Multitel Fusion User manual

1
EXPANSION SHELF
User Manual
PROPRIETARY INFORMATION
The information contained in this document is the property of MULTITEL INC. Except as specifically authorized in writing by MULTITEL INC., the holder of
this document shall:
1. Keep all information contained herein confidential and shall protect same in whole or in part from disclosure and dissemination to all third parties and;
. Use this document for operating and maintenance purposes only.
Document Name:
GUSM_
FUSION
EXP
1
.
4
Issue:
1.
4
Re ised by:
G. Lafond
(CM)
Date
(MM/DD/YYYY)
:
04/0 / 015
© 013 Multitel Inc. Printed in Canada

FUSION – Expansion shelf General Information
TABLE OF CONTENTS
1SPECIFICATIONS ................................................................................................................ 7
1.1 EXPANSION SHELF.............................................................................................................................................. 7
1.2 ELECTRICAL ........................................................................................................................................................ 7
1.3 ENVIRONMENTAL .............................................................................................................................................. 8
1.4 EXPANSION SHELF CONFIGURATION ................................................................................................................. 8
1.5 EXPANSION MODULE 1U1S ............................................................................................................................... 8
1.6 I/O CARDS CONFIGURATION .............................................................................................................................. 8
1.7 ANALOG CARDS ................................................................................................................................................. 9
1.7.1 A alog I put (real) ................................................................................................................................. 9
1.7.2 A alog I put cha els co figuratio (real) .......................................................................................... 10
1.7.3 Virtual Cha els ................................................................................................................................... 12
1.7.4 A alog i put cha els co figuratio (virtual) ...................................................................................... 13
1.8 BINARY INPUT CARD (EVENT) .......................................................................................................................... 14
1.8.1 Bi ary i put cha els co figuratio .................................................................................................... 15
1.9 OUTPUT CARD ................................................................................................................................................. 16
1.9.1 Bi ary output cha els co figuratio .................................................................................................. 17
1.10 HARDWARE COMPONENTS AND SPECIFICATIONS .......................................................................................... 18
2INSTALLATION ................................................................................................................. 19
2.1 EQUIPMENT AND NECESSARY MATERIAL ........................................................................................................ 19
2.1.1 Equipme t supplied by Multitel ........................................................................................................... 19
2.1.2 Material ot supplied by Multitel ......................................................................................................... 19
2.1.3 Required tools ...................................................................................................................................... 19
2.2 SHELVE MOUNTING ......................................................................................................................................... 20
2.2.1 Expa sio shelf ..................................................................................................................................... 20
2.3 INSERTING CARDS ............................................................................................................................................ 21
2.3.1 I/O Cards .............................................................................................................................................. 22
2.4 SYSTEM WIRING............................................................................................................................................... 22
2.5 POWER SUPPLY ................................................................................................................................................ 22
2.6 SYSTEM ALARMS .............................................................................................................................................. 23
2.7 GROUNDING .................................................................................................................................................... 24
2.8 ANALOG CARD WIRING.................................................................................................................................... 25
2.8.1 DC Voltage measureme t .................................................................................................................... 27
2.8.2 Shu t Curre t measureme ts............................................................................................................... 28
2.8.3 Temperature measureme ts ................................................................................................................ 29
2.8.4 AC Curre t measureme ts ................................................................................................................... 31
2.8.5 AC Voltage measureme ts ................................................................................................................... 32
2.8.6 Tra sducer with sig al measureme ts 4-20mA ................................................................................... 35
2.8.7 Hall-Effect Curre t tra sducers ............................................................................................................ 36
2.8.8 Mo itori g Si gle cells ......................................................................................................................... 37
2.9 EVENT CARD WIRING ....................................................................................................................................... 40
2.10 OUTPUT CARD WIRING .................................................................................................................................... 41
2.11 EXPANSION SHELVES CONNECTION ................................................................................................................. 43
3MAINTENANCE ................................................................................................................ 44
3.1 CALIBRATION ................................................................................................................................................... 44
3.1.1 Calibratio comma d ........................................................................................................................... 44

FUSION – Expansion shelf General Information
3
3.1.2 DC Voltage Adjustme ts ....................................................................................................................... 44
3.1.3 Shu t Adjustme ts (±50 mV) ................................................................................................................ 45
3.1.4 Temperature Adjustme ts .................................................................................................................... 45
3.1.5 Hall-Effect Tra sducer Adjustme ts ..................................................................................................... 45
3.1.6 4-20 mA Tra sducer Adjustme ts ........................................................................................................ 45
3.2 TROUBLESHOOTING......................................................................................................................................... 46
3.2.1 System Reset ........................................................................................................................................ 46
3.2.2 Problem with a peripheral card ............................................................................................................ 47
3.3 BATTERY REPLACEMENT .................................................................................................................................. 48
3.3.1 A alog Card .......................................................................................................................................... 48

FUSION – Expansion shelf General Information
4
FIGURES
Figure 1 – a alog card overview ........................................................................................................................................... 9
Figure 2 – Eve t card overview ............................................................................................................................................. 15
Figure 3 – Output card overview ........................................................................................................................................... 16
Figure 4  19” Relay rack mou ti g ...................................................................................................................................... 20
Figure 5 – 23” Relay rack mou ti g ...................................................................................................................................... 21
Figure 6 – Expa sio shelf rear view ..................................................................................................................................... 22
Figure 7 – Power Supply a d grou d co ectio s ................................................................................................................ 23
Figure 8 – Frame grou d co ectio s................................................................................................................................... 24
Figure 9 – DC voltage measureme t ..................................................................................................................................... 27
Figure 10 – DC shu t curre t measureme ts ........................................................................................................................ 28
Figure 11  Ambie t temperature measureme t (M-4107) ................................................................................................. 29
Figure 12  Sealed battery temperature measureme t (M-4103) ........................................................................................ 30
Figure 13  Surface temperature measureme t (M-4111) ................................................................................................... 30
Figure 14 – Si gle phase AC curre t measureme ts ............................................................................................................. 31
Figure 15 – Three-phase AC curre t measureme ts ............................................................................................................. 32
Figure 16 – Si gle phase 120 Volts measureme ts ............................................................................................................... 33
Figure 17 – Si gle phase 240 Volts measureme ts ............................................................................................................... 33
Figure 18 – Three-phase WYE (STAR) co ectio s ................................................................................................................ 34
Figure 19 – Three phase delta co ectio s ........................................................................................................................... 34
Figure 20 – 4-20mA Tra sducer co ectio s ........................................................................................................................ 35
Figure 21 – OSI Curre t tra sducer ....................................................................................................................................... 36
Figure 22 – Si gleCell co ectio ......................................................................................................................................... 37
Figure 23 – Stri g co ectio ............................................................................................................................................... 38
Figure 24 – Bi ary i put cha el co ectio s ...................................................................................................................... 40
Figure 25 – Output cha el co ectio s .............................................................................................................................. 42
Figure 26 – Expa sio shelves co ectio s .......................................................................................................................... 43
Figure 27 – Ferrite bead i stallatio ..................................................................................................................................... 46
Figure 28 – A alog card battery replaceme t ...................................................................................................................... 48

FUSION – Expansion shelf General Information
5
TABLES
Table 1 – Typical power co sumptio of the Expa sio Shelf a d I/O cards ........................................................................ 7
Table 2  C[x] Co figuratio Parameters ............................................................................................................................... 9
Table 3  CxAy Co figuratio Parameters ............................................................................................................................ 10
Table 4  Digital processi g umbers for real cha els ........................................................................................................ 10
Table 5  Typical operati g parameters for differe t a alog measureme t poi ts ............................................................. 11
Table 6  CxVy Co figuratio Parameters ............................................................................................................................ 13
Table 7  Digital processi g umbers for virtual cha els ................................................................................................... 13
Table 8  CxEy Co figuratio Parameters ............................................................................................................................. 15
Table 9  CxOy Co figuratio Parameters ............................................................................................................................ 17
Table 10 – Hardware compo e ts a d specificatio s .......................................................................................................... 18
Table 11 – Expa sio shelves power co ectio s ................................................................................................................. 22
Table 12 – Expa sio shelf card fail alarm co ectio s ....................................................................................................... 23
Table 13 – Expa sio shelf grou di g co ectio s .............................................................................................................. 24
Table 14 – Maximum dista ces betwee the tra sducers a d the expa sio shelf ............................................................. 26
Table 15 – DC voltage i put co ectio ............................................................................................................................... 27
Table 16 – Tra sducers for temperature measureme t ....................................................................................................... 29
Table 17 – Co ecti g a AC voltage tra sducer ................................................................................................................. 32
Table 18 – Troubleshooti g for I/O cards ............................................................................................................................. 47
Table 19 – Mo itori g/co trol card fail LED (a alog, eve t or output) ............................................................................... 47
Table 20 – Specific problems: A alog card FAIL LED ............................................................................................................. 47

FUSION – Expansion shelf General Information
6
CONTROL SHEET
Issue Date
MM/DD/YYYY
Descri tion Originator
1.0 010-0 -08 Release E. Boivin
1.1 011-10-06 Minor Modifications Y. Letourneau
1. 011-1 -0 Minor Modifications Y. Letourneau
1.3 013-09-04 Addition of the Expansion module 1U1S, documentation update G. Lafond

FUSION - Expansion shelf Specifications
7
1SPECIFICATIONS
Please note that our products are continuously modified to improve performance and reliability; therefore, accessories and
components are subject to changes without notice. In that case, these parts or accessories are replaced by equivalent
products. Contact Multitel service for the list of available accessories.
1.1 EXPANSION SHELF
The expansion shelf mounts in either a 19” or a 3” relay rack. The mounting ears are compatible with both the 1” and the 1. 5”
standard spacing schemes.
COMPONENTS HEIGHT WIDTH DEPTH WEIGTH
Expansion shelf 4" (10.1 cm) 17" (43. cm) 1 " (30.5 cm) 14lb (6.363kg)
ANALOG card 1.50" (3.8 cm) 5.1 5" (13 cm) 8.57" ( 1.8 cm) 1.40lbs (0.653kg)
EVENT card 1.50" (3.8 cm) 5.1 5" (13 cm) 8.57" ( 1.8 cm) 0.70lbs (0.3 5kg)
OUTPUT card 1.50" (3.8 cm) 5.1 5" (13 cm) 8.57" ( 1.8 cm) 0.86lbs (0.388kg)
NOTE: Mechanical dimensions do not include mounting bracket and back panel extension accessory.
1.2 ELECTRICAL
The Expansion Shelf may be powered by 4 or 48 Volts DC, depending on the ordered model. AC supply is possible only
through an AC/DC converter. Please contact your Multitel customer service center to recommend the use and specifications
of the required AC/DC converter for your specific application.
The following table presents the typical power consumption of the Expansion Shelf and the monitoring and control cards.
The recommended fusing is determined by the system’s maximum capacity. It is important not to exceed recommended
values, as electrical fires or shocks may occur.
The fuses must be installed close to the source for maximum protection of the connection wires.
Table 1 – Ty ical ower consum tion of the Ex ansion Shelf and I/O cards
VOLTAGE 24 V CC 48 V CC WATT
Recommended fuses 3 A A N/A
Expansion shelf at full capacity 704 mA 135 mA 64.8
ANALOG card 0 mA 110 mA 5.3
EVENT card 164 mA 8 mA 3.9
OUTPUT card 344 mA 17 mA 8.

FUSION - Expansion shelf Specifications
8
1.3 ENVIRONMENTAL
The Expansion Shelf meets or exceeds the following operating temperatures. It is recommended that ventilation holes be
freed for better air circulation, which permits cooling of the unit. The maximum operating altitude is 7000ft ( 000m).
Com onent
Minimum
O erating
tem erature
Maximum
O erating
tem erature
O erating
Humidity
(%RH)
Minimum
Storage
tem erature
Maximum
Storage
tem erature
Storage
Humidity
(%RH)
Expansion Shelf 3
o
F (0
o
C) 1
0
F (50
0
C) 5 to 90 -40
0
F (-40
0
C) 158
0
F (70
0
C) 0 to 95
I/O cards 3
0
F (0
0
C) 1
0
F (50
0
C) 5 to 90 -40
0
F (-40
0
C) 158
0
F (70
0
C) 0 to 95
1.4 EXPANSION SHELF CONFIGURATION
The expansion shelf is built with a back panel board for interconnections. All components are
described in the following sections. This shelf can support a maximum of 5 monitoring/control
cards for monitoring and controlling different telecommunication site components as well as
other peripherals or non-telecommunication equipment.
Up to SIX (6) expansion shelves may be linked together for an increased monitoring and control capacity. FUSION controls
the expansion shelves monitoring/control cards up to a maximum of thirty (30) cards. Two ( ) communication ports, MLINK
and RS-485
1
act as an interconnection bus between the shelves.
The monitoring and control cards are dedicated in design for analog inputs (the ANALOG card), binary inputs (the EVENT card)
or relay outputs (the OUTPUT card). Each shelf requires connection to a power supply, which feeds power to its cards via the
back panel board. There is a DC to DC converter on each monitoring/control card.
1.5 EXPANSION MODULE 1U1S
For modest expansion needs, the Expansion module 1U1S provides a mean to increase the
FUSION monitoring capability from its nominal 1U rack space. Each 1U1S module integrates
one intelligent I/O card and can be factory installed side by side with one FUSION unit or
simply used as a stand-alone remote I/O device. Multiple 1U1S modules (up to 30) can be
daisy chained using the MLINK network connector at the back panel.
For information concerning power specifications, I/O connexions and more details refer to the 1U1S Expansion module Quick
reference sheet.
1.6 I/O CARDS CONFIGURATION
Each I/O card requires a specific physical location which is determined by the DIP switch setting located on the front of each
card. The Web interface feature of FUSION enables the user to configure software and enable or disable the installed cards.
1
The MLINK port is used for interfacing acquisition cards 1 to 15. The RS-485 can be used for acquisition cards 16 to 30 or as
a general RS-485 link. In this last case, it is to be configured with the COM command.

FUSION - Expansion shelf Specifications
9
From the Web interface, select Config from the top menu and choose I/O Card on the left submenu, click on C[x]. It is
important to provide accurate information. Inaccurate information may cause a communication error erasing the card
configuration.
Table 2  C[x] Configuration Parameters
Parameters Descri tion Default Value
Card State Disabled, Enabled or None. When none is selected it will not
appear in the configuration file.
None
Card type Select: None, Event, Output or Analog
Reset Occurrence
Counter
The user can reset the occurrence counter associated with the
BFF1 signal. This is a fail signal setting if trouble is found in any of
the modules.
No
1.7 ANALOG CARDS
The analog card can process measurements of any kind likele DC or AC voltage, current, ambient temperature, humidity, and
several other kinds of phenomena. Virtual analog channels perform calculations on real data.
Each Analog card may monitor/control 18 real analog channels. There is, for each group of three (3) specific analog channels, a
plug-in interface module that offers flexibility and compatibility for all type of measurement. Up to six (6) analog interface modules
can be installed on a card.
Figure 1 – analog card overview
1.7.1 Analog Input (real)
Each analog card monitors up to 18 real channels. The analog interface modules (up to SIX (6) per card) installed on the card itself
define three (3) input channels. Different analog interface modules exist to adapt the FUSION to any application.
FUSION recognizes, via an identification circuit, which analog interface module is in which position and their respective analog
channels. The type of analog interface module determines the available parameters for that channel.

FUSION - Expansion shelf Specifications
10
1.7.2 Analog Input channels configuration (real)
The analog input channels are displayed on the Web interface under the I/O Channels top menu.
To configure channels using the Web interface click on Config from the top menu (Supervisor access only) and choose I/O
Card on the left submenu. The C[x] card must be active in order to view available channels for the selected card. Click on
the C[x] card and then click on the CxAy channel to be configured. A list of programmable parameters will be displayed.
Table 3  CxAy Configuration Parameters
Parameters Descri tion Default Value
Channel state Disabled, Enabled or None. When none is selected it will not
appear in the configuration file. None
Name Channel identification. (Up to 40 characters) Not Programmed
Scale Scaling factor, Select: 1 to 65 535 ( 16 bit ) 80
Measure unit
Measurement unit, up to 5 characters (e.g. Watt, kWatt). Unit
fields are passive enter any required value. Exception:
temperature fields as these are active fields. When C or F is
entered it is automatically associated with °C or °F.
Not Programmed
Number of decimal
digits
Analog value representation: Choose between 0 and 4 digits
where 4=auto 4
Digital signal
processing
Refer to Table 4  Digital processing numbers for real channels.
Select: 0 to 4 0
Sign Polarity: Normal or Inverted Normal
PDF summation flag
Summation function in which the actual channel will participate if
the function is enabled. A virtual channel has to be configured for
the PDF summation for the enabled real channels (the starting
and ending channels have to be specified, a non-activated
channel will not be include in the summation). Select: Disabled or
Enabled
Disabled
For digital signal processing, select among the following:
Table 4  Digital rocessing numbers for real channels
Functions Related number
None 0
Single Cell (6x3Vdc) 1
Reserve 3 to 1
DC signal
AC signal 3
AC + DC signal 4