LG Flatron M203WA User manual

COLOR MONITOR
SERVICE MANUAL
Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : CL-75
MODEL: M203WA(M203WA-BZCB.A**BLF)
( ) **Same model for Service

- 2 -
1. LCD CHARACTERISTICS
Type : TFT Color LCD Module
Size : 258.0(H) x 400.0(V) x 22.0(D)
Pixel Pitch : 0.291mm x 0.291mm
Color Depth : 8bits/ 16.7M colors
Active Video Area : 20.1inches diagonal
Surface Treatment : Anti-Glare, Hard Coating (3H)
Backlight Unit : 6CCFL
Opraating Mode : Transmissive mode, Normally Black
Electrical Interface : LVDS interface
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥10
Right : +88° typ. Left : -88° typ.
Top : +88° typ. Bottom : -88° typ.
2-2. Luminance: 220(min.), 300(typ.)
2-3. Contrast Ratio : 400(min.), 600(typ.)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
1) Type :
Separate Sync, Composite, SOG, Digital
3-3. Operating Frequency
Horizontal : 30 ~ 83kHz
Vertical : 55 ~ 75Hz
4. SPECIAL FUNCTION
4-1. Audio AMP
1) Output: 5Wrms + 5Wrms (Rated Out put ±10%)
2) Freq. Character: 250Hz~20KHz Range(-3dB)
3) Input: PC - 0.7±0.1Vrms
AV - 0.5±0.1Vrms
4-2. SPEAKER
1) Impedance : 16Ω
2) Input : Max +8W, Normal +5W
4-3. TV
1) Type : PAL
2) Tuner IF : PIF - 38.9MHz
SIF - 33.4MHz
CIF - 34.47MHz
3)
Receiving Channel
: VHF- Low: 45.25~140.25MHz
HIGH: 147.25~423.25MHz
UHF - 431.25~855.25MHz
4-4. AV
1) Video Level : Input - 0.7±0.15Vp-p
2) Sync Level : Input - 0.286±0.075Vp-p
3) Color Burst : Input - 0.214±0.072Vp-p
4) Audio Level : AV Input - 0.5±0.1Vrms
PC Input - 0.7±0.1Vrms
5) Video Cross Talk : 43dB
5. Max Resolution
WSXGA : 1680 x 1050@60Hz
6. POWER SUPPLY
6-1. Power
100-240V~, 50/60Hz
6-2. Power Consumption
7. ENVIRONMENT
7-1. Operating Temperature: 10°C~35°C
7-2. Operating Humidity : 20%~80%
7-3. MTBF : 50,000 Hours (Min.)
8. DIMENSIONS(WxLxH)
Width : 505.5 mm (14.17'')
Depth : 231.5 mm (6.02'')
Height : 365 mm (14.17'')
9. WEIGHT (with TILT)
Net. Weight : 6.6kg (14.55 lbs)
Gross Weight : 10.0 kg (22.05 lbs)
CONTENTS
SPECIFICATIONS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
SERVICE PRECAUTIONS ...................................... 4
TIMING CHART ....................................................... 7
DISASSEMBLY ....................................................... 8
BLOCK DIAGRAM ................................................... 9
DESCRIPTION OF BLOCK DIAGRAM ................. 10
ADJUSTMENT ...................................................... 12
TROUBLESHOOTING GUIDE .............................. 15
WIRING DIAGRAM ............................................... 20
EXPLODED VIEW...................................................21
REPLACEMENT PARTS LIST ...............................23
SCHEMATIC DIAGRAM......................................... 30
MODE
POWER ON (NORMAL)
STAND-BY
SUSPEND
POWER OFF
H/V SYNC
ON/ON
OFF/ON
ON/OFF
OFF
POWER CONSUMPTION
less than 74 W
normal-68W, max-74W
less than 4 W
less than 4 W
less than 2 W
VIDEO
ACTIVE
OFF
LED COLOR
BLUE
AMBER

- 3 -
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter

SERVICING PRECAUTIONS
- 4 -
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cotton-
tipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "anti-
static" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)

- 5 -
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

- 6 -
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.

- 7 -
TIMING CHART
VIDEO
SYNC
B
C
EA
D
1 H(Pixels) - 28.321 31.468 900 720 18 108 54 720 X 400
V(Lines) + 70.08 449 400 12 2 35
2 H(Pixels) - 25.175 31.469 800 640 16 96 48 640 x 480
V(Lines) - 59.94 525 480 10 2 33
3 H(Pixels) - 31.5 37.5 840 640 16 64 120 640 x 480
V(Lines) - 75 500 480 1 3 16
4 H(Pixels) + 40.0 37.879 1056 800 40 128 88 800 x 600
V(Lines) + 60.317 628 600 1 4 23
5 H(Pixels) + 49.5 46.875 1056 800 16 80 160 800 x 600
V(Lines) + 75.0 625 600 1 3 21
6 H(Pixels) - 65.0 48.363 1344 1024 24 136 160 1024 x 768
V(Lines) - 60.0 806 768 3 6 29
7 H(Pixels) - 78.75 60.123 1312 1024 16 96 176 1024 x 768
V(Lines) - 75.029 800 768 1 3 28
8 H(Pixels) +/- 108.0 67.500 1600 1152 64 128 256 1152 x 864
V(Lines) +/- 75.000 900 864 1 3 32
9 H(Pixels) + 108.0 63.981 1688 1280 48 112 248 1280 x 1024
V(Lines) + 60.02 1066 1024 1 3 38
10 H(Pixels) + 135.0 79.976 1688 1280 16 144 248 1280 x 1024
V(Lines) + 75.035 1066 1024 1 3 38
11 H(Pixels) - 146.25 65.290 2240 1680 104 176 280 1680 x 1050
V(Lines) + 59.954 1089 1050 3 6 30
Mode H / V Polarity Dot
Clock Frequency [kHz] / [Hz] Total
Period
( E )
Display
( A ) Front
Porch
( D )
Sync.
( C ) Blank
Porch
( B ) Resolution

- 8 -
DISASSEMBLY
Disassembly Hinge Cover.
Pull the speaker cover.
# 1
Remove the screws.
Disassemble back cover.
Press down on cabinet and pull the back cover.
# 2
# 3
# 4
# 5 # 6
Remove the screws.
Remove the screws.
# 7

- 9 -
BLOCK DIAGRAM

DESCRIPTION OF BLOCK DIAGRAM
- 10 -
1. Format Converter (MST9883C)(U702)
This IC contain A/D converter, Pre-amp and PLL circuit that converting Analog video signal(0.7p-p RGB) to digital signal.
(656 Format)
2. Power Supply Block (LIPS)
This Block Generates DC Voltage (5V,15V) to Main Control system from AC Power (100-240 V, 50/60 Hz, 1.2A)
The Minimum of Power efficiency is about 80%.
3. DC/DC Converter block
DC/DC Converter convert the input 5V,15V to proper 3.3V,5V,12V for Main control system.
For shooting heat trouble, we use the DC/DC converting IC.
4. Audio Amplifier (TPA3004D2)(U201)
This block is composed of TPA3004D2 and peripheral device.
The function of the audio amplifier is that to amplify audio L / R signal transmitted from audio decoder. The audio signal is
amplified according to pre-defined DC volume control curve.
Also, headphone amplifier (TPA6110) is controlled through line-out.
5. Audio / Video / IF Decoder(U601)
This block is composed of VCT49xy and peripheral devices.
Micom controls this IC through IIC Line.
1) Video Decoder
This Block Selects input Video signals (like CVBS, Y/C, SCART RGB) and output RGB signal.
On decoding, We can control signal like Contrast, Brightness, Sharpness, Color, tint signals including Adaptive Comb
Filter.
2) Audio Decoder
This block analyzes audio input signal through A/V Jack and PC audio and Tuner IF.
The analyzed signals transmitted to audio amplifier (TPA3004D2)
On decoding, We can control signal like Bass, treble.
3) IF Decoder
This block can change IF signal to audio and video signal that transmitted to Video/audio decoder.
6. Video Signal Processor
It is composed of GM1501(U401).
GM1501 includes A/D Converter and LVDS Transmitter.
GM1501 is directly Inputted Analog and Digital Signal or Video Signal from Video Decoder.
This Signal is converted into compatible Signal by MICOM's control and then GM1501 transmit it to LCD Module.
7. Micom Controller
It is composed of 29LV040B(U403) its functions is controlling each IC, display mode and frequency through EEPROM and
IIC communication.
8. TUNER(TU802)
Micom controls this IC through IIC Line.
TUNER makes IF and transmits IF signal to VCT49xy.

- 11 -
EMI
COMPONENTS
LINE
100 ~ 240V
INPUT RECTIFIER
AND FILTER
ENERGY
TRANSFER
OUTPUT RECTIFIER
AND FILTER
12V
5V
GND
SIGNAL
COLLENT-
ION
PHOTO-
COUPLER
ISOLATI ON
HVDC 100KHz
PRIMARY SECONDARY
50 ~ 60Hz
PWM
COMTROL
CIRCUIT
Operation description_LIPS
LIPS Board Block Diagram
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.

- 12 -
ADJUSTMENT
Windows EDID V1.0 User Manual
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Don’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy “UserPort.sys”file to
“c:\WINNT\system32\drivers”folder
b) Run Userport.exe
c) Remove all default number
d) Add 300-3FF
e) Click Start button.
f) Click Exit button.
2. EDID Read & Write
1) Run WinEDID.exe
2) Edit Week of Manufacture, Year of Manufacture,
Serial Number
a) Input User Info Data
b) Click “Update”button
c) Click “Write”button

- 13 -
SERVICE OSD
Model : M203WX05/06/09
1.300
MPElapsedTime: 19H
Nvram Initial OFF
Teletext Language0
WBAdjust 0
Card Reader ISPToStart
Teletext TOPOFF
RGBTest
Prev
SERVICE MENU
MENU
Aging Mode OFF
Baud Rate 9600
Auto Off after 2Hours ON
VCTi Ver. 0401
Author :
Prev
SERVICE MENU
MENU
■Description of operation
- Elapsed time : Time used for back light
- Nvram Initial : NVRAM reset
- Teletext Language : Sets the Teletext Coad
- WB Adjust : Adjusts the white balance
- Card Reader ISP : The use the Card Reader ISP (Only M203WX)
- Teletext TOP : The use the TOP (On / Off)
- RGB Test : Adjusts RGB Gain, Offset, Sub-Contrast/Sub-Brightness
■Description of operation
- Aging Mode : Sets the aging mode
- Baud Rate : Sets the Baud Rate
- Auto Off after 2Hours
- VCTi version : Show the VCTi version
Teletext
Language
Code Country
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
WEST EU
West Europe
English, France, Scandinavian, Czech, German, Spain, Portuguese, Italian
Recommended data
EAST EU
East Europe
Polish, France, Scandinavian, Czech, Slovak, German, Slovenian, Croatian, Italian, Rumanian
Recommended data
TURKEY + W EU
Recommended data English, France, Scandinavian, Turkish, German, Spain, Portuguese, Italian, Greek
English, Czech, Hungary, German, Polish, Serbia, Turkish, Rumanian,
CYRILLIC 1 (Polish/Russian/Estonian),(Lettish/Estonian)
CYRILLIC 2 Polish, Russian, Scandinavian, Czech, Estonian, Lettish
CYRILLIC 3
Recommended data
English, Russian, Estonian, Czech, Slovak, German, Ukrainian, Lettish, Lithuanian
TURKEY / Greek 1
- English, France, Scandinavian, Turkish, German, Spain, Italian, Greek
TURKEY / Greek 2
- (English/Turkish), (German/Turkish), Greek
TURKEY / Greek 3
A sphere of English, France, Scandinavian, Turkish, German, Spain, Italian, Greek
Turkey & Greek
Recommended data
ARAB / FRANCE - (France/English) , (Turkish/English) , Arabic
ARAB / ENGLISH
A sphere of Arab
(English/France) , (Turkish/France), Arabic
Recommended data
ARAB / HEBREW 1
- Hebrew, Arabic
ARAB / HEBREW 2 Recommended data
(English/France/Arabic) , (Hebrew/Arabic)
FARSI / ENGLISH
A sphere of Farsi
(English/France) , (Turkish/France) , Farsi
Recommended data
FARSI / FRANCE
- France , (Turkish/ France) , Farsi
FARSI ALL - English, France, Farsi

- 14 -
Figure 1. Cable Connection
220
IBM
Compatible PC
PARALLEL PORT
Power inlet (required)
Power LED
ST Switch
Power Select Switch
(110V/220V)
Control Line
Not used
RS232C
PARALLEL
V-SYNC POWER
ST
VGS MONITOR
E
E
V-Sync On/Off Switch
(Switch must be ON.)
F
F
A
A
B
B
C
C
1510
5
569
1
1
1
14
13
25
6
5V
5V
5V
4.7K
4.7K
4.7K
74LS06
74LS06
OFF ON
OFF
ON
11
S-Video
Video Signal
Generator

- 15 -
TROUBLESHOOTING GUIDE
1. NO POWER
No Power
(Power Indicator Off)
Check Key Board
NO
NO
NO
Check Lips
Change Micom
Check Crack of Damage
Of Circuit Item
Around U903,U906
NO Check U402
YES
YES
YES
YES
Check J901 Voltage
Pin #1,#2 : 15V
Pin #5,#6 : 5V
Check U903 Pin #3 : 3.3V
Check U906 Pin #3 : 1.8V
1
2
3
4
5
1 2
Waveforms
J901-#1,2(15V) J901-#5,6(5V)
4 5
U906-#3(1.8V) X401(14.318Mhz)
3U903-#3(3.3V)
Check Micom ID & Version
Check X401 : 14.318Mhz

- 16 -
2. NO RASTER(OSD IS NOT DISPLAYED)
No Raster
(OSD Is Not Displayed)
Change J401
NO
NO
NO
Change Pannel Link Cable
Change Micom
YES
YES
YES
YES
Check Pannel Link
Cable
Check J401 Crack
Check Micom ID &
Version
Check U918 Pin #2 : 2.5V
Check U402
6
Waveforms
U918-#2(2.5V)
6

- 17 -
3. NO RASTER ON AV1, AV2, TV
No Raster On Video Signal
Check Peripheral Circuit
Of J802(Scart)
NO
NO
NO
Change Video Board Ass'y
YES
YES
YES YES
YES
YES
Check Cable of J106
Check Video Board
Check
U908 Pin #1,#3 : 5V, 3.3V
Check U909 Pin #3 : 1.8V
In Case of AV1(Scart) In Case of TV
Change Video Board Ass'y
Check Peripheral Circuit
Check Tuner TU802
Check Connection of EXT.
789
Waveforms
7
8
9
U908-#1(5V) U908-#3(3.3V) U909-#3(1.8V)

- 18 -
4. NO RASTER ON Card Reader
No Raster
On Card Reader
NO
NO
NO
Chang FFC Cable
Repair U502 Soldering
Repair the Point
YES
YES
Check
FFC Cable of J104
Check
U502
Check
Signal of R527, C531,
C528 in Card Reader
Board
10
10
Waveforms
R527,C531,C528

- 19 -
5. NO SOUND
No Sound
NO
NO
NO
Check Speaker Condition
PC Mode
1.Check J103 Peripheral
Circuit
2. Check U803 #5,
Voltage Must over 8V
AV1 Mode
1.Check Scart
Connection
2.Check No Raster AV1
AV2 Mode
1.Check C605, C606
2.If No Signal on C605 or
C606, Change Video
Board
Card Reader
1.Check U703 Peripheral
Circuit
2. Check FFC Cable
Check the
Peripheral IC
Of U201
Change the Cable
Check a Signal of
C153~156
Change the Cable
YES
YES
YES
YES
Check the Cable of
Key to Speaker
<< Check Input Signal Waveform >>
Check input Signal
waveform
Check the Cable of
Main to Key

- 20 -
30P
11P
12P
12P
6631T20034P
6631T12006R
6631T11012W
6631T20036E
EAB31789901
WIRING DIAGRAM