Keba KeControl CP 50 Series Installation and operation manual
KeControl
CP 503/A, CP 505/A,D,K, CP 507/A,C
CPU module
Project engineering manual V 1.06
Translation of the original instructions
Document:V 1.06
Pages: 86
© KEBA 2021
Specifications are subject to change due to further technical developments. Details presented may be
subject to correction.
All rights reserved.
KEBA Industrial Automation GmbH Reindlstraße 51, 4040 Linz, Austria
For information about KEBA and our subsidiaries please look at www.keba.com.
CP 503/A, CP 505/A,D,K, CP 507/A,C Record of Revision
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© KEBA 2021
Record of Revision
Version Date Change in chapter Description Changed
by
1.00 05-2019 - Newly created hli
1.01 09-2019 Techncal data, Var-
ious chapters Various adjustments, CP507 variant added hli
1.02 05-2021 Various chapters 7 segment display, Micro SD card, technical data hasl
1.03 10-2021 Various chapters
Expansion interface created, new structure of
adding modules, expansion bus updated, change to
new company structure, UKCA, standards restruc-
tured
hasl
1.04 05-2022 Technical data SRAM updated hasl
1.05 12-2022 Various chapters
Document title summarized, accessories updated,
diagnostic display acutealized, KeBus connector
cover described in more detail, Dip Switch adapted,
various updates, status LED updated
rmr, hasl
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CP 503/A, CP 505/A,D,K, CP 507/A,C Table of contents
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Table of contents
1 Introduction................................................................................................................ 9
1.1 Purpose of the document................................................................................. 9
1.2 Preconditions ................................................................................................... 9
1.3 Intended use .................................................................................................... 10
1.4 Notes on this document ................................................................................... 10
1.4.1 Contents of the document................................................................. 10
1.4.2 Not contained in this document......................................................... 11
1.5 Documentation for further reading ................................................................... 11
2 Safety notes ............................................................................................................... 12
2.1 Representation................................................................................................. 12
2.2 General safety instructions .............................................................................. 13
2.3 Safety instructions for device maintenance ..................................................... 14
2.4 ESD information............................................................................................... 14
3 Description of the module ........................................................................................ 15
3.1 Front view ........................................................................................................ 15
3.2 Side view.......................................................................................................... 16
3.3 Bottom view ..................................................................................................... 18
3.4 Storage media.................................................................................................. 18
3.4.1 Micro SD card ................................................................................... 18
3.5 DataMatrix code............................................................................................... 20
3.6 Type plate ........................................................................................................ 20
3.7 Symbol printing ................................................................................................ 20
3.8 Accessories...................................................................................................... 21
3.8.1 Micro SD card ................................................................................... 21
3.8.2 Socket plug ....................................................................................... 21
3.8.3 Industrial Mini I/O plug ...................................................................... 22
3.8.4 Industrial Mini I/O cable..................................................................... 22
3.8.5 Battery............................................................................................... 22
3.8.6 Fan.................................................................................................... 22
4 Displays and operating elements ............................................................................ 23
4.1 Diagnosis display (DIAG)................................................................................. 23
4.2 Status LED....................................................................................................... 23
4.3 Control key (CTRL).......................................................................................... 24
4.4 Ethernet Gbit Status LEDs............................................................................... 24
4.5 CAN status LEDs............................................................................................. 25
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4.6 EtherCAT status LEDs RJ45 ........................................................................... 25
4.7 Micro SD Disc Activity LED.............................................................................. 25
5 Mounting and installation instructions ................................................................... 26
5.1 General instructions on assembly and removal............................................... 26
5.2 Mounting rail .................................................................................................... 26
5.3 End bracket...................................................................................................... 26
5.4 Space requirements......................................................................................... 27
5.5 Installing the module........................................................................................ 28
5.6 Removing the module...................................................................................... 29
5.7 Adding modules ............................................................................................... 30
5.7.1 Setting the module address ............................................................. 32
5.7.2 Adding input/output modules ............................................................ 32
5.7.3 Adding expansion modules............................................................... 33
5.7.4 Removing input/output modules ....................................................... 35
5.7.5 Removing expansion modules.......................................................... 37
5.8 Air conditioning and ventilation ........................................................................ 38
5.8.1 Use of air filters ................................................................................. 38
6 Connections and wiring............................................................................................ 39
6.1 Power supply ................................................................................................... 39
6.1.1 Connection example ......................................................................... 40
6.2 EMC and wiring guidelines .............................................................................. 40
6.3 Grounding ........................................................................................................ 41
6.4 USB port .......................................................................................................... 41
6.4.1 Cable and plug specification ............................................................. 41
6.5 EtherCAT interface .......................................................................................... 41
6.5.1 Pin assignment.................................................................................. 41
6.5.2 Cable and plug specification ............................................................. 42
6.6 Ethernet interface............................................................................................. 42
6.6.1 Pin assignment.................................................................................. 42
6.7 CAN interface................................................................................................... 42
6.7.1 Pin assignment.................................................................................. 42
6.7.2 Bus termination ................................................................................. 43
6.7.3 Connection example ......................................................................... 43
6.7.4 Cable and plug specification ............................................................. 44
6.8 Serial interface................................................................................................. 44
6.8.1 RS-232-C interfaces.......................................................................... 44
6.8.2 RS-422-A interfaces.......................................................................... 45
6.8.3 RS-485-A interfaces.......................................................................... 47
6.9 Graphic interface (DVI) .................................................................................... 52
6.9.1 Pin assignment.................................................................................. 52
6.9.2 Cable and plug specification ............................................................. 52
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6.10 Expansion interface ......................................................................................... 53
7 Configuration ............................................................................................................. 54
7.1 CAN configuration............................................................................................ 54
7.2 Serial interface configuration ........................................................................... 54
7.2.1 RS485/422 termination ..................................................................... 55
8 Operating behavior.................................................................................................... 56
8.1 Start-up ............................................................................................................ 56
8.1.1 Display during start-up ...................................................................... 56
8.2 Operating states............................................................................................... 56
8.3 7-segment display............................................................................................ 57
8.4 USB overload switch-off................................................................................... 63
8.5 Response to module errors.............................................................................. 63
8.6 Watchdog......................................................................................................... 63
8.7 Failure of power supply.................................................................................... 63
8.8 Battery monitoring system ............................................................................... 63
8.9 Temperature monitoring................................................................................... 64
9 Diagnosis ................................................................................................................... 65
9.1 LEDs ................................................................................................................ 65
9.2 7-segment display............................................................................................ 65
9.3 State report ...................................................................................................... 65
9.4 Crashreport...................................................................................................... 66
10 Maintenance............................................................................................................... 67
10.1 Battery.............................................................................................................. 67
10.1.1 Battery type and service life.............................................................. 67
10.1.2 Replacing the battery ........................................................................ 67
10.2 Fan................................................................................................................... 69
10.2.1 Fan service life.................................................................................. 69
10.2.2 Replacing the fan .............................................................................. 69
10.3 Create backup.................................................................................................. 72
10.4 Restore a backup............................................................................................. 73
10.5 Executing a firmware update ........................................................................... 73
11 Disposal...................................................................................................................... 74
11.1 Disposal of the module .................................................................................... 74
11.2 Disposal of the battery ..................................................................................... 74
12 Technical data............................................................................................................ 75
12.1 General ............................................................................................................ 75
12.2 Environmental conditions................................................................................. 75
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12.3 Power supply ................................................................................................... 75
12.4 Computer kernel .............................................................................................. 76
12.5 Interfaces ......................................................................................................... 77
12.6 Dimensions, weight.......................................................................................... 78
13 Directives, standards and regulations .................................................................... 79
13.1 EU Directives ................................................................................................... 79
13.2 Standards for checking the conformity............................................................. 79
13.3 Other standards ............................................................................................... 79
13.4 Regulations...................................................................................................... 80
13.5 Standards for the American market ................................................................. 80
14 EU Declaration of conformity ................................................................................... 81
15 UKCA .......................................................................................................................... 82
15.1 UKCA Declaration of Conformity ..................................................................... 82
Index ........................................................................................................................... 83
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Introduction
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1 Introduction
1.1 Purpose of the document
This document describes the structure of the CP 50x/x (CPU module).
Additionally, the installation and configuration is described enough to obtain
an operationally ready module. "Ready for operation" means that the assem-
bly is ready for the synchronization of the firmware and the application.
Information
The manual is written exclusively for the target groups listed in this manual.
The machine manufacturer or system supplier must incorporate the safety
information required for end customers into the operating manual for end
customers in the applicable national language.
1.2 Preconditions
This document contains information for persons with the following skills:
Target group Knowledge and skills pre-requirement
Project engineer
Basic technical training (University of Applied Science/University
level, engineering degree or corresponding professional experience).
Knowledge in:
● working mode of a PLC,
● current valid safety regulations,
● the application.
Electrician
Specialized training in the electro-technical field (in accordance with
industrial training guidelines).
Knowledge in:
● current valid safety regulations,
● wiring guidelines,
● circuit diagrams,
● system analysis and troubleshooting,
● correct installation of electrical connections according to na-
tional and international regulations.
Start-up technician
Basic technical training (Vocational high school, engineering degree
or corresponding professional experience).
Knowledge in:
● current valid safety regulations,
● working mode of machine or plant,
● principal functions of the application,
● system analysis and troubleshooting,
● setting options at the operating installations.
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Introduction
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Target group Knowledge and skills pre-requirement
Service technician
Basic technical training (Vocational high school, engineering degree
or corresponding professional experience).
Knowledge in:
● working mode of a PLC,
● current valid safety regulations,
● working mode of machine or plant,
● diagnosis possibilities,
● systematic error analysis and rectification.
1.3 Intended use
The CP 50x/x was developed for control applications in industrial machines.
The typical applications areas include injection molding machines, robots,
presses, machine tools and similar.
The CP 50x/x may only be used for the types of use detailed in the technical
description and only in compliance with the described technical framework
conditions. The CP 50x/x may only be used in connection with recom-
mended or approved devices.
The CP 50x/x has been developed, manufactured, tested and documented
observing the relevant instructions and standards. Therefore, provided that
the instructions and safety precautions are properly observed, the product
does not pose any danger to the health of persons or a risk of damage to
other property or equipment under normal circumstances.
1.4 Notes on this document
This manual is part of the product. It is to be retained over the entire life cy-
cle of the product and should be forwarded to any subsequent owners or
users of the product. The machine manufacturer or system supplier must in-
corporate the safety instructions and information required for end customers
into the operating instructions for end customers in the applicable national
language.
This documentation must be legible and available to the specified personnel
and must be read and understood by them.
1.4.1 Contents of the document
● Description of the module
● Mounting and installation instructions
● Description of interfaces
● Configuration
● Operating behavior
● Diagnostics functions
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Introduction
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● Maintenance
● Technical data
1.4.2 Not contained in this document
● Programming instruction
● Application diagnosis
● Firmware description
1.5 Documentation for further reading
Name Target group
Provided system manual
● Project engineer
● Electrician
● Programmer
● Commissioning foreman
● Service technician
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Safety notes
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2 Safety notes
2.1 Representation
At various points in this manual, you will see notes and precautionary warn-
ings regarding possible hazards. The symbols used have the following
meaning:
DANGER!
indicates an imminently hazardous situation, which will result in death or se-
rious bodily injury if the corresponding precautions are not taken.
WARNING!
indicates a potentially hazardous situation, which can result in death or seri-
ous bodily injury if the corresponding precautions are not taken.
CAUTION!
means that if the corresponding safety measures are not taken, a potentially
hazardous situation can occur that may result in slight bodily injury.
Caution
means that damage to property can occur if the corresponding safety mea-
sures are not taken.
ESD
This symbol reminds you of the possible consequences of touching electro-
statically sensitive components.
Safety information
Describes important safety-related requirements or informs about essential
safety-related correlations.
Information
Identifies practical tips and useful information. No information that warns
about potentially dangerous or harmful functions is contained.
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Safety notes
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2.2 General safety instructions
WARNING!
● It is absolutely essential that you also observe the safety instructions in
the system manual for your automation system.
● The following application areas are expressly excluded for the CP 50x/x
without completing a special evaluation relating to the application and
implementing the necessary measures in the installation relating to the
operating conditions:
● Use in areas where there is a risk of explosion or fire
● Use in the mining sector
● Use in the open air
● Use in wet rooms or rooms with the risk of splashing water
● Use in environments with heavily polluted air
● Use in environments with harmful solutions, steams or radiations
● Use in non-stationary applications
● The CP 50x/x is not designed for safety-relevant control tasks (e.g.:
shutdown in case of an emergency). For safety-relevant control tasks
and personnel security, additional external safety measures must be im-
plemented to ensure the system remains in a safe operating condition
even in the event of a fault.
● At the developement of the CP 50x/x the standard EN ISO 13849-1 was
not considered.
● The module is defined as "open type equipment" (UL 61010-2-201) or as
"open equipment" (EN 61010-2-201) and must therefore be installed in a
control cabinet.
Caution
Improper use of the assembly or the control system leads to irrepara-
ble damage!
Turn off the power supply before inserting or removing the module. Other-
wise, the module can be destroyed or undefined signal states can lead to
damage of the control system.
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2.3 Safety instructions for device maintenance
WARNING!
● If this device is damaged, the device must be taken out of commission
and repaired or replaced by trained specialized personnel.
● The device must only be opened by trained specialized personnel. They
must only carry out maintenance work that is explicitly permitted by
KEBA (see chapter "Maintenance").
Any other manipulations to the device will result in loss of warranty, guaran-
tee and declaration of conformity by KEBA.
2.4 ESD information
Electronic component are generally put at risk by electro-static discharges
(Electro Static Discharge). An electro-static charge can occur during any ac-
tivity involving movement. ESD can occur with any touch.
Most discharges are so low that they are not noticeable. However, they can
nevertheless put unprotected electronic components at risk or even destroy
them. Therefore, any handling with open electronics is only permissible with
the application of effective ESD protection.
When handling open electronics, please follow the following ESD measures:
● Only touch open electronics if this is absolutely necessary.
● Wear a conductive ESD wristband.
● Use conductive mats.
● Establish a conductive connection between device/system, mat, wrist-
band, and grounding connection.
● Cotton work clothes are preferred over synthetic fiber materials.
● Keep work area free of highly isolating materials (e.g. Styrofoam, plas-
tics, nylon, ...).
● Use ESD protection even for defective modules.
Always keep the devices in their original packaging and only remove the
packaging immediately before installation.
Avoid, for modules which are mounted in an enclosure, direct contact with
any accessible electronic components, such as non-equipped terminals.
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Description of the module
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3 Description of the module
The CPU module is an intelligent master module designed for medium-range
performance within the KEBA automation system.
3.1 Front view
Fig.3-1: Front view
1 ... Locking hooks, expansion module 2 ... USB interface
3 ... DVI interface 4 ... Ethernet interfaces
5 ... Serial number and DataMatrix code 6 ... Power supply
7 ... Control button 8 ... Diagnosis display
9 ... Serial interface 10 ... DIP switch
11 ... CAN interface 12 ... EtherCAT interface
13 ... Lock of the input/output module 14 ... Status LED
15 ... Micro SD card slot
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Description of the module
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3.2 Side view
Fig.3-2: Left side view
1 ... Locking hooks, expansion module 2 ... Area for type plate printing
3 ... Area for connection diagram print-
ing
4 ... Mounting rail locking
5 ... Expansion bus 6 ... Area for symbol printing
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Description of the module
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Fig.3-3: Right side view
1 ... Recesses for locking 2 ... Lock of the input/output module
3 ... Area for type plate printing 4 ... Area for symbol printing
5 ... Mounting rail locking 6 ... KeBus interface for input/output
module
7 ... Area for connection diagram print-
ing
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Description of the module
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3.3 Bottom view
Fig.3-4: Bottom view
1 ... Locking for mounting rail 2 ... Battery slot
3 ... Grounding point
3.4 Storage media
The CP 50x/x can be operated with the following storage media:
● Micro SD card
3.4.1 Micro SD card
The CP 50x/x uses a Micro SD card that contains the operating system. It is
possible to insert and remove the Micro SD card at the front of the module
(without tools). The push-push principle is used for this purpose. It is not per-
missible to change the Micro SD card during operation. If the Micro SD card
is removed during running operation, the module will be reset.
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Description of the module
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Information
Use only approved Micro SD cards from KEBA. Other Micro SD cards will
not guarantee the correct functionality.
Inserting the Micro SD card
To insert a Micro SD card in the module, proceed as follows:
1) Turn off the power supply.
2) Gently push the Micro SD card into the Micro SD slot until it clicks into
place (audible click). Insert in the proper direction!
Fig.3-5: Inserting the Micro SD card
Removing the Micro SD card
To remove a Micro SD card from the module, proceed as follows:
1) Turn off the power supply.
2) To release, gently push the Micro SD card into the Micro SD slot until it
clicks into place (audible click).
Fig.3-6: Releasing the Micro SD card
3) Remove the released Micro SD card.
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Description of the module
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3.5 DataMatrix code
The data matrix code is made up of the following elements:
12345678*123456
Serial number Material number
3.6 Type plate
Information
The type plate shown is an example. The actual data on the type plate de-
pends on the module.
Fig.3-7: Example type plate
1 ... Manufacturer's address 2 ... Manufacturer
3 ... Product group 4 ... Product designation
5 ... Technical data (voltage) 6 ... Ambient temperature
7 ... Country of manufacture 8 ... Production date
9 ... Revision number / index 10 ... Material number
3.7 Symbol printing
There are symbols on the module that are described in the following table.
Information
The symbols described represent the full range of printed symbols. Which
symbols are actually printed depends on the module.
Description of the symbols
CE conformity marking
This manual suits for next models
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Table of contents
