Oki MSM7731-02 User manual

FEBL7731-02-02
User’s Manual
for
MSM7731-02 Evaluation Board
Oki Electric Industry Co., Ltd.
Ver. 2.0
February 2000
1

FEBL7731-02-02
NOTICE
1. The information contained herein can change without notice owing to product and/or technical
improvements. Before using the product, please make sure that the information being referred to is up-to-
date.
2. The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product,
please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3. When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the
specified maximum ratings or operation outside the specified operating range.
5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained
herein. No responsibility is assumed by us for any infringement of a third party’s right which may result
from the use thereof.
6. The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires
special or enhanced quality and reliability characteristics nor in any system or application where the failure
of such system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices,
aerospace equipment, nuclear power control, medical equipment, and life-support systems.
7. Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2000 Oki Electric Industry Co., Ltd.

FEBL7731-02-02
CONTENTS
MSM7731-02 EVALUATION KIT......................................................................................................1
1. GENERAL DESCRIPTIONS .........................................................................................................1
1.1 LSI Socket and MSM7731-02GA LSI......................................................................................................... 1
1.2 Speaker Amplifier LSI (LM4861 manufactured by National Semiconductor)............................................. 1
1.3 Microphone Input Circuit............................................................................................................................. 1
1.4 Single 12 V Power Supply Pin and Ground Pin (TP1 and TP2).................................................................. 1
1.5 Various Test Pins ......................................................................................................................................... 1
1.6 Various DIP Switches .................................................................................................................................. 1
1.7 Various Toggle Switches.............................................................................................................................. 1
1.8 Various Mini-Jacks ...................................................................................................................................... 1
1.9 Variable Resistors ........................................................................................................................................ 2
1.10 On-board Microcontroller Interface Operation............................................................................................ 2
1.11 Spare Area for Additional Amplifier............................................................................................................ 2
1.12 LED Indicator............................................................................................................................................... 2
1.13 On-board Crystal.......................................................................................................................................... 2
1.14 Measurement Location for External Oscilloscope........................................................................................ 2
2. BOARD SCHEMATICS..................................................................................................................3
3. FUNCTIONAL DESCRIPTIONS ..................................................................................................3
3.1 Test Pin (TP)................................................................................................................................................ 3
3.1.1 TP1 ......................................................................................................................................................... 3
3.1.2 TP2 ......................................................................................................................................................... 3
3.1.3 TP3 ......................................................................................................................................................... 3
3.1.4 TP4 ......................................................................................................................................................... 3
3.1.5 TP5 ......................................................................................................................................................... 3
3.2 DIP Switch (DSW)....................................................................................................................................... 3
3.2.1 DSW1..................................................................................................................................................... 3
3.2.2 DSW2..................................................................................................................................................... 3
3.2.3 DSW3..................................................................................................................................................... 4
3.2.4 DSW4..................................................................................................................................................... 4
3.2.5 DSW5..................................................................................................................................................... 4
3.2.6 DSW6..................................................................................................................................................... 4
3.3 Toggle Switch (SW)..................................................................................................................................... 4
3.3.1 SW1 (PDNRST)..................................................................................................................................... 4
3.3.2 SW10 (RST)........................................................................................................................................... 4
3.3.3 SW2 to SW9 (D7 to D0) and SW14 to SW17 (A3 to A0)..................................................................... 4
3.3.4 SW18 (R/W)........................................................................................................................................... 4
3.3.5 SW19 (SET)........................................................................................................................................... 5
3.4 Mini-Jack...................................................................................................................................................... 5
3.4.1 J1 (MIC)................................................................................................................................................. 5
3.4.2 J2 (MIN)................................................................................................................................................. 5
3.4.3 J3 (SP) .................................................................................................................................................... 5
3.4.4 J4 (MOUT)............................................................................................................................................. 5
3.5 Variable Resistor (RV)................................................................................................................................. 5
3.5.1 RV1 ........................................................................................................................................................ 5
3.5.2 RV2 ........................................................................................................................................................ 5
3.5.3 RV4 ........................................................................................................................................................ 5
3.5.4 RV5 ........................................................................................................................................................ 5

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3.6 Jumper (JP) .................................................................................................................................................. 5
3.7 External Oscillator (XL2)............................................................................................................................. 6
3.8 Extra Amplifier Setting ............................................................................................................................... 6
4. HOW TO SET THE OPERATION MODE ..................................................................................8
4.1 Pin Control Mode......................................................................................................................................... 8
4.2 MCU Interface Mode Using On-board Registers......................................................................................... 8
4.3 MCU Interface Mode Using External Microcontroller ................................................................................ 9
4.4 How to Write the Control Register by Using Toggle Switches.................................................................. 11
4.5 How to Read the Control Register by Using Toggle Switches................................................................... 11
4.6 How to Set Cancellation Echo Delay Time................................................................................................ 11
4.6.1 Single EC Mode (Acoustic Echo Cancellation Mode) ......................................................................... 11
4.6.2 Dual EC Mode (Acoustic and Line Echo Cancellation Mode).............................................................12
4.7 How to Set Noise Cancellation Levels....................................................................................................... 12
4.8 How to Set Noise Canceler Pads (NCPAD1, NCPAD2)............................................................................ 13
5. HOW TO CONTROL THE EVALUATION BOARD FOR BEST QUALITY VOICE.........14
5.1 Overview.................................................................................................................................................... 14
5.2 Instruments................................................................................................................................................. 14
5.3 Control Procedure ...................................................................................................................................... 14
5.3.1 STEP 1.................................................................................................................................................. 14
5.3.2 STEP 2.................................................................................................................................................. 15
5.3.3 STEP 3.................................................................................................................................................. 15
5.3.4 STEP 4.................................................................................................................................................. 16
5.3.5 STEP 5.................................................................................................................................................. 16
6. PRECAUTIONS.............................................................................................................................17
7. CIRCUIT DIAGRAMS..................................................................................................................18
Figure 1 Board Schematic .................................................................................................................................. 18
Figure 2 Chip Connection Circuits..................................................................................................................... 19
Figure 3 Peripheral Circuits................................................................................................................................ 20

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Semiconductor User’s Manual for
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MSM7731-02 EVALUATION KIT
This kit contains one Evaluation Board (10.5 ×7 inches), one MSM7731-02GA LSI, and this User’s
Manual.
1. GENERAL DESCRIPTIONS
This is a user’s manual for OKI Noise/Echo Canceler LSI, MSM7731-02. The evaluation board is
designed for your ‘turn-key’ evaluation of the MSM7731-02 with the following features.
1.1 LSI Socket and MSM7731-02GA LSI
1.2 Speaker Amplifier LSI (LM4861 manufactured by National Semiconductor)
This enables a direct connection to a speaker with ease.
1.3 Microphone Input Circuit
This enables a direct connection to a microphone with ease.
1.4 Single 12 V Power Supply Pin and Ground Pin (TP1 and TP2)
The 12 V power supply is suitable for the evaluation in car environment, as it is available for a cigarette
lighter adapter and battery of an automobile. In the board, the single +3 V power supply is applied to the
MSM7731-02 and +5 V is to the LM4861.
1.5 Various Test Pins
Test pins are mounted on the PCB for the connection to an external telephone handset, microcontroller,
and digital interface for easy evaluation in the final application environment.
1.6 Various DIP Switches
DIP switches are mounted on the PCB for the evaluation of the Pin Control Mode of the MSM7731-02.
1.7 Various Toggle Switches
Toggle switches are mounted on the PCB for the evaluation of the MCU Interface Mode of the
MSM7731-02.
1.8 Various Mini-Jacks
Mini-jacks are mounted on the PCB for connecting a speaker and microphone on the near-end and an
external handset toward the far-end.

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1.9 Variable Resistors
There are 4 variable resistors located on the right lower side of the evaluation board. The function of each
resistor is as follows:
RV1: MIC (Microphone) level adjustment
RV2: MIN (Line input) level adjustment
RV4: SP (Speaker output) level adjustment
RV5: MOUT (Line out) level adjustment
1.10 On-board Microcontroller Interface Operation
Besides the Pin Control Mode operation, this board can evaluate the MSM7731-02 by using on-board
registers as well as an external microcontroller. The on-board register can easily be set by using toggle
switches on the PCB (MCU Interface Mode).
1.11 Spare Area for Additional Amplifier
The amplifier such as for the line out to an external telephone handset can be used as an option by using
the area of U15.
1.12 LED Indicator
On-board LEDs are used for the confirmation of the register contents.
1.13 On-board Crystal
The 19.2 MHz crystal is equipped on the board. An oscillator can be used as an option by using the socket
of XL2 (the oscillator is not included in this kit).
1.14 Measurement Location for External Oscilloscope
During the tuning process, some of the output pins of the MSM7731-02 have to be measured by using an
external oscilloscope. There are 6 points where the pins of the oscilloscope have to be set.
(1) AVFRO: Right lead of R13 resistor
(See the Board Schematic of this user manual)
(2) AGSX: Left lead of R9 resistor
(See the Board Schematic of this user manual)
(3) Pin 8 of LM4861: (See the Board Schematic of this user manual)
(4) LVFRO: Left lead of R20 resistor
(See the Board Schematic of this user manual)
(5) LGSX: Right lead of R12 resistor
(See the Board Schematic of this user manual)
(6) LOUT: Left lead of R21 resistor
(See the Board Schematic of this user manual)

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2. BOARD SCHEMATICS
Refer to Figure 1 for the MSM7731-02 Evaluation Board Schematic, Figure 2 for Chip Connection
Circuits and Figure 3 for Peripheral Circuits.
3. FUNCTIONAL DESCRIPTIONS
Refer to Table 1 for analog/digital interface mode setting with an external handset, Table 2 for general
functions of switches and pins.
3.1 Test Pin (TP)
3.1.1 TP1
TP1 located at the right upper corner of the evaluation board is a single DC +12 V power supply pin. The
necessary voltages for the components on the board are automatically regenerated.
3.1.2 TP2
TP2 located at the right upper corner of the evaluation board is a ground pin for the above-mentioned DC
+12 V power supply. Connect it to the ground level.
3.1.3 TP3
TP3 located at the left upper corner of the evaluation board consists of digital interface pins. These pins
are used when a handset has a digital interface to the evaluation board (PCMO, PCMI), or when you want
to transmit digital voice data of telephone conversation down to external memory or to other directions for
the purpose of recording and playback (PCME0, PCMEI).
3.1.4 TP4
TP4 located at the left upper corner of the evaluation board consists of external microcontroller interface
pins. When you want to evaluate your microcontroller, connect the appropriate pins of the
microcontroller to these pins. When the microcontroller interface is used, set DSW6 (DEN, DIN and
EXCK) to “OFF”.
3.1.5 TP5
TP5 located at the right lower corner of the evaluation board consists of analog interface pins for Line in
and out. These pins are connected to the mini-jacks of J2 (MIN) and J4 (MOUT) on the evaluation board
and the jacks could be used as alternative interface of the same function..
3.2 DIP Switch (DSW)
DSW is used for the pin setting in the Pin Control Mode.
3.2.1 DSW1
DSW1 located at the upper middle of the evaluation board consists of switches for manufacturer’s LSI test
pins (TEST1, 2, 3 & 4) and noise canceler level control (NCSEL2). Always set the switches (TEST1, 2,
3 & 4) to “0”. For switch No. 5 (NCSEL2), refer to “Table 2-1: DIP Switch Settings” or the “Pin
Functional Description” of the MSM7731-02 Data Sheet. When evaluating the microcontroller or on-
board register, set switch No. 5 to “0”.
3.2.2 DSW2
DSW2 located at the upper middle of the evaluation board consists of switches for mode selection. Refer
to “Table 2-1: DIP Switch Settings or the “Pin Functional Description” of the MSM7731-02 Data Sheet
for details. When evaluating the microcontroller or on-board register, set the switches other than
switches No. 1 (CLKSEL) and No. 5 (SYNCSEL) to “0”.

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3.2.3 DSW3
DSW3 located at the lower middle of the evaluation board consists of switches for acoustic echo canceler
mode control (AGC, AATT, AHD, and ATHR), noise canceler input/output gain adjustment (NCPAD2),
noise cancellation level control (NCSEL1), and slope filter mode control (SLPTHR). Refer to “Table 2-
1: DIP Switch Settings” or the “Pin Functional Description” of the MSM7731-02 Data Sheet for details.
When evaluating the microcontroller or on-board register, set all the switches to “0”.
3.2.4 DSW4
DSW4 located at the lower middle of the evaluation board consists of switches for line echo canceler
mode control (LGC, LATT, LHD, and LTHR), and noise canceler input/output gain adjustment
(NCPAD1). Refer to “Table 2-1: DIP Switch Settings” or the “Pin Functional Description” of the
MSM7731-02 Data Sheet for details. When evaluating the microcontroller or on-board register, set all
the switches to “0”.
3.2.5 DSW5
DSW5 located at the lower middle of the evaluation board consists of switches for gain adjustment control
and mute of voice data (TPADn for the transmit side, and RPADn for the receive side). Refer to “Table
2-1: DIP Switch Settings” or the “Pin Functional Description” of the MSM7731-02 Data Sheet for details.
When evaluating the microcontroller or on-board register, set all the switches to “0”.
3.2.6 DSW6
DSW6 located at the upper middle of the evaluation board consists of switches to select the mode of the
evaluation board. The external microcontroller mode is selected when all the switches are set to “OFF”,
and the on-board register mode or pin control mode is selected when all the switches are set to “ON”.
3.3 Toggle Switch (SW)
Toggle switches are used for the register setting in the on-board register mode and external MCU mode.
SW1 and SW10 are also used in the pin control mode for the reset functions.
3.3.1 SW1 (PDNRST)
SW1 is a switch for power down reset. The evaluation board goes into a power down reset mode when
the switch is pulled up once. For detailed explanation, refer to the “Pin Functional Description” of the
MSM7731-02 Data Sheet.
3.3.2 SW10 (RST)
SW10 is a switch for the reset of all internal coefficients of the echo and noise canceler.
For detailed explanation, refer to the “Pin Functional Description” of the MSM7731-02 Data Sheet.
3.3.3 SW2 to SW9 (D7 to D0) and SW14 to SW17 (A3 to A0)
SW2 to SW9 (D7 to D0) and SW14 to SW17 (A3 to A0) are switches for setting the contents and
addresses of the control register. SW14 to SW17 (A3 to A0) are used to set the control register address
and SW2 to SW9 (D7 to D0) are used to set the addresses of the designated internal data memory and the
contents of each mode. Those contents and addresses will not be valid till SW19 (SET) is pressed. For
detailed explanation, refer to the Functional Description - Control Registers of the MSM7731-02 Data
Sheet.
3.3.4 SW18 (R/W)
This is a switch to select the read and write mode of control registers. Set SW18 to “W” to write the
address and register contents into the MSM7731-02 which is set by the toggle switches of SW2 to SW9
(D7 to D0) and SW14 to SW17 (A3 to A0). Set SW18 to “R” to read the written data of the address and
register contents out of the MSM7731-02. The contents of the MSM7731-02 register addressed by the
toggle switches of SW2 to SW9 (D7 to D0) are read out and displayed on the LEDs (LED2 to LED9) at
the right bottom of the evaluation board. For detailed operations, refer to Sections 4-4 and 4-5 of this
manual.

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3.3.5 SW19 (SET)
This switch has an “enter” function. After setting the toggle switches, press this switch to execute the read
or write operation.
3.4 Mini-Jack
3.4.1 J1 (MIC)
MIC is a jack for acoustic side microphone input. This jack is connected to AIN of the MSM7731-02.
For the detailed schematic between MIC and AIN, refer to Figure 3-2 of this user’s manual.
3.4.2 J2 (MIN)
MIN is a jack for line side analog voice input. The jack is connected to LIN of the MSM7731-02 and
MIN pin of TP5 on this evaluation board. For the detailed schematic between MIN and LIN, refer to
Figure 3-1 of this user’s manual.
3.4.3 J3 (SP)
SP is a jack for acoustic side speaker output. This jack is connected to the on-board speaker amplifier
LM4861 manufactured by National Semiconductor at U13 (left side of the demonstration board). The
input pin of the LM4861 is connected to AOUT of the MSM7731-02. For the detailed schematic between
SP and AOUT, refer to Figure 3-3 of this user’s manual.
3.4.4 J4 (MOUT)
MOUT is a jack for line side analog voice output. The jack is connected to LOUT of the MSM7731-02
and MOUT pin of TP5 on this evaluation board. For the detailed schematic between MOUT and LOUT,
refer to Figure 3-1 of this user’s manual.
3.5 Variable Resistor (RV)
3.5.1 RV1
RV1 is a variable resistor to control the input gain from a microphone through the J1 (MIC) mini-jack. The
MIC jack is connected to the AIN pin of the MSM7731-02. For the detailed schematic between AIN and
MIC, refer to Figure 3-2 of this user’s manual.
3.5.2 RV2
RV2 is a variable resistor to control the input gain from analog line input from the handset side through the
J2 (MIN) mini-jack or MIN pin of TP5. The MIN jack and MIN pin are connected to the LIN pin of the
MSM7731-02. For the detailed schematic between MIN and LIN, refer to Figure 3-1 of this user’s
manual.
3.5.3 RV4
RV4 is a variable resistor to control the output gain for speaker output through the J3 (SP) mini-jack.
The SP jack is connected to the AOUT pin of the MSM7731-02 through the LM4861 speaker amplifier.
For the detailed schematic between SP and AOUT, refer to Figure 3-3 of this user’s manual.
3.5.4 RV5
RV5 is a variable resistor to control the output gain of analog line output into the handset side through the
MOUT mini-jack or MOUT pin of TP5. The MOUT jack is connected to the LOUT pin of the
MSM7731-02. For the detailed schematic between MOUT and LOUT, refer to Figure 3-1 of this user’s
manual.
3.6 Jumper (JP)
JP1 and JP2 located at the upper left corner are switches for a digital interface. In both digital (TP3) and
analog (MIN, MOUT) interface modes, set both JP1 and JP2 to “1 (pull-up state)” as far as PCMSEL

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(DSW2) is set to “1”, and set both JP1 and JP2 to “0 (pull-down state)” as far as PCMSEL (DSW2) is set
to “0”.
Table 1 Jumper Settings
Mode JP1 JP2
PCMSEL = 0 Set to “0” Set to “0”
Analog and Digital
Interface Mode PCMSEL = 1 Set to “1” Set to “1”
3.7 External Oscillator (XL2)
When an external oscillator is used, insert the oscillator into the socket of XL2. The crystal XL1,
capacitors C7 and C8, and resistor R5 have to be removed.
3.8 Extra Amplifier Setting
This evaluation board can be provided with an additional amplifier by using U15 which is used for
connecting the amplifier such as to an external telephone handset. The pin 4 of U15 is connected to GND
and the pin 8 is to a single +5 V power supply. Other pins of U15 are open and can be connected by
using a jumper line at your disposal.
Table 2-1 DIP Switch Settings
Refer to the “Pin Functional Description” of the MSM7731-02 data sheet for detailed explanation.
SW Name Parameter Name Set to “1” Set to “0”
1-4 TEST 1, 2, 3 & 4 — Always set to 0
DSW1 5 NCSEL2 Noise cancellation level select. Refer to Table 2-2 for details.
1 CLKSEL External clock mode Internal clock mode
2 ECSEL Single EC mode Dual EC mode
3 MCUSEL MCU interface disabled MCU interface enabled
4 PCMSEL µ-law PCM mode 16-bit linear mode
5 SYSNCSEL Short frame sync mode Normal sync mode
7 GLPADTHR GLPAD active GLPAD inactive (through mode)
DSW2
8 LINEEN Line side codec power down Line side codec normal operation
1 SLPTHR Slope filter inactive Slope filter active
2 NCSEL1 Noise cancellation level select. Refer to Table 2-2 for details.
4 ATHR Acoustic echo canceler inactive Acoustic echo canceler active
5 AHD Acoustic howling detector inactive Acoustic howling detector active
6 NCPAD2 Noise canceler input/output gain adjustment. Refer to Table 2-3.
7 AATT Setting acoustic attenuation 6 dB Setting acoustic attenuation 12 dB
DSW3
8 AGC Acoustic gain control inactive Acoustic gain control active
1 LTHR Line echo canceler inactive Line echo canceler active
2 LHD Line howling detector inactive Line howling detector active
3 NCPAD1 Noise canceler input/output gain adjustment. Refer to Table 2-3.
4 LATT Line attenuation function inactive Line attenuation function active
DSW4
5 LGC Line gain control inactive Line gain control active
DSW5 1-8 RPAD4-1, TPAD4-1 Transmitting and receiving gain adjustment.
Refer to Table 2-4.