Panasonic KX-FP215 User manual

© Panasonic Communications Co., Ltd. 2009. Unau-
thorized copying and distribution is a violation of law.
ORDER NO. KMF0902226CE
F7
Compact Plain Paper Fax with Digital Answering System
Model No. KX-FP215
(for U.S.A.)

2
KX-FP215
TABLE OF CONTENTS PAGE PAGE
1 Safety Precautions -----------------------------------------------5
1.1. For Service Technicians----------------------------------5
1.2. AC Caution---------------------------------------------------5
1.3. Personal Safety Precautions----------------------------6
1.3.1. Moving Sections of the Unit-------------------------6
1.3.2. Live Electrical Sections ------------------------------6
1.4. Service Precautions ---------------------------------------7
1.4.1. Precautions to Prevent Damage from
static Electricity ----------------------------------------7
2Warning--------------------------------------------------------------8
2.1. About Lead Free Solder (PbF: Pb free) --------------8
2.1.1. Suggested PbF Solder-------------------------------8
2.2. Insulation Resistance Test-------------------------------9
2.3. Battery Caution ---------------------------------------------9
2.4. Discarding of P. C. Board --------------------------------9
3 Specifications ----------------------------------------------------10
4 General/Introduction------------------------------------------- 11
4.1. Optional Accessories------------------------------------ 11
5Features------------------------------------------------------------ 11
6 Technical Descriptions----------------------------------------12
6.1. Connection Diagram-------------------------------------12
6.2. General Block---------------------------------------------13
6.2.1. General Block Diagram----------------------------14
6.3. Control Section -------------------------------------------15
6.3.1. Block Diagram----------------------------------------15
6.3.2. Memory Map------------------------------------------16
6.3.3. ASIC (IC501) -----------------------------------------17
6.3.4. Flash Memory (IC506) -----------------------------20
6.3.5. Dynamic RAM (IC503)-----------------------------20
6.3.6. Reset Circuit (Watch dog timer) -----------------21
6.3.7. RTC Backup Circuit---------------------------------22
6.3.8. Supervision Circuit for the Thermal Head
Temperature ------------------------------------------23
6.4. Facsimile Section ----------------------------------------24
6.4.1. Image Data Flow During Facsimile
Operation----------------------------------------------24
6.4.2. Block Diagram----------------------------------------25
6.4.3. Thermal Head----------------------------------------26
6.4.4. Scanning Block --------------------------------------28
6.4.5. Stepping Motor Drive Circuit----------------------29
6.5. Sensors and Switches ----------------------------------31
6.5.1. Document Top Sensor (SW351)-----------------32
6.5.2. Document Set Sensor (SW352)-----------------32
6.5.3. Paper Top Sensor (SW1001)---------------------33
6.5.4. Cover Open Sensor (SW1001) ------------------33
6.5.5. Film End Sensor (SW1003)-----------------------34
6.5.6. Motor Position Sensor (SW1004) ---------------34
6.5.7. Hook Switch (SW1501)----------------------------34
6.6. Modem Section-------------------------------------------35
6.6.1. Function------------------------------------------------35
6.6.2. Modem Circuit Operation--------------------------41
6.7. NCU Section-----------------------------------------------42
6.7.1. General------------------------------------------------ 42
6.7.2. EXT. TEL. Line Relay (RLY101)----------------- 42
6.7.3. Bell Detection Circuit------------------------------- 42
6.7.4. Pulse Dial Circuit and ON/OFF Hook
Circuit-------------------------------------------------- 42
6.7.5. Line Amplifier and Side Tone Circuit----------- 43
6.7.6. Auto Disconnect Circuit --------------------------- 43
6.7.7. Calling Line Identification Circuit---------------- 44
6.8. ITS (Integrated telephone System) and
Monitor Section------------------------------------------- 45
6.8.1. General------------------------------------------------ 45
6.8.2. Speakerphone Circuit------------------------------ 45
6.8.3. Handset Circuit-------------------------------------- 45
6.8.4. Monitor Circuit for Each Signals----------------- 45
6.9. Operation Board Section ------------------------------ 46
6.10. LCD Section----------------------------------------------- 47
6.11. Power Supply Board Section ------------------------- 48
7 Location of Controls and Components ----------------- 51
7.1. Overview--------------------------------------------------- 51
7.2. Control Panel --------------------------------------------- 51
8 Installation Instructions -------------------------------------- 52
8.1. Installation Space---------------------------------------- 52
8.2. Connections----------------------------------------------- 53
8.3. Installing the Ink Film ----------------------------------- 53
8.4. Installing the Paper Tray------------------------------- 55
8.5. Paper Support-------------------------------------------- 55
8.6. Installing the Recording Paper ----------------------- 56
9 Operating Instructions---------------------------------------- 57
9.1. Setting Your Logo---------------------------------------- 57
10 Test Mode --------------------------------------------------------- 58
10.1. DTMF Signal Tone Transmit Selection------------- 59
10.2. Button Code Table--------------------------------------- 60
10.3. Print Test Pattern ---------------------------------------- 61
11 Service Mode----------------------------------------------------- 62
11.1. Programing and Lists----------------------------------- 62
11.1.1. Operation --------------------------------------------- 62
11.1.2. Operation Flow -------------------------------------- 62
11.1.3. Service Function Table ---------------------------- 63
11.1.4. Memory Clear Specification---------------------- 65
11.2. The Example of the Printed List --------------------- 66
11.2.1. User Mode-------------------------------------------- 66
11.2.2. Service Mode Settings ---------------------------- 67
11.2.3. History ------------------------------------------------- 68
12 Troubleshooting Guide--------------------------------------- 70
12.1. Troubleshooting Summary ---------------------------- 70
12.1.1. Precautions------------------------------------------- 70
12.2. Error Messages-Display ------------------------------- 71
12.3. Error Messages-Report -------------------------------- 73
12.3.1. Journal Report--------------------------------------- 73
12.3.2. Special Service Journal Report------------------ 82
12.3.3. Communication Section--------------------------- 86
12.4. Remote Programming---------------------------------- 95

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KX-FP215
12.4.1. Entering the Remote Programming Mode
and Changing Service Codes --------------------95
12.4.2. Program Mode Table--------------------------------96
12.5. Troubleshooting Details---------------------------------98
12.5.1. Outline--------------------------------------------------98
12.5.2. Starting Troubleshooting---------------------------98
12.5.3. Troubleshooting Items Table----------------------99
12.5.4. ADF (Auto Document Feed) Section ---------101
12.5.5. Digital Board Section------------------------------114
12.5.6. Analog Board Section ----------------------------121
12.5.7. Digital Speakerphone-----------------------------123
12.5.8. Power Supply Board Section -------------------125
12.5.9. Operation Panel Section-------------------------128
12.5.10. Sensor Section-------------------------------------129
12.5.11. CIS (Contact Image Sensor) Section---------131
12.5.12. Thermal Head Section----------------------------132
13 Service Fixture & Tools--------------------------------------133
14 Disassembly and Assembly Instructions -------------134
14.1. General Section-----------------------------------------134
14.2. Disassembly Flowchart -------------------------------135
14.2.1. Upper Cabinet Section ---------------------------135
14.2.2. Lower Cabinet Section ---------------------------135
14.2.3. Back Cover Section -------------------------------136
14.2.4. Operation Panel Section-------------------------136
14.3. Disassembly Procedure-------------------------------137
14.3.1. How to Remove the Image Sensor (CIS)----137
14.3.2. How to Remove the Thermal Head -----------138
14.3.3. How to Remove the Bottom Frame -----------140
14.3.4. How to Remove the P.C. Boards and
Speaker ----------------------------------------------141
14.3.5. How to Remove the Power Supply Board
and AC cord-----------------------------------------142
14.3.6. How to Remove the Gear Block and
Separation Roller ----------------------------------143
14.3.7. How to Remove the Gears, Motors and
Arms of the Gear Block --------------------------144
14.3.8. How to Remove the Handset Cradle and
Hook Switch Board--------------------------------146
14.3.9. How to Remove the Back Cover---------------147
14.3.10. How to Remove the Platen Roller and
Lock Lever-------------------------------------------148
14.3.11. How to Remove the Pickup Roller-------------150
14.3.12. How to Remove the Operation Panel --------151
14.3.13. How to Remove the Operation Board and
LCD----------------------------------------------------152
14.3.14. How to Remove the Separation Holder
and Exit Roller--------------------------------------153
14.3.15. Installation Position of the Lead Wires -------154
15 Maintenance-----------------------------------------------------158
15.1. Maintenance Items and Component Locations -158
15.1.1. Outline------------------------------------------------158
15.1.2. Component Locations ----------------------------158
15.2. Gear Section---------------------------------------------160
15.2.1. Mode Selection-------------------------------------160
15.2.2. Mode Operation------------------------------------161
15.2.3. Mechanical Movements in the Main
Operations (transmitting documents,
receiving faxes and copying) -------------------164
15.3. Jams-------------------------------------------------------167
15.3.1. Recording Paper Jams---------------------------167
15.3.2. Document Jams - sending-----------------------168
15.4. Cleaning-------------------------------------------------- 169
15.4.1. Document feeder/recording paper feeder/
scanner glass cleaning -------------------------- 169
15.4.2. Thermal Head Cleaning ------------------------- 170
16 Miscellaneous-------------------------------------------------- 171
16.1. Terminal Guide of the ICs Transistors and
Diodes ---------------------------------------------------- 171
16.1.1. Digital Board---------------------------------------- 171
16.1.2. Analog Board--------------------------------------- 171
16.1.3. Operation Board----------------------------------- 171
16.1.4. Power Supply Board------------------------------ 172
16.1.5. Interface Board ------------------------------------ 172
16.2. How to Replace the Flat Package IC ------------- 173
16.2.1. Preparation------------------------------------------ 173
16.2.2. Flat Package IC Removal Procedure -------- 173
16.2.3. Flat Package IC Installation Procedure------ 173
16.2.4. Bridge Modification Procedure----------------- 173
16.3. Test Chart------------------------------------------------ 174
16.3.1. ITU-T No.1 Test chart ---------------------------- 174
16.3.2. ITU-T No.2 Test Chart---------------------------- 175
16.3.3. Test Chart ------------------------------------------- 176
17 Schematic Diagram ------------------------------------------ 178
17.1. Digital Board (PCB1)---------------------------------- 178
17.2. Analog Board (PCB2)--------------------------------- 182
17.3. Operation Board (PCB3)----------------------------- 184
17.4. Power Supply Board (PCB4)------------------------ 185
17.5. Interface Board (PCB5)------------------------------- 186
17.6. Sensor Board (PCB6)--------------------------------- 187
17.7. Film End Sensor Board (PCB7)-------------------- 187
17.8. Motor Position Sensor Board (PCB8)------------- 187
17.9. Hook Switch Board (PCB9)-------------------------- 188
18 Printed Circuit Board ---------------------------------------- 189
18.1. Digital Board (PCB1)---------------------------------- 189
18.1.1. Bottom View ---------------------------------------- 189
18.1.2. Component View ---------------------------------- 190
18.2. Analog Board (PCB2)--------------------------------- 191
18.2.1. Bottom View ---------------------------------------- 191
18.2.2. Component View ---------------------------------- 192
18.3. Operation Board (PCB3)----------------------------- 193
18.4. Power Supply Board (PCB4)------------------------ 194
18.5. Interface Board (PCB5)------------------------------- 195
18.6. Sensor Board (PCB6)--------------------------------- 195
18.7. Film End Sensor Board (PCB7)-------------------- 195
18.8. Motor Position Sensor Board (PCB8)------------- 195
18.9. Hook Switch Board (PCB9)-------------------------- 196
19 Appendix Information of Schematic Diagram------- 196
20 Exploded View and Replacement Parts List--------- 197
20.1. Cabinet, Mechanical and Electrical Parts
Location -------------------------------------------------- 197
20.1.1. General Section ----------------------------------- 197
20.1.2. Operation Panel Section ------------------------ 198
20.1.3. Upper Cabinet Section--------------------------- 199
20.1.4. Back Cover Section------------------------------- 200
20.1.5. Lower Cabinet Section--------------------------- 202
20.1.6. Gear Block Section ------------------------------- 203
20.1.7. Screws ---------------------------------------------- 204
20.1.8. Accessories and Packing Materials ---------- 205
20.2. Replacement Parts List------------------------------- 206
20.2.1. Cabinet and Electrical Parts-------------------- 206
20.2.2. Digital Board Parts-------------------------------- 207
20.2.3. Analog Board Parts------------------------------- 209

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KX-FP215
20.2.4. Operation Board Parts --------------------------- 210
20.2.5. Power Supply Board Parts-----------------------211
20.2.6. Interface Board Parts------------------------------211
20.2.7. Sensor Board Parts-------------------------------211
20.2.8. Film End Sensor Board Parts -------------------211
20.2.9. Motor Position Sensor Board Parts----------- 212
20.2.10. Hook Swicth Board Parts------------------------ 212
20.2.11. MIC Board Parts----------------------------------- 212

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KX-FP215
1 Safety Precautions
1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
1.1. For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-
vent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
1.2. AC Caution
For safety, before closing the lower cabinet, please make sure of the following precautions.
1. The earth lead is fixed with the screw.
2. The AC lead is connected properly to power supply board.
3. Wrap the earth lead around the core 5 times.
4. Wrap the AC lead around the core 5 times.

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KX-FP215
1.3. Personal Safety Precautions
1.3.1. Moving Sections of the Unit
Be careful not to let your hair, clothes, fingers, accessories, etc., become caught in any moving sections of the unit.
The moving sections of the unit are the rollers and a gear. There is a separation roller and a document feed roller which are
rotated by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially
when the unit is operating.
1.3.2. Live Electrical Sections
All the electrical sections of the unit supplied with AC power by the AC power cord are live.
Never disassemble the unit for service with the AC power supply plugged in.
CAUTION:
AC voltage is supplied to the primary side of the power supply unit. Therefore, always unplug the AC power cord before disas-
sembling for service.

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KX-FP215
1.4. Service Precautions
1.4.1. Precautions to Prevent Damage from static Electricity
Electrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change their
electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity.
Never touch the electrical sections such as the power supply unit, etc.

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KX-FP215
2Warning
2.1. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50°~ 70°F, (30°~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700°± 20°F, (370°± 10°C).
• Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent solder
splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

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KX-FP215
2.2. Insulation Resistance Test
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each exposed metal cabinet part
(screw heads, control shafts, bottom frame, etc.).
Note: Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of a shock hazard.
2.3. Battery Caution
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the man-
ufacturer. Discard used batteries according to following caution:
Disposal of lithium batteries should be performed by permitted, professional disposal firms knowledgeable in state government
federal and local hazardous materials and hazardous waste transportation and disposal requirements.
A battery continues to have no transportation limitations as long as it is separated to prevent short circuits and packed in strong
packaging.
Commercial firms that dispose of any quantity of lithium cells should have a mechanism in place to account for their ultimate dis-
position. This is a good practice for all types of commercial or industrial waste.
Recommend Type Number:
CR2032 (BAT501) Manufactured by MATSUSHITA/TOSHIBA
How to remove the lithium battery. Refer to How to Remove the P.C. Boards and Speaker (P.141).
2.4. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

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KX-FP215
3 Specifications
Any details given in these instructions are subject to change without notice.
*1Transmission speed depends on the contents of the pages, resolution, telephone line conditions and capability of the other
party’s machine.
*2Transmission speed is based on the ITU-T No. 1 Test Chart with original mode. If the capability of the other party’s machine is
inferior to your unit, the transmission time may be longer. (Refer to ITU-T No.1 Test chart (P.174).)
*3If an error occurs during fax reception, such as a paper jam or if the recording paper runs out, the fax and subsequent faxes will
be retained in memory.
Applicable Lines: Public Switched Telephone Network
Document Size: Max. 216 mm (8 1/2") in width, Max. 600 mm (23 5/8") in length
Effective Scanning Width: 208 mm (8 3/16")
Effective Printing Width: Letter: 208 mm (8 3/16")
A4: 202 mm (7 15/16")
Recording Paper Size: Letter: 216 mm ×279 mm (8 1/2" ×11")
A4: 210 mm ×297 mm (8 1/4" ×11 11/16")
Recording Paper Weight: 60 g/m2to 90 g/m2(16 lb to 24 lb)
Transmission Speed*1:Approx. 8 s/page (ECM-MMR)*2
Scanning Density: Horizontal: 8 pels/mm (203 pels/inch)
Vertical:
3.85 lines/mm (98 lines/inch) (standard resolution)
7.7 lines/mm (196 lines/inch) (fine/photo resolution)
15.4 lines/mm (392 lines/inch) (super fine resolution)
Photo Resolution: 64 levels
Scanner Type: Contact Image Sensor
Printer Type: Thermal Transfer on Plain Paper
Data Compression System: Modified Huffman (MH), Modified READ (MR), Modified Modified READ (MMR)
Modem Speed: 14,400 / 12,000 / 9,600 / 7,200 / 4,800 / 2,400 bps; Automatic Fallback
Operating Environment: 5°C—35°C (41°F—95°F), 20 %—80 % RH (Relative Humidity)
Dimensions: Approx. height 106 mm ×width 356 mm ×depth 200 mm (4 3/16" ×14” ×7 7/8")
Mass (Weight): Approx. 2.7 kg (5.9 lb)
Power Consumption: Standby: Approx. 1.4 W
Transmission: Approx. 15 W
Reception: Approx. 40 W (When receiving a 20% black document)
Copy: Approx. 40 W (When copying a 20% black document)
Maximum: Approx. 135 W (When copying a 100% black document)
Power Supply: 120 V AC, 60 Hz
Fax Memory Capacity*3:Transmission: Approx. 25 pages
Reception: Approx. 28 pages
(Based on the ITU-T No. 1 Test Chart in standard resolution, without using the Error
Correction Mode.)
Voice Memory Capacity: Approx. 18 minutes of recording time including greeting messages
(Recording time may be reduced by the calling party’s background noise.)

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KX-FP215
4 General/Introduction
4.1. Optional Accessories
*1 To ensure the unit operates properly, we recommend using the Panasonic replacement film.
The ink film is not reusable. Do not rewind and use the ink film again.
5 Features
General
• Help function
Display:
- FILM ORDER SHEET
- SEND GUIDE
- BASIC SETTINGS
- FEATURE LIST
- TAM OPERATION
- FAX SND/RCV
-COPIER
- Q and A
- ERRORS
- REPORTS
-CALLERID
• LCD (Liquid Crystal Display) readout
Plain Paper Facsimile Machine
• 8 second transmission speed
The 8 second speed is based upon the ITU-T No. 1 Test
Chart on the condition that memory transmission is
performed.
• Letter/A4, G3 compatible
• Automatic document feeder (up to 10 sheets)
• Quick scan
• Resolution: Standard/Fine/Super fine/Photo (64 level)
• Broadcast
• 20-sheet recording paper capacity (16 lb to 24 lb)
• Automatic fax/phone switching
• Distinctive ring detection
Subscription to distinctive ring services is required.
Large Memory... Performed by DRAM
Approx. 28 pages of memory reception
Approx. 25 pages of memory transmission
Integrated Telephone System
• On-hook dialing
•Voicemuting
• Redialing function
• 50-station telephone directory with Phonebook
• Caller ID service
• Digital SP-Phone
Enhanced Copier Function
• Multi-copy function (up to 20 copies)
• Enlargement and reduction
•Collate
• 64-Level halftone
Digital Answering System
• Voice Time/Day Stamp
• 18-Minutes recording time
Model No. Description Specification
KX-FA91 Replacement Film*1 25 m (82’) ×2 rolls
(Each roll will print about 80 letter-sized pages.)

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KX-FP215
6 Technical Descriptions
6.1. Connection Diagram

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KX-FP215
6.2. General Block
The following is an outline of each device IC on the digital board. (Refer to General Block Diagram (P.14).).
1. ASIC (IC501)
Composed mainly of an address decoder and a modem control.
Controls the general FAX operations.
Controls the operation panel I/F.
Controls the thermal head I/F and CIS I/F.
Performs the image processing.
CPU and Real time clock
Provides the reset pulse for each of the major ICs.
2. Flash ROM (IC506)
Contains all of the program instructions on the unit operations.
This memory is used mainly for the parameter working in the storage area.
3. Dynamic RAM (IC503)
This memory is used mainly for the parameter working in the storage area.
4. MODEM (IC505)
Performs the modulation and the demodulation for FAX communication.
5. Read Section
CIS image sensor to read transmitted documents.
6. Motor Driver (IC401)
Drives the transmission motor and the reception motor.
7. Thermal Head
Contains heat-emitting elements for dot matrix image printing.
8. Analog Board
Composed of ITS circuit and NCU circuit.
9. Sensor Section
Composed of a cover open and film end switch, a document set switch, a document top switch, a paper top sensor and a
motor position switch.
10. Power Supply Board Switching Section
Supplies +6V and +24V to the unit.
11. Flash Memory (IC507)
This memory is used for voice prompt and TAM.

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KX-FP215
6.2.1. General Block Diagram

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KX-FP215
6.3. Control Section
6.3.1. Block Diagram
KX-FP215 : CONTROL SECTION BLOCK DIAGRAM
IC501
ASIC
ADR[15:13]
RBA[5:0]
ADR[12:0]
DB[7:0]
XRD
XWR
XROMCS XOPRBE
XMDMCS
IC506
FLASH IC505
MODEM
A[17:0]
D[7:0]
XRD XCS
A[4:0]
D[7:0]
XRD XWR XCS
XWDERR IN
OUT
GND
KSTART,KLATCH KSCLK,KTXD KRXD
TO CIS
F1,FTG
VIDEO
OP-RESET
XRESETI
XORESET
XRESET
XBACKEN
IC504
RESET-IC
+3.3V/BATT +2.5V/BATT
BATT
+ -
24MHz
32.768KHz
TX
RX
TO Analog Board
A[12:0]
RBA[5:0]
A[4:0]
+5V
XRAS
XCAS
A[9:0]
D[7:0]
XRD XWR XRAS XCAS
IC503
DRAM
A[7:4]
RBA[5:0]
+3.3V
CN501
THLAT,THC,THDAT STB1,STB2
Q501,502,504 HEADON
RXE
TM REED,PTOP,COVER OPEN RXE,RM0~3 FILM_CHECK,MOTOR_POS
CN502,503
CN505
CN504
CN507
CISLEDON
32.256MHz
+3.3V
VDET
Q503 +3.3V+2.5V Q505
+2.5V/BATT +3.3V/BATT
XWR
+5V
MIC IN
IC510
SP-AMP
IC509
AND
To Operation Panel
A[17:0]
D[7:0]
XRD XCS XWR
IC507
FLASH
A[12:0]
RBA[5:0]
XRESCS2

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KX-FP215
6.3.2. Memory Map

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KX-FP215
6.3.3. ASIC (IC501)
This custom IC is used for the general FAX operations.
1. CPU:
This model uses a Z80 equivalent to the CPU operating
at 12 MHz. Most of the peripheral functions are performed
by custom-designed LSIs. Therefore, the CPU only works
for processing the results.
2. RTC:
Real Time Clock
3. DECODER:
Decodes the address.
4. ROM/RAM I/F:
Controls the SELECT signal of ROM or RAM and the
bank switching.
5. CIS I/F:
Controls the document reading.
6. IMAGE DATA RAM:
This memory is programmed into the ASIC and uses 8
KB for the image processing. (See Fig. A.)
7. THERMAL HEAD I/F:
Transmits the recorded data to the thermal head.
8. MOTOR I/F:
Controls the transmission motor which feeds the docu-
ment.
Controls the receiving motor which feeds the recording
paper.
9. OPERATION PANEL I/F:
Serial interface with Operation Panel.
10. I/O PORT:
I/O Port Interface.
11. ANALOG UNIT:
Electronic volume for the monitor.
Sends beep tones, etc.
Fig. A
Note:
This memory is incorporated into the ASIC (IC501) and used for the image processing.
Fig. A shows the memory map of the Image Data RAM.

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KX-FP215
Descriptions of Pin Distribution (IC501)
NO. SIGNAL I/O POWER SUPPLIED
VOLTAGE DESCRIPTION
1 VSSA GND POWER SOURCE (ANALOG GND)
2 VDDA 3.3 3.3V POWER SOURCE (ANALOG +3.3V)
3 AIN1 A 3.3V CIS IMAGE SIGNAL INPUT (SIG)
4 AIN2 A 3.3V THERMISTOR TEMPERATURE WATCH INPUT
5 AIN3 A 3.3V LINE VOLTAGE DETECTION SIGNAL INPUT (DCIN)
6 AMON A 3.3V ANALOG SIGNAL MONITOR TERMINAL
7 VSS GND POWER SOURCE (GND)
8 X32OUT O 3.3V/BATT RTC (32.768KHz) CONNECTION
9 X32IN I 3.3V/BATT RTC (32.768KHz) CONNECTION
10 VDD (3.3V / B) ----- POWER SOURCE (+3.3V/LITHIUM BATTERY)
11 XBACEN I 3.3V/BATT BACKUP ENABLE
12 XRAMCS O 3.3V/BATT NOT USED
13 VDD (3.3V / B) ----- POWER SOURCE(+3.3V / LITHIUM BATTERY)
14 VDD (2.5V/B) ----- POWER SOURCE (+2.5V / LITHIUM BATTERY)
15 FTG O 3.3V SH SIGNAL OUTPUT FOR CIS (SI)
16 F1 O 3.3V 01 SIGNAL OUTPUT FOR CIS (CLK)
17 F2/OP O 3.3V OUTPUT PORT (THON)
18 FR/OP O 3.3V OUTPUT PORT (MDMRST)
19 CPC I 3.3V INPUT PORT (CPC)
20 RVN I 3.3V INPUT PORT (REED)
21 IRDATXD/IOP O 3.3V OUTPUT PORT (CISLED)
22 IRDARXD/IOP80 I 3.3V INPUT PORT (PTOP)
23 TXD/IOP I 3.3V INPUT PORT (FILMEND)
24 RXD/IOP O 3.3V OUTPUT PORT (HS-ALC)
25 XRTS/IOP I 3.3V INPUT PORT (HOOK)
26 XCTS/IOP O 3.3V OUTPUT PORT (SPMUTE)
27 VDD (2.5V) ----- POWER SOURCE (+2.5V)
28 TONE1 A 3.3V TONE OUTPUT
29 TONE2 A 3.3V TONE OUTPUT
30 VOLUREF A 3.3V ANALOG REF VOLTAGE
31 VOLUOUT A 3.3V VOLUME OUTPUT
32 VOLUIN A 3.3V VOLUME INPUT
33 XNMI I 3.3V HIGH FIXED
34 FMEMDO/IOP O 3.3V OUTPUT PORT (CIS ON)
35 VDD (3.3V) ----- POWER SOURCE (+3.3V)
36 VSS GND POWER SOURCE (GND)
37 VSS GND POWER SOURCE (GND)
38 VDD (3.3V) ----- POWER SOURCE (+3.3V)
39 MIDAT/IOP O 3.3V PORT (DATA)
40 MICLK/IOP O 3.3V PORT (DR)
41 MILAT/IOP O 3.3V PORT (CD)
42 20KOSC/IOP I/O 3.3V PORT (TONEIEN)
43 XWAIT I 3.3V INPUT PORT (MPOS)
44 HSTRD/IOP O 3.3V OUTPUT (DCLK)
45 HSTWR/IOP O 3.3V OUTPUT PORT (XHSTWR)
46 XOPRBE O 3.3V MFCS
47 ADR15 O 3.3V CPU ADDRESS BUS 15 (NOT USED)
48 ADR14 O 3.3V CPU ADDRESS BUS 14 (NOT USED)
49 ADR13 O 3.3V CPU ADDRESS BUS 13 (NOT USED)
50 VDD (2.5V) ----- POWER SOURCE (+2.5V)
51 XOUT O 3.3V SYSTEM CLOCK (24MHz)
52 XIN I 3.3V SYSTEM CLOCK (24MHz)
53 VSS GND POWER SOURCE (GND)
54 VDD (3.3V) ----- POWER SOURCE (+3.3V)
55 XTEST O 3.3V 24MHz CLOCK
56 TEST1 I 3.3V HIGH FIXED

19
KX-FP215
57 TEST2 I 3.3V HIGH FIXED
58 TEST3 I 3.3V HIGH FIXED
59 TEST4 I 3.3V HIGH FIXED
60 XMDMINT I 3.3V MODEM INTERRUPT
61 XMDMCS O 3.3V MODEM CHIP SELECT
62 XRAS/IOP O 3.3V DRAM (IC503) ROW ADDRESS STROBE
63 XCAS1/IOP O 3.3V DRAM (IC503) CULUM ADDRESS STROBE
64 XCAS2/IOP I 3.3V INPUT PORT (COVER)
65 XRESCS2 O 3.3V FLASH CHIP SELECT (XRESCS2)
66 DB3 I/O 3.3V CPU DATA BUS 3
67 DB2 I/O 3.3V CPU DATA BUS 2
68 DB4 I/O 3.3V CPU DATA BUS 4
69 DB1 I/O 3.3V CPU DATA BUS 1
70 DB5 I/O 3.3V CPU DATA BUS 5
71 VDD (3.3V) ----- POWER SOURCE (+3.3V)
72 VSS GND POWER SOURCE (GND)
73 VSS GND POWER SOURCE (GND)
74 VDD (3.3V) ----- POWER SOURCE (+3.3V)
75 DB0 I/O 3.3V CPU DATA BUS 0
76 DB6 I/O 3.3V CPU DATA BUS 6
77 DB7 I/O 3.3V CPU DATA BUS 7
78 XROMCS O 3.3V ROM (IC502) CHIP SELECT
79 RD O 3.3V CPU RD
80 WR O 3.3V CPU WR
81 ADR0 O 3.3V CPU ADDRESS BUS 0
82 ADR1 O 3.3V CPU ADDRESS BUS 1
83 ADR2 O 3.3V CPU ADDRESS BUS 2
84 ADR3 O 3.3V CPU ADDRESS BUS 3
85 ADR4 O 3.3V CPU ADDRESS BUS 4
86 ADR5 O 3.3V CPU ADDRESS BUS 5
87 VSS GND POWER SOURCE (GND)
88 VDD (2.5V) ----- POWER SOURCE (+2.5V)
89 ADR6 O 3.3V CPU ADDRESS BUS 6
90 ADR7 O 3.3V CPU ADDRESS BUS 7
91 ADR8 O 3.3V CPU ADDRESS BUS 8
92 ADR9 O 3.3V CPU ADDRESS 9
93 ADR10 O 3.3V CPU ADDRESS 10
94 ADR11 O 3.3V CPU ADDRESS 11
95 ADR12 O 3.3V CPU ADDRESS 12
96 RBA0 O 3.3V ROM/RAM BANK ADDRESS 0
97 RBA1 O 3.3V ROM/RAM BANK ADDRESS 1
98 RBA2 O 3.3V ROM/RAM BANK ADDRESS 2
99 RBA3 O 3.3V ROM/RAM BANK ADDRESS 3
100 RBA4 O 3.3V ROM/RAM BANK ADDRESS 4
101 RBA5 O 3.3V ROM/RAM BANK ADDRESS 5
102 RBA6/IOP96 O 3.3V A19
103 STB1 O 3.3V STROBE SIGNAL OUTPUT TO THERMAL HEAD
104 STB2 O 3.3V STROBE SIGNAL OUTPUT TO THERMAL HEAD
105 STB3 O 3.3V STROBE SIGNAL OUTPUT TO THERMAL HEAD
106 XRESET I 3.3V RESET INPUT
107 VDD (3.3V) ----- POWER SOURCE (+3.3V)
108 VSS GND POWER SOURCE (GND)
109 VSS GND POWER SOURCE (GND)
110 VDD (3.3V) ----- POWER SOURCE (+3.3V)
111 XORESET O 3.3V NOT USED
112 VDD(5V) ----- POWER SOURCE (+5V)
113 VSS GND POWER SOURCE (GND)
NO. SIGNAL I/O POWER SUPPLIED
VOLTAGE DESCRIPTION

20
KX-FP215
6.3.4. Flash Memory (IC506)
This 512KB ROM (FLASH MEMORY) carries a common area of 32KB and bank areas which each have 8KB (BK4~BK63). The
addresses from 0000H to 7FFFH are for the common area and from 8000H to 9FFFH are for the bank areas.
6.3.5. Dynamic RAM (IC503)
The DRAM serves as CPU and receives memory.
The address is F200H~F3FFH (DRAM access window 1) and F600H~F7FFH (DRAM access window 2).
114 XRESETI I 3.3V RESET INPUT
115 WDERR O 3.3V WATCHED ERROR OUTPUT SIGNAL
116 THDAT O 3.3V RECORDED IMAGE OUTPUT (XTHDAT)
117 THCLK O 3.3V CLOCK OUTPUT FOR DATA TRANSFER (XTHCLK)
118 THLAT O 3.3V PULSE OUTPUT FOR DATA LATCH (XTHLAT)
119 STBNP I 3.3V INPUT PORT (TEST)
120 RM0/IOP O 3.3V OUTPUT PORT (OPRESET)
121 RM1/IOP I/O 3.3V (TEL RXEN)
122 RM2/IOP I/O 3.3V (HS RXEN)
123 RM3/IOP I/O 3.3V MDMTXEN
124 RXE/IOP I 3.3V INPUT PORT (BELL)
125 TMO O 3.3V MOTOR A PHASE
126 VDD (2.5V) ----- POWER SOURCE (+2.5V)
127 VSS GND POWER SOURCE (GND)
128 TM1/IOP O 3.3V MOTOR B PHASE
129 TM2/IOP O 3.3V MOTOR /A PHASE
130 TM3/IOP O 3.3V MOTOR /B PHASE
131 TXE/IOP O 3.3V MOTOR ENABLE SIGNAL
132 KSTART O 3.3V OPERATION PANEL CONTROL
133 KLATCH O 3.3V OPERATION PANEL CONTROL
134 KSCLK O 3.3V OPERATION PANEL CONTROL
135 KTXD O 3.3V OPERATION PANEL CONTROL
136 KRXD I 3.3V OPERATION PANEL CONTROL
137 FMEMCLK/IOP O 3.3V OUTPUT PORT (BREAK)
138 FMEMDI/IOP O 3.3V OUTPUT PORT (DR)
139 ADSEL1 O 3.3V CHANNEL SELECT SIGNAL FOR AIN2
140 VDDA (2.5V) 2.5V POWER SOURCE (ANALOG +2.5V)
141 VREFB A 3.3V A/D CONVERTER'S ZERO STANDARD VOLTAGE
OUTPUT
142 VCL A 3.3V ANALOG PART STANDARD VOLTAGE SIGNAL
143 VREFT A 3.3V A/D CONVERTER'S FULL SCALE VOLTAGE OUTPUT
144 VSSA GND POWER SOURCE (ANALOG GND)
NO. SIGNAL I/O POWER SUPPLIED
VOLTAGE DESCRIPTION