z between
earth ground/power cord plug prongs and externally
exposed accessible parts. Use an AC voltmeter to
measure across both terminals of load Z. See Fig.1-1-9
and following Fig.1-1-12.
Fig.1-1-9
(5) Grounding (Class 1 model only)
Confirm specified or lower grounding impedance between
earth pin in AC inlet and externally exposed accessible
parts (Video in, Video out, Audio in, Audio out or Fixing
screw etc.).Measuring Method:
Connect milli ohm meter between earth pin in AC inlet and
exposed accessible parts. See Fig.1-1-10 and grounding
specifications.
Fig.1-1-10
Fig.1-1-11
Fig.1-1-12
NOTE :
These tables are unofficial and for reference only. Be sure to confirm the precise values for your particular country and locality.
Chassis Power cord
primary wire
d'
d
ab
c
VA
Externally
exposed
accessible part
Z
Exposed accessible part
Grounding Specifications
AC inlet
Region
USA & Canada
Europe & Australia
Grounding Impedance (Z)
Z 0.1 ohm
Z 0.5 ohm
Earth pin
MIlli ohm meter
AC Line Voltage Region
Japan
Europe & Australia
R 1 M /500 V DC
USA & Canada 1 M R 12 M /500 V DC
R 10 M /500 V DC
Insulation Resistance (R)Dielectric Strength ClearanceDistance (d), (d')
100 V
100 to 240 V
110 to 130 V
110 to 130 V
200 to 240 V
AC 1 kV 1 minute
AC 1.5 kV 1 minute
AC 1 kV 1 minute
(Class )
(Class )
AC 3 kV 1 minute
AC 1.5 kV 1 minute
d, d' 3 mm
d, d' 4 mm
d, d' 3.2 mm
d' 8 mm (Power cord)
d' 6 mm (Primary wire)
d 4 mm
AC Line Voltage Region
Japan
Europe & Australia
USA & Canada
Load Z Leakage Current (i) a, b, c
100 V
110 to 130 V
110 to 130 V
220 to 240 V
i 1 mA rms
i 0.5 mA rms
i 0.7 mA peak
i 2 mA dc
i 0.7 mA peak
i 2 mA dc
Exposed accessible parts
Exposed accessible parts
Antenna earth terminals
Other terminals
1
1.5
2
50
0.15

(No.YF001)1-5
SECTION 3
DISASSEMBLY
3.1 BEFORE ASSEMBLY AND DISASSEMBLY
3.1.1 Precautions
• Be sure to disconnect the power supply unit prior to mounting
and soldering of parts.
• Prior to removing a component part that needs to disconnect
its connector(s) and its screw(s), first disconnect the wire(s)
from the connector(s), and then remove the screw(s).
• When connecting/disconnecting wires, pay enough attention
not to damage the connectors.
• When inserting the flat wire to the connector, pay attention to
the direction of the flat wire.
• Be careful in removing the parts to which some spacer or
shield is attached for reinforcement or insulation.
• When replacing chip parts (especially IC parts), first remove
the solder completely to prevent peeling of the pattern.
• Tighten screws properly during the procedures. Unless
specified otherwise, tighten screws at a torque of 0.118N·m
(1.2kgf·cm). However, 0.118N·m (1.2kgf·cm) is a value at the
time of production. At the time of service, perform the
procedure at a torque 10% less than 0.118N·m (1.2kgf·cm).
(See "SERVICE NOTE" as for tightening torque.)
3.1.2 Destination of connectors
3.1.3 Disconnection of connectors (Wires)
Fig.3-1-1
3.1.4 Tools required for disassembly and assembly
Fig.3-1-2
•Torque driver
Be sure to use to fastening the mechanism and exterior parts
because those parts must strictly be controlled for tightening
torque.
•Bit
This bit is slightly longer than those set in conventional torque
drivers.
•Tweezers
To be used for removing and installing parts and wires.
•Chip IC replacement jig
To be used for replacement of IC.
•Cleaning cloth
Recommended cleaning cloth to wipe down the video heads,
mechanism (tape transport system), optical lens surface.
3.2 ASSEMBLY AND DISASSEMBLY OF MAIN PARTS
3.2.1 Assembly and disassembly
When reassembling, perform the step(s) in reverse order.
(∗1) Order of steps in Procedure
When reassembling, preform the step(s) in the reverseorder.
These numbers are also used as the identification (location)
No. of parts Figures.
(∗2) Part to be removed or installed.
(∗3) Fig. No. showing Procedure or Part Location.
C = CABINET
(∗4) Identification of part to be removed, unhooked, unlocked,
released, unplugged, unclamped or unsoldered.
S = Screw
L = Lock, Release, Hook
SD = Solder
CN = Connector
[Example]
• 4 (S1a) = Remove four S1a screws.
• 3 (L1a) = Disengage three L1a hooks.
• 2 (SD1a) = Unsolder two SD1a points.
• CN1a = Remove a CN1a connector.
(∗5) Adjustment information for installation.
CN2a
CN2b
MAIN CN101
MAIN CN103
40
2
CONN. No. PIN No.CONNECTOR
Two kinds of double-arrows in connection tables respectively
show kinds of connector/wires.
: The connector of the side to remove
: Wire: Flat wire : Board to board (B-B)
MONI/BW CN761
MIC CN762
B-B Connector
B-B Connector
B-B Connector
· Pull the both ends of the board in the direction of the arrow, and remove the B-B Connector.
FPC Connector
Wire
· Pull both ends of the connector in the arrow
direction, remove the lock and disconnect the flat
wire.
FPC Connector
Lock
Wire
· Extend the locks in the direction of the arrow for
unlocking and then pull out the wire. After
removing the wire, immediately restore the locks
to their original positions because the locks are
apt to come off the connector.
Cleaning cloth
KSMM-01
Torque driver
YTU94088
Bit
YTU94088-003
Chip IC replacement jig
PTS40844-2
Tweezers
P-895
( 4) ( 5)( 2) ( 3)( 1)
TOP COVER ASSEMBLY
UPPER ASSEMBLY
(Inc. VF ASSEMBLY,
SPEAKER/MONITOR)
VF ASSEMBLY
Fig.C1
Fig.C2-1
Fig.C2-2
S1,2(L1)
S2a,2(S2b),3(S2c)
2(S2d),S2e,S2c
L2,CN2a,b
2(S8),L8,CN8a
-
-
NOTE 8a
NOTE 8b
[1]
[2]
[8]
STEP
No. PART NOTE
Fig.
No. POINT

1-6 (No.YF001)
3.2.2 ASSEMBLY/DISASSEMBLY OF CABINET PARTS AND ELECTRICAL PARTS
zDisassembly procedure
NOTE3:
The sub operation unit is attached to the UPPER CASE by
using double-sided adhesive tape. Don't remove the sub
operation unit except when replacing it.
Also, the FPC is attached to the backside of the UPPER
CASE by using a spacer. Don't remove it.
NOTE4a:
When removing the JACK BOARD ASSEMBLY, remove the
two screws 17 and 18 if the screws attach the LUG wire to
the JACK BOARD ASSEMBLY. And then, remove the COV-
ER (UPPER).
NOTE4b:
When attaching the JACK BOARD ASSEMBLY, be careful
about the position of switch.
NOTE5:
The wire of the MO-SW BOARD ASSEMBLY is attached to
the backside of the UPPER CASE by using a spacer. Don't
remove the wire from the spacer except when replacing the
MO-SW BOARD ASSEMBLY.
NOTE6a:
When disassembling the MONITOR ASSEMBLY, first re-
move the COVER (UPPER). Be careful not to damage the
parts when removing the COVER (UPPER), especially if the
FPC of the sub operation unit are attached to the wire of the
MO-SW BOARD ASSEMBLY by using a spacer.
NOTE6b:
Since the HINGE ASSEMBLY is inserted between the
EARTH PLATE (U) and and the UPPER CASE, be careful
not to damage or deform the EARTH PLATE (U) when re-
moving the MONITOR ASSEMBLY.
NOTE6c:
For the disassembly procedure of MONITOR ASSEMBLY,
see “3.2.3 DISASSEMBLY/ASSEMBLY of [6] MONITOR
ASSEMBLY.”
NOTE7a:
When removing the FRONT ASSEMBLY, open the CAS-
SETTE COVER and remove the screw.
NOTE7b:
Be careful of electric shock due to a capacitor for lighting a
strobe.
NOTE7c:
When attaching the FRONT ASSEMBLY, put the FRONT
ASSEMBLY securely in the slot of the LOWER CASE.
Be careful about the engagement of the wire.
NOTE8:
During the procedure, open the CASSETTE COVER so that
you can see the sticker attached to the CASSETTE HOUS-
ING ASSEMBLY. If you keep the CASSETTE COVER com-
pletely open during the procedure, the SW501 on the
backside of the REAR ASSEMBLY may be damaged.
NOTE10a:
Be careful not to damage the lens.
NOTE10b:
Be careful not to damage or cut the FPC.
NOTE10c:
For the disassembly procedure of OP BLOCK ASSEMBLY/
CCD BOARD ASSEMBLY, see “3.2.4 ASSEMBLY/DISAS-
SEMBLY OF [10] OP BLOCK ASSEMBLY/CCD BOARD
ASSEMBLY.”
NOTE11:
For the disassembly procedure of the VF ASSEMBLY, see
“3.2.5 DISASSEMBLY/ASSEMBLY OF [11] VF ASSEM-
BLY.”
zDestination of connectors
STEP
No. PART Fig. No. POINT NOTE
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]
[14]
[15]
/[16]
RING (VF)
UPPER ASSEMBLY
SUB OPE UNIT
JACK BOARD ASSEMBLY
MO-SW BOARD ASSEMBLY
MONITOR ASSEMBLY
FRONT ASSEMBLY
REAR ASSEMBLY
MAIN BOARD ASSEMBLY
OP BLOCK ASSEMBLY
/CCD BOARD ASSEMBLY
VF ASSEMBLY
BASE
BRACKET(TOP)ASSEMBLY
LOWER ASSEMBLY
PRE/MDA BOARD ASSEMBLY
/MECHANISM ASSEMBLY
S1a,S1b,2(L1)
S2a,COVER(JACK)
2(S2a),S2b,4(S2c),CN2a,b
CN3,SPACER
COVER(JACK),S4a,4(S4b),CN4
S5,L5
2(S6a),L6a,COVER(UPPER)
2(S6b),2(L6b), LUG WIRE
2(S7),L7a,b,c,CN7a,b,c
CN8,S8a,3(S8b)
CN9a,b,c,d,e,f,S9a,S9b,L9
S10a,2(S10b),L10
S11a,S11b,L11a,b
2(S12)
3(S13),4(L13)
2(S14),L14
3(S15a),BRACKET(MECHA)ASSEMBLY,
2(S15b),L15,SHIELD COVER
CN15a,b,c,d,e,f,3(S15c)
Fig.C1-1
Fig.C1-2
Fig.C2
Fig.C3
Fig.C4
Fig.C5
Fig.C6
-
-
NOTE3
NOTE4a,b
NOTE5
NOTE6a,b,c
NOTE7a,b,c
NOTE8
-
NOTE10a,b,c
NOTE11
-
-
-
-
CONN.
No.
CONNECTOR PIN
No.
CN2a MAIN CN110 JACK CN401 24
CN2b MAIN CN109 MONITOR CN601 45/39
CN3 JACK CN403 SUB OPE UNIT - 9
CN4 JACK CN402 MO-SW - 2
CN7a MAIN CN112 STROBE 10
CN7b MAIN CN103 STROBE UNIT - 2
CN7c MAIN CN113 MIC (INT) - 4
CN8 MAIN CN106 REAR CN501 80
CN9a MAIN CN101 OP BLOCK - 24
CN9b MAIN CN102 CCD - 20
CN9c MAIN CN105
POWER/ZOOM UNIT - 15
CN9d MAIN CN104 VF ASSY CN7001 20
CN9e MAIN CN107 PRE/MDA CN307 80
CN9f MAIN CN113 IR CN901 6
CN15a PRE/MDA CN306 SENSOR - 16
CN15b PRE/MDA CN305 CAPSTAN MOTOR - 18
CN15c PRE/MDA CN304 DRUM MOTOR - 11
CN15d PRE/MDA CN302 HEAD - 8
CN15e PRE/MDA CN307 ROTARY ENCODER - 6
CN15f PRE/MDA CN303 LOADIND MOTOR - 6

(No.YF001)1-7
Fig.C1-1
Fig.C1-2
9
(S2c)
8
(S2c)
5
(S2a)
7
(S2c)
6
(S2b)
2
(S1b)
L1
[1]
[2]
1
(S1a)
10
(S2c)
10
(S2c)
9
(S2c)
8
(S2c)
7
(S2c)
6
(S2b)
3
(S2a)
4
(S2a)
COVER
(JACK)
CN2a
CN2b
* 0.118N · m (1.2kgf · cm)
LUG WIRE
SCREW(NO.20) LUG WIRE
b
a
a
b
[4]
L6a
[5]
NOTE3
[3]
[6]
NOTE6c
*
16
(S5)
11
(S4a)
*
20
(S6b)
*
19
(S6b)
LUG WIRE
18
(S6a)
17
(S6a)
CN4
L6b
L5
CN3
SPACER
CN3
<CONNECTOR LOCATION>
<WIRE CONNECTION>
SPACER
NOTE3 EARTH PLATE(U)
NOTE6b
LUG WIRE
NOTE4a
COVER (UPPER)
NOTE6a
NOTE4b
NOTE3
12
(S4b)
15
(S4b)
13
(S4b) 14
(S4b)
COVER
(JACK)
NOTE4a

1-8 (No.YF001)
Fig.C2
Fig.C3
CN7b
CN7c CN8
CN7a
23
(S8a)
21
(S7)
24
(S8b)
[8] 24
(S8b)
26
(S8b)
25
(S8b)
23
(S8a)
NOTE7a,8
CASSETTE COVER
21
(S7)
L7a
L7b
L7c
22
(S7)
[7]
CN7b
CN7a
CN7c
CN8
<MAIN BOARD ASSEMBLY
(CONECTOR LOCATION)>
NOTE7b,c
CN9e
CN9a
L9
CN9b
CN9c
CN9d
27
(S9a)
28
(S9b)
CN9f
[9]
CN9a
CN9d
CN9e
CN9c
CN9b
CN9f
<MAIN BOARD ASSEMBLY
(CONECTOR LOCATION)>

(No.YF001)1-9
Fig.C4
Fig.C5
L11b
L11a
L10
29
(S10a)
31
(S10b)
30
(S10b)
NOTE10a
NOTE10c
NOTE10b
32
(S11a) 33
(S11b)
[11]
[10]
NOTE11
[12]
[13]
36
(S13)
38
(S13)
34
(S12) 35
(S12)
37
(S13)
NOTE12
L13
L13

1-10 (No.YF001)
Fig.C6
*0.069N · m (0.7kgf · cm)
[14]
[16]
[15] 39
(S14)
40
(S14)
42
(S15a)
BRACKET(MECHA)ASSEMBLY
L15
L14
SHIELD COVER
*
45
(S15b)
48
(S15c)
47
(S15c)
46
(S15c)
*
44
(S15b)
41
(S15a) 43
(S15a)
CN15a
CN15b CN15c CN15d
CN15f
CN15e
<PRE/MDA BOARD ASSEMBLY
(CONNECTOR LOCATION)>

(No.YF001)1-11
3.2.3 DISASSEMBLY/ASSEMBLY OF [6] MONITOR ASSEMBLY
zCAUTION
(1) Be careful in handling the LCD module, especially not to
damage or soil the monitor screen.If it is soiled with fin-
gerprints, etc., gently clean it with chamois or the clean-
ing cloth.
(2) Since the BACKLIGHT is soldered to the ASSEMBLY
BOARD, the BACKLIGHT should not be separated from
the ASSEMBLY BOARD except when replacing the
BACKLIGHT.
zDisassembly procedure of MONITOR ASSEMBLY
(1) While removing the five screws 1 to 5 in numerical order
and disengaging the four hooks (L6a to L6d) in
alphabetical order, open the MONITOR COVER
ASSEMBLY and remove the MONITOR COVER
ASSEMBLY.
(2) Remove the SENSOR BOARD ASSEMBLY from the
MONITOR CASE.
(3) Remove the FPC of one connector CN6a, and remove
the MONITOR HINGE ASSEMBLY.
(4) Remove the FPC of the LCD module from one connector
CN6b, and remove the MONITOR BOARD ASSEMBLY
and the BACKLIHGT simultaneously.
(5) Remove the FRAME (LCD) U together with the LCD
module.
(6) Remove the FRAME (LCD) L.
zDisassembly procedure of HINGE ASSEMBLY/FPC AS-
SEMBLY
(1) While removing the two screws (6 and 7) and disengag-
ing the two hooks (L6e, f) in alphabetical order, remove
the HINGE COVER (U)
(2) Remove the HINGE COVER (L),
NOTE6a:
Be careful not to lose the magnet.
When attaching magnet, be careful about the attach-
ment direction. (MARKING : INSIDE)
(3) Remove the FPC ASSEBLY from the HINGE ASSEM-
BLY.
NOTE6b:
When attaching the FPC ASSEMBLY, wind the FPC
around the HINGE ASSEMBLY 3.5 times. Be careful
not to cut or damage the FPC.
Fig.3-2-3
*0.098N · m (1.0kgf · cm)
MONITOR CASE
FRAME (LCD) L
LCD MODULE
HINGE ASSEMBLY
FRAME (LCD) U
1
2
a
L6a
L6b
SD6
L6d
L6c
CN6a
CN6b
a
L6f
6
7
MAGNET
L6e
NOTE6a,b
3
*
5
*
4
BACK LIGHT
MOITOR BOARD ASEMBLY
MONITOR COVER ASSEMBLY
<HINGE ASSEMBLY>
HINGE COVER (U)
HINGE COVER (L)
SENSOR BOARD ASSEMBLY

1-12 (No.YF001)
3.2.4 ASSEMBLY/DISASSEMBLY OF [10] OP BLOCK ASSMBLY/CCD BOARD ASSEMBLY
zCAUTIONS
(1) During the procedure, remove the OP BLOCK
ASSEMBLY if necessary. When removing the OP
BLOCK ASSEMBLY, be careful not to damage the lens.
(2) During the procedure, be careful in handling CCD
IMAGE SENSOR, OP LPF, lens, and so on. Be careful
not to damage or soil the surface of them.
If they are soiled with fingerprints, etc., gently clean them
with chamois or the cleaning cloth.
(3) When products are shipped from the factory, protection
seals are applied onto transparent glass of some CCD
image sensors. Leave the protection seal as it is, and
take it off just before assembling the CCD image sensor
to the OP BLOCK ASSEMBLY.
(4) When removing OP LPF, be careful of the attachment
direction of OP LPF. (Marking is attached to some OP
LPFs.) When reassembling OP LPF, reattach OP LPF to
the original position.
zDisassembly procedure of OP BLOCK ASSEMBLY/CCD
BOARD ASSEMBLY
(1) Unsolder the fourteen soldered parts (SD10) on the CCD
BOARD ASSEMBLY, and remove the CCD BOARD
ASSEMBLY.
(2) Remove the two screws (1 and 2), and remove the CCD
BASE ASSEMBLY.
NOTE10a:
When removing the CCD BASE ASSEMBLY, be
careful in handling a sheet and OP LPF since a sheet
or OP LPF may be removed together with the CCD
BASE ASSEMBLY.
NOTE10b:
When replacing the CCD image sensor, don't remove
the CCD image sensor from the CCD BASE
ASSEMBLY. Instead, replace the entire CCD BASE
ASSEMBLY.
zAssembly procedure of OP BLOCK ASSEMBLY/CCD
BOARD ASSEMBLY
(1) Attach the OP LPF to the OP BLOCK ASSEMBLY, and
then the sheet to the OP BLOCK ASSEMBLY.
NOTE10c:
When attaching OP LPF to the OP BLOCK
ASSEMBLY, be careful about the attachment
direction.
(2) Attach the CCD ASSEMBLY so that the sheet is not
shifted, and attach the CCD ASSEMBLY and the sheet
to the OP BLOCK ASSEMBLY by tightening them with
the two screws (1 and 2).
(3) Insert the CCD BOARD ASSEMBLY to the CCD BASE
ASSEMBLY, and solder the fourteen points (SD10).
zReplacement of service repair parts
Service repair parts of the OP BLOCK ASSEMBLY are as
follows. When replacing the parts, be careful not to cut or
damage the FPC, and not to damage the parts due to
soldering (overheat).
(1) Focus motor
(2) Zoom motor
(3) Iris motor unit
NOTE10d:
When replacing the focus motor or the zoom motor, lift
the FPC approx.1mm away from the jack to solder the
FPC.
NOTE10e:
Iris motor unit contains the FPC ASSEMBLY and the
SENSOR *2.
Fig.3-2-4
2
(S10a)
1
(S10a)
14(SD10)
OP
side
CCD
side
Blue
OP LPF
OP BLOCK
ZOOM MOTOR
<NOTE 10d>
OP LPF
<NOTE 10c>
<NOTE 10a, b>
CCD BASE ASSEMBLY
CCD BOARD ASSEMBLY
IRIS MOTOR UNIT<NOTE 10d, e>
FOCUS MOTOR
<NOTE 10d>
0.118N.m (1.2kgf.cm)
4
(S10b)
3
(S10b)
6
(S10b)
5
(S10b)
8
(S10c)
7
(S10b)
9
(S10c)
SENSOR
SHEET

(No.YF001)1-13
3.2.5 DISASSEMBLY/ASSEMBLY OF [11] VF ASSEMBLY
• When replacing the VF FPC ASSEMBLY, first remove the
exterior parts of the VF ASSEMBLY (UPPER CASE (VF),
BOTTOM CASE (VF)). And then, remove the connector from
the board assembly. If you remove the connector first, the FPC
may be cut or the switch may be damaged.
zDisassembly of VF ASSEMBLY
(1) Remove the EYE CUP.
(2) Remove the two screws (1 and 2), and let the VF FPC
ASSEMBLY move easily.
(3) Remove the four screws (3 to 6).
(4) While lifting the HOLDER (VF) ASSEMBLY and the
BOTTOM CASE (VF) together, remove the two screws
(7 and 8), and remove the UPPER CASE (VF).
(5) While lifting the parts (HOLDER (LCD) and GUIDE
(LENS) etc.) on the BOTTOM CASE (VF), remove the
VF FPC ASSEMBLY from the VF BOARD ASSEMBLY,
and remove the FPC from the HOLDER (VF)
ASSEMBLY.
NOTE11a:
During the procedure, be careful not to damage the
FPC.
(6) Remove the BOTTOM CASE (VF).
(7) Remove one screw (9), and separate the VF
ASSEMBLY into the HOLDER (LCD) part and the
GUIDE (LENS) part. If necessary, separate the VF
ASSEMBLY into each part. Then, replace parts.
NOTE11b:
Don't separate the VF ASSEMBLY into each part
unless necessary.
Fig.3-2-5
4
(S11b)
8
(S11a)
7
(S11a)
5
(S11b)
6
(S11b)
2
(S11a)
1
(S11a)
3
(S11b)
10
(S11d)
9
(S11c)
UPPER CASE(VF)
BOTTOM CASE(VF)
EYE CUP HOLDER(VF)
ASSEMBLY
VF FPC ASSEMBLY
CVF BOARD
ASSEMBLY
VF FPC
ASSEMBLY
HOLDER(LCD)BLOCK COVER(LCD)
SPLING(LCD)
SHEET(DIFF)
STOPPER(POLA)
PLATE(LCD)
GUIDE(LENS)
LENS HOLDER
ASSEMBLY
SHEET(LENS)
STOPPER(EYE)
GUIDE(LCD)
LIQUID CRYSTAL
HOLDER(LCD)
LEVER(VF)
SPLING(LENS)
HOLDER(SHEET)
SHEET 2(POLA)
SHEET 1(POLA)
GUIDE(LENS)BLOCK

1-14 (No.YF001)
SECTION 4
ADJUSTMENT
4.1 PREPARATION
4.1.1 Precaution
Camera system and deck system of this model are specially
adjusted by using PC.
However, if parts such as the following are replaced, an
adjustment is required. The adjustment must be performed in a
Service Center equipped with the concerned facilities.
• OP BLOCK ASSEMBLY
• EEP ROM (IC1003 of MAIN board)
In the event of malfunction with electrical circuits, first find a
defective portion with the aid of proper test instruments as shown
in the following electrical adjustment procedure, and then
commence necessary repair/ replacement/adjustment.
• In observing chip TP, use IC clips, etc. to avoid any stress.
Prior to replacement of chip parts (especially IC), remove the
solder completely to prevent peeling of the pattern.
• Use a patch cord if necessary. As for a patch cord, see the
BOARD INTERCONNECTIONS.
• Since connectors are fragile, carefully handle them in
disconnecting and connecting the FPC.
4.1.2 REQUIRED TEST EQUIPMENT
• Personal computer (for Windows)
• Color TV monitor
• Oscilloscope (dual-trace type, observable 100MHz or higher
frequency). The one observable 300 MHz or higher frequency
is recommended.
• Digital voltmeter
• DC power supply or AC adapter
• Frequency counter (with threshold level adjuster)
4.1.3 TOOLS REQUIRED FOR ADJUSTMENT
•Torque driver
Be sure to use to fastening the mechanism and exterior parts
because those parts must strictly be controlled for tightening
torque.
•Bit
This bit is slightly longer than those set in conventional torque
drivers.
•Tweezers
To be used for removing and installing parts and wires.
•Chip IC replacement jig
To be used for adjustment of the camera system.
•Cleaning cloth
Recommended the Cleaning cloth to wipe down the video
heads, mechanism (tape transport system), optical lens sur-
face.
Service Support System
YTU94057-71
INF Adjustment Lens
YTU92001B
INF Adjustment Lens Holder
YTU94087
Camera Stand
YTU93079
Light box Assembly
YTU93096A
Gray Scale Chart
YTU94133A
Color Bar Chart
YTU94133C
Communication Cable
YTU93107A
PC Cable
QAM0099-002
Alignment Tape
MC-1
Jig Connector Cable
YTU93106C
Extension Connector
YTU94145D-40
Torque Driver
YTU94088
Bit
YTU94088-003
Chip IC Replacement Jig
PTS40844-2
Tweezers
P-895
Cleaning Cloth
KSMM-01
Guide Driver (Hexagonal)
D-770-1.27

(No.YF001)1-15
•Guide driver (Hexagonal)
To be used to turn the guide roller to adjustment of the linarity
of playback envelope.
•INF adjustment lens
To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.
•INF lens holder
To be used together with the Camera stand for operating the
Videocamera in the stripped-down condition such as the sta-
tus without the exterior parts or for using commodities that are
not yet conformable to the interchangeable ring. For the usage
of the INF lens holder, refer to the Service Bulletin No. YA-SB-
10035.
•Camera stand
To be used together with the INF adjustment lens holder. For
the usage of the Camera stand, refer to the Service Bulletin
No. YA-SB-10035.
•Light box assembly
To be used for adjustment of the camera system. For the
usage of the Light box assembly, refer to the Service Bulletin
No. YA-SB-10035.
•Gray scale chart
To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.
•Color bar chart
To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.
•Alignment tape
To be used for check and adjustment of interchangeability of
the mechanism.
•PC cable
Tobeusedto connectthe Videocameraanda personalcomputer
with each other when a personal computer issued for adjustment.
•Communication cable
Connect the Communication cable between the PC cable and
Jig connector cable when performing a PC adjustment.
•Service support system
To be used for adjustment with a personal computer. Software
can be downloaded also from JS-net.
•Jig connector cable
Connected to JIG CONNECTOR of the main board and used
for electrical adjustment, etc.
•Extension connector
Connect this extension connector to the connector of the Jig
connector cable for extending the cable connector.
4.2 JIG CONNECTOR CABLE CONNECTION
Connection procedure
TO JLIP_RX
TO JLIP_TX
TO GND
TO ENV_OUT
TO HID1
COMMUNICATION CABLEJIG CONNECTOR OSCILLOSCOPEJIG CONNECTOR
WHITE
RED
BLACK
GUIDE ROLLER (SUP)
MENU
RS232C
COM PORT
SERVICE SUPPORT SYSTEM
PC CABLE
FOR
COMMUNICATION CABLE
COMMUNICATION CABLE
PERSONAL COMPUTER
COVER (JIG)
JIG CONNECTOR CABLE
JIG CONNECTOR
ADJUST
SCREW
SCREW
GUIDE ROLLER (TU)

1-16 (No.YF001)
Jig connector diagrams 4.3 MECHANISM COMPATIBILITY ADJUSTMENT
4.3.1 Tape pattern adjustment
NOTE:
Prior to the adjustment, remove the cover (ADJUST).
(1) Play back the compatibility adjustment tape.
(2) While triggering the HID1, observe the waveform of
ENV_OUT.
(3) Set the manual tracking mode (ATF OFF).
(4) Confirm that the waveform is entirely parallel and straight,
and free from remarkable level-down, through the tracking
operation.
Make the confirmation as follows if necessary.
(5) If level-down is observed on the left hand side of the
waveform, straighten the level by turning the GUIDE
ROLLER (SUP).
If level-down is observed on the right hand side of the
waveform, straighten the
level by turning the GUIDE ROLLER (TU).
(6) After the adjustment, try the unloading motion once, and
confirm that the waveform is flat when the tape has been
played back again.
(7) Play back the self-recording.
(8) Confirm that the waveform is flat.
Fig.4-3-1
Fig.4-3-2
4.4 ELECTRICAL ADJUSTMENT
Electrical adjustment is performed by using a personal computer
and software for SERVICE SUPPORT SYSTEM. Read
README.TXT file to use the software properly.
As for the connection of cables, see "4.2 JIG CONNECTOR
CABLE CONNECTION".
VPPD
DRST
REG_3V
SRV_TX
SRV_RX
VPPC
CJIG_RST
AL_3VSYS
IF_TX
JLIP_TX
JLIP_RX
TDI
TDO
TMS
TCMK
TRST
PB_CLK
ENV_OUT
MAIN_VCO
ATFI
HID1
DISCRI
FS_PLL
TXD2
SPA
SBE
RXD2
GND
GND
V_OUT
M_VCOM
MON_B
MON_R
MON_G
M_HD
VF_COM
CVF_B
CVF_R
CVF_G
VF_RPD
JLIP_RX
TDO
TCMK
PB_CLK
MAIN_VCO
HID1
FS_PLL
SPA
RXD2
GND
M_VCOM
MON_R
M_HD
CVF_B
CVF_G
JLIP_TX
TDI
TMS
TRST
ENV_OUT
ATFI
DISCRI
TXD2
SBE
V_OUT
MON_B
MON_G
VF_COM
CVF_R
VF_RPD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
25
26
27
28
29
30
31
32
33
35
36
37
38
39
40
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
JIG CONNECTOR CABLE (YTU93106C)
MAIN
CN108
JIG CONN. BOARD
(PIN NO.)
NOTE:
The JIG connector board uses 30
pins from among 40 pins of CN108 on
the MAIN board.
Pins 1 to 5, 21 to 24, and 34 of
CN108 on the Main board are not
used.
Flatten the waveform.
Misalignment of guide roller
height on the take-up side
Misalignment of guide
roller height on the
supply side
ENV_OUT
HID1

(No.YF001)1-17
SECTION 5
TROUBLE SHOOTING
5.1 SERVICE NOTE
[3] [4] [5]
1 2 3 4 5 6 7 8 9 10 - 11121314151617181920
***** -* **
-
C1-2
[10] [13]
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
** ** *****
C4 C5
39 40 41 42 43 44 45 46 47 48
**
[10] OP BLOCK ASSEMBLY
1234567 123456789 *** 12345678910
NOTE:
1) * : Don't reuse the screw, because screw lock bond was applied to them. 2) Pay careful attention to tightening torque for each screw.
: 0.078N
.
m (0.8kgf
.
cm)
: 0.098N
.
m (1.0kgf
.
cm)
: 0.118N
.
m (1.2kgf
.
cm) : 0.069N
.
m (0.7kgf
.
cm)
C1-1
C3
[11] VF ASSEMBLY
[6]
MONITOR ASSEMBLY
[7] [8]
C2
[14]
[1] [2] [6]
[11] [12][9]
[15]/[16]
C6
3-2-3
3-2-5
3-2-4
Symbol No.
Removing order of screw
Place to stick screw
Screw tightening torque
Reference drawing (Fig.No.)
Symbol No.
Removing order of screw
Place to stick screw
Screw tightening torque
Reference drawing (Fig.No.)
Symbol No.
Removing order of screw
Place to stick screw
Screw tightening torque
Reference drawing (Fig.No.)
Removing order of screw
Place to stick screw
Screw tightening torque
Reference drawing (Fig.No.)
Removing order of screw
Place to stick screw
Screw tightening torque
Reference drawing (Fig.No.)
Removing order of screw
Place to stick screw
Screw tightening torque
Reference drawing (Fig.No.)

1-18 (No.YF001)
5.2 TAKE OUT CASSETTE TAPE
(1) Remove the Power Unit (battery or DC code) from the set.
(2) Remove one screw, and remove a plate (ADJ).
NOTE:
For more efficient operation, loosen and move the grip
belt prior to the procedure (2).
(3) Open the CASSETTE COVER till it is completely opened
and fixed.
(4) Attach a PVC tape as shown in the figure.
NOTE:
Be careful of cassette tape damage caused because the
CASSETTE HOUSING ASSEMBLY is moved upward at
the unloading end (EJECT mode).
(5) To set the SLIDE DECK ASSEMBLY to the unloading end,
apply DC 3V to the electrode (terminal) on the top surface
of the LOADING MOTOR ASSEMBLY that is seen through
a hole under the plate removed in the procedure (2).
NOTE:
Be careful not to attach grease or a similar substance to
the surface of the cassette tape on the tape transport
system.
(6) Wind the cassette tape by directly turning the REEL DISK
ASSEMBLY (SUP) from the backside of the SLIDE DECK
ASSEMBLY by using a sharp tool (Chip IC replacement
tool).
(7) Confirm that the cassette tape is completely wound, and
then peel off the PVC tape from the CASSETTE HOUSING
ASSEMBLY and take out the cassette tape.
NOTE:
To confirm that the cassette tape is completely wound,
confirm that one REEL DISK ASSEMBLY (TU) rotates
as you rotate the other REEL DISK ASSEMBLY (SUP).
(8) Make sure that grease or a similar substance is not
attached to the surface of the tape taken out in the
procedure (7). Similarly, also make sure that grease or a
similar substance is not attached on the MECHANISM
ASSEMBLY, especially the tape transport system.
Fig.5-2-1
(DC3V)
TAPE
LOADING MOTOR
ASSEMBLY
REEL DISK
ASSEMBLY (SUP)
SLIDE DECK
ASSEMBLY
CASSETTE HOUSING
ASSEMBLY
CASSETTE COVER

(No.YF001)1-19
5.3 EMERGENCY DISPLAY
Whenever some abnormal signal is input to the syscon CPU, an
error number (E01, as an example) is displayed on the LCD
monitor or (in the electronic view finder).In every error status,
such the message as shown below alter nately appear over and
over.
• In an emergency mode, all operations except turning on/off the
POWER switch are ineffectual.
Example (in case of the error number E01):
Fig.5-3-1
E01
UNIT IN
SAFEGUARD MODE
E01
REMOVE AND
REATTACH BATTERY
LCD display Emergencymode Details Possible cause
E01 LOADING In the case the encoder position is
not shifted to the next point though
the loading motor has rotated in the
loading direction for 4 seconds or
more. This error is defined as [E01].
1. The mechanism is locked during mode shift.
2.Themechanismislocked at themechanismloadingend,
because the encoder position is skipped during
mechanism mode shift.
3. No power is supplied to the loading MDA.
E02 UNLOADING In the case the encoder position is
not shifted to the next point though
the loading motor has rotated in the
unloadingdirection for 4seconds or
more. This error is defined as [E02].
1. The mechanism is locked during mode shift.
2.Themechanismislocked at themechanismloadingend,
because the encoder position is skipped during
mechanism mode shift.
E03 TU & SUP REEL FG In the case no REEL FG is
produced for seconds shown in the
table below or more in the capstan
rotation mode after loading was
complete, the mechanism mode is
shiftedtoSTOP with thepinchroller
set off. This error is defined as
[E03].However, no REEL EMG is
detected in the SLW/STILL mode.
1. The idler gear does not engage with the reel disk well.
2. Though the idler gear and reel disk are engaged with
each other, the tape is not wound because of overload
to the mechanism.
3. No FG pulse is output from the reel sensor.
4. No power is supplied to the reel sensor.
5. Tape transport operation takes place with a cassette
having no tape inside.
6. The tape slackens and no pulse is produced until the
slack is taken up and the tape comes into the normal
status.
E04 DRUM FG In the case there is no DRUM FG
input in the drum rotation mode for
4 seconds or more. This error is
defined as [E04], and the
mechanism mode is shifted to
STOP with the pinch roller set off.
1. The drum cannot be started or drum rotation is stopped
because tape transport load is too high.
1) Tape tension is extremely high.
2) The tape is damaged or soiled with grease, etc.
2. The DRUM FG signal is not received by the syscon CPU.
1) Disconnection in the middle of the signal line.
2) Failure of the DRUM FG pulse generator (hall
element).
3. No drum control voltage is supplied to the MDA.
4. No power is supplied to the DRUM MDA.
E05 - - -
E06 CAPSTAN FG In the case no CAPSTAN FG is
produced in the capstan rotation
mode for 2 seconds or more. This
error is defined as [E06], and the
mechanism mode is shifted to
STOP with the pinch roller set
off.However, no CAPSTAN EMG is
detected in the STILL/FF/REW
mode.
1. The CAPSTAN FG signal is not received by the syscon
CPU.
1) Disconnection in the middle of the signal line.
2) Failure of the CAPSTAN FG pulse generator (MR
element).
2. No capstan control voltage is supplied to the MDA.
3. The capstan cannot be started or capstan rotation is
stopped because tape transport load is too high.
1) Tape tension is extremely high. (Mechanical locking)
2)Thetapeisdamaged or soiled with grease,etc.(Tape
tangling occurs, etc.)
PB/REC
S-FWD
S-REW
FF
REW
3 SEC
3 SEC
0.3 SEC
3 SEC
0.1 SEC
3 SEC
0.3 SEC
3 SEC
0.1 SEC
3 SEC
REEL(SUP) REEL(TU)

(No.YF001)
WPC
Printed in Japan
JVC SERVICE & ENGINEERING COMPANY OF AMERICA
DIVISION OF JVC AMERICAS CORP.
www.jvcservice.com(US Only)
JVC CANADA INC.
Head office : 21 Finchdene Square Scarborough, Ontario M1X 1A7 [phone]