Msi Xdap User manual

xDAP Family Safety Manual

Safety Guidelines and Declaration of Conformity for the xDAP Family

Version 1.01

Microstar Laboratories, Inc.

The contents of this manual are protected by copyright. All rights are reserved. No part of this manual may be

copied, reproduced, or translated to another language without prior written consent of Microstar Laboratories, Inc.

Microstar Laboratories, Inc.

2265 116th Avenue N.E.

Bellevue, WA 98004

Tel: (425) 453-2345

Fax: (425) 453-3199

www.mstarlabs.com

Data Acquisition Processor, DAP, and xDAP are trademarks of Microstar Laboratories, Inc.

Microstar Laboratories requires express written approval from its President if any Microstar Laboratories products

are to be used in or with systems, devices, or applications in which failure could endanger human life.

Part Number xSFTY101

Contents

1. Introduction.............................................................................................................................4

2. Products Covered....................................................................................................................5

3. Specifications...........................................................................................................................6

4. Mounting and nvironment...................................................................................................7

5. lectrical Grounding...............................................................................................................8

6. Access and Maintenance.........................................................................................................9

A. Appendix: Declaration of Conformity..................................................................................10

Index............................................................................................................................................13

1. Introduction

This manual provides safety and maintenance information, applicable generally to data acquisition equipment, and

applicable specifically to the Microstar Laboratories xDAP family of Data Acquisition Processor products. The xDAP

family has been tested and found to be in conformance with international safety standards, and a declaration of conformity is

included in this manual.

Intended Application

The xDAP family of Data Acquisition Processor products is intended for capturing high-resolution measurements of of

signals of the kind produced by sensor or digital logic devices, converting these to a digitized form compatible with digital

computer processing, and delivering these results through an external communication cable to other systems for recording,

display, or other purposes.

Special restrictions on use of individual models are given in the hardware manual for each xDAP product.

xDAP products are not intended for any application for which its performance is critical to human life and safety. XDAP

products cannot guarantee the availability necessary for critical applications such as direct control of nuclear reactors, and

they do not provide electrical isolation suitable for general medical applications.

Operating Instructions

Connect the xDAP equipment and power it up as described in the installation guide and the hardware manual for the

specific xDAP product. Once started, the equipment is operated through software commands, sent from an application on

the PC host to the equipment via the USB interface cable. The installation guide for xDAP USB equipment provides

instructions on connectors and software setup. The installation guide is available on the DAPtools software CD (or the

equivalent downloaded file system image) provided with each xDAP unit, or from the Microstar Laboratories Web site at

http://www.mstarlabs.com.

. Products Covered

All xDAP products are variants of the xDAP008 or xDAP008i base product. These are chassis boxes containing variously-

configured devices that constitute a complete xDAP product. The two base products are really the same thing except for

physical dimensions. The size of the enclosure is indicated by an i suffix.

•The xDAP008 is packaged in a half-width rack size, compatible with 3U 42HP specifications.

•The xDAP008i is packaged in a full-width rack size, compatible with 3U 84HP specifications.

The i suffix is also carried forward to indicate the physical size of completely configured products. The products covered by

this document include the following:

•xDAP7410, xDAP7410i

•xDAP7420, xDAP7420i

•xDAP7620, xDAP7620i

All of these products provide the following features:

•signal channel configurations

•signal conversion devices

•USB communications port

•processor and logic chip devices

The various products feature different configurations of the following features:

•embedded processor and chip set type

•digital logic devices

•numbers and arrangements of signal channels

•signal connectors

Study the hardware manual for specific information about hardware features available on each xDAP model.

3. Specifications

Technical specifications

Technical specifications are provided for each xDAP product. These are available on the DAPtools software CD (or the

equivalent downloaded file system image) provided with each xDAP unit, or from the Microstar Laboratories Web site at

http://www.mstarlabs.com/.

Electrical Specifications

Electrical specifications are included within the technical specifications documents. Some general information related to

safety is repeated in this manual for completeness. For full information about electrical specifications, refer to the technical

specifications sheet.

The xDAP products are rated for operation at 100 to 120 VAC at up to 6A, or for operation at 220 to 240 VAC at up to 3A.

No settings or configuration adjustments are necessary to select one of the two power source levels. The products are rated

for operation on 50Hz or on 60Hz power systems.

Physical specifications

Equipment conforms to the physical dimensions and mounting specifications defined in standard IEEE-1011.10 and

compatible with IEC 60297 “19-inch rack” standards. Certain xDAP models are intended as a sub-rack assembly to be

mounted in an industrial rack. These models will provide mounting flanges and mounting holes as defined by the standards.

Other xDAP models are intended for desktop use only and do not have the flanges or mounting holes, but they may have

carrying handles.

Electrical connector specifications

The power connector is an IEC 60320 type C14 receptacle. The provided power cable is intended for use withing the USA,

where it is typical of appliances such as computer equipment at up to 120 V and 15Amp, AC. This connector is safe to use

with European voltages up to 240 V, but it is the user s responsibility to provide a safe and appropriate power cable that

has the IEC 60320 mating connector on one end, and the appropriate connector or converter on the other end, for

compatibility with electrical equipment used by the local power distribution system.

4. Mounting and Environment

There are typically no thermal hazards when desktop equipment is used as intended and with reasonable care on the

desktop.

Rack mounted systems will need to provide clearance sufficient for the power cord connector, so that there is no danger of

crimping and damaging the power conductors to create a risk of short circuits and fire.

If there is an external enclosure into which an xDAP unit is mounted, there must be sufficient separation between the

enclosure door and xDAP front panel to avoid damaging front panel cables and connectors. Some separation might be

needed between the enclosure's door and cables to avoid coupling of electrical ground noise into sensitive signal paths.

The processor chip inside of the xDAP unit will generate a significant amount of heat. The maximum safe ambient

temperature is given in the technical specifications, but will typically be around 50 degrees Centigrade. In general,

temperatures that are safe for humans are also safe for operating the xDAP units, but sustained operation at relatively high

ambient temperatures could accelerate degradation of materials in electronic components, thus impairing the product

lifetime.

For equipment mounted in an enclosure, there must be adequate air flow to carry away generated heat and avoid an

excessive temperature rise inside of the enclosure. The air intake is through the bottom plate. The primary fan for drawing

air and processor heat out of the unit is on the back of the xDAP unit. It is particularly important that these air flow paths are

not obstructed.

If it is necessary to unmount the unit, the recommended sequence of actions is:

1. stop software processing first if you can

2. turn off the front panel illuminated switch

3. turn off the back panel power supply switch

4. disconnect the power cable

The unit is not isolated from environmental hazards. Take appropriate precautions to prevent liquids and other contaminants

from getting into the equipment and causing harm to sensitive electronic components.

5. Electrical Grounding

The principal point of connection to the main grounding means for an xDAP is through the ground connection on the power

receptacle, which uses IEC 60320 type C14 connectors. xDAP products follow the accepted practices for grounding

computing equipment such as PCs. The case is solidly connected to the receptacle earth ground. There is a low impedance

connection between the case and the DC power supply ground. There is a similar connection, with much lesser current

capability, between xDAP low-power signal converter electronics and the same common ground. Generally, this grounding

strategy will provide a high degree of grounding safety for desktop units, but for industrial equipment in a rack, beware that

it can introduce unanticipated electrical ground connections between equipment through the case and rack. This can be

beneficial, but it could also allow stray ground current to use the rack as a bypass path or ground coupling link. There is

usually no danger from this, but there could be implications for how the affected equipment operates, and for conformance

with EMC directives.

There can be exposure to damage from connecting xDAP systems to signal sources that are referenced to a “floating

ground.” The analog inputs on xDAP products cope well with small shifts in common mode voltage levels, since the signal

inputs are differential and high impedance, but the inputs can be damaged if either input voltage exceeds the maximum

voltage range limits relative to the xDAP ground, even for a short time.

There are ground-reference pins on analog connectors, intended for equalizing small voltage differences that might exist

between sensors and signal inputs. There are also ground-return pins on digital input and output connectors. If any of these

are incorrectly connected to power current source, it is possible that too much current will attempt to flow back to the power

supply ground through the delicate ground reference connections of the signal pins. This more or less guarantees damage to

the xDAP unit.

Be particularly careful when wiring signals. It is best to have all systems turned off and unplugged from power sources when

wiring. It is easy to accidentally short-circuit signal lines to incorrect pins or to the strongly grounded case, damaging the

signal inputs, the sensors, or both. Signals lines that you think are not powered could pack a damaging level of static charge,

so anti-static precautions are strongly advised.

6. Access and Maintenance

The only access to the inside of an xDAP unit is through removable front connector panels. Sometimes these panels are

solely for purposes of physically mounting signal connectors, but sometimes a mounted circuit board behind the panel will

fit into board guides, and physically and electrically connect deep inside the unit. The only reason for opening these panels

is for purposes of mounting or maintaining connectors or connector/circuit board modules. Make sure that the unit is turned

off and power switched off before uncovering any panels. Disconnect the power and signal cables before inserting or

removing boards. Slots should not be left uncovered. Do not allow chemical, liquid, or foreign object to get into the unit

while slots are uncovered. Use electrostatic charge precautions when handling boards, which may carry delicate static-

sensitive components. Make sure that modules are correctly seated and the panels tightly reattached before operating the

equipment again.

Except for the modules that fit the covered slots, and the external cables and connectors that attached to external connectors,

the system has no user-repairable parts. In the event that the high-speed fuses act and possibly limit accidental electrical

overload damage, these too are mounted on internal circuit boards and are not user-replaceable. The unit must be shipped

back to the factory for repair. Contact Microstar Laboratories at the address listed in the front of this manual.

Over long periods of time, it is possible that the xDAP unit will start to exhibit small offset and gain errors in its

measurement results. Follow your organization's policies and use good technical judgment about how often to check the

calibration of your equipment. Calibration adjustments do not require access to the interior of the unit. Calibration of an

xDAP requires some very sophisticated equipment and is not “field adjustable.” Contact Microstar Laboratories, or have

your qualified calibration laboratory do this, for assistance.

A. Appendix: Declaration of Conformity

The xDAP products are intended to be used in an industrial or controlled laboratory

environment. They are not intended to be used in residential or commercial

environments.

Installations must provide 3-wire AC power with an earth ground common to the host

computer system and the xDAP units, as discussed in Chapter 5 of this document, in

order to meet the IEC61326 EMC requirements as set forth in the applicable EMC

directives.

NOTE: xDAP products are used in combination with separate equipment provided by

the system user or system integrator. It is the responsibility of the system user or system

integrator to ensure that any system using an xDAP product is compliant to all relevant

standards.

NOTE: This equipment was found to comply with the limits for a Class A digital

device, pursuant to part 15 of the FCC Rules (USA), and to ICES-003 (Canada). Cet

appareil numérique de la classe A est conforme à la norme NMB-003 (du Canada). The

class A limits are designed to provide reasonable protection against harmful interference

when the equipment is operated in a commercial environment. This equipment

generates, uses, and can radiate radio frequency energy and, if not installed and used in

accordance with the instruction manual, may cause harmful interference to radio

communications. Operation of this equipment in a residential area is likely to cause

harmful interference, in which case the user will be required to correct the interference

at his or her own expense.

NOTE: The RoHS directive (Restrictions on Hazardous Substances) from the European

Union applies to products categorized in the WEEE directive (Waste from Electrical and

Electronic Equipment ), which was intended to guide further standards for recycling

used electronic equipment. WEEE defines 10 product categories in its Annex 1A. The

RoHS directive is not mandatory for products in category 9, Monitoring and control

instruments, which is the category covering xDAP products. While this means that the

xDAP products are suitable for use within the European Union, policies of individual

organizations, or constraints on systems where Microstar products could be used, might

demand full conformance to the RoHS directive. Microstar Laboratories is committed to

providing products that conform to RoHS requirements, and xDAP products that fully

conform will be indicated clearly.

D CLARATION OF CONFORMITY

(According to ISO/IEC GUIDE 22 and EN 45014)

Manufacturer: Microstar Laboratories, Inc.

2265 116th Avenue N.E.

Bellevue WA 98004 USA

DECLARES THAT THE PRODUCTS

Product Name: xDAP Data Acquisition Processors

Model Numbers: Base Chassis: xDAP008 and xDAP008i

Products: (base system configured with option cards)

xDAP7410, xDAP7410i

xDAP7420, xDAP7420i

xDAP7620, xDAP7620i

CONFORM TO THE FOLLOWING EUROPEAN DIRECTIVES

Low Voltage Directive: 2006 / 95 / EC

EMC Directive: 2004 / 108 / EC

Test Protocols: Safety: EN 61010-1:2001

EMC: EN 61326-1:2013

Year Mark First Applied: 011

Signatory:Ian Lewis, President

Microstar Laboratories, Inc.

Index

Calibration....................................................................................................................................................................................... 9

Copyrights and Trademarks.............................................................................................................................................................. 1

Declaration of Conformity.............................................................................................................................................................10

Enclosure...........................................................................................................................................................................................

rack mount........................................................................................................................................................................... 5, 6, 7

rack size....................................................................................................................................................................................... 5

standards...................................................................................................................................................................................... 6

Front connector panels.....................................................................................................................................................................9

Grounding........................................................................................................................................................................................ 8

Hardware features............................................................................................................................................................................ 5

Installation guide.............................................................................................................................................................................. 4

Intended Application........................................................................................................................................................................ 4

Operating Instructions...................................................................................................................................................................... 4

Operating power............................................................................................................................................................................... 6

Power connector...............................................................................................................................................................................6

products........................................................................................................................................................................................... 5

Repair............................................................................................................................................................................................... 9

RoHS directive, EU........................................................................................................................................................................10

Specifications...................................................................................................................................................................................6

Thermal hazards...............................................................................................................................................................................7

WEEE directive, EU...................................................................................................................................................................... 10

xDAP products................................................................................................................................................................................. 5

xDAP008 and xDAP008i.................................................................................................................................................................5

Table of contents

Other MSI Measuring Instrument manuals