LG 32UD59 User manual

Internal Use Only
P/NO :
CHASSIS :
MODEL :
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
SERVICE MANUAL
MFL62449346(1705-REV00)
32UD59 32UD59-BB
LM71F
LED LCD MONITOR

- 2 -
Copyright © 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION............................................................................................3
SERVICING PRECAUTIONS.....................................................................4
SPECIFICATIONS......................................................................................6
TIMING CHART .........................................................................................7
ADJUSTMENT ...........................................................................................11
BLOCK DIAGRAM.....................................................................................13
EXPLODED VIEW......................................................................................14
ASSEMBLE AND DISASSEMBLE............................................................15
TROUBLE SHOOTING .............................................................................17

- 3 -
Copyright©2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD monitor that
are important for safety. These parts are marked on the
schematic diagram and the Exploded View. It is essential
that these critical parts should be replaced with the
manufacturer’s specified parts to prevent electric shock, fire or
other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the original parts
and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE WITH
BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged in four
corners.
• Do not press on the panel, edge of the frame strongly or electric
shock as this will result in damage to the screen.
• Do not scratch or press on the panel with any sharp objects,
such as pencil or pen as this may result in damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are grounded
through wrist band.
• Do not leave the module in high temperature and in areas of
high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within the
module.
• If the surface of panel become dirty, please wipe it off with a
softmaterial. (Cleaning with a dirty or rough cloth may damage
the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or LIPS
part, must disconnect the AC power because high voltage
appears at inverter circuit about 650Vrms.
• Handle with care wires or connectors of the inverter circuit. If
the wires are pressed cause short and may burn or take fire.
Leakage Current Hot Check Circuit
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
Ω
0.15uF

- 4 -
Copyright©2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes LGE Internal Use Only
SERVICING PRECAUTIONS
CAUTION:Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE:If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or re-connecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION:A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) is opropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices.Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500ºF to 600ºF.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500ºF to 600ºF)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION:Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500ºF to 600ºF)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION:Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.

- 5 -
Copyright©2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION:Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes - 6 - LGE Internal Use Only
SPECIFICATION
NOTE: Specifications and others are subject to change without notice for improvement.
1.32UD59
** Provided accessory: #7/#8/#9/#10/#11/#12/#13
No
Item
Content
Remark
1
Customer
BRAND
2
User Model Name
32UD59
3
Sale region
Worldwide
4
Feature
31.5” LCD MONITOR(UHD)
5
Chassis Name
LM71F
6
General
Scope
External SW
& Adj.
5-way joystick switch
Function
Picture Mode, Ratio, S.E.S, Six Color, On
Screen Control, Dual Controller
Gamma calibration
7
Power Cord
Length : 1.55±0.05 M/ Shape : Wall-out /
Color : Black
Weight : 0.16kg ± 10%
Power cord can be changed
according to region.
Cable
HDMI
Length : 1.5m±0.05m / Shape : Detachable
Type / Color : Black / Weight : 0.091kg± 10%
SET accessory
P/N : EAD63954401
CABLE : 100Ω±10Ω
CONNECTOR : 100Ω±15Ω
DisplayPort
Length : 1.5m±0.05m
Shape : Detachable Type / Color : Black /
Weight : 0.095kg± 10%
SET accessory
P/N : EAD63749401
CABLE : 100Ω±5Ω
CONNECTOR : 100Ω±10Ω
9
Power
Output: DC 19V 3.42A, 65W Adapter
Color: Black,Weight : 0.58kg ±10%, without
vinyl bag
P/N : EAY62990906
10
Factory calibration report
0.002kg
SET accessory / Refer to BOM
1 1
Applying module list
P/No
Specification
EAJ64127601
M315DJJ-K30

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes - 7 - LGE Internal Use Only
2.Applying module Character
1) Characteristic
No
Item
Content
Remark
1
LCD Module
Feature
Maker
INX
T y p e
V A
Active DisplayArea
31.5 inches(80.0051cm) (Aspect ratio 16:9)
Pixel Pitch [mm]
0.2 0.0603 [mm]X RGB X 0.18159 [mm]
Electrical Interface
V by 1
Color Depth
1.073 Billion colors
Size (Outline) [mm]
717.4(H)x413.85(V)x17.9(D)mm (Typ.)
Surface Treatment
AG type, 3H hard coating, Haze 25
Operating Mode
Transmissive mode, normally Black
Back light Unit
White LED
Color Gamut
DCI-P3 95%
Standard Measurement Condition
Ambient Luminance Level : dark ( < 10 lux)
Ambient Temperature : Normal Temperature(10 ~ 25 ℃)
warm-up Time : More than 30min (at Full White Pattern)
Input Signal : 3840X2160@60Hz
Contrast : 70 / Brightness : Max. 100
6500K : Color Temperature Setting is 6500 K( if it’s not special specification)
Another Spec.: Product Specification Standard( LG(55)G1-1034 )
Cosmetic Spec. : LCD Module IIS Spec

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes - 8 - LGE Internal Use Only
TIMING CHART
Signal (Video & Sync)
– DisplayPort
Mode
section
polarity
DOT
CLOCK[MHz]
Frequency
[kHz]/[Hz]
Total
Period(E)
Display
(A)
Front
Porch(D)
Sync.
(C)
Back
Porch(B)
Resolution
1
H(Pixels)
-
25.175
31.469
800
640
16
96
48
640 x 480
V(Lines)
-
59.94
525
480
10
2
33
2
H(Pixels)
+
40
37.879
1056
800
40
128
88
800 x 600
V(Lines)
+
60.317
628
600
1
4
23
3
H(Pixels)
-
65
48.363
1344
1024
24
136
160
1024 x 768
V(Lines)
-
60
806
768
3
6
29
4
H(Pixels)
+
79.99
54.347
1472
1152
32
96
192
1152 x 864
V(Lines)
+
60.05
905
864
1
3
37
5
H(Pixels)
+
74.250
45.00
1650
1280
1 1 0
40
220
1280 x 720
V(Lines)
+
60.00
750
720
5
5
20
6
H(Pixels)
+
108
63.981
1688
1280
48
112
248
1280 x 1024
V(Lines)
+
60.02
1066
1024
1
3
38
7
H(Pixels)
+
108.00
60.00
1800
1600
24
80
96
1600 x 900
V(Lines)
+
60.00
1000
900
1
3
96
8
H(Pixels)
+
148.5
67.5
2200
1920
88
44
148
1920 x 1080
V(Lines)
-
60
1125
1080
4
5
36
9
H(Pixels)
+
241.50
88.79
2720
2560
48
32
80
2560 x 1440
V(Lines)
-
59.95
1481
1440
3
5
33
10
H(Pixels)
+
266.64
66.66
4000
3840
8
144
8
3840 x 2160
V(Lines)
-
30
2222
2160
54
5
3
11
1)
H(Pixels)
+
533
133.32
4000
3840
8
144
8
3840 x 2160
V(Lines)
-
60
2222
2160
54
5
3

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes - 9 - LGE Internal Use Only
< HDMI>
Main Recommended Timing(HDMI Video input)
Factory support
mode
Horizontal
frequency
Vertical
frequency
(Preset Mode)
(KHz)
(Hz)
1
480P
31.5
60
2
720P
45
60
3
1080P
67.5
60
4
2160P
135
60
Mode
section
polarity
DOT CLOCK[MHz]
Frequency
[kHz]/[Hz]
Total
Period(E)
Display
(A)
Front
Porch(D)
Sync.
(C)
Back
Porch(B)
Resolution
1
H(Pixels)
-
25.175
31.469
800
640
16
96
48
640 x 480
V(Lines)
-
59.94
525
480
10
2
33
2
H(Pixels)
+
40
37.879
1056
800
40
128
88
800 x 600
V(Lines)
+
60.317
628
600
1
4
23
3
H(Pixels)
-
65
48.363
1344
1024
24
136
160
1024 x 768
V(Lines)
-
60
806
768
3
6
29
4
H(Pixels)
+
79.99
54.347
1472
1152
32
96
192
1152 x 864
V(Lines)
+
60.05
905
864
1
3
37
5
H(Pixels)
+
74.250
45.00
1650
1280
1 1 0
40
220
1280 x 720
V(Lines)
+
60.00
750
720
5
5
20
6
H(Pixels)
+
108
63.981
1688
1280
48
112
248
1280 x 1024
V(Lines)
+
60.02
1066
1024
1
3
38
7
H(Pixels)
+
108.00
60.00
1800
1600
24
80
96
1600 x 900
V(Lines)
+
60.00
1000
900
1
3
96
8
H(Pixels)
+
148.5
67.5
2200
1920
88
44
148
1920 x 1080
V(Lines)
-
60
1125
1080
4
5
36
9
H(Pixels)
+
241.50
88.79
2720
2560
48
32
80
2560 x 1440
V(Lines)
-
59.95
1481
1440
3
5
33
10
H(Pixels)
+
297
67.5
4400
3840
176
88
296
3840 x 2160
V(Lines)
-
30
2250
2160
8
10
72
11
1)
H(Pixels)
+
594
135
4400
3840
176
88
296
3840 x 2160
V(Lines)
-
60
2250
2160
8
10
72

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes - 10 - LGE Internal Use Only
4. Supporting timing
EDID 2Page 영 역 의 Video Short Block Description
수평
크기
수직
크기
주사방 식
주 파 수
비율
HDMI 1.4
HDMI 2.0
HDMI FreeSync
DP
DP FreeSync
640
480
P
59.94/60
4:3
●
●
●
720
480
P
59.94/60
4:3
●
720
480
P
59.94/60
16:9
●
●
●
1280
720
P
59.94/60
16:9
●
●
●
1920
1080
I
59.94/60
16:9
●
●
1920
1080
P
23.98/24
16:9
●
1920
1080
P
29.97/30
16:9
●
●
1920
1080
P
59.94/60
16:9
●
●
●
3840
2160
P
23.98/24
16:9
●
3840
2160
P
25
16:9
●
3840
2160
P
29.97/30
16:9
●
3840
2160
P
50
16:9
●
3840
2160
P
59.94/60
16:9
●

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes - 11 - LGE Internal Use Only
ADJUSTMENT
1. How to Enter the SVC mode
#1) Monitor Power off using the Circle OSD
#2) Move joystick button Left 3 Times and Right 1 Time
#5) DC On (Click the Joystick Power button)
#6) Select the Menu
#7) you can see Service Menu at the top left side and you can get information from it.
2. How to update the F/W”(refer to Next Page)
#1). Connect Mstar Jig to monitor and PC.

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes - 12 - LGE Internal Use Only
#2). Connect HDMI cable and select “Connect”button.
#3). Select “Read”button(1st) and find bin file(2nd) and then check the checksum value(3th).
#4). Select“Auto”button(1st) and confirm the checkbox settings(2nd) and then select“Run”button(3th).
*Please make sure that “File Area”option is selected.
#5).After ISP is completed, do factory reset in the OSD main menu.

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes - 13 - LGE Internal Use Only
BLOCK DIAGRAM (Main)
MST9U17Q1
SPI
UHD
Panel (3840 X 2160)
HDMI 1
DPRX, AUXN, HPD
HDMI 2
TS3DV642
(Switch)
Key1, Key2
DDR2
SDRAM
(128MB)
Flash
Memory
(8M)
TMDS // DDC // HPD Joystick
(Control Key)
DP
System
EEPROM
(32KB)
I2C
EDID
EEPROM (내장)
HP Out
L/R Out
HP AMP
ALC5629
WLED_ENABLE WLED_ADIM
( HDMI 2.0 )
Vby1
AUDIO
AMP
NTP7515
LED Driver IC
MP3378E
I2S
(DP1.2)

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes -14- LGE Internal Use Only
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
910
900
400
920
200
A3
500 510
320
330
300
540
120

■assemble method
1. Assemble with CA+ Module
2. Assemble by latches
1.Put on the rear shield assy on the module
guided by cabinet rib
1.Assemble LVDS cable by hand.
2.Assemble LED driver cable by hand.
1.Assemble the Jog assy and speaker assy
and attach tape 1EA
1. Assemble the B/C and cabinet by latch 1. Assemble screw 4EA back cover with rear sheield
1.Assemble Stand base and Body by
Thumb screw.
General drivers
▣ Tool Description
Gloves
Caution: SVC man must check insulation sheet on the module before assembling the set
1.Assemble Stand assy at back cover
(One click button)
Assemble and disassemble method

■Disassemble method
1. Remove the stand using one click button 1.Remove the Screw 4EA
1.Disassemble from top ->left/right ->top corner . 1.The open status top/side of both ,
one hand was supported module, and open the Back cover.
1. Disassemble the Rear shield assy and all cable.
1. Remove the cabinet from module
General drivers
▣ Tool Description
Gloves
Assemble and disassemble method

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 17-
LGE Internal Use Only
Trouble shooting : No Power
First of all, Check whether there is SVC Bulletin in GCSC System for these model.
Replace X200
N
Check JK400
Voltage Level (19V)
Check Power connector
OK ? Replace Adapter
Y
N Y
Check IC402 Output
Voltage Level (12V)
Replace IC402 &
Recheck
Y
N
Check X200 Clock
12MHz
Check IC401 Output
Voltage Level (5V)
Replace IC401 &
Recheck
N
Y
Replace IC202 Flash
Memory
Y
Check IC404,IC405
Output
Voltage Level (1.8V,1.15V)
Replace IC403 & IC404
Recheck
N
Y

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 18-
LGE Internal Use Only
Trouble shooting : No Screen on
Replace Cable
N
Module Back Light On?
Check IC500
Replace LED Driver IC
Y
N
N
Check Panel Power 12V (P201)
Check IC402 Output 12V
Replace IC402 &
Recheck
Y
N
Check Panel eDP AUX
P201(#17,18)
Check IC200
Repair Main B/D
Y
N
Check FFC Cable for Damage
or Open Conductors
Check LED Driver Output
(P500 - 1,2,7,8)
Replace T-Con Board or
Module
Y
Check IC200 (PIN No.199)
Replace Main Scaler OC
N
Check WLED_ENABLE
High?
Y

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 19-
LGE Internal Use Only
Trouble shooting : No Video – HDMI
Replace Main Scaler (IC200)
Check input signal format
Is it supported?
Check JK100(JK101) for
proper connection or
Damage
Replace Connector
Y
N
Check I2C Signal
(JK100 or JK101) Re Download EDID Data
Y
N
Y
Check HDMI Cable for
Damage or Open Connector
Y

Copyright 2017 LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 20 -
LGE Internal Use Only
Trouble shooting : No Video – DP
Replace Main Scaler (IC200)
Check input signal format
Is it supported?
Check JK102 for proper
connection or Damage Replace Connector
Y
N
Y
Check DP Cable for Damage
or Open Connector
Y