Multitel Fusion User manual

1
EXPANSION SHELF
User Manual
PROPRIETARY INFORMATION
The information contained in this document is the property of MULTITEL INC. Except as specifically authorized in writing by MULTITEL INC., the holder of
this document shall:
1. Keep all information contained herein confidential and shall protect same in whole or in part from disclosure and dissemination to all third parties and;
. Use this document for operating and maintenance purposes only.
Document Name:
GUSM_
FUSION
EXP
1
.
4
Issue:
1.
4
Re ised by:
G. Lafond
(CM)
Date
(MM/DD/YYYY)
:
04/0 / 015
© 013 Multitel Inc. Printed in Canada

FUSION – Expansion shelf General Information
TABLE OF CONTENTS
1SPECIFICATIONS ................................................................................................................ 7
1.1 EXPANSION SHELF.............................................................................................................................................. 7
1.2 ELECTRICAL ........................................................................................................................................................ 7
1.3 ENVIRONMENTAL .............................................................................................................................................. 8
1.4 EXPANSION SHELF CONFIGURATION ................................................................................................................. 8
1.5 EXPANSION MODULE 1U1S ............................................................................................................................... 8
1.6 I/O CARDS CONFIGURATION .............................................................................................................................. 8
1.7 ANALOG CARDS ................................................................................................................................................. 9
1.7.1 A alog I put (real) ................................................................................................................................. 9
1.7.2 A alog I put cha els co figuratio (real) .......................................................................................... 10
1.7.3 Virtual Cha els ................................................................................................................................... 12
1.7.4 A alog i put cha els co figuratio (virtual) ...................................................................................... 13
1.8 BINARY INPUT CARD (EVENT) .......................................................................................................................... 14
1.8.1 Bi ary i put cha els co figuratio .................................................................................................... 15
1.9 OUTPUT CARD ................................................................................................................................................. 16
1.9.1 Bi ary output cha els co figuratio .................................................................................................. 17
1.10 HARDWARE COMPONENTS AND SPECIFICATIONS .......................................................................................... 18
2INSTALLATION ................................................................................................................. 19
2.1 EQUIPMENT AND NECESSARY MATERIAL ........................................................................................................ 19
2.1.1 Equipme t supplied by Multitel ........................................................................................................... 19
2.1.2 Material ot supplied by Multitel ......................................................................................................... 19
2.1.3 Required tools ...................................................................................................................................... 19
2.2 SHELVE MOUNTING ......................................................................................................................................... 20
2.2.1 Expa sio shelf ..................................................................................................................................... 20
2.3 INSERTING CARDS ............................................................................................................................................ 21
2.3.1 I/O Cards .............................................................................................................................................. 22
2.4 SYSTEM WIRING............................................................................................................................................... 22
2.5 POWER SUPPLY ................................................................................................................................................ 22
2.6 SYSTEM ALARMS .............................................................................................................................................. 23
2.7 GROUNDING .................................................................................................................................................... 24
2.8 ANALOG CARD WIRING.................................................................................................................................... 25
2.8.1 DC Voltage measureme t .................................................................................................................... 27
2.8.2 Shu t Curre t measureme ts............................................................................................................... 28
2.8.3 Temperature measureme ts ................................................................................................................ 29
2.8.4 AC Curre t measureme ts ................................................................................................................... 31
2.8.5 AC Voltage measureme ts ................................................................................................................... 32
2.8.6 Tra sducer with sig al measureme ts 4-20mA ................................................................................... 35
2.8.7 Hall-Effect Curre t tra sducers ............................................................................................................ 36
2.8.8 Mo itori g Si gle cells ......................................................................................................................... 37
2.9 EVENT CARD WIRING ....................................................................................................................................... 40
2.10 OUTPUT CARD WIRING .................................................................................................................................... 41
2.11 EXPANSION SHELVES CONNECTION ................................................................................................................. 43
3MAINTENANCE ................................................................................................................ 44
3.1 CALIBRATION ................................................................................................................................................... 44
3.1.1 Calibratio comma d ........................................................................................................................... 44

FUSION – Expansion shelf General Information
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3.1.2 DC Voltage Adjustme ts ....................................................................................................................... 44
3.1.3 Shu t Adjustme ts (±50 mV) ................................................................................................................ 45
3.1.4 Temperature Adjustme ts .................................................................................................................... 45
3.1.5 Hall-Effect Tra sducer Adjustme ts ..................................................................................................... 45
3.1.6 4-20 mA Tra sducer Adjustme ts ........................................................................................................ 45
3.2 TROUBLESHOOTING......................................................................................................................................... 46
3.2.1 System Reset ........................................................................................................................................ 46
3.2.2 Problem with a peripheral card ............................................................................................................ 47
3.3 BATTERY REPLACEMENT .................................................................................................................................. 48
3.3.1 A alog Card .......................................................................................................................................... 48

FUSION – Expansion shelf General Information
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FIGURES
Figure 1 – a alog card overview ........................................................................................................................................... 9
Figure 2 – Eve t card overview ............................................................................................................................................. 15
Figure 3 – Output card overview ........................................................................................................................................... 16
Figure 4  19” Relay rack mou ti g ...................................................................................................................................... 20
Figure 5 – 23” Relay rack mou ti g ...................................................................................................................................... 21
Figure 6 – Expa sio shelf rear view ..................................................................................................................................... 22
Figure 7 – Power Supply a d grou d co ectio s ................................................................................................................ 23
Figure 8 – Frame grou d co ectio s................................................................................................................................... 24
Figure 9 – DC voltage measureme t ..................................................................................................................................... 27
Figure 10 – DC shu t curre t measureme ts ........................................................................................................................ 28
Figure 11  Ambie t temperature measureme t (M-4107) ................................................................................................. 29
Figure 12  Sealed battery temperature measureme t (M-4103) ........................................................................................ 30
Figure 13  Surface temperature measureme t (M-4111) ................................................................................................... 30
Figure 14 – Si gle phase AC curre t measureme ts ............................................................................................................. 31
Figure 15 – Three-phase AC curre t measureme ts ............................................................................................................. 32
Figure 16 – Si gle phase 120 Volts measureme ts ............................................................................................................... 33
Figure 17 – Si gle phase 240 Volts measureme ts ............................................................................................................... 33
Figure 18 – Three-phase WYE (STAR) co ectio s ................................................................................................................ 34
Figure 19 – Three phase delta co ectio s ........................................................................................................................... 34
Figure 20 – 4-20mA Tra sducer co ectio s ........................................................................................................................ 35
Figure 21 – OSI Curre t tra sducer ....................................................................................................................................... 36
Figure 22 – Si gleCell co ectio ......................................................................................................................................... 37
Figure 23 – Stri g co ectio ............................................................................................................................................... 38
Figure 24 – Bi ary i put cha el co ectio s ...................................................................................................................... 40
Figure 25 – Output cha el co ectio s .............................................................................................................................. 42
Figure 26 – Expa sio shelves co ectio s .......................................................................................................................... 43
Figure 27 – Ferrite bead i stallatio ..................................................................................................................................... 46
Figure 28 – A alog card battery replaceme t ...................................................................................................................... 48

FUSION – Expansion shelf General Information
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TABLES
Table 1 – Typical power co sumptio of the Expa sio Shelf a d I/O cards ........................................................................ 7
Table 2  C[x] Co figuratio Parameters ............................................................................................................................... 9
Table 3  CxAy Co figuratio Parameters ............................................................................................................................ 10
Table 4  Digital processi g umbers for real cha els ........................................................................................................ 10
Table 5  Typical operati g parameters for differe t a alog measureme t poi ts ............................................................. 11
Table 6  CxVy Co figuratio Parameters ............................................................................................................................ 13
Table 7  Digital processi g umbers for virtual cha els ................................................................................................... 13
Table 8  CxEy Co figuratio Parameters ............................................................................................................................. 15
Table 9  CxOy Co figuratio Parameters ............................................................................................................................ 17
Table 10 – Hardware compo e ts a d specificatio s .......................................................................................................... 18
Table 11 – Expa sio shelves power co ectio s ................................................................................................................. 22
Table 12 – Expa sio shelf card fail alarm co ectio s ....................................................................................................... 23
Table 13 – Expa sio shelf grou di g co ectio s .............................................................................................................. 24
Table 14 – Maximum dista ces betwee the tra sducers a d the expa sio shelf ............................................................. 26
Table 15 – DC voltage i put co ectio ............................................................................................................................... 27
Table 16 – Tra sducers for temperature measureme t ....................................................................................................... 29
Table 17 – Co ecti g a AC voltage tra sducer ................................................................................................................. 32
Table 18 – Troubleshooti g for I/O cards ............................................................................................................................. 47
Table 19 – Mo itori g/co trol card fail LED (a alog, eve t or output) ............................................................................... 47
Table 20 – Specific problems: A alog card FAIL LED ............................................................................................................. 47

FUSION – Expansion shelf General Information
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CONTROL SHEET
Issue Date
MM/DD/YYYY
Descri tion Originator
1.0 010-0 -08 Release E. Boivin
1.1 011-10-06 Minor Modifications Y. Letourneau
1. 011-1 -0 Minor Modifications Y. Letourneau
1.3 013-09-04 Addition of the Expansion module 1U1S, documentation update G. Lafond

FUSION - Expansion shelf Specifications
7
1SPECIFICATIONS
Please note that our products are continuously modified to improve performance and reliability; therefore, accessories and
components are subject to changes without notice. In that case, these parts or accessories are replaced by equivalent
products. Contact Multitel service for the list of available accessories.
1.1 EXPANSION SHELF
The expansion shelf mounts in either a 19” or a 3” relay rack. The mounting ears are compatible with both the 1” and the 1. 5”
standard spacing schemes.
COMPONENTS HEIGHT WIDTH DEPTH WEIGTH
Expansion shelf 4" (10.1 cm) 17" (43. cm) 1 " (30.5 cm) 14lb (6.363kg)
ANALOG card 1.50" (3.8 cm) 5.1 5" (13 cm) 8.57" ( 1.8 cm) 1.40lbs (0.653kg)
EVENT card 1.50" (3.8 cm) 5.1 5" (13 cm) 8.57" ( 1.8 cm) 0.70lbs (0.3 5kg)
OUTPUT card 1.50" (3.8 cm) 5.1 5" (13 cm) 8.57" ( 1.8 cm) 0.86lbs (0.388kg)
NOTE: Mechanical dimensions do not include mounting bracket and back panel extension accessory.
1.2 ELECTRICAL
The Expansion Shelf may be powered by 4 or 48 Volts DC, depending on the ordered model. AC supply is possible only
through an AC/DC converter. Please contact your Multitel customer service center to recommend the use and specifications
of the required AC/DC converter for your specific application.
The following table presents the typical power consumption of the Expansion Shelf and the monitoring and control cards.
The recommended fusing is determined by the system’s maximum capacity. It is important not to exceed recommended
values, as electrical fires or shocks may occur.
The fuses must be installed close to the source for maximum protection of the connection wires.
Table 1 – Ty ical ower consum tion of the Ex ansion Shelf and I/O cards
VOLTAGE 24 V CC 48 V CC WATT
Recommended fuses 3 A A N/A
Expansion shelf at full capacity 704 mA 135 mA 64.8
ANALOG card 0 mA 110 mA 5.3
EVENT card 164 mA 8 mA 3.9
OUTPUT card 344 mA 17 mA 8.

FUSION - Expansion shelf Specifications
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1.3 ENVIRONMENTAL
The Expansion Shelf meets or exceeds the following operating temperatures. It is recommended that ventilation holes be
freed for better air circulation, which permits cooling of the unit. The maximum operating altitude is 7000ft ( 000m).
Com onent
Minimum
O erating
tem erature
Maximum
O erating
tem erature
O erating
Humidity
(%RH)
Minimum
Storage
tem erature
Maximum
Storage
tem erature
Storage
Humidity
(%RH)
Expansion Shelf 3
o
F (0
o
C) 1
0
F (50
0
C) 5 to 90 -40
0
F (-40
0
C) 158
0
F (70
0
C) 0 to 95
I/O cards 3
0
F (0
0
C) 1
0
F (50
0
C) 5 to 90 -40
0
F (-40
0
C) 158
0
F (70
0
C) 0 to 95
1.4 EXPANSION SHELF CONFIGURATION
The expansion shelf is built with a back panel board for interconnections. All components are
described in the following sections. This shelf can support a maximum of 5 monitoring/control
cards for monitoring and controlling different telecommunication site components as well as
other peripherals or non-telecommunication equipment.
Up to SIX (6) expansion shelves may be linked together for an increased monitoring and control capacity. FUSION controls
the expansion shelves monitoring/control cards up to a maximum of thirty (30) cards. Two ( ) communication ports, MLINK
and RS-485
1
act as an interconnection bus between the shelves.
The monitoring and control cards are dedicated in design for analog inputs (the ANALOG card), binary inputs (the EVENT card)
or relay outputs (the OUTPUT card). Each shelf requires connection to a power supply, which feeds power to its cards via the
back panel board. There is a DC to DC converter on each monitoring/control card.
1.5 EXPANSION MODULE 1U1S
For modest expansion needs, the Expansion module 1U1S provides a mean to increase the
FUSION monitoring capability from its nominal 1U rack space. Each 1U1S module integrates
one intelligent I/O card and can be factory installed side by side with one FUSION unit or
simply used as a stand-alone remote I/O device. Multiple 1U1S modules (up to 30) can be
daisy chained using the MLINK network connector at the back panel.
For information concerning power specifications, I/O connexions and more details refer to the 1U1S Expansion module Quick
reference sheet.
1.6 I/O CARDS CONFIGURATION
Each I/O card requires a specific physical location which is determined by the DIP switch setting located on the front of each
card. The Web interface feature of FUSION enables the user to configure software and enable or disable the installed cards.
1
The MLINK port is used for interfacing acquisition cards 1 to 15. The RS-485 can be used for acquisition cards 16 to 30 or as
a general RS-485 link. In this last case, it is to be configured with the COM command.

FUSION - Expansion shelf Specifications
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From the Web interface, select Config from the top menu and choose I/O Card on the left submenu, click on C[x]. It is
important to provide accurate information. Inaccurate information may cause a communication error erasing the card
configuration.
Table 2  C[x] Configuration Parameters
Parameters Descri tion Default Value
Card State Disabled, Enabled or None. When none is selected it will not
appear in the configuration file.
None
Card type Select: None, Event, Output or Analog
Reset Occurrence
Counter
The user can reset the occurrence counter associated with the
BFF1 signal. This is a fail signal setting if trouble is found in any of
the modules.
No
1.7 ANALOG CARDS
The analog card can process measurements of any kind likele DC or AC voltage, current, ambient temperature, humidity, and
several other kinds of phenomena. Virtual analog channels perform calculations on real data.
Each Analog card may monitor/control 18 real analog channels. There is, for each group of three (3) specific analog channels, a
plug-in interface module that offers flexibility and compatibility for all type of measurement. Up to six (6) analog interface modules
can be installed on a card.
Figure 1 – analog card overview
1.7.1 Analog Input (real)
Each analog card monitors up to 18 real channels. The analog interface modules (up to SIX (6) per card) installed on the card itself
define three (3) input channels. Different analog interface modules exist to adapt the FUSION to any application.
FUSION recognizes, via an identification circuit, which analog interface module is in which position and their respective analog
channels. The type of analog interface module determines the available parameters for that channel.

FUSION - Expansion shelf Specifications
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1.7.2 Analog Input channels configuration (real)
The analog input channels are displayed on the Web interface under the I/O Channels top menu.
To configure channels using the Web interface click on Config from the top menu (Supervisor access only) and choose I/O
Card on the left submenu. The C[x] card must be active in order to view available channels for the selected card. Click on
the C[x] card and then click on the CxAy channel to be configured. A list of programmable parameters will be displayed.
Table 3  CxAy Configuration Parameters
Parameters Descri tion Default Value
Channel state Disabled, Enabled or None. When none is selected it will not
appear in the configuration file. None
Name Channel identification. (Up to 40 characters) Not Programmed
Scale Scaling factor, Select: 1 to 65 535 ( 16 bit ) 80
Measure unit
Measurement unit, up to 5 characters (e.g. Watt, kWatt). Unit
fields are passive enter any required value. Exception:
temperature fields as these are active fields. When C or F is
entered it is automatically associated with °C or °F.
Not Programmed
Number of decimal
digits
Analog value representation: Choose between 0 and 4 digits
where 4=auto 4
Digital signal
processing
Refer to Table 4  Digital processing numbers for real channels.
Select: 0 to 4 0
Sign Polarity: Normal or Inverted Normal
PDF summation flag
Summation function in which the actual channel will participate if
the function is enabled. A virtual channel has to be configured for
the PDF summation for the enabled real channels (the starting
and ending channels have to be specified, a non-activated
channel will not be include in the summation). Select: Disabled or
Enabled
Disabled
For digital signal processing, select among the following:
Table 4  Digital rocessing numbers for real channels
Functions Related number
None 0
Single Cell (6x3Vdc) 1
Reserve 3 to 1
DC signal
AC signal 3
AC + DC signal 4

FUSION - Expansion shelf Specifications
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Table 5  Ty ical o erating arameters for different analog measurement oints
Measurement Scale Model # Unit Numerical
treatment
Temperature
170 M-3631V
°C or °F 0 170 M-3671V
170 M-367 V
DC Voltage Battery, plant
00 M-3614V
Vdc 0
00 M-3617V
00 M-3671V
00 M-3618V
Midpoint, cell
blocks, etc.
60 M-3619V
Vdc 0 3 M-3684V
DC Current Shunt Shunt value
M-3611V
Adc 0
M-3671V
M-3617V
M-367 V
M-3618V
DC Current OSI transducer Max transducer value
( 00) M-3651V Adc 0
DC Current Honeywell
transducer
Max transducer value
( 00) M-3681V Adc 0
AC Voltage
(SDTA-01)
Transformer
1 0 Vac
rms
40 Vac
rms
80 - 560 Vac 3
M-3661V
M3618V
AC Voltage
(SDTA-0 )
Transformer
40 Vac
rms
600 Vac
rms
560 - 1400 M-3661V Vac 3
AC Current transducer
100-1500A
Scale factor 15.01 :1
1501 à 515 M366 V Aac 3
4- 0mA transducer humidity Max. transducer value
0mA ( 00) M-3641V % 0
AC Current Interface, non-insulated 100/300/
1 000/3 000 M-366 V Aac 3

FUSION - Expansion shelf Specifications
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1.7.3 Virtual Channels
Each analog card contains 18 virtual channels able to make specific and arithmetic calculations. These channels store the
solved values of preprogrammed mathematical functions with respect to the raw data available via the real analog channels.
The following table presents the virtual channel’s DSP compatibility, versus the real channel DSPs.
REAL
\
VIRTUAL
0: None 1: Amp.hour 2:AC Harmonic Index 3: Active power 4: Reactive power 5: Complex power 6: Power factor 7: Total: Active power 8: Total: Reactive power 9: Total: Complex power 10: Total: Power factor 11: D.C. power 12: reserved
13: Cumulative Wh consumption
14: Cumulative VARh consumption
15: Cumulative VAh consumption
16: Watt demand per period
17: VAR demand per period
18: VA demand per period 19: dBm Power 20: D.C. Power (R*I^2) 21: DC signal 22: AC signal 23: AC+DC signal 24: Arithmetics
0: None
x x x x x x
1: reserved
2: Automatic trigger
x x xxxx
3: One shot trigger
x x xxxx
4: Periodic trigger
x x xxxx
5: reserved
6: reserved
7: reserved
8: reserved
9: Control interactive PID
x
10: Control n/inter. PID
x
11: Control inter. PID w/LPF
x
12: Control n/inter. PID w/LPF
x
13: Control without PID
x
14: reserved
15: reserved
16: reserved
17: reserved
18: reserved
19: reserved
20: reserved
21: reserved
22: DC signal
x
x
x
x
x
x
x
x
23: AC signal
x
x
x
x
x
x
x
x
x
x
x
x
24: AC+DC signal
x
x
x
x
x
x
x
x
The information regarding the fault indicator can be found in the Troubleshooting section.

FUSION - Expansion shelf Specifications
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1.7.4 Analog input channels configuration ( irtual)
The analog input virtual channels are displayed on the Web interface under the I/O Channels top menu.
To configure channels using the Web interface click on Config from the top menu (Supervisor access only) and choose I/O
Card on the left submenu. The C[x] card must be active in order to view available channels for the selected card. Click on
the C[x] card and then click on the CxVy channel to be configured. A list of programmable parameters will be displayed.
Table 6  CxVy Configuration Parameters
Parameters Descri tion Default Value
Channel state Disabled, Enabled or None. When none is selected it will not
appear in the configuration file. None
Name Channel identification. (Up to 40 characters) Not Programmed
Unit’s prefix Prefix to go with the chosen Unit. Select: None, kilo or Mega None
Unit
Unit, up to 5 characters (e.g. Watt, kWatt). Unit fields are passive
enter any required value. Exception: temperature fields as these
are active fields. When C or F is entered it is automatically
associated with °C or °F.
Not Programmed
Number of decimal
digits
Analog value representation: Choose between 0 and 4 digits
where 4=auto 4
Digital signal
processing
Refer to Table 7  Digital processing numbers for virtual channels.
For the arithmetical operator, the user must select 4 and
program accordingly. An analog channel will always be calculated
against a constant or another analog channel. Select: 0 to 5
0
Sign Polarity: Normal or Inverted Normal
Corresponding input
channel Disabled
For digital signal processing, select among the following:
Table 7  Digital rocessing numbers for virtual channels
Functions Related number
None 0
Amp. hour 1
Reserved 4 to 10
DC power 11
Single Cell (6x3Vdc real) 1
Reserved 13 to 0
DC signal 1
AC signal
AC + DC signal 3
Arithmetic operation:+,-,*,/ 4
PDF summation operation 5

FUSION - Expansion shelf Specifications
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1.8 BINARY INPUT CARD (EVENT)
The Binary input card, designated EVENT, is used to detect on-off status change such as door open, rectifier failure, AC outage,
HVAC set running, etc. A site alarm system or integration into an application is effortless because of the flexibility of the card’s 48
binary input channels and the ability of the FUSION to accommodate additional EVENT cards. Each binary input channel is
individually programmable. Grouping functions, alarm severity, history log files and other features make the FUSION a powerful
tool for managing telecommunication site peripheral equipment.
Each of the 48 inputs can be associated with information; Minor, Major or Critical alarm type. Therefore, when the status of a
channel is displayed, the importance of the alarm can be seen immediately.
Each binary input channel is terminated at the back panel of the expansion shelf. The binary input card monitors each input. The
voltage reference point is the same for each binary input: this is the digital ground (Connector A, pin 1). When the measured
signal is within the ground or battery activation level (see example below), the corresponding binary input channel is activated.
This means the channel’s corresponding mnemonic becomes true. The binary input channel mnemonics are named ‘CxEy’, where
x corresponds to the card position (1 to 30) and y corresponds to the binary input channel (1 to 48).
Note: In order to use the event channels in a source mode to detect passive dry contact referenced to ground, they need to
be configured with equals levels for ground and battery margins and also to have at least 8 volts lower in absolute value
than the floating voltage of the selected channels. These levels may be different from one channel to another depending of
the Event card hardware version and the supply voltage. Their values can be seen using the command VCxEy (x=1 to 30, y=1
to 48) with at least a user level access. Then the Event channels can be configured consequently in supervisor level access.
If the latch option has been selected in the Operation mode, once the input is activated, it will remain in this state until a
USER with the right permission allows unlatching of the input using the “RESET” command. The occurrence counter is used
to tally the number of valid state changes. It may also be reset using the “RESET” command.
For the Activation Level margins, see the following drawing.
Each event card can monitor 48 channels and each of these inputs is continuously sampled at a frequency of 10 Hz. Input status
is transmitted to the FUSION upon request. Each transition is kept by the event card to be transmitted to the FUSION.
-75V
75V
40V
10V
0V
-10V
-40V
BATTERY
BATTERY
GROUND
FLOATING
FLOATING

FUSION - Expansion shelf Specifications
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Figure 2 – Event card overview
1.8.1 Binary input channels configuration
The binary input channels are displayed on the Web interface under the I/O Channels top menu.
To configure parameters associated with the corresponding binary channel (CxEy), click on Config from the top menu
(Supervisor access only) and then choose I/O Card on the left submenu. The C[x] card has to be enabled in order to view
the available channels. Click on the CxEy channel to be configured. A list of programmable parameters will be displayed for
configuration.
Table 8  CxEy Configuration Parameters
Parameters Descri tion Default Value
Channel state Disabled, Enabled or None. When none is selected, it will not
appear in the configuration file. None
Name Channel identification. (Up to 40 characters) Not Programmed
Alarm Level Each Binary Input Channel can be associated with an alarm level
type: Not Logged, Informational, Minor, Major or Critical. Not Logged
State of floating level Select: No alarm or Alarm No alarm
Operating mode
The operating mode enables the user to select between Not
latched and latched input channel operation. If the latch option
has been selected (once the input is activated) it will remain in
this state until a USER with the right permission level enables
unlatching of the input.
Not latched
Activation delay Pre-set time used to delay the input activation, it starts counting
on a rising edge of the input. Select: 0 to 9990 * 1/10 seconds 0s
Deactivation delay
Pre-set time used to delay the input de-activation, it starts
counting on a falling edge of the input.
Select: 0 to 9990*1/10 seconds
0s
Margin for ground level Refer to section 1.6 for details. Select: 0 to 75V absolute 10V
Margin for battery level Refer to section 1.6 for details. Select: 0 to 75V absolute 40V
Activation level
The activation level enables the user to select between Ground
or Battery levels. When the measured signal is within the
margin for battery or ground level (depending on the selection),
the corresponding binary channel is activated.
Select: Ground or Battery levels
Ground
Reset Occurrence
counter
The occurrence counter is used to tally the number of valid state
changes. Permission to reset occurrence counter: Yes or No No

FUSION - Expansion shelf Specifications
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1.9 OUTPUT CARD
The relay output card is used to generate discrete alarms or to control operations. When used for discrete alarm, the output
channels are interconnected to the local alarm or telemetry equipment so that alarms generated by the FUSION can be
transported to the Operating Support System (OSS) or to the surveillance center.
The control mode is used to start and stop specific equipment remotely, manually or automatically. Uses may vary from
turning on/off rectifiers, converters, generator sets to disconnecting loads and regulating ventilation / HVAC units.
Each output card can control 3 channels. Outputs are supplied by SPST relays with the NO contact (Normally Open) available.
The normally open contacts (NO) are grouped by 16 and are available via terminals labeled ‘Output Common A’ and ‘Output
Common B’ on the output card. This design feature facilitates wiring upon installation. These micro relays should be protected
using an external diode when connecting inductive loads such as a solenoid or a control relay coil.
Binary output channel operation:
Operating mode: triggered
The output channel becomes active when the triggering equation or triggering source is TRUE (valid). The output will be
delayed by the activation delay value and will be prolonged by the deactivation delay value. The pulse duration parameter is
not used in this mode.
Operating mode: pulsed
The output channel provides a pulse from 0.1 to 10 seconds when the triggering equation or source is TRUE (valid). Activation
and deactivation delay are not used in this mode.
Up to 30 relay output cards can be installed into a FUSION using the expansion shelves. The relay in position 33 of the card is
installed to report an eventual Card Fail alarm through the system. The Power/Fail LED located on the card’s front panel turns to
green when operation is normal and flashes red when there is a problem. The troubleshooting section contains detailed
information on this subject.
NOTE:
The output card’s relays do not operate inductive loads. If an output is connected to an inductive load, a diode must be
connected across the load to avoid over-voltage. Otherwise, the equipment may be reset and/or damaged.
Manually controlled output ‘Binary Manual’ channels can be used as triggering source.
Figure 3 – Out ut card overview

FUSION - Expansion shelf Specifications
17
1.9.1 Binary output channels configuration
The binary output channels are displayed on the Web interface under the I/O Channels top menu.
To configure parameters associated with the corresponding binary channel (CxOy), click on Config from the top menu
(Supervisor access only) and then choose I/O Card on the left submenu. In order to view available channels the C[x] card
has to be enabled. Click on the CxOy channel to be configured. A list of programmable parameters will be displayed.
Table 9  CxOy Configuration Parameters
Parameters Descri tion Default Value
Channel state Disabled, Enabled or None. When None is selected it does not
appear in the configuration file. None
Name Channel identification. (Up to 40 characters) Not Programmed
Alarm Level Each Binary Output Channel can be associated with an alarm level
type: Not Logged, Informational Minor, Major or Critical. Not Logged
Operating mode
The operating mode Enables the user to select between Triggered
and Pulsed operation. Functionality of these modes of operation
is explained in section 1.7
Triggered
Activation delay
This parameter is available only if the triggered mode has been
selected. Pre-set time used to delay the output activation, it starts
counting on the triggering source input rising edge.
Select: 0 to 9990*1/10 seconds
0s
Deactivation delay
This parameter is available only if the triggered mode has been
selected. Pre-set time used to delay the output de-activation, it
starts counting on the triggering source falling edge.
Select: 0 to 9990*1/10 seconds
0s
Pulse duration This parameter is available only if the pulse mode has been
selected. Select: 1 to 100*1/10 seconds. 1
Triggering source Triggering source used to activate the output channel Not Programmed
Reset Occurrence
counter
The occurrence counter is used to tally the number of valid state
changes. Permission to reset occurrence counter: Yes or No No
Triggered mode
The output channel becomes active when the triggering equation or
triggering source is TRUE (valid). It will be delayed by the activation
delay value and extended by the deactivation delay pre-set time.
E.g. If TH1 is the triggering source activation delay is 10 seconds and
deactivation delay is 5 seconds. The output channel signal C1O1
would look like:
5s
TH1
10
s
C101

FUSION - Expansion shelf Specifications
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Pulsed mode
The output channel becomes active if the triggering source is active.
It will stay ON as long as the pre-set pulse duration has not expired.
If the triggering source state stays valid for a shorter period than
the pulse duration, the output will stay valid for the pulse duration
pre-set time. E.g. If TH1 is the triggering source; the pulse duration
is 10 seconds the output channel signal C1O would look like:
1.10 HARDWARE COMPONENTS AND
SPECIFICATIONS
Table 10 – Hardware com onents and s ecifications
I/O Cards Com onents S ecifications
Analog Card
INTEL 80188EB microprocessor
3 K byte EPROM memory
1 8K byte STATIC RAM memory
A watchdog circuit
1 -bit analog to digital
converter
A 4 or 48V DC/DC converter
18 real analog input channels
18 virtual analog channels
1 Power/Fail LED and Fail relay
A/D converter: 1 bits
Resolution: 000 samples
Precision: 000 samples
Isolation: 750 Volts
DC Signal overload (Except for
temperature, OSI and 4- 0mA input
channels):
50 -300 DCVolts
AC Signal overload: 75 Volts rms
CMVR: 1000 Volts
Impedance: 500kOhms-1MOhms
Event Card
A Mitsubishi M50747
microprocessor
3 kB EPROM memory
3 kB STATIC RAM memory
A watchdog circuit
8-bit Analog/Digital converter
4 or 48V DC/DC converter
48 binary input channel
1 Power/Fail LED and Fail relay
A/D converter: 1 bits
Resolution: 000 samples
Precision: 000 samples
DC Signal overload: +/- 55 DC Volts
Impedance: 1MOhms
Output Card
A Mitsubishi M50747
microprocessor.
3 kB EPROM memory.
3 kB STATIC RAM memory.
A watchdog circuit.
A 4 or 48V DC/DC converter.
3 user-programmable SPST
micro-relays.
1 Power/Fail LED and Fail relay.
Under AC load
Rated load: 0.4Amp @ 1 5 Volts
Maximum operating voltage: 50 Volts
Maximum operating current: 3Amps
Maximum switching capacity: 50 VA
Under DC load
Rated load: A @ 30 Volts
Maximum operating voltage 0 Volts
Maximum operating current: 3 Amps
Maximum switching capacity: 60 Watts
Pulse
TH1
10
s
C10

FUSION – Expansion shelf Installation
19
2INSTALLATION
2.1 EQUIPMENT AND NECESSARY MATERIAL
2.1.1 Equipment supplied by Multitel
A basic Expansion shelf consists of the following components:
Back panel equipped with modular connectors.
Modular telephone cable (9.8 ft/3m)
This USER MANUAL.
Configuration sheet for each card’s location.
Mounting brackets for 19" or 3" framework.
Mounting screws.
3 eight position connectors
NOTE: Before proceeding with installation, verify that all material has been received and is in good condition.
2.1.2 Material not supplied by Multitel
Modular telephone jack, surface mount
Stranded wire, No (to wire the monitored and controlled I/O points)
Stranded wire, No16 (to wire the inverters)
Solid wire, No (to wire the RFAx signals)
Terminal lugs (fork type or others) -16 and 1 -10
In-line fuse holders (to protect FUSION from signals connected to the shunts or to any point other than ground)
Fuses.
Shunt (sized as required) for battery current measurement
2.1.3 Required tools
Safety glasses or goggles
Anti-static wrist strap
Portable terminal or computer and a RS- 3 cable and adapter to access the system through the RS- 3 port (as
required)
Direct RS- 3 cable (pin to and pin 3 to 3)
Standard installation tools (various screw drivers, long nose, cutters, etc.)
Digital voltmeter/multimeter, 3½ digit (or better)
Ampmeter 3
1/
digits (or better).
Crimping tool for the terminal lugs (fork type or others)

FUSION – Expansion shelf Installation
0
2.2 SHELVE MOUNTING
The EXPANSION SHELF can only be installed in standard telecommunication relay racks. The mounting brackets provided can
adapt the mounting for European and North American relay rack standards and provide flush or recess mounting.
2.2.1 Expansion shelf
The expansion shelf can be installed on a 3" or 19" framework. For a 3" framework, screw the narrow side of the brackets
to the cabinet and the wide side to the framework. The main shelf can be installed with the front end flush with the
framework, or with a 5" or 6" projection (as shown in the following figures).
To mount the expansion shelf in a 19" framework, screw the wide side of the brackets to the cabinet and the narrow side to
the framework. The main shelf can be installed with the front-end flush with the framework, or a 5" projection (as shown in
the following figures).
In all cases, a maximum projection of ¾" must be added for the front panel. Brackets can be installed on frameworks with
holes at 1" center or with holes at ½" center, every 1¼". (See the following figures)
Figure 4  19” Relay rack mounting
Note: The front view of the expansion shelf is different from the one shown on this figure.