NAD C660 User manual

MODEL : C660
SERVICE MANUAL
NAD
SERVICE MANUAL C660
C660
C660
SERVICE MANUAL
AUDIO CD RECORDER
AUDIO CD RECORDER
AUDIO CD RECORDER
NAD ELECTRONICS INTERNATIONAL
TORONTO
NAD 2001
NAD

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CONTENTS
SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . 2
SERVICING PRECAUTIONS . . . . . . . . . . . . . . . . 3
ESD PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . 5
TROUBLESHOOTING GUIDE . . . . . . . . . . . . . . . 6
OVERALL WIRING DIAGRAM . . . . . . . . . . . . . . 29
BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . 31
CIRCUIT DIAGRAMS . . . . . . . . . . . . . . . . . . . . . 34
PRINTED CIRCUIT BOARD DIAGRAMS . . . . . . . 41
EXPLODED VIEW . . . . . . . . . . . . . . . . . . . . . . . 47
REPLACEMENT PARTS LIST . . . . . . . . . . . . . . 50
SPECIFICATIONS
Signal Format
Playback Sampling Frequency 44.1 kHz
D/A Conversion 96kHz, Multi-Bit Delta-Sigma Conversion
Oversampling 128 Times
Playback Specifications
Frequency Response 2Hz – 20,050Hz
Playback S/N 100dB
Playback Dynamic Range 95dB
Playback THD 0.005% / –88dB
Analog Audio Output 2V RMS, ± 2dB (1KHz 0dB)
Digital-Coaxial Output 0.5 Vpp/75Ω
Headphone Output 0.5V RMS/32ΩLoad (1KHz 0dB)
Record Specifications
Digital Dubbing Mode (X1/X2/X4) Equal to source
Digital Input Sample Rate 32kHz ~ 96kHz
Signal/Noise Ratio - Analog 84dB
Signal/Noise Ratio - External (Sourse) source-10dB
Dynamic Range 87dB
THD 0.005%/-85dB
Analog Input Sensitivity 300 mV RMS 47kΩ= 0dB
Digital Inputs (Direct Recording) 44.1kHz, ± 100 ppm/min.
General
Power Requirement 100~240V AC, 50/60Hz
Power Consumption 28 Watts
Dimensions
Width 17.3"/440mm
Height 4.4"/112mm
Depth 13.9"/354mm
Weight 14.3 lb/6.5 kg

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SERVICING PRECAUTIONS
NOTES REGARDING HANDLING OF THE PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and
impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction
and/or damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason
the adjustment point and installation
screws should absolutely never be touched.
4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used
for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cot-
ton swab should be used, taking care not to distort this.
6) Never attempt to disassemble the pick-up.
Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do
not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of
this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
Storage in conductive bag
NEVER look directly at the laser beam, and don’t let contact
fingers or other exposed skin.
Magnet
How to hold the pick-up
Conductive Sheet
Cotton swab
Pressure
Pressure
Drop impact

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NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These compo-
nents are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage,
components can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must
be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong
magnetism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1MΩ)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent
static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Resistor
(1 Mohm) Conductive
Sheet
Resistor
(1 Mohm)
Armband

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ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components com-
monly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated cir-
cuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-
face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static"
can generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL
OTHER SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen-
erate static electricity sufficient to damage an ESD device).