Murata LBEE58D1VF-TEMP User manual

Preliminary Specification Number : SP-8D1VF-H
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
W-LAN+Bluetooth Combo Module Data Sheet
Qualcomm Chipset QCA6390
for IEEE802.11a/b/g/n/ac/ax 2*2 MIMO + BT 5.1
Sample P/N : LBEE58D1VF-TEMP

Preliminary Specification Number : SP-8D1VF-H
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The revision history of the product specification
Revised No.
Revised Date
Note
-
2019.3.5
Initial Release
A
2019.3.29
2.1 Block Diagram Updated
3. ABSOLUTE MAXIMUM RATINGS Updated
4. OPERATING CONDITION Updated
5.1 Dimensions Update and <PIN SHAPE>
5.2 Pin Layput updated
9. LAND PATTERN (TOP VIEW) Updated
Added 5.3. Module PIN Descriptions
Added 6. POWER OF SEQUENCE
B
2019.5.29
5.1 UBM sizu Updated
2. Weight Updated
C
2019.6.3
5. Added Marking information(Tentative)
10. Added Dimensions of Tape(Tentative)
D
2019.7.1
2.1 Changed block diagram (remove xtal inside module)
5.1 Changed pin shape
5.2 Changed pin shape and pin description (XTALO->XTALI)
5.3 Changed pin description (XTALO->XTALI)
9 Changed pin shape
E
2019.8.23
3. ABSOLUTE MAXIMUM RATINGS updated
4. OPERATING CONDITION updated
F
2019.9.10
7. REFERENCE CIRCUIT
Added the latest circuit
10.TAPE AND REEL PACKING
(1) Dimensions of Tape (Plastic tape
Change tape dimensions for MP
(4) Leader and Tail tape
Changed packaging unit to 2000pcs/reel for MP
G
2019.12.15
8. ELECTRONICAL CHARACTERISTICS
Updated the value
H
2019.12.26
5.3 Revised pin description for terminal P1 and P2.

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TABLE OF CONTENTS
1. SCOPE..................................................................................................................................................... 3
2. KEY FEATURE ...................................................................................................................................... 3
2.1. Block Diagram .......................................................................................................................... 3
2.2. Ordering Information............................................................................................................... 3
2.3. RoHS Compliance..................................................................................................................... 3
3. ABSOLUTE MAXIMUM RATINGS...................................................................................................... 4
4. OPERATING CONDITION ................................................................................................................... 4
5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS ................................................. 5
5.1. Dimensions ............................................................................................................................... 5
5.2. Pin Layout................................................................................................................................. 7
5.3. Module PIN Descriptions....................................................................................................... 10
6. POWER OF SEQUENCE..................................................................................................................... 14
7. REFERENCE CIRCUIT....................................................................................................................... 15
8. ELECTORICAL CHARACTERISTICS (Chain 0/1) ........................................................................... 16
8.1. DC/RF Characteristics for IEEE802.11b - 2.4GHz.............................................................. 16
8.2. DC/RF Characteristics for IEEE802.11g - 2.4GHz .............................................................. 16
8.3. DC/RF Characteristics for IEEE802.11n - 2.4GHz.............................................................. 17
8.4. DC/RF Characteristics for IEEE802.11ax - 2.4GHz............................................................ 17
8.5. DC/RF Characteristics for IEEE802.11a - 5GHz ................................................................. 18
8.6. DC/RF Characteristics for IEEE802.11n(HT 20/40MHz) - 5GHz....................................... 18
8.7. DC/RF Characteristics for IEEE802. 11ac (VHT20/VHT40/VHT80) - 5GHz .................... 20
8.8. DC/RF Characteristics for IEEE802. 11ax (HE20/HE40/HE80) - 5GHz ........................... 21
8.9. DC/RF Characteristics for Bluetooth.................................................................................... 22
8.10. DC/RF Characteristics for Bluetooth（LE）.................................................................... 23
9. LAND PATTERN (TOP VIEW)............................................................................................................ 24
10. TAPE AND REEL PACKING........................................................................................................... 25
11. NOTICE............................................................................................................................................. 28
11.1. Storage Conditions: ............................................................................................................ 28
11.2. Handling Conditions: ......................................................................................................... 28
11.3. Standard PCB Design (Land Pattern and Dimensions):................................................. 28
11.4. Notice for Chip Placer: ....................................................................................................... 28
11.5. Soldering Conditions: ......................................................................................................... 29
11.6. Cleaning: ............................................................................................................................. 29
11.7. Operational Environment Conditions:.............................................................................. 29
11.8. Input Power Capacity:........................................................................................................ 30
12. PRECONDITION TO USE OUR PRODUCTS ............................................................................... 31
Please be aware that an important notice concerning availability, standard warranty and use in critical applications of
Murata products and disclaimers thereto appears at the end of this specification sheet.

Preliminary Specification Number : SP-8D1VF-H
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1. SCOPE
This specification is applied to the IEEE802.11a/b/g/n/ac/ax W-LAN + BT5.1 combo module.
2. KEY FEATURE
- Qualcomm QCA6390 inside
- Compliant with IEEE802.11a/b/g/n/ac/ax
- Supports W-LAN 2*2 MU-MIMO
- DBS(Dual band simultaneous) with dual MAC, up to 1774.5Mbps data rate (2*2 + 2*2, 11ax DBS)
- Compliant with BT specification
- 5G Rx Splitters inside for ANT sharing w/LAA
- Surface mount type 8.75 x 7.0 mm (Typical), H = 1.1 mm (Max)
- Extreme size efficient dual side mount structure with conformal shield.
- Weight : 0.19g
- MSL : 3
2.1. Block Diagram
2.2. Ordering Information
Ordering Part Number
Description
LBEE58D1VF-TEMP
In case of sample order
LBEE58D1VF-TEMP-D
EVK
2.3. RoHS Compliance
This module is compliant with the RoHS directive.

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3. ABSOLUTE MAXIMUM RATINGS
Parameter
min.
max.
Unit
Storage Temperature
-40
85
deg.C
Supply Voltage
RFA0P8_LDO_IN
-0.3
Vddx+0.2
V
RFA12_LDO_IN
-0.3
Vddx+0.2
V
RFA17_LDO_IN
-0.3
Vddx+0.2
V
PCIE0P92_LDO_IN
-0.3
Vddx+0.2
V
PCIE18_LDO_IN
-0.3
Vddx+0.2
V
CX_MX_BT_LDO_IN
-0.3
Vddx+0.2
V
AON_RFACMN_LDO_IN
-0.3
Vddx+0.2
V
VDD18_DIG_IO
-0.3
Vddx+0.2
V
VPH_PA_2G_CH0,
VPH_PA_2G_CH1,
VPH_PA_5G_CH0,
VPH_PA_5G_CH1
-0.3
5.25
V
* Vddx is the supply voltage associated with the input or output pin to whichthe test voltage is
applied.
* Stresses in excess of the absolute ratings may cause permanent damage. Functional operation
is not implied under these conditions. Exposure to absolute ratings for extended periods of time
may adversely affect reliability. No damage assuming only one parameter is set at limit at a time
with all other parameters are set within operating condition.
4. OPERATING CONDITION
Parameter
min.
typ.
max.
unit
Operating Temperature*1
-20
25
+75
deg.C
Supply Voltage
RFA0P8_LDO_IN
0.9
0.95
1.0
V
RFA12_LDO_IN
1.3
1.38
1.42
V
RFA17_LDO_IN
1.9
2.0
2.1
V
PCIE0P92_LDO_IN
1.28
1.35
1.45
V
PCIE18_LDO_IN
1.9
2.0
2.1
V
CX_MX_BT_LDO_IN
0.9
0.95
1.0
V
AON_RFACMN_LDO_IN
0.9
0.95
1.89
V
VDD18_DIG_IO
1.71
1.8
1.89
V
VPH_PA_2G_CH0,
VPH_PA_2G_CH1,
VPH_PA_5G_CH0,
VPH_PA_5G_CH1
3.0
3.85
4.6
V
* Functionality is guaranteed but specifications require derating at extreme temperatures.

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5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS
5.1. Dimensions
<TOP VIEW>
<SIDE VIEW>

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(Marking information)
Lot No
2D code
1pin mark
Murata Logo
Module Type

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5.2. Pin Layout
<TOP VIEW>
Address
X
Y
Net Name
A1
0.325
0.35
GND
A2
0.325
0.8
PCIE_TXN
A3
0.325
1.25
GND
A4
0.325
1.7
PCIE_RXP
A5
0.325
2.15
GND
A6
0.325
2.6
PCIE_REFCLKN
A7
0.325
3.05
GND
A8
0.325
3.5
WLAN_SW_CTRL
A9
0.325
3.95
CLK_OUT_REF
A10
0.325
4.4
PCIE0P92_LDO_IN
A11
0.325
4.85
GND
A12
0.325
5.3
RFA0P8_LDO_IN
A13
0.325
5.75
CX_MX_BT_LDO_IN
A14
0.325
6.2
VDD18_DIG_IO
A15
0.325
6.65
GND
B1
0.775
0.35
GND
B2
0.775
0.8
PCIE_TXP
B3
0.775
1.25
GND
B4
0.775
1.7
PCIE_RXN
B5
0.775
2.15
GND
B6
0.775
2.6
PCIE_REFCLKP
B7
0.775
3.05
GND
B8
0.775
3.5
PCIE_CLKREQ#
B9
0.775
3.95
WL_LED/PCIE_BAR_SIZE0
B10
0.775
4.4
GND
B11
0.775
4.85
PCIE18_LDO_IN
B12
0.775
5.3
GND
B13
0.775
5.75
CX_MX_BT_LDO_IN

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B14
0.775
6.2
GND
B15
0.775
6.65
RFA12_LDO_IN
C1
1.225
0.35
PCIE_WAKE#
C2
1.225
0.8
GND
C14
1.225
6.2
AON_RFACMN_LDO_IN
C15
1.225
6.65
GND
D1
1.675
0.35
LF_CLK_IN
D2
1.675
0.8
PCIE_RST#
D14
1.675
6.2
GND
D15
1.675
6.65
RFA17_LDO_IN
E1
2.125
0.35
BT_I2S0_SDO/EDL_MODE
E2
2.125
0.8
BT_I2S0_SCK/BT_SLIMBUS_CLK
E14
2.125
6.2
CLK_REQ_IN
E15
2.125
6.65
GND
F1
2.575
0.35
BT_I2S0_SDI/BT_SLIMBUS_DATA
F2
2.575
0.8
BT_I2S0_WS
F14
2.575
6.2
GND
F15
2.575
6.65
WLAN_EN
G1
3.025
0.35
BT_SENS_RXD
G2
3.025
0.8
BT_SENS_TXD/CPU_INIT_RESET
G14
3.025
6.2
GND
G15
3.025
6.65
BT_EN
H1
3.475
0.35
XTAL_GND
H2
3.475
0.8
XTAL_GND
H14
3.475
6.2
GND
H15
3.475
6.65
LAA_AS_EN
J1
3.925
0.35
XTALI
J2
3.925
0.8
XTAL_GND
J14
3.925
6.2
WL_PA_MUTE
J15
3.925
6.65
WL_TXEN
K1
4.375
0.35
XTAL_GND
K2
4.375
0.8
XTAL_GND
K14
4.375
6.2
LAA_TXEN
K15
4.375
6.65
LAA_RX
L1
4.825
0.35
BT_UART_CTS
L2
4.825
0.8
BT_UART_RXD
L14
4.825
6.2
GND
L15
4.825
6.65
GND
M1
5.275
0.35
BT_UART_TXD
M2
5.275
0.8
BT_UART_RTS
M14
5.275
6.2
GPS_COEX/PBL_BOOTSPEED_0
M15
5.275
6.65
CLK_REQ_OUT/PBL_FAST_BOOT
N1
5.725
0.35
COEX_TXD/BOOT_FROM_ROM
N2
5.725
0.8
COEX_RXD
N14
5.725
6.2
WL_UART_RXD
N15
5.725
6.65
WL_UART_RTS/PBL_AUTH_EN
P1
6.175
0.35
HST_SLM_CH0_CTL0/CLK_REQ_0
P2
6.175
0.8
HST_SLM_CH0_CTL1/CLK_REQ_1
P14
6.175
6.2
GND
P15
6.175
6.65
WL_UART_TXD/WDOG_DISABLE
Q1
6.625
0.35
HST_SLM_CH1_CTL0/PBL_BOOTSPEED_1

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Q2
6.625
0.8
HST_SLM_CH1_CTL1/XO_TCXO_SEL
Q14
6.625
6.2
GND
Q15
6.625
6.65
GND
R1
7.075
0.35
GND
R2
7.075
0.8
GND
R14
7.075
6.2
GND
R15
7.075
6.65
GND
S1
7.525
0.35
5G_CH0_LTE-U_RX_AS
S2
7.525
0.8
GND
S14
7.525
6.2
GND
S15
7.525
6.65
2G_CH1
T1
7.975
0.35
GND
T2
7.975
0.8
GND
T3
7.975
1.25
VPH_PA_5G_CH0
T4
7.975
1.7
GND
T5
7.975
2.15
GND
T6
7.975
2.6
GND
T7
7.975
3.05
GND
T8
7.975
3.5
GND
T9
7.975
3.95
GND
T10
7.975
4.4
GND
T11
7.975
4.85
GND
T12
7.975
5.3
VPH_PA_5G_CH1
T13
7.975
5.75
GND
T14
7.975
6.2
GND
T15
7.975
6.65
GND
V1
8.425
0.35
GND
V2
8.425
0.8
GND
V3
8.425
1.25
VPH_PA_2G_CH0
V4
8.425
1.7
GND
V5
8.425
2.15
2G_CH0
V6
8.425
2.6
GND
V7
8.425
3.05
GND
V8
8.425
3.5
5G_CH0
V9
8.425
3.95
GND
V10
8.425
4.4
5G_CH1_LTE-U_RX_AS
V11
8.425
4.85
GND
V12
8.425
5.3
VPH_PA_2G_CH1
V13
8.425
5.75
GND
V14
8.425
6.2
5G_CH1
V15
8.425
6.65
GND