Murata LBEU5ZZ1WL-857SMP User manual

Preliminary Specification Number :SP-ZZ1WL-857
Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
LoRa + Wi-Fi + Bluetooth + GNSS Module Data Sheet
Semtech LR1110 Chipset for 802.11 b/g/n (sniff),LoRa, GNSS
ST Micro STM32WB55VGY6 Chipset for MCU and BT
Design Name:
Type1WL
Sample Part Number:
LBEU5ZZ1WL-857SMP
MP Part Number:
LBEU5ZZ1WL-857
This Datasheet is preliminary version, and subject
to change without notice

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The revision history of the product specification
Revised
Date
Revision
Code
Revised
Page
Revised Item
Change
Reason
2022/09/20
-
-
-
First release
2022-09-21
A
3,5
Added the weight information.
Updated the laser mark information on top side
Changed sample par number and EVK part number
Update

Preliminary Specification Number : SP-ZZ1WL-857
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Murata(China) Investment Co., Ltd.
TABLE OF CONTENTS
1. SCOPE .................................................................... 3
2. Part Number ................................................................ 3
3. Block Diagram............................................................... 3
4. Certification Information ........................................................ 4
4.1. Radio Certification .................................................... 4
4.2. Bluetooth® Qualification ................................................ 4
5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS .......................... 5
5.1. Dimensions ......................................................... 5
5.2. Pin Layout and Descriptions ............................................. 6
6. ABSOLUTE MAXIMUM RATINGS ................................................ 8
7. OPERATING CONDITION ...................................................... 8
8. RF Characteristics ............................................................ 9
8.1. RF Characteristics for Sub-GHz .......................................... 9
8.2. RF Characteristics for Wi-Fi Passive Scanner................................ 10
8.3. RF Characteristics for BLE ............................................. 11
8.4. RF Characteristics for GNSS............................................ 12
9. LAND PATTERN (TOP VIEW) .................................................. 13
10.REFERENCE CIRCUIT ..................................................... 14
11. TAPE AND REEL PACKING .................................................. 15
11.1. Dimension of Tape .................................................... 15
11.2. Dimensions of Reel.................................................... 15
11.3. Taping Diagrams...................................................... 16
11.4. Leader and Tail Tape................................................... 16
12.NOTICE ................................................................ 18
12.1. Storage Conditions: ................................................ 18
12.2. Handling Conditions:................................................ 18
12.3. Standard PCB Design (Land Pattern and Dimensions): ....................... 18
12.4. Notice for Chip Placer: .............................................. 19
12.5. Soldering Conditions: ............................................... 19
12.6. Cleaning: ........................................................ 20
12.7. Operational Environment Conditions: .................................... 20
12.8. Input Power Capacity: ............................................... 20
13. PRECONDITION TO USE OUR PRODUCTS ..................................... 21
Please be aware that an important notice concerning availability, standard warranty and use in critical applications of
Murata products and disclaimers thereto appears at the end of this specification sheet.

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1. SCOPE
This specification is applied to Geolocation module for LoRa, Wi-Fi, BT, and GNSS.
- Interface : USB/UART/SPI/I2C
- Chipset : Semtech LR1110 for LoRa, Wi-Fi, and GNSS
STMicro STM32WB55 for MCU and BT
- Module Size : 17.50 x 17.00 x 2.15(MAX) mm
- Weight : 1130 mg
- Structure : Metal case＋PCB (Lead Free Module)
- RoHS : This component can meet with RoHS compliance.
2. Part Number
Ordering Part Number
Description
LBEU5ZZ1WL-857-TEMP
In case of sample order
LBEU5ZZ1WL-857-EVB
In case of EVB order
LBEU5ZZ1WL-857
Mass Produced Product
“Type1WL” is design name of this module. Design name may be used in certification test report.
3. Block Diagram

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4. Certification Information
4.1. Radio Certification
USA/Canada
FCC ID
IC
*Please follow installation manual inAppendix
Europe
TBD
Japan
TBD
4.2. Bluetooth® Qualification
QDID: T.B.D.

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5. DIMENSIONS, MARKING AND TERMINAL CONFIGURATIONS
5.1. Dimensions
A
Pin 1 Hole
B
Murata Logo
C
Module model name
D
ES Version
E
Inspection Number
F
2D Code
Mark
Dimension
Mark
Dimension
Mark
Dimension
W
17.00±0.20
L
17.50±0.20
a1
0.50±0.10
a2
0.50±0.10
a3
0.80±0.10
b1
0.20±0.15
b2
1.875±0.150
b3
4.10±0.15
b4
4.50±0.15
b5
0.20±0.15
b6
1.70±0.15
b7
4.35±0.15
c1
0.80±0.10
c2
0.80±0.10
c3
0.80±0.10
e1
0.35±0.10
e2
0.35±0.10
e3
0.80±0.10
e4
0.80±0.10
T
2.15max
Note: The laser mark is temporary.

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5.2. Pin Layout and Descriptions
Pin
NO.
Terminal Name
Type
Connection to IC terminal
Description
1
GND
GND
-
Ground
2
NRST_MCU
I
STM32: NRST
STM32 reset signal, active low
3
I2C_INT1
I/O
STM32: PC2
Interrupt for I2C sensor
4
I2C_SCL
I/O
STM32: PB8
I2C clock
5
I2C_SDA
I/O
STM32: PB7
I2C data
6
I2C_POWER
I/O
STM32: PB9
Power for I2C sensor
7
GPIO1
I/O
STM32: PD14
General purpose I/O
8
BOOT0
I
STM32: PH3-BOOT0
STM32 BOOT0 pin. At start up, BOOT0 pin
and BOOT1 option bit are used to select
three boot option:
Boot from user flash:(BOOT1:x, BOOT0:0)
Boot from system memory: (BOOT1:0,
Top View

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BOOT0:1)
Boot from embedded SRAM: (BOOT1:1,
BOOT0:1)
9
GND
GND
-
Ground
10
ANT_2G4
RF
-
2.4GHz antenna(BLE/ Wi-Fi)
11
GND
GND
-
Ground
12
GPIO2
I/O
STM32: PD13
General purpose I/O
13
SWDIO
I/O
STM32: PA13
SWD interface data pin
14
SWCLK
I/O
STM32: PA14
SWD interface clock pin
15
SWO
I/O
STM32: PB3
SWD interface debug pin
16
GND
GND
-
Ground
17
GND
GND
-
Ground
18
GND
GND
-
Ground
19
VDD
Power
-
Power supply for MCU and LoRa
20
VDD
Power
-
Power supply for MCU and LoRa
21
GND
GND
-
Ground
22
GPIO3
I/O
STM32: PD7
General purpose I/O
23
USB_DP
I/O
STM32: PA12
USB interface data positive
24
USB_DM
I/O
STM32: PA11
USB interface data minus
25
SPI_CS
I/O
STM32: PD2
SPI interface chip select
26
SPI_MOSI
I/O
STM32: PD4
SPI interface master output slave input
27
SPI_MISO
I/O
STM32: PD3
SPI interface master input slave output
28
SPI_SCK
I/O
STM32: PD1
SPI interface clock
29
GPIO4
I/O
STM32: PD0
General purpose I/O
30
NC
Power
-
NC
31
GND
GND
-
Ground
32
NC
Power
-
NC
33
GND
GND
-
Ground
34
GND
GND
-
Ground
35
GPIO11
I/O
STM32: PC10
General purpose I/O
36
GPIO12
I/O
STM32: PA15
General purpose I/O
37
GND
GND
-
Ground
38
USART_RX
I/O
STM32: PA10
USART of STM32
39
USART_TX
I/O
STM32: PA9
USART of STM32
40
GPIO13
I/O
STM32: PE4
General purpose I/O
41
GPIO14
I/O
STM32: PB15
General purpose I/O
42
GND
GND
-
Ground
43
GND
GND
-
Ground
44
ANT_GNSS
RF
-
GNSS antenna
45
GND
GND
-
Ground
46
VBAT_SENSE
AI/O
STM32: PA1
Measure battery voltage
47
GPIO5
I/O
STM32: PC9
General purpose I/O
48
LPUART_CTS
I/O
STM32: PB13
LPUART of STM32
49
GND
GND
-
Ground
50
GND
GND
-
Ground
51
NRST_LORA
I
LR1110: NRESET
LR1110 reset, active low
52
GND
GND
-
Ground
53
ANT_LORA
RF
-
LoRa antenna
54
GND
GND
-
Ground
55
GPIO6
I/O
STM32: PD6
General purpose I/O
56
GPIO7
I/O
STM32: PD10
General purpose I/O
57
LPUART_RTS
I/O
STM32: PB12
LPUART of STM32
58
PWM_CTRL
I/O
STM32: PB6
Load control
59
GPIO8
I/O
STM32: PC4
General purpose I/O
60
GPIO9
I/O
STM32: PC5
General purpose I/O
61
LPUART_TX
I/O
STM32: PB11
LPUART of STM32
62
LPUART_RX
I/O
STM32: PB10
LPUART of STM32
63
USR_ADC
AI/O
STM32: PA0
Analog IO
64
GPIO10
I/O
STM32: PC11
General purpose I/O
65
I2C_INT2
I/O
STM32: PC3
Interrupt for I2C sensor
66
GND
GND
GND
Ground

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67-102
GND
GND
-
Ground
6. ABSOLUTE MAXIMUM RATINGS
Parameter
min.
typ.
max.
unit
Storage Temperature
-40
-
85
deg.C
Supply Voltage
VDD_3V3
-0.3
3.6
V
VDD_GNSS
-0.3
4.3
V
VDD_GNSS_BU
-0.3
4.3
V
7. OPERATING CONDITION
Parameter
min.
typ.
max.
unit
Operating Temperature
-30
-
85
deg.C
Supply Voltage
VDD_3V3
3.0
3.3
V
VDD_GNSS
2.8
4.3
V
VDD_GNSS_BU
2.0
4.3
V

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8. RF Characteristics
8.1. RF Characteristics for Sub-GHz
Sub-GHz Bands Receiver Specifications
Symbol
Description
Conditions
Min
Typ.
Max
Unit
FRRXLF
RX input frequency
Sub-GHz frequency range, LoRa and FSK
863
-
928
MHz
RXS2F3
Sensitivity 2-FSK
BRF = 4.8 kb/s, FDA = 5 kHz, BWF = 20 kHz
-
TBD
-
dBm
RXS2F3HP3
Sensitivity 2-FSK,
RxBoosted = 1
BRF = 4.8 kb/s, FDA = 5 kHz, BWF = 20 kHz
-
TBD
-
dBm
RXSL3
RXSL4
RXSL5
RXSL6
RXSL7
RXSL8
Sensitivity LoRa®
RxBoosted = 0
BWL = 125 kHz, SF = 7
BWL = 125 kHz, SF = 12
BWL = 250 kHz, SF = 7
BWL = 250 kHz, SF = 12
BWL = 500 kHz, SF = 7
BWL = 500 kHz, SF = 12
-
-
-
-
-
-
TBD
TBD
TBD
TBD
TBD
TBD
-
-
-
-
-
-
dBm
RXSL3HP7
RXSL4HP7
RXSL5HP7
RXSL6HP7
RXSL7HP7
RXSL8HP7
Sensitivity LoRa®,
RxBoosted = 1
BWL = 125 kHz, SF = 7
BWL = 125 kHz, SF = 12
BWL = 250 kHz, SF = 7
BWL = 250 kHz, SF = 12
BWL = 500 kHz, SF = 7
BWL = 500 kHz, SF = 12
-
-
-
-
-
-
TBD
-140
TBD
TBD
TBD
TBD
-
-
-
-
-
-
dBm
IDDR_F
Supply current in receiver
FSK mode
RxBoost OFF
RxBoost ON
-
-
TBD
TBD
-
-
-
mA
IDDR_L
Supply current in receiver
LoRa mode, RxBoost off
BW = 125 kHz
BW = 250 kHz
BW = 500 kHz
-
-
-
TBD
TBD
TBD
-
-
-
mA

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Sub-GHz Path Transmitter Specifications
Symbol
Description
Conditions
Min
Typ.
Max
Unit
TXOPLP
TXOPHP
Maximum TX power
LP PA
HP PA
+13.5
+21
-
-
dBm
dBm
ΔRF_ OPH_V
RF output power stability versus
voltage supply
VDD = 3.0 V to 3.3 V
LP PA operating
HP PA, operating
-
-
TBD
TBD
-
-
dB
ΔRF_T
RF output power stability versus
temperature
From T = -40 °C to +85 °C
LP PA operating
HP PA, operating
-
-
TBD
TBD
-
-
dB
TXPRNGLF
TX power range
Programmable in steps of -1dB from
maximum TX power
-
31
-
steps
IDDT_L
Supply current in LoRa transmitter
mode with impedance matching
LP PA setting = 14 dBm
HP PA, setting = 22 dBm
-
-
TBD
TBD
-
-
mA
8.2. RF Characteristics for Wi-Fi Passive Scanner
Conditions : 25deg.C,
Items
Description
Conditions
Min
Typ.
Max
Unit
FRRXWF
RX input frequency
Wi-Fi channels
2412
-
2484
MHz
IDDRXWI-FI
Supply Current in Wi-Fi
scan mode
Preambles detect phase
Capture phase
Processing phase
TBD
TBD
TBD
mA
RXSWFB1
Wi-Fi sensitivity for Wi-Fi
802.11 b, DSSS
DBPSK, DR = 1Mb/s
-92
dBm
RXSWFG1
Wi-Fi sensitivity for Wi-Fi
802.11 g, OFDM, 20MHz
channel spacing
BPSK, CR = 1/2, DR = 6 Mb/s
TBD
dBm
RXSWFN1
Wi-Fi sensitivity for Wi-Fi
802.11 n, OFDM, 20MHz
channel spacing, short
guard interval
BPSK, CR = 1/2, DR = 7.2 Mb/s
TBD
dBm

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8.3. RF Characteristics for BLE
RF characteristics are given at 1 Mbps, unless otherwise specified.
Normal conditions : 25 deg.C, VDD= 3.3V
Items
Contents
Bluetooth specification (power class)
Version 5.0 (LE)
Channel frequency (spacing)
2402 to 2480 MHz (2MHz)
Number of RF Channel
40
Item / Condition
Min.
Typ.
Max.
Unit
Center Frequency
2402
-
2480
MHz
Channel Spacing
-
2
-
MHz
Number of RF channel
-
40
-
-
Maximum output power
0 dBm output power
Minimum output power
-
-
-
5.0
-
-
-
-
-
dBm
dBm
dBm
Modulation Characteristics
1) Δf1avg
225
-
275
kHz
2) Δf2max (at 99.9%)
185
-
-
kHz
3) Δf2avg / Δf1avg
0.8
-
-
-
Carrier frequency offset and drift
1) Frequency offset
-150
-
150
kHz
2) Frequency drift
-
-
50
kHz
3) Drift rate
-
-
20
kHz
Receiver sensitivity (PER < 30.8%)
-
-92
-
dBm
Maximum input signal level (PER < 30.8%)
-
TBD
-
dBm
PER Report Integrity (-30dBm input)
50
-
65.4
%
RF BLE current consumption
Symbol
Parameter
Typ.
Unit
Itxmax
TX maximum output
power consumption
TBD
mA
Itx0dbm
TX 0 dBm output power
consumption
TBD
Irxlo
Rx consumption
TBD

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8.4. RF Characteristics for GNSS
LR1110 GNSS Scanner Receiver Specifications
Symbol
Description
Conditions
Min
Typ.
Max
Unit
IDDRXGPS1
IDDRXGPS2
Supply current in
GNSS scan mode
Capture phase
Processing phase
TBD
TBD
mA
mA
FRRXGPS
RX input
frequency
GPS
BeiDou
-
-
1.57542
1.5611
-
-
GHz
RXSGPS1E
RXSGPS2E
RXSBEI1E
RXSBEI2E
GNSS sensitivity
GPS, indoor classification, and strong signal SV
capture
GPS, weak signal SV capture
BeiDou, strong signal SV capture
BeiDou, weak signal SV capture
-
-
-
-
TBD
TBD
TBD
TBD
-
-
-
-
dBm
dBm
dBm
dBm

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9. LAND PATTERN (TOP VIEW)

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10.REFERENCE CIRCUIT
L6
NC
R5 0R
L5
NC
ANT_GNSS
R3 0R
ANT_2G4
L1
NC L2 NC
SWCLK
SWDIO
CON1
CON4
1
2
3
4
R1
100k
Type1WL Module
U1
GND
1
nRST_MCU
2
I2C_SCL
4
I2C_SDA
5
I2C_INT1
3
I2C_POWER
6
GPIO1
7
BOOT0
8
GND
9
ANT_2G4
10
GND
11
GPIO2
12
SWCLK
14 SWDIO
13
SWO
15
GND
16
GND
17
GND
18
P3V3
19
P3V3
20
GND
21
GPIO3
22
USB_DP
23
USB_DM
24
SPI_CS
25
SPI_SCK
28 SPI_MISO 27 SPI_MOSI 26
GPIO4
29
NC
30
GND
31
NC
32
GND
33
GND 34
GPIO11 35
GPIO12 36
GND 37
USART_RX 38
USART_TX 39
GPIO13 40
GPIO14 41
GND 42
GND 43
ANT_GNSS 44
GND 45
VBAT_SENSE 46
GPIO5 47
LPUART_CTS 48
GND 49
GND 50
nRST_LoRa 51
GND 52
ANT_LoRa 53
GND 54
GPIO6 55 GPIO7 56
LPUART_RTS 57
GPIO8 59
PWM_Ctrl 58
GPIO9 60
LPUART_TX 61
LPUART_RX 62
GPIO10 64
USR_ADC 63
GND 66
I2C_INT2 65
epad
67
epad
68
epad
69
epad
70
epad
71
epad
72
epad
73
epad
74
epad
75
epad
76
epad
77
epad
78
epad
79
epad
80
epad
81
epad
82
epad
83
epad
84
epad 85
epad 86
epad 87
epad 88
epad 89
epad 90
epad 91
epad 92
epad 93
epad 94
epad 95
epad 96
epad 97
epad 98
epad 99
epad 100
epad 101
epad 102
C1
4.7uF
C2
0.1uF
nReset_ST
USB_DP USB_DM
COMMAND_UART_TX COMMAND_UART_RX
VDD33
R2
100k
VDD33
L4
NC
R4 0R
L3
NC
ANT_LORA
SWDIO
SWCLK

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11.TAPE AND REEL PACKING
11.1. Dimension of Tape
11.2. Dimensions of Reel
(unit: mm)

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11.3. Taping Diagrams
[1] Feeding Hole : As specified in (1)
[2] Hole for chip : As specified in (1)
[3] Cover tape : 62μMin thickness
[4] Base tape : As specified in (1)
11.4. Leader and Tail Tape
Feeding Hole
Chip
Feeding Direction
[2]
[3]
[4]
[3] [1]

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-The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled
toward the user.
-The cover tape and base tape are not adhered at no components area for 250mm Min.
-Tear off strength against pulling of cover tape: 5N Min.
-Packaging unit : 800 pcs/ reel
-Material
Base tape : Plastic
Reel : Plastic
Cover tape, cavity tape and reel are made the anti-static processing.
-Peeling of force: 1.3N max. in the direction of peeling as shown below.
-Packaging (Humidity proof Packing)
Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant
and the humidity indicator.
165 to 180 °
0.7 N max.
Base tape
Cover tape
1.3 N max.

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12. NOTICE
12.1. Storage Conditions:
Please use this product within 6month after receipt.
- The product shall be stored without opening the packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)
- The product left more than 6months after reception, it needs to be confirmed the solderbility before
used.
- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).
- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp
object and dropping the product, shall not be applied in order not to damage the packing materials.
This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)
- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be
used within 168hours.
- When the color of the indicator in the packing changed, the product shall be baked before soldering.
Baking condition: 125+5/-0deg.C, 24hours, 1time
The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and
Cover Tape) are not heat-resistant.
12.2. Handling Conditions:
Be careful in handling or transporting products because excessive stress or mechanical shock may
break products.
Handle with care if products may have cracks or damages on their terminals, the characteristics of
products may change. Do not touch products with bear hands that may result in poor solder ability and
destroy by static electrical charge.
12.3. Standard PCB Design (Land Pattern and Dimensions):
All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern
should be provided between IN and OUT terminals. Please refer to the specifications for the standard
land dimensions.

Preliminary Specification Number : SP-ZZ1WL-857
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Preliminary & Confidential
< Specification may be changed by Murata without notice >
Murata(China) Investment Co., Ltd.
The recommended land pattern and dimensions is as Murata's standard. The characteristics of products
may vary depending on the pattern drawing method, grounding method, land dimensions, land forming
method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the
characteristics in the actual set. When using non-standard lands, contact Murata beforehand.
12.4. Notice for Chip Placer:
When placing products on the PCB, products may be stressed and broken by uneven forces from a
worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to
follow the specifications for the maintenance of the chip placer being used. For the positioning of
products on the PCB, be aware that mechanical chucking may damage products.
12.5. Soldering Conditions:
The recommendation conditions of soldering are as in the following figure.
When products are immersed in solvent after mounting, pay special attention to maintain the
temperature difference within 100 °C. Soldering must be carried out by the above mentioned
conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.
Contact Murata before use if concerning other soldering conditions.
Reflow soldering standard conditions(Example)
Within
120s
Pre-
heating
time(s)
220 deg.C
Within
60s
Cooling down
Slowly
180 deg.C
150 deg.C
235 to 245 deg.C
Within 3s