MicroSys miriac SBC-S32V234 User manual

Creating Embedded Systems
miriac SBC-S32V234
User Manual
V 1.0

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© MicroSys Electronics GmbH 2018
1 General Notes
Copyright MicroSys Electronics GmbH, December 2018
All rights reserved. All rights in any information which appears in this document
belong to MicroSys Electronics GmbH or our licensors. You may copy the
information in this manual for your personal, non-commercial use.
Copyrighted products are not explicitly indicated in this manual. The absence of the
copyright (©) and trademark (TM or ®) symbols does not imply that a product is not
protected. Additionally, registered patents and trademarks are similarly not
expressly indicated in this manual.
1.1 Warranty
To the extent permissible by applicable law all information in this document is
provided without warranty of any kind, whether expressed or implied, including but
not limited to any implied warranty of satisfactory quality or fitness for a particular
purpose, or of non-infringement of any third party’s rights. We try to keep this
document accurate and up-to-date but we do not make any warranty or
representation about such matters. In particular we assume no liability or
responsibility for any errors or omissions in this document.
MicroSys Electronics GmbH neither gives any guarantee nor accepts any liability
whatsoever for consequential damages resulting from the use of this manual or its
associated product.
MicroSys Electronics GmbH further reserves the right to alter the layout and/or
design of the hardware without prior notification and accepts no liability for doing
so.
1.2 Links
We make no warranty about any other sites that are linked to or from this
document, whether we authorize such links or not.
1.3 Liability
To the extent permissible by applicable law, in no circumstance, including (but not
limited to) negligence, shall we be liable for your reliance on any information in this
document, nor shall we be liable for any direct, incidental, special, consequential,
indirect or punitive damages nor any loss of profit that result from the use of, or the
inability to use, this document or any material on any site linked to this document
even if we have been advised of the possibility of such damage. In no event shall
our liability to you for all damages, losses and causes of action whatsoever,
whether in contract, tort (including but not limited to negligence) or otherwise
exceed the amount, if any, paid by you to us for gaining access to this document.
MicroSys Electronics GmbH
Muehlweg 1
82054 Sauerlach
Germany
Phone: +49 8104 801-0
Fax: +49 8104 801-110

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1.4 Offer to Provide Source Code of Certain
Software
This product contains copyrighted software that is licensed under the General
Public License (“GPL”) and under the Lesser General Public License Version
(“LGPL”). The GPL and LGPL licensed code in this product is distributed without
any warranty. Copies of these licenses are included in this product.
You may obtain the complete corresponding source code (as defined in the GPL)
for the GPL Software, and/or the complete corresponding source code of the LGPL
Software (with the complete machine-readable “work that uses the Library”) for a
period of three years after our last shipment of the product including the GPL
Software and/or LGPL Software, which will be no earlier than December 1, 2010,
for the cost of reproduction and shipment, which is dependent on the preferred
carrier and the location where you want to have it shipped to, by sending a request
to:
MicroSys Electronics GmbH
Muehlweg 1
82054 Sauerlach
Germany
In your request please provide the product name and version for which you wish to
obtain the corresponding source code and your contact details so that we can
coordinate the terms and cost of shipment with you.
The source code will be distributed WITHOUT ANY WARRANTY and licensed
under the same license as the corresponding binary/object code.
This offer is valid to anyone in receipt of this information.
MicroSys Electronics GmbH is eager to duly provide complete source code as
required under various Free Open Source Software licenses. If, however you
encounter any problems in obtaining the full corresponding source code we would
be much obliged if you give us a notification to the email address
gpl@microsys.de, stating the product and describing the problem (please do NOT
send large attachments such as source code archives etc. to this email address)

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1.5 Symbols, Conventions and Abbreviations
1.5.1 Symbols
Throughout this document, the following symbols will be used:
Information marked with this symbol MUST be obeyed to
avoid the risk of severe injury, health danger, or major
destruction of the unit and its environment
Information marked with this symbol MUST be obeyed to
avoid the risk of possible injury, permanent damage or
malfunction of the unit.
Information marked with this symbol gives important hints
upon details of this manual, or in order to get the best use
out of the product and its features.
Table 1 Symbols
1.5.2 Conventions
Symbol
explanation
#
denotes a low active signal
←
denotes the signal flow in the shown direction
→
denotes the signal flow in the shown direction
↔
denotes the signal flow in both directions
→
denotes the signal flow in the shown direction with additional logic /
additional ICs in the signal path
I/O
denotes a bidirectional pin
Input
denotes an input pin
matched
denotes the according signal to be routed impedance controlled and
length matched
Output
denotes an output pin
Pin 1
refers to the numeric pin of a component package
Pin a1
refers to the array position of a pin within a component package
XXX-
denotes the negative signal of a differential pair
XXX+
denotes the positive signal of a differential pair
XXX
denotes an optional not mounted or fitted part
Table 2 Conventions

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2 Introduction
Thank you for choosing the MicroSys MPX-S32V234 module. This manual should
help you to get the best performance and details out all of its features.
2.1 Safety and Handling Precautions
ALWAYS use the correct type and polarity of the power
supply!
DO NOT exceed the rated maximum values for the power
supply! This may result in severe permanent damage to
the unit, as well as possible serious injury.
ALWAYS keep the unit dry, clean and free of foreign
objects. Otherwise, irreparable damage may occur.
Parts of the unit may become hot during operation. Take
care not to touch any parts of the circuitry during
operation to avoid burns, and operate the unit in a well-
ventilated location. Provide an appropriate cooling
solution as required.
ALWAYS take care of ESD-safe handling!
Many pins on external connectors are directly connected
to the CPU or other ESD sensitive devices.
Make or break ANY connections ONLY while the unit is
switched OFF.
Otherwise, permanent damage to the unit may occur,
which is not covered by warranty.
There is no separate SHIELD connection.
All the metal sheaths of shielded connectors are
connected to GND.
Also, all mounting holes of the carrier board are
connected to GND.
The module’s mounting holes are not connected to GND
Take this into account when handling and mounting the
unit.
Table 3 Safety and Handling Precautions

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2.2 Short Description
The miriac MPX-S32V234 is a member of the MPX module family, based on NXP’s
S32V234 vision processing MPU
It targets the evaluation of the main interfaces of the S32V234 processor
2.3 Ordering Information
The MPX-S32V234 System-on-Module (SoM) is available in the following configu-
rations:
Part No.
Title
Description
854901
miriac MPX-S32V234 SoM
NXP S32V234@1GHz CPU, 2GB
DDR3L, standard temp 0C to +70C
854902
miriac MPX-S32V234 SoM
same as 854901, but with extended
temp -40C to +70C
854903
miriac MPX-S32V234 SoM
same as 854901, except CPU contains
Cryptographic Service Engine
2.4 Board Preparation
■Make sure the BMD switch, located on the MPX-S32V module, is set properly
in order to select the correct boot source.
For more details see chapter 4.2 Boot Mode Configuration
■Make sure the GPU switch, located on the MPX-S32V234 module, is set
properly in order to select the correct GPU supply.
For more details see chapter 5.5 Switches
Figure 1: BMD Switch
Figure 2: GPU Switch

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2.5 Software
When ordering MPX-S32V234 SoMs they are delivered with a version of U-Boot in
the onboard eMMC which was used in the factory to test the module on MicroSys'
CRX-32V carrier.
Assuming you are intending to mount the module on your own carrier, then you will
need to modify U-Boot accordingly.
The SBC-S32V234 (which is the MPX-S32V234 module mounted on the CRX-32V
carrier) is supported by NXP's automotive Linux BSP for S32. You can download
the latest Linux BSP from:
https://source.codeaurora.org/external/autobsps32/auto_yocto_bsp/
This should serve as your starting point for modifying U-Boot and Linux.
NXP has a release cadence of once every 3 months. As of December 2018, the
current release is BSP 19.0

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3 Module Description
This section describes all parts of the MPX-S32V234 module.
3.1 Block Diagram MPX-S32V234 Module

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3.2 Feature Overview
Feature
Type
Description
CPU
NXP S32V234
Core Clock 1GHz
Quad-Cortex®-A53
Single-Cortex®-M4
SDRAM
Dual 32-bit DDR3L
interface
2 x up to 1GByte
up to 1066MT/s
Mass Storage
8-bit eMMC
16 GByte
PCI Express
via MXM Connector
Rev.2.0
5Gbps
Lane x1
RC/EP
100MHz Clock Source
I2C support
Removable Media
via MXM Connector
For microSD cards
4/8-bit support
Ethernet
via MXM Connector
RGMII
Grahics Output
via MXM Connector
Parallel 24-bit
Video Input
MIPI-CSI-A
4 Lanes + Clock
MIPI-CSI-B
4 Lanes + Clock
Serial Interfaces
via MXM Connector
UART0
via MXM Connector
UART1
CAN Interface
via MXM Connector
CAN0
via MXM Connector
CAN1
RTC
Time/Date
PCF85263A
external backup
Board Control
S9KEAZN64A
Voltage supervision
Reset logic
Boot configuration
Status LED
Switches
Sliding Swicthes
RCON/Serial Select
GPU Power ON/Off
Indicators
LEDs
MCU Status
Reset Status
User GPIO1
User GPIO2
Connectors
Module Connectors
ADC Channel 0-7
MCU Programming Port
314-pin MXM Conncetor

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3.3 Mechanical Dimensions
3.3.1 MPX-S32V234 Module
The following drawing shows the mechanical outline of the MPX-S32V234 module
that is plugged into the CRX-S32V carrier board.
This drawing is not to scale.
For 3D data files please contact MicroSys.
Figure 3 Mechanical Dimensions

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3.4 Module Top Side
3.5 Module Bottom Side

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3.7 System Environment
3.7.1 Temperature Ratings
The MPX-S32V234 contains parts with the following ambient, junction or case
temperature ratings. Due to these limits, the system function is only guaranteed, if
none of them are exceeded at any time. The MPX-S32V234 requires an adequate
heatsink.
Part
Tmin
Tmax
C-0402-NP0-Series
-55°C
125°C
C-0402-X5R-Series
-55°C
85°C
C-0402-X7R-Series
-55°C
125°C
C-0603-226-X5R-Z
-55°C
85°C
C-0603-X7R-Series
-55°C
125°C
C-0805-X7R-Series
-55°C
125°C
C-1206-X7R-Series
-55°C
125°C
C-EEEFK1H331AQ
-55°C
105°C
CML-744-227
-40°C
125°C
CML-744-233-670
-40°C
85°C
D-B320A-13-F
-55°C
150°C
D-BAS70
-65°C
150°C
D-BAT54S
-55°C
125°C
D-SD2114S040S5R0
-55°C
125°C
FB-742-792-XXX
-55°C
125°C
HEADER-2.54-180-M-1X2
-40°C
125°C
HEADER-2.54-180-SM-1X5
-40°C
163°C
IC-BTS462T
-40°C
150°C
IC-DSC1001CI2-027.0000
-40°C
85°C
IC-DSC557-0344FI1
-40°C
85°C
IC-FT232RQ
-40°C
85°C
IC-IR347xMTRPBF
-40°C
125°C
IC-KSZ9031RNXIA
-40°C
85°C
IC-MAX4886ETO
-40°C
85°C
IC-MC33662BLEF
-40°C
125°C
IC-MT41K256M16HA-107-IT
-40°C
95°C
IC-MTFC16GAKAENA-4M-IT
-40°C
85°C
IC-NCV8715SQ50T2G
-40°C
125°C
IC-PCA9517ADP
-40°C
85°C
IC-PCF85263ATL
-40°C
85°C
IC-PS32V234CMN0VUB
-40°C
125°C
IC-REF3030AIDBZ
-40°C
125°C

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Part
Tmin
Tmax
IC-S9KEAZN64AMLH
-40°C
85°C
IC-SN74LVC1G125DCK
-40°C
125°C
IC-SN74LVC244ARGYR
-40°C
125°C
IC-TPS22920LYZP
-40°C
85°C
IC-TPS51200DRC
-40°C
85°C
IC-TPS5433xDDAR
-40°C
150°C
IC-TPS70933DBV
-40°C
125°C
L-744-311-220
-55°C
125°C
L-744-383-56033
-40°C
85°C
L-744-383-57068
-40°C
85°C
LD-155124xx73200
-40°C
85°C
PCB-ADP-8065-01
-40°C
85°C
PCB-MPX-S32V234-02
-40°C
85°C
R-0402-Serie
-55°C
155°C
R-0603-Serie
-55°C
155°C
R-0805-Serie
-55°C
155°C
R-1206-Serie
-55°C
155°C
R-2010-Serie
-55°C
155°C
ST-WE-687-118-140-22
-25°C
85°C
SW-WE-450-404-015-514
-40°C
85°C
T-BSS138LT1
-55°C
150°C
T-FDT434P
-55°C
150°C
T-PDTA114YT
-55°C
150°C
T-PDTC123JT
-65°C
150°C
XT-FT13A-40.00000/8-20-20/48
-40°C
85°C
3.7.2 Power Dissipation
Component
max.Temperature
Power Dissipation
CPU
Tj125° C
7W
DDR
Tc95° C
1.5W
Core Regulator
Tj125° C
1.2W
DDR Regulator
Tj125° C
0.3W
(j=junction, c=case, a=ambient)

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3.8 Power Supply
3.8.1 Input Supply Rating
The MPX-S32V234 module runs from a single power supply with the following
ratings:
Input Voltage Operating Range:
12V DC +/-25%
Typical Current Consumption
( room temperature / U-Boot prompt):
0,40A @12V
The input of the MPX-S32V234 system is not protected against wrong polarity and
over-current
DO NOT exceed the rated maximum values for the power
supply! This may result in severe permanent damage to
the unit, as well as possible serious injury.

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3.8.2 Power-Up
During a power-up sequence, the MCU first checks the input voltage to be within
their necessary limits. After that, the POL (Point Of Load) regulators on the module
will be activated. Any regulators on the carrier board should track the correspond-
ing voltages on pins B15 and B16 of the module connector. If all module voltages
are o.k. the reset sequence will be started. If there is no external reset request, e.g.
via RSTIN# from the reset key, the RESET# will be released after 100ms. A low
level on the RSTIN# line extends this time. During normal operation, a falling edge
at RSTIN# initiates a reset sequence for the whole system, which is at least 100ms
long. As long the reset line is low, the system will be held in the reset state. If the
signal is released, the CPU will fetch its power-up configuration and starts up with
its BIST and/or boot sequence. The RSTOUT# signal will directly follow the state of
the RESET# signal. As long the RSTOUT# is active all connected devices must be
held in a reset state in order not to block the power-up configuration settings.
+12V
PWEN
V(intern)
RSTIN#
RSTOUT#
PORST#
If the MCU detects any overvoltage, it will turn off all internal point of load regula-
tors.

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3.9 Reset Structure
Signal Name
Function
Type
RSTIN#
System Global Reset Input
4K7 Pullup
RSTOUT#
System Global Reset Output
Totem Pole
PORST#
Power-On Reset for CPU
Totem Pole
RESET#
Reset for CPU
Open Drain
M0RST#
Reset for Memory Bank 0
Totem Pole
M1RST#
Reset for Memory Bank 1
Totem Pole
( # denotes an active low signal )
Table 3-3 Reset signal overview
Figure 3-3 Reset Structure

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4 System Core, Boot Configuration
4.1 Processor NXP S32V234
The S32V234 is a vision processing MPU with four ARM® Cortex®-A53 cores and
a single Cortex-M4 core. The four CPU cores run at a maximum clock speed of
1000MHz.
Figure 4-7 Processor Block diagram

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4.2 Boot Mode Configuration
The MPX-S32V234 module offers several different boot modes to choose from.
The settings can be done via the sliding switch BMD on the module and two
BOOT-SEL signals on the MXM connectorr according to the following table.
The switch BMD sets the BMODE[0] and BMODE[1] signals of the CPU to low,
while the two configuration resistors BMD0 and BMD1 are used to set a fixed low
value on these lines.
The BMD, BMD0 and BMD1 parts are located on the MPX-S32V234 module.
green denotes the default configuration
Note 1) BMD0 and BMD1 are soldered resistors (size 0402) and not intended to be
changed by user.
Shown positions set the corresponding BTMOD0/1 line to low. BTMOD0 controls
the CPU configuration port PC9, i.e. BOOTMOD(0), while BTMOD1 is connected to
the CPU configuration port PC10, i.e. BOOTMOD(1).
Boot Mode
BMD-Switch
BMD01)
BMD11)
Serial Download, virgin device
No function
installed
installed
Serial Download, virgin device
Position 0
removed
installed
Serial Download, prog. device
Position 1
removed
installed
RCON Boot, if no fuses
Position 0
installed
removed
Serial Download, prog. device
Position 1
installed
removed
RCON Boot, no fuses
Position 0
removed
removed
Serial Download, prog. device
Position 1
removed
removed
Figure 4: BMD Switch
Figure 6: Position BTM1=low
Figure 5: Position BTM0=low

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4.3 BOOT-SEL Signals
The two signals BOOT-SEL1 and BOOT-SEL2 located on the MXM connector
B130 and B131 allow the following default boot modes, when the BMD switch is set
to position RCON. If the BMD switch is set to serial download, these signals have
no function.
If the eMMC or the SDHC are to be used after previously having booted from the
other device, then BOOT-SEL1 must be set correctly and the “mmc rescan” com-
mand must be executed from within U-Boot. The “mmc info” command will then
show the new active storage device.
BOOT-SEL1
BOOT-SEL2
Boot Device
high
high
Cortex A53 via SDHC-A
low
high
Cortex A53 via eMMC
high
low
Cortex M4 via SDHC-A
low
low
Cortex M4 via eMMC

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4.4 Power-Up Configuration
The S32V234 is configured during power-up by the state of 32 I/O signals, which
are controlled by the MCU. Within the MCU, the four most popular RCON boot
configurations are implemented and can be selected via the BOOT DIP switch
located on the carrier board.
These configurations are only valid, if the Boot Mode Configuration is set to RCON Boot!
Signal
RCON
Port
eSDHC Mode
eMMC Mode
FLXR-TENB
RCON[0]
PA[7]
0
0
FLXR-TXD
RCON[1]
PA[8]
0
0
FLXR-RXD
RCON[2]
PA[9]
0
0
UART0-RXD
RCON[3]
PA[11]
0
0
UART0-TXD
RCON[4]
PA[12]
0
1
UART1-RXD
RCON[5]
PA[13]
0
0
UART1-TXD
RCON[6]
PA[14]
0
1
I2C0-SDA
RCON[7]
PA[15]
1
1
I2C0-SCL
RCON[8]
PB[0]
0
0
I2C1-SDA
RCON[9]
PB[1]
0
0
I2C1-SCL
RCON[10]
PB[2]
0
0
I2C2-SDA
RCON[11]
PB[3]
0
1
SPI0-SCK
RCON[12]
PB[5]
0
0
SPI0-SOUT
RCON[13]
PB[6]
0
0
SPI0-SIN
RCON[14]
PB[7]
0
0
SPI0-CS0#
RCON[15]
PB[8]
0
1
SPI1-SCK
RCON[16]
PB[9]
0
1
SPI1-SOUT
RCON[17]
PB[10]
0
0
SPI1-SIN
RCON[18]
PB[11]
0
0
SPI1-CS0#
RCON[19]
PB[12]
0
0
SPI2-SCK
RCON[20]
PB[13]
0
0
SPI2-SOUT
RCON[21]
PB[14]
1
1
SPI2-SIN
RCON[22]
PB[15]
0
0
SPI2-CS0#
RCON[23]
PC[0]
0
0
SPI3-SCK
RCON[24]
PC[1]
0
0
SPI3-SOUT
RCON[25]
PC[2]
0
0
SPI3-SIN
RCON[26]
PC[3]
0
0
SPI3-CS0#
RCON[27]
PC[4]
0
0
FXT0-CH0
RCON[28]
PC[5]
0
0
FXT0-CH1
RCON[29]
PC[6]
0
0
FXT0-CH2
RCON[30]
PC[7]
0
0
FXT0-CH3
RCON[31]
PC[8]
1
1
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