Microchip Technology SAM E70 Xplained Ultra User manual

SAM E70 Xplained Ultra User's Guide
Introduction
This user’s guide provides detailed information about the SAM E70 Xplained Ultra Evaluation kit and its
various features. Figure below illustrates the SAM E70 Xplained Ultra Evaluation kit.
Figure 1. SAM E70 Xplained Ultra Evaluation Kit with PHY Daughter Board
Features
• ATSAME70Q21 Microcontroller
• One Mechanical Reset Button
• One Mechanical User Push Button
• Two User LEDs
• 12.0 MHz Oscillator (DSC6003)
• 32.768 kHz Oscillator (DSC6083)
• 2-MB SDRAM
• 4-MB QSPI Flash (SST26VF032BA)
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• Ethernet Interface with External IEEE 802.3az 10Base-T/100Base-TX Ethernet RMII PHY on a
Daughter Board
• AT24MAC402 256KB EEPROM with EUI-48 Address
• ATA6561 CAN Transceiver
• Micro SD Card Connector with SDIO Support
• Camera Interface Connector
• Two Xplained Pro Extension Headers
• Graphics Card Interface
• CoreSight® 20 Connector for 4-bit ETM
• Arduino MEGA Shield Connector
• External Debugger Connector
• USB Interface, Device and Host Mode
• Embedded Debugger:
– Programming and debugging through USB interface
– Auto-ID for board identification in Atmel Studio and MPLAB® X
– One yellow status LED
– One green board power LED
– Symbolic debug of complex data types including scope information
– Data Gateway Interface: SPI, I2C, four GPIOs
– Virtual COM port (CDC)
• External Power Input (5-14V) or USB Power
• X32 Daughter Board Interface to Support Audio and Bluetooth®
• One mikroBus™ Interface
Kit Overview
The Microchip PIC32 SAM E70 Xplained Ultra Development Kit (DM320113) provides a modular
development system for Microchip’s line of 32-bit Cortex® microcontrollers.
For a free Microchip demonstration code and additional information, visit the MPLAB Harmony™ web
page at: http://www.microchip.com/MPLABHarmony.
The Atmel SAM E70 Xplained Ultra Dvelopment Kit is a hardware platform to evaluate the Microchip
ATSAME70Q21. The kit offers a set of features that enables the ATSAME70Q21 users to start with the
SAM E70 peripherals and understand how to integrate the device in their design.
The SAM E70 Xlpained Ultra kit contains the following items:
• One SAM E70 Xplained Ultra Development Kit
• One KSZ8061 Ethernet PHY
• One Graphics card set up for 565 (16-bit color) graphics
Note: If any items are missing in the kit, contact Microchip sales office for assistance. A list of Microchip
Sales offices is provided on the last page of this document.
The figure below illustrates the SAM E70 Xplained Ultra Evaluation Kit features.
© 2019 Microchip Technology Inc. DS70005389A-page 2

Figure 2. SAM E70 Xplained Ultra Evaluation Kit
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The table below provides the SAM E70 Xplained Ultra Evaluation kit feature descriptions.
Table 1. SAM E70 Xplained Ultra Evaluation Kit Feature and Location
Number Description
1 CAN interface
2 X32 Daughter Board interface
3 Mikro interface
4 Ethernet PHY interface
5 Ethernet Clock enable/disable jumper
1. Shorted = disabled
2. Open = enabled
6 EXT1/EXT2 interface
7 Debugger USB
1. Programming
2. Power
3. DGI
8 External Reset Button
9 User Button
10 MCU current measurement jumper
11 SAM E70 Host/Device USB
12 CoreSite® 20 (SWD + ETM) debugging interface
13 Barrel power input (2.1mm)
14 User defined LEDs
15 LED2/USB detect jumper
16 Image Sensor interface
17 SWD debugger interface
18 Graphics card interface
19 ATSAME70Q21B
20 SQI external Flash memory
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Table of Contents
Introduction......................................................................................................................1
1. Getting Started.......................................................................................................... 6
2. Xplained Ultra............................................................................................................ 8
3. Embedded Debugger................................................................................................ 9
3.1. Hardware Identification System....................................................................................................9
4. System Level Block Diagram...................................................................................11
5. Hardware Features..................................................................................................12
5.1. Xplained Pro Standard Extension Header..................................................................................12
5.2. Graphics Connectors or GFX Card Interface............................................................................. 13
5.3. SDRAM and LCD Connections.................................................................................................. 16
5.4. Camera Connector.....................................................................................................................18
5.5. USB Connectivity....................................................................................................................... 19
5.6. Chip Erase Header.....................................................................................................................20
5.7. Audio Connectivity......................................................................................................................20
5.8. mikroBUS™ Header................................................................................................................... 22
5.9. CAN............................................................................................................................................22
5.10. Ethernet......................................................................................................................................23
5.11. Debug USB Connectivity............................................................................................................24
5.12. Switches.....................................................................................................................................24
5.13. AT24MAC402 Serial EEPROM.................................................................................................. 25
5.14. Power Sources...........................................................................................................................26
6. Hardware................................................................................................................. 28
6.1. SAM E70 Xplained Ultra Development Board Schematics........................................................ 28
6.2. Bill of Materials...........................................................................................................................50
The Microchip Web Site................................................................................................ 55
Customer Change Notification Service..........................................................................55
Customer Support......................................................................................................... 55
Microchip Devices Code Protection Feature................................................................. 55
Legal Notice...................................................................................................................56
Trademarks................................................................................................................... 56
Quality Management System Certified by DNV.............................................................57
Worldwide Sales and Service........................................................................................58
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1. Getting Started
SAM E70 Xplained Ultra Evaluation Quick Start
Follow these steps to explore the Atmel SAM E70 Xplained Ultra evaluation kit:
1. Download and install MPLAB X.
2. Launch MPLAB X.
3. Install MPLAB Harmony 3™.
When Microchip SAM E70 Xplained Ultra is connected to the computer for the first time, the operating
system will install a driver software. The driver file supports both 32-bit and 64-bit versions of Microsoft®
Windows® XP/ Vista /7/8/10.
Once the kit is powered, the green power LED will be lit and MPLAB X will auto-detect the kit and identify
which Xplained Pro extension boards are connected. MPLAB X will provide relevant information like data
sheets and kit documentation. The SAM E70 device is programmed and debugged by the on-board
Embedded Debugger, hence no external programmer or debugger tool is needed.
Design Documentation and Relevant Links
The following list provides links to the relevant documents and software for the SAM E70 Xplained Ultra.
• Xplained Pro products
– Atmel Xplained Pro is a series of small-sized and easy-to-use evaluation kit for Microchip
microcontrollers and other Microchip products. It consists of a series of low-cost MCU boards for
evaluation and demonstration of features and capabilities of different MCU families.
• Microchip MPLAB® Integrated Development Environment
– A free Microchip MPLAB IDE for development of C/C++ and assembler code for Microchip
microcontrollers.
• MPLAB Harmony™
– A free MPLAB Harmony code base is available for user application. The latest MPLAB Harmony
code is available for download at:http://www.microchip.com/MPLABHarmony.
• EDBG User Guide
– This user’s guide provides additional information about the on-board Embedded Debugger.
• Data Visualizer
– Data Visualizer is a program used for processing and visualizing data. The Data Visualizer can
receive data from various sources, such as the Embedded Debugger Data Gateway Interface
that is found on the Xplained Pro boards and COM ports.
• IAR Embedded Workbench® for ARM®
– A commercial C/C++ compiler that is available for ARM. A 30-day evaluation version and a code
size limited kick-start version are also available for download from their web site. The code size
limit is 16-KB for devices with M0, M0+, M1 cores, and 32-KB for devices with other cores.
• Keil MDK-ARM Microcontroller Development Kit
– The MDK-ARM is a complete software development environment for Cortex®-M, Cortex-R4,
ARM7™, and ARM9™ processor-based devices. The MDK-ARM is specifically designed for
microcontroller applications, it is user friendly yet powerful enough for the most demanding
embedded applications.
• Design Documentation
Getting Started
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– Package containing schematics, BOM, assembly drawings, 3D plots, layer plots, and so on.
• Hardware Users Guide
– PDF version of this user guide.
Getting Started
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2. Xplained Ultra
The SAM E70 Xplained Ultra implements several Xplained Pro standards like extension headers and
connectors. Xplained Pro is an evaluation platform that provides a full Microchip microcontroller
experience. The platform consists of a series of Microcontroller (MCU) boards and extension boards that
are integrated with the Microchip MPLAB IDE that supports data streaming. The Xplained Pro MCU
boards support a wide range of Xplained Pro extension boards, such as audio DACs/CODECs, Ethernet
PHYs, graphics cards, and mikroBUS™ that are connected through a set of standardized headers and
connectors. Each extension board has an identification (ID) chip to uniquely identify which boards are
connected to a Xplained Pro MCU board. This information is used to present relevant user guides,
application notes, data sheets, and example code through MPLAB X.
Xplained Ultra
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3. Embedded Debugger
The SAM E70 Xplained Ultra contains Microchip Embedded Debugger (EDBG) for on-board debugging.
The EDBG is a composite USB device, which is based on the following interfaces:
• Debugger
• Virtual COM Port
• Data Gateway Interface (DGI)
Together with the Microchip MPLAB IDE, the EDBG debugger interface can program and debug the
ATSAME70Q21. On the SAM E70 Xplained Ultra, the SWD interface is connected between the EDBG
and the ATSAME70Q21.
The Virtual COM Port is connected to a UART on the ATSAME70Q21 and provides an easy way to
communicate with the target application through the terminal software. It offers variable baud rate, parity,
and Stop bit settings. The settings on the ATSAME70Q21 must match the settings given in the terminal
software.
Note: If not set automatically, Data Terminal Ready (DTR) must be set in the terminal software.
The DGI consists of several physical interfaces for communication with the host computer.
Communication over the interfaces is bidirectional. It can be used to send events and values from the
ATSAME70Q21, or as a generic printf-style data channel. Traffic over the interfaces can be timestamped
on the EDBG for accurate tracing of events. Note that timestamping imposes an overhead that reduces
maximal throughput. The Data Visualizer is used to send and receive data through DGI.
The EDBG controls two LEDs on SAM E70 Xplained Ultra: a power LED and a status LED.
The following table describes how the LEDs are controlled in different operation modes.
Table 3-1. EDBG LED Control
Operation Mode Power LED Status LED
Normal operation The power LED is lit when power is
applied to the board.
Activity indicator, LED flashes when any
communication happens to the EDBG.
Bootloader mode
(idle)
The power LED and the status LED
blinks simultaneously.
The power LED and the status LED
blinks simultaneously.
Bootloader mode
(firmware upgrade)
The power LED and the status LED
blinks in an alternating pattern.
The power LED and the status LED
blinks in an alternating pattern.
For additional information on EDBG, refer to the EDBG User Guide.
3.1 Hardware Identification System
All Xplained Pro-compatible extension boards have an Microchip ATSHA204 CryptoAuthentication™ chip
mounted. This chip contains information that identifies the extension with its name and data. When an
Xplained Pro extension is connected to an Xplained Pro MCU board, the information is read and sent to
the MPLAB X IDE. The Microchip kits extension, installed with MPLAB X, provides relevant information,
such as code examples, and links to relevant documents. The following table provides the data fields
stored in the ID chip with content examples.
Embedded Debugger
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Table 3-2. Xplained Pro ID Chip Content Example
Data Field Data Type Example
Manufacture ASCII string Microchip’\0’
Product Name ASCII string
Product Revision ASCII string 04’\0’
Product Serial number ASCII string 1774020200000010’\0’
Minimum Voltage (mV) uint16_t 3000
Maximum Voltage (mV) uint16_t 3600
Maximum Current (mA) uint16_t 30
Embedded Debugger
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4. System Level Block Diagram
The following figure illustrates the high-level signal block diagram of the SAM E70 Xplained Ultra
Development Kit.
Figure 4-1. Signal Level Block Diagram
Wire buses that are tied together are connected together. In this system the SPI bus data and clock are
shared across several interfaces. The SPI Slave selects are addressed individually with GPIO.
System I2C uses I2C0 and connects to the debugger, EXT1, EXT2, and mikroBus/X32. Touch I2C uses
I2C2 and only goes from the microcontroller to the graphics connector.
The debugger has the following interfaces connected: DGI SPI, DGI I2C, DGI UART, and SWD.
UART wires from the microcontroller to the blocks are not shared with each other.
System Level Block Diagram
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5. Hardware Features
5.1 Xplained Pro Standard Extension Header
All Xplained Ultra Kits have many dual row, 20-pin, 100 mil extension headers. Xplained Ultra MCU
boards have male headers, while Xplained Ultra extensions have their female counterparts as shown in
the image below.
Note: All pins are not always connected.
The extension headers can be used to connect a variety of Xplained Pro extensions to Xplained Ultra
MCU boards or to access the pins of the target MCU on Xplained Ultra MCU boards directly.
Figure 5-1. Extension Headers
All connected pins follow the defined pinout description as shown in the following table.
Table 5-1. Xplained Pro Standard Extension Header
Pin number Name Description
1 ID Communication line to the ID chip on an extension board
2 GND Ground
3 ADC(+) Analog-to-Digital Converter, alternatively positive part of differential ADC
4 ADC(-) Analog-to-Digital Converter, alternatively negative part of differential ADC
5 GPIO1 General purpose I/O
6 GPIO2 General purpose I/O
7 PWM(+) Pulse-Width Modulation, alternatively positive part of differential PWM
8 PWM(-) Pulse-Width Modulation, alternatively negative part of differential PWM
9 IRQ/INT/GPIO Interrupt request line and general purpose I/O
10 SPI SS B/GPIO SPI Slave Select or general purpose I/O
11 I2C SDA Data line for I2C interface. Always implemented, bus type
12 I2C SCL Clock line for I2C interface. Always implemented, bus type
13 UART RX Receiver line of target device UART
Hardware Features
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...........continued
Pin number Name Description
14 UART TX Transmitter line of target device UART
15 SPI SS A/GPIO SPI Slave Select or general purpose I/O
16 SPI MOSI Master Out Slave In line of serial peripheral interface. Always
implemented, bus type.
17 SPI MISO Master In Slave Out line of serial peripheral interface. Always
implemented, bus type.
18 SPI SCK Clock for serial peripheral interface. Always implemented, bus type.
19 GND Ground
20 VCC Power for extension boards (3.3V)
5.2 Graphics Connectors or GFX Card Interface
The SAM E70 Xplained Ultra Development Kit is designed to have a modular graphics interface. This
interface enables using several graphics cards, which allow for expandability and different use cases. A
565 adapter card is included in the kit, which takes 16-bit parallel LCD data and converts it to 24-bit data.
This card also provides access to ADC for resistive touch screens, hence an external controller is not
needed. See table below for pin descriptions.
Table 5-2. Graphics Interface Pinout
Pin Number Name Description
1 GND Ground
2 GND Ground
3 MCLR Master Clear, Controlled by the debuggers. Allows for a
complete system reboot.
4 IRQ1 (LCD Touch) Interrupt request line for cap touch device
5 5.0v VCC 5.0v
6 IRQ2 (Q Touch) Interrupt request line for Q touch devices
7 LCDEN LCD Data Enable
8 IRQ3 (Display Controllers) Interrupt request line for external display controllers
9 LCDHSYNC/NCS3 LCD Horizontal Sync
10 IRQ4 (Resistive touch) Interrupt request line for resistive touch controllers
11 LCDVSYNC/nWE LEC Vertical Sync or Write enable (active-low)
12 5.0v VCC +5.0v
13 LCDPCK/nRD LCD pixel Clock or Read Enable (active-low)
14 I2C SDA Data line for I2C interface. Always implemented, bus type.
Hardware Features
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...........continued
Pin Number Name Description
15 LCD D0 LCD Data bit 0
16 I2C SCL Clock line for I2C interface. Always implemented, bus type.
17 LCD D1 LCD Data bit 1
18 SPI SCK Clock for serial peripheral interface. Always implemented, bus
type.
19 LCD D2 LCD Data bit 2
20 SPI MOSI Master Out Slave In line of serial peripheral interface.
21 LCD D3 LCD Data bit 3
22 SPI MISO Master In Slave Out line of serial peripheral interface.
23 LCD D4 LCD Data bit 4
24 SPI SS SPI Slave Select
25 LCD D5 LCD Data bit 5
26 UART RX Receiver line of target device UART
27 LCD D6 LCD Data bit 6
28 UART TX Transmitter line of target device UART. (from MCU to GFX
card)
29 LCD D7 LCD Data bit 7
30 UART RTS UART Ready To Send (from MCU to GFX card)
31 LCD D8 LCD Data bit 8
32 UART CTS UART Clear To Send (from MCU to GFX card)
33 LCD D9 LCD Data bit 9
34 LCD PWM LCD PWM back light control
35 LCD D10 LCD Data bit 10
36 PWM2 Pulse-Width Modulation,
37 LCD D11 LCD Data bit 11
38 GPIO1 General purpose I/O
39 LCD D12 LCD Data bit 12
40 GPIO2 General purpose I/O
41 LCD D13 LCD Data bit 13
42 GPIO3 General purpose I/O
43 LCD D14 LCD Data bit 14
Hardware Features
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...........continued
Pin Number Name Description
44 STBY/RST/GPIO4 Standby/Reset or general purpose I/O. For resetting devices
attached to the GFX connector.
45 LCD D15 LCD Data bit 15
46 STBY/RST/GPIO5 Standby2/Reset2 or general purpose I/O
47 LCD D16 LCD Data bit 16 (Not Implemented on this design)
48 ID pin Communication line to the ID chip on an extension board
49 LCD D17 LCD Data bit 17 (Not Implemented on this design)
50 ADC 0 Analog-to-Digital Converter to MCU
51 LCD D18 LCD Data bit 18 (Not Implemented on this design)
52 ADC1 Analog-to-Digital Converter to MCU
53 LCD D19 LCD Data bit 19 (Not Implemented on this design)
54 ADC2 Analog-to-Digital Converter to MCU
55 LCD D20 LCD Data bit 20 (Not Implemented on this design)
56 ADC3 Analog-to-Digital Converter to MCU
57 LCD D21 LCD Data bit 21 (Not Implemented on this design)
58 ADC4 Analog-to-Digital Converter to MCU
59 LCD D22 LCD Data bit 22
60 ADC5 Analog-to-Digital Converter to MCU
61 LCD D23 LCD Data bit 23
62 ADC6 Analog-to-Digital Converter to MCU
63 3.3V VCC +3.3V VCC
64 ADC7 Analog-to-Digital Converter to MCU
65 GND Ground
66 3.3V VCC +3.3V VCC
67 GND Ground
68 GND TAB Mounting Tab
69 GND TAB Mounting Tab
Hardware Features
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5.3 SDRAM and LCD Connections
The external bus interface (EBI) on SAM E71 Xplaned Ultra is controlled by the static memory controller
(SMC) and SDRAM controllers modules in the ATSAME70Q21B.
ATSAME70Q21B has on-die series termination on very I/O pin as shown in figure below.
Figure 5-2. On-Die Termination
The EBI is connected to the on-board SDRAM and the Xplained Pro Graphics connector. The following
figure shows how the SDRAM and LCD share the same sets of data pins, and displays the location of the
series termination resistors.
Figure 5-3. LCD and SDRAM
As the I/O pins have on-die series termination, the impedance of the drivers must be matched to the
impedance of the EBI tracks on the PCB using series resistors. The EBI tracks are routed as 50Ω on
SAM E70 Xplained Ultra. The clock and address lines are only driven by the ATSAME70Q21B, while the
data lines are driven by the ATSAME70Q21B and the on-board SDRAM.
Hardware Features
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Simulation of the transmissions lines using IBIS files for the ATSAME70Q21B and the SDRAM gave the
results are shown in the table below.
Table 5-3. EBI Simulation Results
Driving Circuit Signal Type Driver Impedance
(from ibis)
Series
Termination
Z0
ATSAME70Q21B Data/Address 22Ω 24Ω ≈ 22Ω 50Ω
Clock 21Ω 25Ω ≈ 22Ω 50Ω
SDRAM Data 11Ω 32Ω ≈ 33Ω 50Ω
The routing of the data lines to the LCD connector causes stubs on the data lines at the SDRAM (the
stubs are even longer when a cable is plugged in). The 200Ω resistors are placed close to the SDRAM to
create a high-impedance path for the signal to the stubs, improving the signal integrity when
communicating with the SDRAM.
TIP:
• The series-termination is always placed near to the driving pin.
• The 200Ω resistors are placed close to the intersection between the SDRAM routing and the routing
to the LCD connector.
• All designs must be simulated using an IBIS file for the ATSAMV71Q21B and the target peripherals
to check whether the signals are within the limits of the devices.
Hardware Features
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5.4 Camera Connector
A 2 x 15, 100 mil pin-header camera connector is implemented to provide access to the SAM E70's
parallel Image Sensor Interface (ISI).
Table 5-4. Camera Interface Pin Description
Pin Number Name Function
1 VCC +3.3v
2 GND Ground
3 VCC +3.3v
4 GND Ground
5 Reset Reset
6 PWD ISI PWD
7 I2C SCK Clock line for I2C interface. Always implemented, bus type.
8 I2C SDA Data line for I2C interface. Always implemented, bus type.
9 GND Ground
10 MCK Master Clock
11 GND Ground
12 VSYNC Image Sensor Vertical Sync
13 GND Ground
14 HSYNC Image Sensor Horizontal Sync
15 GND Ground
16 Pixel Clock Image Sensor Pixel Clock
17 GND Ground
18 ISI D0 Image Sensor Data Bit 0
19 ISI D1 Image Sensor Data Bit 1
20 ISI D2 Image Sensor Data Bit 2
21 ISI D3 Image Sensor Data Bit 3
22 ISI D4 Image Sensor Data Bit 4
23 ISI D5 Image Sensor Data Bit 5
24 ISI D6 Image Sensor Data Bit 6
25 ISI D7 Image Sensor Data Bit 7
26 ISI D8 Image Sensor Data Bit 8
27 ISI D9 Image Sensor Data Bit 9
28 ISI D10 Image Sensor Data Bit 10
Hardware Features
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...........continued
Pin Number Name Function
29 ISI D11 Image Sensor Data Bit 11
30 GND Ground
5.5 USB Connectivity
Users can connect to the PIC32 USB microcontroller using any one of the following modes:
•Host mode: If connecting the device to the Type-A/B Micro connector, an adapter is required. Using
this method, a maximum of 400 mA can be supplied from the debug USB port to the host port. If a
full 500 mA supply is needed, an external supply must be connected to the application board.
•Device mode: Connect the SAM E70 to the target USB Micro-A/B port using a USB cable. This is
enough to power the board as a device. If programming and debugging is required, connect the
Debug USB Micro-A/B port. The other end of the cable must have a Type-A connector, to connect it
to a USB host.
•On-The-Go (OTG) mode: Connect the starter kit to the OTG device by using an OTG Micro-A/B
cable to the Micro-A/B port.
There is a 1x3, 100mil pin-header marked VBUS on the kit. The PB08 pin on the SAM E70 can be
connected to the LED2 or to the target USB VBUS DETECT signal by placing a jumper between pin 1
and pin 2, or pin 2 and pin 3 on this pin-header. The USB VBUS DETECT is the target USB voltage
divided by 1.64. When connected to the PB08 pin the signal can be used to detect power on the target
USB connector.
Table 5-5. USB Jumper Description
Pin number Name Description
1 LED2 LED2 active-low
2 PB08 Pin and Port to microcontroller
3 VBUS_ Detect VBUS Detect, used to detect when a device cable (micro-B) is plugged
into the SAM E70
The SAM E70 Xplained Ultra has a Micro-USB connector to use with the SAM E70 USB module labeled
as TARGET USB on the kit. In USB Host mode, the VBUS voltage is provided by the kit, and must be
enabled by setting the VBUS Host Enable pin to low. When a USB OTG cable is plugged in, it will
automatically trigger the power supply.
Table 5-6. USB Interface Pin Description
Pin on SAM USB Function
PA08 VBUS Host Enable
HSDM USB -
HSDP USB +
Hardware Features
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5.6 Chip Erase Header
A 1x2 pin-header is connected to the SAM E70 chip erase pin, PB12, and 3V3 is marked ERASE. This
header can be used to chip erase the SAM E70 by placing the jumper on the header and toggle power to
the board. After the power is toggled, the jumper must be removed. Using the chip erase jumper may be
the only way to erase a chip with the security bit set, and applications that immediately set invalid clock
options, or go into deep sleep without any wake-up sources enabled.
5.7 Audio Connectivity
The SAM E70 provides an audio connection through the X32 interface to the two main audio modules in
the chip, such as the SSC and the I2S. On this board the SSC interface is considered the main audio
interface. See image below.
There is a 32-pin interface to the board to support the audio codec or DACs and Bluetooth radios. This
interface has two audio supply interfaces, such as the SSC and the I2S. Addition to this other control lines
and data interfaces are available.
Figure 5-4. SSC/I2S Block Diagram
Table 5-7. X32 Audio Interface Pin Description
Pin Number Name Description Interface
1 GND Ground Power
Hardware Features
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