ON Semiconductor NCL30073LED4GEVB User manual

©Semiconductor Components Industries, LLC, 2017
July, 2017 −Rev. 0
1Publication Order Number:
EVBUM2505/D
NCL30073LED4GEVB
15 W High Power Factor
LED Driver Evaluation Board
User'sManual
Overview
This manual covers the specification, theory of operation,
testing and construction of the NCL30073LED4GEVB
evaluation board. The NCL30073 board demonstrates a
15 W high PF buck boost LED driver for a typical downlight
application.
Key Features
The key features of this evaluation board include:
•Low Parts Count
•TRIAC Dimmer Compatible
•High Power Factor
•Integrated Fault Protection
♦Over Temperature on board (a PCB mounted PTC)
♦Output Over Current
♦Output Over Voltage
Table 1. SPECIFICATIONS
Input voltage 207 −253 V ac
Line Frequency 50 Hz
Power Factor (100% Load) 0.9Min
Output Voltage 72 V dc
Output Ripple 75% Pk −Pk
Output Current 200 mA dc ±5%
Efficiency 88.5% Typ.
Start Up Time < 250 msec Typ.
Figure 1. Evaluation Board Photo
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EVAL BOARD USER’S MANUAL

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THEORY OF OPERATION
Power Stage
The power stage is a flying buck boost design. In this
configuration, drain of the switching FET is connected to the
rectified HVDC and the source is switching. This has many
benefits:
1. Direct output current sensing
2. Direct output voltage sensing
3. No Aux winding needed
The power stage operates as a fixed frequency DCM
power stage. The DCM allows for no forced commutation
of the output diode for good EMI performance. The fixed
current/fixed frequency provides for a constant power
control over a large portion of the input waveform. The
resistor divider of R27 and R29 provides some wave shaping
to improve the power factor. The input current waveform is
made to be square for maximum TRIAC dimmer
compatibility.
Figure 2.
Output Voltage Sense and Vcc generation
Dout1 is in parallel with the output during the off time of
the FET and stores energy in Cvcc. R36 and R37 divide the
output voltage and Q2 buffers it to provide Vcc power to the
controller. Since the divider is a fixed ratio, Vcc is a fixed
percentage of the output voltage. When Vcc rises above
25 V, the controller detects and OVP fault. The maximum
output voltage is set by adjusting the ratio of R36/R37.
In cases where the output has a lot of ripple current and the
LED has high dynamic resistance, the peak output voltage
can be much higher than the average output voltage. The
inductor winding will charge the Cvcc to the peak of the
output voltage which may trigger the OVP sooner than
expected so in this case the peak voltage of the LED string
is critical.
Protection
Thermal Protection
Rtco is a PTC connected between the CS pin and Rsens.
The controller creates and internal signal current from the
CS pin. As the resistance of Rtco becomes larger with
temperature, the signal level at the CS pin increases causing
the current to foldback with temperature.
Programmable OVP
R36 and R37 set Vcc as a fixed percentage of the output
voltage. The OVP threshold on the controller is 25 V. So the
ratio of R36/R37 is set to trip the Vcc OVP threshold at about
100 V output.
Overcurrent Protection
The controller has built in overcurrent limits.
Output Current
The output current is set by the value of Rsens. It’s
possible to adjust the output current by changing Rsens.
TRIAC Dimming Compatibility
The EMI filter components are selected to provide
optimum damping of the EMI filter to eliminate ringback of
the input current which will lead to loss of hold current in the
dimmer. The square nature of the input current makes the
best case for TRIAC holding current over the line cycle
while still maintaining power factor above 0.9.

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SCHEMATIC
Figure 3. Input Circuit
AC_L 1
AC_N 1
+HVDC_iso
+
−
AC1
AC2
D4
MB6S
C4
100nF 400V C6
33nF 400V
RV1
MOV 250V
L1
10mH
Rdamp
680
F2
0A5
Figure 4. Main Circuit
Q2
MMBT5551LT1G
LED−
1
LED+
1
+HVDC_iso
L5
1.2mH
Rsens
1.13
CVcc
10uF 100V
Dout
MURA160T3G
Dout1
MURA160T3G
C7
1uF 50V
t
Rtco
680 PTC
Cout
100uF100V
Q1
NDD60N900U1T4G
R15
143k
R38
220k
R29
412k
C8
10nF
R37
100k
R36
301k
R27
10k
U2
NCL30073
Gnd 4
Gdrv 5
Vcc 6
CS
3
OPP
1
FB
2

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BILL OF MATERIAL
Table 2. BILL OF MATERIAL
Refer-
ence Qty Part Distributor
Distributor
Part Number Manufacturer
Manufacturer
Part Number
Substitution
Allowed
CVcc 1 10 mF 100 V Rubycon 100YXJ10M5X11 Digikey 1189−2150−ND Yes
Cout 1 100 mF 100 V Nichicon UVK2A101MPD Digikey UVK2A101MPD−ND Yes
C4 1 100 nF 400 V Faratronic C212G104−4B****+++ Faratronic C212G104−4B****+++ Yes
C6 1 33 nF 400 V Faratronic C212G333−3A****+++ Faratronic C212G333−3A****+++ Yes
C7 1 1 mF 50 V Yageo CC0805KKX7R9BB1
05
Digikey 311−1886−1−ND Yes
C8 1 10 nF Yageo CC0603KRX7R9BB1
03
Digikey 311−1085−1−ND Yes
Dout1,
Dout
2 MURA160T3G ON
Semiconductor
MURA160T3G ON
Semiconductor
MURA160T3G No
D4 1 MB6S MCC MB6S Digikey MB4S−TPMSCT−ND Yes
F2 1 0A5 Littelfuse 0263.500WRT1L Digikey F1999CT−ND Yes
L1 1 10 mH Wurth 744772103 Digikey 732−3791−ND Yes
L5 1 1.2 mH Wurth 750316243 Wurth 750316243 Yes
Q1 1 NDD60N900U1T4G ON
Semiconductor
NDD60N900U1T4G ON
Semiconductor
NDD60N900U1T4G No
Q2 1 MMBT5551LT1G ON
Semiconductor
MMBT5551LT1G ON
Semiconductor
MMBT5551LT1G No
RV1 1MOV 250V Littelfuse V390ZA05P Digikey F3361−ND Yes
Rdamp 1 680 Yageo RSF200JB−73−680R Digikey 680W−2−ND Yes
Rsens 1 1.13 Yageo RC1206FR−071R13L Digikey 311−1.13FRCT−ND Yes
Rtco 1 680 PTC Epcos B59721A90A62 Digikey 495−4312−1−ND Yes
R15 1 143k Yageo RC1206FR−07143KL Digikey 311−143KFRCT−ND Yes
R27 1 10k Yageo RC0603FR−0710k0L Digikey 311−10.0KHRCT−ND Yes
R29 1 412k Yageo RC1206FR−07412KL Digikey 311−412KFRCT−ND Yes
R36 1 301k Yageo RC0603FR−07301KL Digikey 311−301KHRCT−ND Yes
R37 1 100k Yageo RC0603FR−07100KL Digikey 311−100KHRCT−ND Yes
R38 1 220k Yageo RC1206FR−07220KL Digikey 311−220KFRCT−ND Yes
U2 1 NCL30073 ON
Semiconductor
NCL30073 ON
Semiconductor
NCL30073 No
NOTE: All components to comply with RoHS 2002/95/EC

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GERBER VIEWS
Figure 5. Top Side PCB

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Figure 6. PCB Outline
Circuit Board Fabrication Notes
1. Fabricate per IPC−6011 and IPC6012. Inspect to
IPA−A−600 Class 2 or updated standard.
2. Printed Circuit Board is defined by files listed in
fileset.
3. Modification to copper within the PCB outline is
not allowed without permission, except where
noted otherwise. The manufacturer may make
adjustments to compensate for manufacturing
process, but the final PCB is required to reflect the
associated gerber file design ±0.001 in. for etched
features within the PCB outline.
4. Material in accordance with IPC−4101/21, FR4,
Tg 125°C min.
5. Layer to layer registration shall not exceed
±0.004 in.
6. External finished copper conductor thickness shall
be 0.0026 in. min. (ie 2oz)
7. Copper plating thickness for through holes shall be
0.0013 in. min. (ie 1oz)
8. All holes sizes are finished hole size.
9. Finished PCB thickness 0.062 in.
10. All un-dimensioned holes to be drilled using the
NC drill data.
11. Size tolerance of plated holes: ±0.003 in. :
non−plated holes ±0.002 in.
12. All holes shall be ±0.003 in. of their true position
U.D.S.
13. Construction to be SMOBC, using liquid photo
image (LPI) solder mask in accordance with
IPC−SM−B40C, Type B, Class 2, and be green in
color.
14. Solder mask mis-registration ±0.004 in. max.
15. Silkscreen shall be permanent non−conductive
white ink.
16. The fabrication process shall be UL approved and
the PCB shall have a flammability rating of
UL94V0 to be marked on the solder side in
silkscreen with date, manufactures approved logo,
and type designation.
17. Warp and twist of the PCB shall not exceed
0.0075 in. per in.
18. 100% electrical verification required.
19. Surface finish: electroless nickel immersion gold
(ENIG)
20. RoHS 2002/95/EC compliance required.

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ECA PICTURES
Figure 7. Top View

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TEST PROCEDURE
Equipment Needed
•AC Source – 200 to 260 V ac 50 Hz Minimum 100 W
capability
•AC Wattmeter – 100 W Minimum, True RMS Input
Voltage, Current, Power Factor, and THD 0.2%
accuracy or better
•DC Voltmeter – 300 V dc minimum 0.1% accuracy or
better
•DC Ammeter – 1 A dc minimum 0.1% accuracy or
better
•LED Load – 70 V – 80 V @ 110 mA
Test Connections
1. Connect the LED Load to the red(+) and black(−)
leads through the ammeter shown in Figure 10.
Caution: Observe the correct polarity or the
load may be damaged.
2. Connect the AC power to the input of the AC
wattmeter shown in Figure 8.Connect the white
leads to the output of the AC wattmeter
3. Connect the DC voltmeter as shown in Figure 8.
Figure 8. Test Set Up
AC Power
Source
AC
Wattmeter
UUT DC Ammeter LED Test
Load
DC Voltmeter
Note: Unless otherwise specified, all voltage measurements are taken at the terminals of the UUT.
Functional Test Procedure
1. Set the LED Load for 75 V output.
2. Set the input power to 230 V 50 Hz.
Caution: Do not touch the ECA once it is
energized because there are hazardous voltages
present.
Regulation
230 V / Max Load
Table 3.
Output Current Output Power Power Factor THD
207 V
230 V
253 V
Efficiency +Vout Iout
Pin 100%

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TEST DATA
Figure 9. Power Factor Over Line
Figure 10. THD Over Line

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Figure 11. Efficiency
Figure 12. Regulation Over Line

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Figure 13. Start Up with AC Applied 230 V
Figure 14. Output Ripple 75% Pk −Pk

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Figure 15.
Figure 16. Thermal Image SMT Side
Q1
R15, R29, R38

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