Murata SMST21NMHB Series User manual

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
1 July.2014
1 Features
 RF Transformer “Stabilized Matching Device“ is RF impedance matching components.
 You can adjust impedance matching easily between antenna and feeding point, when you use RF
Transformer.
 RF Transformer has very few frequency characteristics. So it’s extremely useful for RF impedance
matching.
 Small size : 2.0 x 1.25 x 0.6 mm3
2 Part Number Configuration
SMST 21 NMHB – 003
① ② ③ ④
① Product ID (SMST = Antenna Matching device)
② Dimension Code
(Unit : mm)
Code Dimension
21 2.0 x 1.25
③ Control Code
④ Serial Number
※RoHS Compliant
Halogen free
T/R only.

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
2 July.2014
3 Construction Dimensions
3.1 Dimensions
Unit：mm
Mark Size Mark Size
L 2.00 +/- 0.15 c 0.95 +/- 0.10
W 1.25 +/- 0.15 d 0.35 +/- 0.10
T 0.60 +/- 0.10 e 0.30 +/- 0.10
a 0.35 +/- 0.10 f 0.15 +/- 0.10
b 0.40 +/- 0.10
3.2 Pin Configuration
Pin No. Pin Name Description
(1) GND Ground
(2) RF2 RF port (Radiator)
(3) NC No connect
(4) RF1 RF port (RFIC)

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
3 July.2014
3.3 Circuit Diagram
4 Characteristics
4.1 Absolute maximum ratings
Rating Symbol Value Unit
Operating Temperature TOP -40 to +85 oC
Storage Temperature TSTO -40 to +85 oC
Input power PIN 35 dBm
4.2 Electrical Characteristics (T=25 oC)
Parameter
Low Band (892MHz) High Band (1940MHz)
Impedance Insertion Loss*1 Impedance Insertion Loss*1
Symbol RL ILL RH ILH
Unit Ω dB Ω dB
Test condition RF1=50Ω
RF1=50
Ω
,
RF2=R
L
RF1=50Ω
RF1=50
Ω
,
RF2=R
H
SMST21NMHB-001 8 0.32 19 0.17
SMST21NMHB-002 8 0.38 22 0.16
SMST21NMHB-003 12 0.26 19 0.17
SMST21NMHB-004 12 0.25 22 0.11
*1: When RF2 is terminated by the complex conjugate of the component
~
Radiator
RF-IC
SMST21NMHB
-
***
NC GND
RF1
RF2
L1
L2

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
4 July.2014
4.3 Typical Characteristics
[SMST21NMHB-001]
Smith chart Equivalent circuit
[SMST21NMBH-002]
Smith chart Equivalent circuit
[Low Band]
[High Band]
[Low Band]
[High Band]
20
20
10
10
5.0
5.0
2.0
2.00.5
0.5
0.2
0.2
freq ﴾700.0MHz to 2.300GHz﴿
m1
m2
m1
freq=
S﴾2,2﴿=0.730 / 153.283
impedance = 8.229 + j11.569
892.0MHz
m2
freq=
S﴾2,2﴿=0.476 / 159.448
impedance = 18.278 + j7.887
1.940GHz
0.5 1.0 2.0 5.0 10 20
2.0
2.0
1.01.0
0.5
0.5
S﴾2,2﴿

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
5 July.2014
[SMST21NMHB-003]
Smith chart Equivalent circuit
[SMST21NMBH-004]
Smith chart Equivalent circuit
0.5 1.0 2.0 5.0 10 20
2.0
2.0
1.01.0
0.5
0.5
S﴾2,2﴿
[Low Band]
[High Band]
0.5 1.0 2.0 5.0 10 20
20
20
10
10
5.0
5.0
2.0
2.0
1.01.0
0.5
0.5
0.2
0.2
freq ﴾700.0MHz to 2.300GHz﴿
S﴾2,2﴿
m1
m2
m1
freq=
S﴾2,2﴿=0.639 / 145.168
impedance = 12.041 + j14.852
892.0MHz
m2
freq=
S﴾2,2﴿=0.408 / 149.128
impedance = 22.346 + j11.209
1.940GHz
[Low Band]
[High Band]

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
6 July.2014
5 Reliability Test
【Mechanical Test】
No.
Items
Specifications
Test Methods
1 Vibration
Resistance
Appearance
No severe damages Solder specimens on the testing jig (glass
fluorine boards) shown in appended Fig.1 by a
Pb free solder. The soldering shall be done
either by iron or reflow and be conducted with
care so that the soldering is uniform and free of
defect such as by heat shock.
Frequency : 10~2000 Hz
Acceleration : 196 m/s2
Direction : X,Y,Z 3 axis
Period : 2 h on each direction
Total 6 h.
Electrical
Specifications Satisfy specifications listed in
paragraph 4-2 over operational
temperature range
2 Shock
Appearance
No severe damages Solder specimens on the testing jig (glass
fluorine boards) shown in appended Fig.1 by a
Pb free solder. The soldering shall be done
either by iron or reflow and be conducted with
care so that the soldering is uniform and free of
defect such as by heat shock
Acceleration : 14,700 m/s2
Period : 0.3 ms.
Cycle : 3 times
Electrical
Specifications Satisfy specifications listed in
paragraph 4-2 over operational
temperature range
3 Deflection
No damage with 1.6mm deflection Solder specimens on the testing jig (glass
epoxy boards) by a Pb free solder. The
soldering shall be done either by iron or reflow
and be conducted with care so that the
soldering is uniform and free of defect such as
by heat shock.
4 Soldering strength
(Push Strength) 3N Minimum
Solder specimens onto test jig shown below.
Apply pushing force at 0.5mm/s until electrode
pads are pealed off or ceramics are broken.
Pushing force is applied to longitudinal
direction.
5 Solderability of Termination
75% of the terminations is to be
soldered evenly and continuously.
Immerse specimens first an ethanol solution of
rosin, then in a Pb free solder solution for 2±0.5
sec. at 245±5 °C.
Preheat : 100~120 °C, 60 sec.
Solder Paste : Sn-Ag-Cu
Flux : Solution of ethanol and rosin
(25 % rosin in weight proportion)
6 Resistance
to Soldering
Heat
(Reflow)
Appearance
No severe damages Preheat Temperature : 150-180 °C
Preheat Period : 90+/-30 s
High Temperature : 220 ℃
High Temp. Period : 30+/-10 s
Peak Temperature : 260+5/-0 °C
Specimens are soldered twice with the above
condition, and then kept in room condition for
24 h before measurements.
Electrical
specifications Satisfy specifications listed in
paragraph 4-2 over operational
temperature range
Pushing Direction
Jig
Specimen

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
7 July.2014
【Environmental Test】
No.
Items
Specifications
Test Methods
7 High Temp.
Exposure
Appearance
No severe damages Temperature : 85+2/-0 °C
Period : 1000+48/-0 h
Room Condition : 2 ~ 24 h
Electrical
specifications Satisfy specifications listed in
paragraph 4-2 over operational
temperature range
8 Temperature
Cycle
Appearance
No severe damages Set the specimens to the supporting jig in the
same manner and under the same conditions
as Fig.1 and conduct the 100 cycles according
to the temperatures and time shown in the
following table. Set it for 2 to 24 h at room
temperature, then measure.
Electrical
specifications Satisfy specifications listed in
paragraph 4-2 over operational
temperature range
9 Humidity
(Steady
State)
Appearance
No severe damages
Temperature：85±2 ℃
Humidity：80～90 %RH
Period：1000+48/-0 h
Room Condition：2 ～ 24 h
Electrical
specifications Satisfy specifications listed in
paragraph 4-2 over operational
temperature range
10 Low Temp.
Exposure
Appearance
No severe damages
Temperature：-40±2 ℃
Period：1000+48/-0 h
Room Condition：2 ～ 24 h
Electrical
specifications Satisfy specifications listed in
paragraph 4-2 over operational
temperature range
Fig.1 Land Pattern
TOP VIEW
Unit: mm
Mark Size Mark Size
a 0.35 d 0.35
b 0.40 e 0.30
c 0.95 f 0.15
Note: This footprint is for reference purpose only.
Step Temp(°C) Time(min)
1 Min. Operating
Temp.+0/-3 30±3
2 Max. Operating
Temp.+0/-3 30±3

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
8 July.2014
6 Tape and Reel Packing
1) Dimensions of Tape (Plastic tape)
2) Dimensions of Reel
(Unit: mm)
(Unit: mm)
9.0＋1.0
－0
2±0.5
13.0
±
1.0
φ13±0.2
Φ60 Φ180
Feeding direction

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
9 July.2014
3) Taping Diagrams
[1] Feeding hole: As specified in (1)
[2] Hole for chip: As specified in (1)
[3] Cover tape: 0.05mm in thickness
[4] Base tape: As specified in (1)
[1]
[2]
[3]
[3]
[4]
A
Feeding hole
Chip
Feeding Direction

RF Transformer (Stabilized Matching Device)
SMST21NMHB series
10 July.2014
4) Leader and Tail tape
5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the
user.
6) Packaging unit: 4000 pcs
7) Material Base tape: Plastic
Reel: Plastic
8） Peeling of force : 0.1～1.0 N in the direction of peeling as shown below.
Tail tape
(No components) Components No components
Feeding direction
Leader tape
(Cover tape alone)
Over160m Over100mm
Over400mm
165 ~ 180 °
0.7 N max.
Base tape
Cover tape
0.1~
1.0
N