LG M2762DP-EML User manual

LCD MONITOR TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LD93E
MODEL : M2762DP M2762DP-EML
North/Latin A erica http://aic.lgservice.co
Europe/Africa http://eic.lgservice.co
Asia/Oceania http://biz.lgservice.co
Internal Use Only
P/NO : MFL62477319(1006-REV00) Printed in Korea

Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTIONS .........................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION ...............................................................13
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM...................................................................................24
EXPLODED VIEW .................................................................................. 28
SVC. SHEET ...............................................................................................

Copyright ©2010 LG Electronics. Inc. All right reserved.
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SAFET PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. se a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
COND IT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFET NOTICE
0.15uF
Ω

Copyright ©2010 LG Electronics. Inc. All right reserved.
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CA TION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. nless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
nless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures s ecified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. se only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. se only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. se a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. se an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. se a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. se the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CA TION: Work quickly to avoid overheating the circuit
board printed foil.
6. se the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

Copyright ©2010 LG Electronics. Inc. All right reserved.
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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Re lacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a " " shape the end of each of three leads remaining
on the circuit board.
3. Bend into a " " shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the " " with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. ( se this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small " " in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
se the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright ©2010 LG Electronics. Inc. All right reserved.
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- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application Range.
1) This spec sheet is applied all of the LCD TV with LD93E
chassis.
2) Not included spec and each product spec in this spec sheet
apply correspondingly to the following each country standard
and requirement of Buyer
2. Specification
Each part is tested as below without special appointment
1) Temperature : 25 °C ± 5 °C (77 °F ± 9 °F),
CST : 40 °C ± 5° C
2) Relative Humidity : 65 % ±10 %
3) Power Voltage : Standard input voltage
(100 V - 240 V ~, 50 / 60 Hz)
4) Specification and performance of each parts are followed
each drawing and specification by part number in accordance
with BOM.
5) The receiver must be operated for about 20 minutes prior to
the adjustment.
3.Test method
1) Performance :
LGE TV test method followed
2) Demanded other specification
- Safety : L, CSA, IEC specification
- EMC : FCC, ICES, IEC specification
Model Market Appliance
M2762DP SA, CANADA, MEXICO Safety : L1492,
CSA C22.2.No.1
EMC : FCC Class B,
IC Class B
4. General specification
4.1 PC
No Item Specification Remark
1 Supported Sync.Type Separate Sync.,Digital
Horizontal 30~83kHz
Analog Vertical 56~75 Hz
2 Operating Frequency Horizontal 30~83kHz
Digital Vertical 56~75 Hz
Max. 1920 x 1080 @60Hz
3 Resolution Analog Recommend 1920 x 1080 @60Hz
Max. 1920 x 1080 @60Hz
Digital Recommend 1920 x 1080 @60Hz
4 Inrush Current Cold Start :50 A /Hot :120 A
Operating Condition Sync (H/V) Video LED Wattage
Blue 70( ) 1.Sound
5 Power On On/On Active Blue 65(Typ) 1/8W non-clipped max. audio signal
S/W Mode 2.Video
(Contrast Max, Brightness Max)
3.input DVI
Off/On Off Amber 1W For RGB
Sleep mode On/Off Off Off 1W
6 MTBF 50,000 HRS with 90%Confidence level Lamp Life : 50,000 Hours(min)
7 sing Altitude 5,000 m (for Reliability) 3,000m(for FOS)

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Copyright ©2010 LG Electronics. Inc. All right reserved.
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4.2 TV
No Item Specification Remarks
1. Receiving System ATSC/NTSC-M
1. Available Channel 1) TV AIR : 02~69
2) DTV AIR : 02-69
3) CATV : 01~135
4) CADTV : 01~135
3. Input Voltage 1) AC 100 ~ 240V 50/60Hz Mark : 110V (60Hz)
4. Market North America
5. Screen Size 27 inch Wide
6. Aspect Ratio 16:9
7. LCD Module LM270WF1-TLD1 (1920x1080)
8. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
9. Storage Environment 1) Temp : -20 ~ 60 deg
2) Humidity : 0 ~ 90 %
5. Chroma & Brightness
Test Condition : Default Mode at Each PSM

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Copyright ©2010 LG Electronics. Inc. All right reserved.
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* Optical Test Condition (Revision 3)
- Surrounding Brightness Level : dark
- Surrounding Temperature : 25±5°
- warm-up Time : 30 Min
- Contrast, Brightness : Outgoing condition
-. *Incase of Vivid Mode, high level saturation may be occurred. Check gray linearity at standard mode.
6. LCD Module Optical characteristics
Panel Optical Char.
* Active area
1. Active area of LCD PANEL is in bezel of cabinet.
2. Interval between active area and bezel
|A-B| ≤ 1.0 mm , |C-D| ≤ 1.0 mm
A: Interval between left of active area and bezel
B: Interval between right of active area and bezel
C: Interval between top of active area and bezel
D: Interval between bottom of active area and bezel
C
B
D
A
Active Area
Bezel

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Copyright ©2010 LG Electronics. Inc. All right reserved.
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7. External Input Format
No. Specification Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel clock( MHz)
1. 720* 480 15.73 59.94 SDTV, DVD 480I
2. 720* 480 15.73 60.00 SDTV, DVD 480I
3. 720* 480 31.47 59.94 SDTV 480P
4. 720* 480 31.50 60.00 SDTV 480P
5. 1280* 720 44.96 59.94 HDTV 720P
6. 1280* 720 45.00 60.00 HDTV 720P
7. 1920* 1080 33.72 59.94 HDTV 1080I
8. 1920* 1080 33.75 60.00 HDTV 1080I
9. 1920* 1080 23.0 24.0 HDTV 1080P
10. 1920* 1080 37.75 30 HDTV 1080P
11. 1920* 1080 67.43 59.94 HDTV 1080P
12. 1920* 1080 67.5 60.00 HDTV 1080P
No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1. 720* 400 31.468 70.08 28.321
2. 640* 480 31.469 59.94 25.175
3. 640* 480 37.5 75 31.5
4. 800* 600 37.879 60.317 40.0
5. 800* 600 46.875 75.0 49.5
6. 1024* 768 48.363 60.0 65.0
7. 1024* 768 60.123 75.029 78.75
8. 1152* 864 67.500 75.000 108.0
9. 1280* 1024 63.981 60.02 108.0
10. 1280* 1024 79.976 75.035 135.0
11. 1680* 1050 64.674 59.883 119.0
12. 1680* 1050 65.290 59.954 146.25
13. 1600* 1200 75.0 60.0 162.0
14. 1920* 1080 66.587 59.934 138.5
7.1 Component Video Input (Y, CB/PB, CR/PR)
7. 2 RGB/DVI Input (Only For PC)

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7.2.1 EDID Data for RGB/ DVI PC
- EDID Data for RGB(Product ID : 22381)
- EDID Data for DVI(Product ID : 22382)
1). Adjustable Data :
*: Serial No. .(Input the S/N at Total Assembly line)
**: week
***: year ex) when year 2006 : input “10”
**** : CHECK S M (deferent along Serial No, week, year)

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Copyright ©2010 LG Electronics. Inc. All right reserved.
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No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark
1 720* 480 31.469 / 31.5 59.94 / 60 23.00/ 23.03 SDTV 480P
2 720* 576 31.25 50 54 SDTV 576P
3 1280* 720 37.500 50 74.25 HDTV 720P
4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P
5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I
6 1920* 1080 28.125 50.00 74.25 HDTV 1080I
7 1920* 1080 26.97 / 23 23.97 / 24 74.17/ 74.25 HDTV 1080P
8 1920* 1080 33.716 / 33.75 29.976 / 30.00 74.25 HDTV 1080P
9 1920* 1080 56.250 50 148.5 HDTV 1080P
10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P
7.3 HDMI1, 2 : DTV Table(For Video, PC is not Supported)
- HDMI1/ HDMI2 (Product ID: 22383)
: physical address.(HDMI1 : 10, HDMI2 : 20) / **(week), ***(year), ****(Check sum) : Adjustable Data
Adjustable Datas(Serial No, week, Year and Check sum) in HDMI EDID are same with RGB/DVI

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Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
No. Item Content nit Remark
1. Product Width(W) Length(D) Height(H) mm
Dimension Before Packing 649.1 210 485 mm
After Packing 729 539 170 mm
2. Product Only SET 7.2 Kg
Weight With BOX 9.8 Kg
3. Container Individual or 20ft 40ft
Loading Palletizing Indi. Wooden Indi. Wooden
Quantity 416 360 858 792
4. Stand
Type Detachable ( Base detachable)
Assy
Size(W x D x H) 330.0 x 210.0 x 51.8
Tilt Degree -5~15 degree
Tilt force 1.0~3.5kgf
Swivel Degree 358 degree
Swivel Force 0.5 ~ 2.kgf
5. Appearance General Refer to Standard of LG(55)G1-1020
*Appearance Gap spec
Front: 0.5 mm
Back & Bottom : 1.0 m
8.Mechanical Specification

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ADJUSTMENT INSTRUCTION
1. Application
This document is applied to LD93E chassis LCD Monitor TV
which is manufactured in TV (or Monitor) Factory or is
produced on the basis of this data.
2. Designation
2.1 The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2.2. Power Adjustment: Free Voltage
2.3. Magnetic Field Condition: Nil.
2.4. Input signal nit: Product Specification Standard
2.5. Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25°C ± 5°C
Relative humidity : 65 ±10%
Input voltage : 220V, 60Hz
2.6. Adjustment equipment: Color Analyzer (CA-210 or CA-
110), Pattern Generator (MSPG-925L or Equivalent),
DDC Adjustment Jig equipment, SVC remote controller
3. Main PCB check process
• APC - After Manual-Insult, executing APC
* Download
1. Execute ISP program "Mstar ISP tility" and then click
"Config" tab.
2. Set as below, and then click "Auto Detect" and check "OK"
message.
If display "Error", Check connect computer, jig, and set.
3. Click "Connect" tab.
If display "Can’t ", Check connect computer, jig, and set.
4. Click "Read" tab, and then load download file(XXXX.bin)
by clicking "Read"
5. Click "Auto" tab and set as below
6. Click "Run".
7. After downloading, check "OK" message.
(1) (3)
(2) OK
Please Check the Speed :
To use speed between
from 2 KHz to 4 KHz
(4)
filexxx.bin

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- 14 -
3.1 ADC Process
3.1.1 PC input ADC
3.1.1.1 Auto RGB Gain/Offset Adjustment
_ Convert to PC in Input-source
I2C COMMAND : 0xF4 (SELECT_INP T) 0x00 0x60 (RGB)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT), 0x60(RGB),
0x90(HDMI)
_ Signal equipment displays
Output Voltage : 700 mVp-p
Impress Resolution XGA (1024 x 768 @ 60Hz)
Model : 60 in Pattern Generator
Pattern : 29 in Pattern Generator (MSPG-925 SERISE)
[gray pattern that left & right is black and center is white
signal (Refer below picture)].
Adjustment pattern (PC )
_ Adjust by commanding A TO_COLOR_ADJ ST(0xF1) 0x00
0x02 instruction.
3.1.1.2 Confirmation
_We confirm whether “0xB6(RGB)” address of EEPROM “0xA2”
is “0xAA” or not.
_If “0xB6(RGB)” address of EEPROM “0xB2” isn’t “0xAA”, we
adjust once more
_We can confirm the ADC values from “0xB0~0xB5(RGB)”
addresses in a page “0xA2”
*Manual ADC process using Service Remocon. After enter
Service Mode by pushing “INSTART” key,
execute “ADC Adjust” by pushing “_” key at “Adjust-RGB”.
3.2.1COMPONENT input ADC
3.2.1.1Component Gain/Offset Adjustment
_ Convert to Component in Input-source
I2C COMMAND : 0xF4 (SELECT_INP T) 0x00 0x40
(COMPONENT)
cf. 0x10(TV), 0x20(AV), 0x40(COMPONENT), 0x60(RGB),
0x90(HDMI)
_ Signal equipment displays at SD Mode
Impress Resolution 480i
MODEL : 209 in Pattern Generator(SD Mode)
PATTERN : 08 in Pattern Generator( MSPG-925
SERISE)
_ Signal equipment displays at HD Mode
Impress Resolution 1080i
MODEL : 223 in Pattern Generator(HD Mode)
PATTERN : 08 in Pattern Generator( MSPG-925 SERISE)
Adjustment pattern (COMPONENT )
3.2 Function Check
3.2.1 Check display and sound
_Check Input and Signal items. ( cf. work instructions)
1.TV
2. AV (CVBS/ S-Video)
3.COMPONENT (1080i)
4.RGB (PC : 1980*1080 @ 60hz)
5.HDMI
6.PC Audio In and H/P Out
* Display and Sound check is executed by Remote controller.
4. Total Assembly line process
4.1 Adjustment Preparation
_ Above 30 minutes H/run in RF no signal
_ 15 Pin D-Sub Connector, for IIC communication not including
VGA signal, is connected to A TO W/B EQ IPMENT
4.2 Adjust color coordinate of 9300K
_ Set Input mode to RGB.
_ Set Temperature : 9300K
_ Adjust x: 0.283 ±0.005, y: 0.298 ±0.005(9300oK )
4.3 Adjust color coordinate of 8000K(Normal, Color
Temperature)
_ Set Input mode to RGB.
_ Set Temperature : 8000K
_ Adjust x: 0.298 ±0.005, y: 0.305 ±0.005(8000oK)
4.4 DPM operation confirmation (Only Apply for MNT Model)
Check if Power LED Color and Power Consumption operate as
standard.
_ Set Input to RGB and connect D-sub cable to set
_ Measurement Condition : (100~240V@ 50/60Hz)
_ Confirm DPM operation at the state of screen without Signal
4.5 DDC EDID Write : M2762DP-PML
_ Connect D-sub Signal Cable to D-Sub Jack.
_ Connect DVI Signal Cable to DVI Jack.
_ Connect HDMI1,2 Signal Cable to HDMI1,2 Jack.
_ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
_ Check whether written EDID data is correct or not. (refer to
Product spec).
4.6 HDCP (High-Bandwidth Digital Contents Protection)
SETTING
_ Connect D-sub Signal Cable to D-Sub Jack
_ Input HDCP key with HDCP-key- in-program
_ HDCP Key value is stored on EEPROM(AT24C512) which is
80~A1 addresses of 0xA0~0xA2 page
._AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925
_ HDCP Key value is different among the sets.

- 15 -
Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
4.7 Outgoing condition Configuration
_ After all function test., press IN-STOP Key by SVC Remote
controller. And Make Ship Condition.
_ When pressing IN-STOP key by SVC remocon, Red LED are
blinked alternatively. And then Automatically turn off. (Must not
AC power OFF during blinking)
4.8 Internal pressure
Confirm whether is normal or not when between power board's
ac block and GND is impacked on 1.5kV(dc) or 2.2kV(dc) for one
second

Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 16 -
TROUBLESHOOTING
1. Power- Up Boot Fail Trouble Shooting
Check P700 All
Voltage Level (5V, 15V)
Check Power con nector
OK ? Replace P ower oard
Y
Check IC700 Outp ut
Voltage Level (3.3V)
Replace IC 700 &
Recheck
Y
N
Check X101 Clock
12MHz Replace X 101
Y
N
Replace IC 105 Flash
Memory
Check IC707 Outp ut
Voltage Level (5V) Replace IC707
N
NN
Y
Wave form of X101

Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 17 -
2. No OSD Trouble Shooting
Check P30 0
#8(TXEC+) , #9(TXEC-) ,
#20(TXOC+) , #21(TXOC-)
IC101 has pro lem
Check L VDS Ca le for damage or open
con ductors .
Check L CD Module
Control oard
(Refer to Module CAS)
Y
N
Y
Replace Ca le
N
Y
1. Check Po wer Board , 15V
2. Check IC707 Output Voltage(5V)
3. Check P300(#1,2 ,3) 5V
1. Replace Pow er Board
2. Replace IC707
3. Replace Q300
N
Check P700(#9) INV_ON
High(3.3V)?
Check GPIO Path
(Refer to Appe ndix 1 .)
N
Y

Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 18 -
3. Digital TV Video Trouble Shooting
Check RF Ca le
Check T P Clock, Data, Sync
R440, R441, R442 Tuner(T U400) has pro lems
Check P30 0 LVDS Clo ck
#10(TXEC+) , #11(TXEC-) ,
#22(TXOC+) , #23(TXOC-)
Y
N
Check Tu ner 5V Power &
Q708 Ouput(5V) Replace Q7 08
Y
N
Y
IC101 has pro lem
N
Y
Check L D400 color Bad Tun er. Replace Tuner
None Yello w none
Check Demod ulator Input Clock
X400 (25MHz) Replace X400
N
Y
Check L CD Module
Control oard
Refer to Mo dule CAS
Wave form of X400

Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 19 -
4. Component Video Trouble Shooting
Check input signal format.
Is it supported?
Check signal
C124, C126, C129
Check R10 7, R109, R112,
C124, C126, C129
Y
N
Check J K602 Replace JK602 or Che ck Divice
Y
N
Y
IC101 has pro lem
Y
Check Compo nent Ca le
Wave form of C124Wave form of C126Wave form of C129
Waveform of Comp Y Wave orm of Comp P Wave orm of Comp Pr
The Waveforms depend on input signal
The Waveforms depend on input signal

Copyright ©2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal se Only
- 20 -
5. RGB Video Trouble Shooting
Check input signal format
Is it supported?
Check signal , Hsync, Vsync
(R673, R674) Replace R6 73, R674
Check signal RGB
(R119, R104, R105
C121,C122,C119)
Y
N
Check J K607 Replace JK607
Y
N
Y
Replace R119, R104, R105,
C121,C122,C119
N
IC101 has pro lem
Y
Check RGB Ca le connector
for damage
Y
Wave orm of R673(Vsync) Waveform of R673(Vsync)
Waveform of R104/C121
Waveform of R105/C122 Waveform of R119/C119
The Waveforms depend on input signal