Intel SSDSC2BW120A4K5 User manual

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 1
Intel®Solid-State Drive 530 Series
(2.5-inch)
Product Specification
 Capacities: 80 GB, 120 GB, 180 GB, 240 GB,
360 GB, 480 GB
 Components:
−Intel®20 nm NAND Flash Memory
−Multi-Level Cell (MLC)
 Form Factors: 2.5-inch
 Thickness: 7 mm
 Weight: Up to 78 grams
 SATA 6Gb/s Bandwidth Performance1
(Iometer* Queue Depth 32)
−Sustained Sequential Read: up to 540 MB/s
−Sustained Sequential Write: up to 490
MB/s
 Read and Write IOPS1
(Iometer Queue Depth 32)
−Random 4 KB Reads: up to 41,000 IOPS
−Random 4 KB Writes: up to 80,000 IOPS2
 Latency (average sequential)
−Read: 80 µs (TYP)
−Write: 85 µs (TYP)
 Data Compression
 AES 256-bit Encryption
 End-to-End Data Protection
 Compatibility
−Intel®SSD Toolbox with Intel®SSD
Optimizer
−Intel®Data Migration Software
−Intel®Rapid Storage Technology
−SATA Revision 3.0
−ACS-2 (ATA/ATAPI Command Set 2)
−SSD Enhanced SMART ATA feature set
 Power Management
−5.0 V SATA Supply Rail
−SATA Link Power Management (LPM)
−Device Sleep (DevSleep)
 Power
−Active (BAPCo MobileMark* 2007
Workload): 195 mW
−Idle3: 125 mW
−DevSleep: 5 mW
 Temperature
−Operating4: 0oC to 70oC
−Non-Operating: -55oC to 95oC
 Reliability
—Uncorrectable Bit Error Rate (UBER):
<1 sector per 1016 bits read
—Mean Time Between Failure (MTBF):
1,200,000 hours
—Shock (operating and non-operating):
1,500 G/0.5 msec
 Vibration
—Operating: 2.17 GRMS (5-700 Hz)
—Non-operating: 3.13 GRMS (5-800 Hz)
 Certifications and Declarations:
−UL*
−CE*
−C-Tick*
−BSMI*
−KCC*
−Microsoft* WHCK
−VCCI*
−SATA-IO*
 Product Ecological Compliance
−RoHS*
NOTES:
1. Performance values vary by capacity.
2. Random 4 KB writes measured using out-of-box SSD.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the
system for maintaining proper device operating temperatures on heavier workloads.

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
2 Order Number: 329212-003US
Ordering Information
Contact your local Intel sales representative for ordering information.
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Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 3
Contents
Revision History....................................................................................................................4
1Introduction...............................................................................................................5
1.1 Terminology................................................................................................................. 6
1.2 Reference Documents.................................................................................................... 7
2Product Specifications................................................................................................8
2.1 Capacity ...................................................................................................................... 8
2.2 Performance................................................................................................................. 8
2.3 Electrical Characteristics ................................................................................................ 9
2.4 Environmental Conditions............................................................................................. 10
2.4.1 Temperature, Shock, Vibration ........................................................................ 10
2.4.2 Altitude......................................................................................................... 10
2.5 Product Regulatory Compliance..................................................................................... 11
2.6 Reliability................................................................................................................... 12
2.7 Hot Plug Support......................................................................................................... 12
3Mechanical Information ...........................................................................................13
4Pin and Signal Descriptions......................................................................................14
4.1 Pin Locations .............................................................................................................. 14
4.2 Signal Descriptions...................................................................................................... 14
4.2.1Connector Pin Signal Definitions....................................................................... 14
4.2.2 Power Pin Signal Definitions ............................................................................ 15
4.3 Device Sleep Feature................................................................................................... 15
5Supported Command Sets........................................................................................16
5.1 ATA General Feature Command Set............................................................................... 16
5.2 Power Management..................................................................................................... 17
5.3 Security Mode Feature Set ........................................................................................... 17
5.4 SMART Command Set.................................................................................................. 18
5.4.1 SMART Attributes........................................................................................... 18
5.4.2 SMART Logs .................................................................................................. 21
5.5 Device Statistics ......................................................................................................... 21
5.6 SMART Command Transport......................................................................................... 22
5.7 Data Set Management Command Set ............................................................................ 22
5.8 Host Protected Area Command Set................................................................................ 22
5.9 48-Bit Address Command Set....................................................................................... 22
5.10 General Purpose Log Command Set............................................................................... 22
5.11 Native Command Queuing............................................................................................ 23
5.12 Software Settings Preservation..................................................................................... 23
5.13 SATA Link Power Management (LPM)............................................................................. 23
6Certifications and Declarations ................................................................................24
7Appendix..................................................................................................................25

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
4 Order Number: 329212-003US
Revision History
Document
Number Revision Number Description Revision Date
329212 001US Initial release July 2013
329212 002US Added 120 GB capacity September 2013
329212 003US Added 80 GB, 360 GB, and 480 GB capacities October 2013

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 5
1Introduction
This document describes the specifications and capabilities of the Intel® Solid-State Drive 530 Series
(Intel® SSD 530 Series).
The Intel SSD 530 Series delivers the next generation storage solution with new low power features
designed for Ultrabook™. The next generation Intel SSD continues to provide high performance
expected for Serial Advanced Technology Attachment (SATA)-based computers.
The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives
(HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, and
ruggedness offered by an SSD.
The latest feature addition is the DevSleep functionality, a low power drive state controlled by the host
via the DevSleep pin. The drive will consume a mere 5 mW while in this state.
As compared to standard SATA HDDs, Intel SSD 530 Series offers these key features:
•High I/O and throughput performance
•Low power consumption
•Increased system responsiveness
•High reliability
•Enhanced ruggedness
The Intel SSD 530 Series also offers additional key features such as:
•Advanced Encryption Standard (AES) 256-bit Encryption
AES 256-bit encryption is an industry standard in data security, providing a hardware-based
mechanism for encryption and decryption of user data. Utilizing a 256-bit encryption key, AES
encryption—when combined with an ATA drive password—helps protect user data.
•End-to-End Data Protection
End-to-end data protection helps protect data from being corrupted across the data path by using
cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from
the host interface to the NAND, and back.
•Data Compression
Data compression helps improve performance and endurance by automatically compressing
information sent to the SSD so that less data has to be processed and stored on the NAND. The
amount of data that can be compressed depends on the type of data.

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
6 Order Number: 329212-003US
1.1 Terminology
Table 1: Terminology
Term Description
ATA
Advanced Technology Attachment
DAS
Device Activity Signal
DevSleep
Device Sleep, a new addition to the SATA specification
DIPM
Device Initiated Power Management
DMA
Direct Memory Access
EXT
Extended
FPDMA
First Party Direct Memory Access
GB
Gigabyte (1,000,000,000 bytes)
Note: The total usable capacity of the SSD may be less than the total physical
capacity because a small portion of the capacity is used for NAND flash
management and maintenance purposes.
HDD
Hard Disk Drive
HIPM
Host Initiated Power Management
I/O
Input/Output
IOPS
Input/Output Operations Per Second
KB
Kilobyte (1,024 bytes)
LBA
Logical Block Address
LPM
Link Power Management
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NCQ
Native Command Queuing
NOP
No Operation
PIO Programmed Input/Output
RDT
Reliability Demonstration Test
RMS
Root Mean Squared
SATA
Serial Advanced Technology Attachment
SMART
Self-Monitoring, Analysis and Reporting Technology
SSD
Solid-State Drive
TYP
Typical
UBER
Uncorrectable Bit Error Rate

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 7
1.2 Reference Documents
Table 2: Standard References
Date or Rev. # Title Location
May 2005
SFF-8201, 2.5-inch drive form factor
http://www.sffcommittee.org/
May 2006
SFF-8223, 2.5-inch Drive w/Serial Attachment
Connector
http://www.sffcommittee.org/
Sept 2008
IEC 55022 Information Technology Equipment —
Radio disturbance Characteristics— Limits and
methods of measurement CISPR22:2008
(Modified)
http://www.iec.ch/
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
June 2009 RoHS
http://qdms.intel.com/
Click Search MDDS Database and search
for material description datasheet
June 2009
Serial ATA Revision 3.0
http://www.sata-io.org/
August 2009 ACS-2 Specification http://www.t13.org/
August 2010
IEC 55024 Information Technology Equipment —
Immunity characteristics— Limits and methods
of measurement CISPR24:2010 http://www.iec.ch/
Sept 2010
Solid-State Drive (SSD) Requirements and
Endurance Test Method (JESD218)
http://www.jedec.org/standards-
documents/docs/jesd218/

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
8 Order Number: 329212-003US
2Product Specifications
2.1 Capacity
Table 3: User Addressable Sectors
Capacity Unformatted Capacity (Total User Addressable Sectors in LBA mode)
80 GB
156,301,488
120 GB
234,441,648
180 GB
351,651,888
240 GB
468,862,128
360 GB
703,282,608
480 GB
937,703,088
2.2 Performance
Table 4: Compressible Performance
Capacity
Specification
Random
4 KB Read
(up to)
1
Random
4 KB Write
(up to)
2
Random
4 KB Write
(TYP)
1
Sequential
128 KB Read1Sequential
128 KB Write1
IOPS
IOPS
IOPS
MB/s
MB/s
80 GB
24,000
80,000
33,000
540
480
120 GB
24,000
80,000
37,500
540
480
180 GB
41,000
80,000
49,000
540
490
240 GB
41,000
80,000
49,000
540
490
360 GB
45,000
80,000
33,000
540
490
480 GB
48,000
80,000
33,000
540
490
Note:
1. Performance measured using Iometer* with Queue Depth 32. Measurements are performed on 8 GB of
Logical Block Address (LBA) range on a full SSD
2. Random 4 KB writes measured using out-of-box SSD.
Table 5: Incompressible Performance
Capacity
Specification
Random
4 KB Read
(up to)
1
Random
4 KB Write
(up to)
1
Sequential
128 KB Read1Sequential
128 KB Write1
IOPS
IOPS
MB/s
MB/s
80 GB
20,500
13,000
430
100
120 GB
18,000
15,000
450
130
180 GB
37,500
17,000
470
170
240 GB
37,500
23,000
510
230
360 GB
37,500
10,000
525
240
480 GB
37,500
13,000
540
300
Note:
1. Performance measured using Iometer* with Queue Depth 32

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 9
Table 6: Latency
Specification Intel® SSD 530 Series
80 GB 120 GB 180 GB 240 GB 360 GB 480 GB
Read1
80 µs (TYP)
85 µs (TYP)
1 s (TYP)
Write1
Power On To Ready2
Note:
1. Based on sequential 4 KB using Iometer with Queue Depth 1 workload with compressible (non-random)
data pattern. Write Cache enabled.
2. Power On To Ready time assumes proper shutdown
2.3 Electrical Characteristics
Table 7: Operating Voltage and Power Consumption
Electrical Characteristics Value
80 GB 120 GB 180 GB 240 GB 360 GB 480 GB
Operating Voltage for 5 V (±5%)
Min
Max
Rise Time (Max/Min)
Fall Time (Max/Min)
Noise Tolerance
Min Off Time
1
4.75 V
5.25 V
100 ms / 0.1 ms
5 s / 1 ms
100 mV pp (10 Hz – 30 MHz)
1 s
Power Consumption (TYP)
Active2
Idle3
DevSleep
4
195 mW
125 mW
5 mW
Thermal Power5
2.8 W
3.1 W
3.7 W
4.5 W
4.5 W
4.5 W
Regulator Power6
3.4 W
3.4 W
4.0 W
4.9 W
5.0 W
5.0 W
Note:
1. Minimum time from when power removed from drive (Vcc < 100 mV) to when power can be reapplied
to drive.
2. Active power measured during execution of MobileMark* 2007 with SATA Link Power Management
(LPM) enabled.
3. Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
4. Power consumption during DevSleep state.
5. Power measured during 128 KB sequential writes with Queue Depth 32 workload using 100 ms sample
period. This represents power that would be thermal load on system during heavy workloads.
6. Power measured during 128 KB sequential writes with Queue Depth 32 workload using 500 µs sample
period. This represents power that system power supply would have to regulate for proper device
operation.

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
10 Order Number: 329212-003US
2.4 Environmental Conditions
2.4.1 Temperature, Shock, Vibration
Table 8: Temperature, Shock, Vibration
Electrical Characteristics Range
Case Temperature
Operating1
Non-operating2
0º C - 70º C
-55º C - 95º C
Temperature Gradient3
Operating
Non-operating
30 (TYP) ºC/hr
30 (TYP) ºC/hr
Humidity
Operating
Non-operating
5 – 95 %
5 – 95 %
Shock and Vibration Range
Shock4
Operating
Non-operating
1,500 G (Max) at 0.5 msec
1,500 G (Max) at 0.5 msec
Vibration5
Operating
Non-operating
2.17 GRMS (5-700 Hz) Max
3.13 GRMS (5-800 Hz) Max
Note:
1. As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within the
system for maintaining proper device operating temperature on heavier workloads.
2. Please contact your Intel representative for details on the non-operating temperature range.
3. Temperature gradient measured without condensation.
4. Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-
mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using
peak acceleration and pulse width value.
5. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the
drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is
measured using G Root Mean Squared (GRMS) value.
2.4.2 Altitude
The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Drive
tested under non-operational conditions to pressures representative of -1 K and +40 K feet.

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 11
2.5 Product Regulatory Compliance
The Intel® SSD 530 Series meets or exceeds the regulatory or certification requirements in the table
below.
Table 9: Product Regulatory Compliance Specifications
Title Description Region For Which
Conformity
Declared
TITLE 47-Telecommunications CHAPTER
1— FEDERAL COMMUNMICATIONS
COMMISSION PART 15 — RADIO
FREQUENCY DEVICES
ICES-003, Issue 4 Interference-Causing
Equipment
Standard Digital Apparatus
FCC Part 15B Class B
CA/CSA-CEI/IEC CISPR 22-10 (Ref.
CISPR 22:2008).
USA
Canada
IEC 55024 Information Technology
Equipment — Immunity characteristics—
Limits and methods of measurement
CISPR24:2010
EN-55024: 2010 and its amendments European Union
IEC 55022 Information Technology
Equipment — Radio disturbance
Characteristics— Limits and methods of
measurement CISPR24:2008 (Modified)
EN-55022: 2010 and its amendments European Union
EN-60950-1 2nd Edition Information Technology Equipment —
Safety — Part 1: General Requirements USA/Canada
UL/CSA EN-60950-1 2nd Edition Information Technology Equipment —
Safety — Part 1: General Requirements USA/Canada

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
12 Order Number: 329212-003US
2.6 Reliability
The Intel® SSD 530 Series meets or exceeds SSD endurance and data retention requirements as
specified in the JESD218 specification.
Table 10: Reliability Specifications
Parameter Value
Uncorrectable Bit Error Rate (UBER)
Uncorrectable bit error rate will not exceed one sector in the specified
number of bits read. In the unlikely event of a non-recoverable read error,
the SSD will report it as a read failure to the host; the sector in error is
considered corrupt and is not returned to the host.
< 1 sector per 1016 bits read
Mean Time Between Failures (MTBF)
Mean Time Between Failures is estimated based on Telcordia*
methodology and demonstrated through Reliability Demonstration Test
(RDT).
≥ 1.2 million hours
Minimum Useful Life/Endurance Rating
The SSD will have a minimum useful life based on a typical client workload
assuming up to 20 GB of host writes per day.
5 years
Insertion Cycles
Maximum insertion/removal cycles on 2.5 inch port
250 insertion/removal cycles
2.7 Hot Plug Support
Hot Plug insertion and removal is supported in the presence of a proper connector and appropriate
operation system, as described in the SATA 3.0 specification.
This product supports asynchronous signal recovery and issues an unsolicited COMINIT when first
mated with a powered connector to guarantee reliable detection by a host system without hardware
device detection.

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 13
3Mechanical Information
The figure below shows the mechanical information for the full size 2.5 inch Intel® SSD 530 Series
SSD. All dimensions are in millimeters.
Figure 1: Dimensions for Full Size 2.5 inch Drives

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
14 Order Number: 329212-003US
4Pin and Signal Descriptions
4.1 Pin Locations
Figure 2: Layout of Signal and Power Segment Pins
Note: 2.5-inch connector supports in-built latching capability.
4.2 Signal Descriptions
4.2.1 Connector Pin Signal Definitions
Table 11: Serial ATA Connector Pin Signal Definitions
Pin Function Definition
S1 Ground 1st mate
S2 A+ Differential signal pair A
S3 A-
S4 Ground 1st mate
S5 B- Differential signal pair B
S6 B+
S7 Ground 1st mate
Note: Key and spacing separate signal and power segments.

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 15
4.2.2 Power Pin Signal Definitions
Table 12: Serial ATA Power Pin Definitions
Pin1Name Definition Mating Order
P12V33 3.3 V Power; not used 2nd Mate
P22V33 3.3 V Power; not used 2nd Mate
P32DevSleep Device Sleep Pin 1st Mate
P43,4 Ground 1st Mate
P53Ground 1st Mate
P63Ground 1st Mate
P73,5 V55 V Power 1st Mate
P83,5 V55 V Power 2nd Mate
P93,5 V55 V Power 2nd Mate
P103Ground 1st Mate
P116DAS Device Activity Signal 2nd Mate
P123, 4 Ground 1st Mate
P132V12 12 V Power; not used 1st Mate
P142V12 12 V Power; not used 2nd Mate
P152V12 12 V Power; not used 2nd Mate
Notes:
1. All pins are in a single row, with a 1.27 mm (0.050-inch) pitch.
2. Pins P1, P2 and P3 are connected together; Pins P13, P14 and P15 are connected together. Although they are not
connected internally to the device, the host may apply voltage on these pins.
3. The mating sequence is:
• Ground pins P4-P6, P10, P12 and the 5 V power pin P7.
• Signal pins and the rest of the 5 V power pins P8-P9.
4. Ground connectors P4 and P12 may contact before the other 1st mate pins in both the power and signal connectors to
discharge ESD in a suitably configured backplane connector.
5. Power pins P7, P8, and P9 are internally connected to one another within the device.
6. The host may ground P11 if it is not used for Device Activity Signal (DAS).
4.3 Device Sleep Feature
Device Sleep (or DevSleep/DEVSLP) is the latest feature aligned with Intel® 4th Generation Core™-
based Ultrabook™. Ultrabook™ has stringent power requirements for SSDs and as such requires an
ability to put the drive in a low power state. Although Link Power Management allows some control
over power consumption, both methods still require the SATA link to remain online. The DevSleep pin
is an enable high pin which is pulled up by the drive

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
16 Order Number: 329212-003US
5Supported Command Sets
The Intel SSD 530 Series supports all mandatory Advanced Technology Attachment (ATA) and Serial
ATA (SATA) commands defined in the ACS-2 and SATA Revision 3.0 specifications. The mandatory and
optional commands are defined in this section.
5.1 ATA General Feature Command Set
General Feature command set (non-PACKET), which consists of:
−EXECUTE DEVICE DIAGNOSTIC
−FLUSH CACHE
−IDENTIFY DEVICE 1
−READ DMA
−READ SECTOR(S)
−READ VERIFY SECTOR(S)
−SEEK
−SET FEATURES
−WRITE DMA
−WRITE SECTOR(S)
−READ MULTIPLE
−SET MULTIPLE MODE
−WRITE MULTIPLE
The Intel SSD 530 Series also supports the following optional commands:
−READ BUFFFER
−WRITE BUFFER
−NOP
−DOWNLOAD MICROCODE
Note:
1. See the Appendix for details on the sector data returned after issuing an IDENTIFY DEVICE command.

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 17
5.2 Power Management
The Intel SSD 530 Series supports several power management feature sets as defined by the ATA
specification: general Power Management feature set, Advanced Power Management feature set, and
Power-Up in Standby (PUIS) feature set.
The Advanced Power Management and PUIS features can be enabled or disabled using the SET
FEATURES command.
The Power Management feature set includes the following commands:
•CHECK POWER MODE
•IDLE
•IDLE IMMEDIATE
•SLEEP
•STANDBY
•STANDBY IMMEDIATE
5.3 Security Mode Feature Set
The Intel SSD 530 Series supports the Security Mode command set, which consists of:
•SECURITY SET PASSWORD
•SECURITY UNLOCK
•SECURITY ERASE PREPARE
•SECURITY ERASE UNIT
−Normal Mode – Full NAND erase of user available space and spare area
−Enhanced Mode – Cryptographically erase data
•SECURITY FREEZE LOCK
•SECURITY DISABLE PASSWORD

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
18 Order Number: 329212-003US
5.4 SMART Command Set
The Intel SSD 530 Series supports the SMART command set, which consists of:
•SMART READ DATA
•SMART READ ATTRIBUTE THRESHOLDS
•SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE
•SMART SAVE ATTRIBUTE VALUES
•SMART EXECUTE OFF-LINE IMMEDIATE
•SMART READ LOG SECTOR
•SMART WRITE LOG SECTOR
•SMART ENABLE OPERATIONS
•SMART DISABLE OPERATIONS
•SMART RETURN STATUS
5.4.1 SMART Attributes
Table 13 lists the SMART attributes supported by the Intel SSD 530 Series; Table 14 lists the
corresponding status flags and threshold settings.
Table 13: SMART Attributes
ID Attribute Status Flags Threshold
SP EC ER PE OC PW
05h
Re-allocated Sector Count
The raw value of this attribute shows the
number of retired blocks since leaving the
factory (grown defect count).
1 1 0 0 1 0 0 (none)
09h
Power-On Hours Count
The raw value reports two values: the first
4 bytes report the cumulative number of
power-on hours over the life of the device,
the remaining bytes report the number of
milliseconds since the last hour increment.
The On/Off status of the Device Initiated
Power Management (DIPM) feature will
affect the number of hours reported. If DIPM
is turned On, the recorded value for
power-on hours does not include the time
that the device is in a "slumber" state. If
DIPM is turned Off, the recorded value for
power-on hours should match the clock
time, as all three device states are counted:
active, idle and slumber.
1 1 0 0 1 0 0 (none)
0Ch Power Cycle Count
The raw value of this attribute reports the
cumulative number of power cycle events
over the life of the device.
1 1 0 0 1 0 0 (none)

Intel® Solid-State Drive 530 Series (2.5-inch)
October 2013 Product Specification
Order Number: 329212-003US 19
ID Attribute Status Flags Threshold
SP EC ER PE OC PW
AAh Available Reserved Space 1 1 0 0 1 1 10
ABh
Program Fail Count
The raw value of this attribute shows total
count of program fails and the normalized
value, beginning at 100, shows the percent
remaining of allowable program fails.
1 1 0 0 1 0 0 (none)
ACh
Erase Fail Count
The raw value of this attribute shows total
count of erase fails and the normalized
value, beginning at 100, shows the percent
remaining of allowable erase fails.
1 1 0 0 1 0 0 (none)
AEh
Unexpected Power Loss
The raw value of this attribute reports the
cumulative number of unsafe (unclean)
shutdown events over the life of the device.
An unsafe shutdown occurs whenever the
device is powered off without STANDBY
IMMEDIATE being the last command
1 1 0 0 1 0 0 (none)
B7h
SATA Downshift Count
The count of the number of times SATA
interface selected lower signaling rate due
to error.
1 1 0 0 1 0 0 (none)
B8h
End-to-End Error Detection Count
Reports number of errors encountered
during end-to-end error detection within the
SSD data path.
1 1 0 0 1 1 90
BBh
Uncorrectable Error Count
The raw value shows the count of errors that
could not be recovered using Error
Correction Code (ECC).
1100100 (none)
BEh
Temperature
Reports real-time temperature of drive as
measured by temperature sensor on drive PCB.
The normalized value reports the current
temperature value. The raw value shows current,
lifetime highest and lifetime lowest
temperatures. Byte 1:0 = current temp Celsius;
Byte 3:2 = lifetime highest temp Celsius; Byte
5:4 = lifetime lowest temp Celsius.
1100100 (none)
C0h
Power-Off Retract Count (Unsafe Shutdown
Count)
The raw value of this attribute reports the
cumulative number of unsafe (unclean)
shutdown events over the life of the device. An
unsafe shutdown occurs whenever the device is
powered off without STANDBY IMMEDIATE being
the last command.
1100100 (none)
C7h
CRC Error Count
The total number of encountered SATA interface
cyclic redundancy check (CRC) errors. 1100100 (none)

Intel® Solid-State Drive 530 Series (2.5-inch)
Product Specification October 2013
20 Order Number: 329212-003US
ID Attribute Status Flags Threshold
SP EC ER PE OC PW
E1h
Host Writes
The raw value of this attribute reports the total
number of sectors written by the host system.
The raw value is increased by 1 for every 65,536
sectors (32 MB) written by the host.
1100100 (none)
E2h
Timed Workload Media Wear
Measures the wear seen by the SSD (since reset
of the workload timer, attribute E4h), as a
percentage of the maximum rated cycles.
1100100 (none)
E3h
Timed Workload Host Read/Write Ratio
Shows the percentage of I/O operations that are
read operations (since reset of the workload
timer, attribute E4h).
1100100 (none)
E4h
Timed Workload Timer
Measures the elapsed time (number of minutes
since starting this workload timer).
1100100 (none)
E8h
Available Reserved Space
This attribute reports the number of reserve
blocks remaining. The normalized value begins at
100 (64h), which corresponds to 100 percent
availability of the reserved space. The threshold
value for this attribute is 10 percent availability.
11001110
E9h
Media Wearout Indicator
This attribute reports the number of cycles the
NAND media has undergone. The normalized value
declines linearly from 100 to 1 as the average
erase cycle count increases from 0 to the
maximum rated cycles.
Once the normalized value reaches 1, the number
will not decrease, although it is likely that
significant additional wear can be put on the
device.
1100100 (none)
F1h
Total LBAs Written
The raw value of this attribute reports the total
number of sectors written by the host system.
The raw value is increased by 1 for every 65,536
sectors (32 MB) written by the host.
1100100 (none)
F2h
Total LBAs Read
The raw value of this attribute reports the total
number of sectors read by the host system. The
raw value is increased by 1 for every 65,536
sectors (32 MB) read by the host.
1100100 (none)
F9h
Total NAND Writes
Raw value reports the number of writes to NAND
in 1 GB increments. 1100100 (none)