Panasonic SA-HT530EB User manual

ORDERNO. MD0501005C2
DVDHomeTheaterSound System
SA-HT530EB
Colour
(S)...SilverType
SPECIFICATIONS
Specification
1

AmplifierSection
RMSOutputPower:DolbyDigital Mode
FrontCh
55 W perchannel (6), 1kHz, 10%THD
Surround Ch
55 W perchannel (6), 1kHz, 10%THD
CenterCh
160 W perchannel (6), 1kHz, 10%THD
SubwooferCh
220 W perchannel (4), 100 Hz, 10%THD
Total RMSDolbyDigital Mode
Power 600 W
DINOutputPower:DolbyDigital Mode
FrontCh
40 W perchannel (6), 1kHz, 1%THD
Surround Ch
40 W perchannel (6), 1kHz, 1%THD
CenterCh
120 W perchannel (6), 1kHz, 1%THD
SubwooferCh
150 W perchannel (4), 100 Hz, 1%THD
Total DINDolbyDigital Mode
Power 430 W
FM/AMTuner, Terminals
Section
Presetstation FM15 stations
AM/MW 15 stations
FrequencyModulation (FM)
FrequencyRange
87.50-108.00 MHz(50-kHzstep)
Sensitivity 1.5V(IHF)
S/N26 dB 1.2V
Antennaterminals 75 (unbalanced)
AmplitudeModulation (AM/MW)
FrequencyRange 522-1629 kHz(9-kHzstep)
AMSensitivityS/N20 dBat999
kHz 560 V/m
PhoneJack
Terminal Stereo, 3.5mm jack
Disc Section
Disc played [8cm or12 cm]
1. DVD-RAM(DVD-VRcompatible, JPEGformatted disc)
2. DVD-Audio
3. DVD-Video
4. DVD-R, DVD-RW (DVD-Video compatible)+R, +RW (Video
compatible)
5. CD-Audio (CD-DA)
6. Video CD
7. SVCD(Conforming to IEC62107)
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8. CD-R/RW (CD-DA, Video-CD, SVCD, MP3, WMA, JPEG
formatted disc)
9. MP3/WMA*1
-Compatiblecompression rate:
MP3:between32 kbpsand 320 kbps
WMA:between48 kbpsand 320 kbps
10. JPEG*1
-ExifVer2.1JPEGBaselinefiles
-Pictureresolution: between320 x240 and 6144 x4096 pixels(sub
sampling is4:2:2or4:2:0)
11. HighMATLevel 2(Audio and Image)
*1Thetotal combined maximumnumberofrecognizableaudio
and picturecontentsand groups:4000 audio and picture
contentsand 400 groups.
Pick up
Wavelength CD785 nm
DVD662 nm
Laserpower CLASS 2/CLASS 3A
Audio output(Disc)
Numberofchannels 5.1ch (FL, FR, C, SL, SR, SW)
Video Section
Video System
Signal system PAL625/50, PAL525/60, NTSC
Compositevideo output
Outputlevel 1Vp-p (75 )
Terminal Pin jack (1system)
Scartjack (1system)
S-video output
Youtputlevel 1Vp-p (75 )
Coutputlevel PAL;0.3Vp-p (75 )
NTSC;0.286 Vp-p (75 )
Terminal Sterminal (1system)
Scartjack (1system)
ComponentVideo Output(480p/480i)
Youtputlevel 1Vp-p (75 )
PBoutputlevel 0.7Vp-p (75 )
PRoutputlevel 0.7Vp-p (75 )
Terminal
Pin jack (Y:green, PB:blue, PR:red)(1system)
RGBvideo output
Routputlevel 0.7Vp-p (75 )
Goutputlevel 0.7Vp-p (75 )
Boutputlevel 0.7Vp-p (75 )
Terminal Scartjack (1system)
General
PowerSupply AC230-240 V, 50 Hz
Powerconsumption 25 W (SA-HT530), / 250 W (SB
-WA530)
Dimensions(W xHxD) 430 x60 x348.3mm
Mass 2.7kg (SA-HT530)
Operating temperaturerange +5 °Cto +35 °C
3

Operating
temperature
range
+
5
°
C
to
+
35
°
C
Operating humidityrange
5%to 90 %RH(no condensation)
Powerconsumption in standbymode:approx. 0.7W
*2Rating with lowcutfilterequipped amplifier
System
SC-HT530 (EB) Main unit: SA-HT530 (EB)
Satellitespeakers:SB-HT530 (EB)
Activesubwoofer:SB-WA530 (EB)
Satellitespeakers:SB-HT530 (EB)
Frontspeakers:SB-FS530 (EB)x2
Surround speakers:SB-FS530 (EB)x2
Centerspeaker:SB-PC730 (P-S1)x1
Note:
1. Specificationsaresubjectto changewithout notice. Mass and
dimensionsareapproximate.
2. Total harmonicdistortion ismeasuredbythedigital spectrum analyzer.
1. Caution forACMains Lead
4

2. Use of ActiveSubwoofer
2.1. Checking MainUnitwhenActiveSubwooferisUsed
5

2.2. Checking MainUnitUsing PowerJig
Iftheactive subwooferisnotavailableduring timeofrepairtotheunit, thefollowing equipment
couldbeused.
Jigproductnumber
RFKZ0182 (110V , 127V, 220V, 230V -240V for withvoltageselector overseas domesticuse).
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3. BeforeRepairand Adjustment
DisconnectACpower, dischargePowerSupplyCapacitorsC2080 through a10 , 10 Wresistor
toground.
DONOTSHORT-CIRCUITDIRECTLY(withascrewdriverblade, for instance), as thismay destroy
solidstatedevices.
Afterrepairsarecompleted, restorepowergraduallyusing avariac, toavoidovercurrent.
Currentconsumption atAC230V-240V, 50HzinNOSIGNALmodeshouldbe~850 mA(Active
Subwoofer).
4. SAFETYPRECAUTIONS
4.1. GENERALGUIDELINES
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, ensurethat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
4.1.1. LEAKAGE CURRENTCOLDCHECK (FORACTIVE SUBWOOFER)
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturnpathtothechassis,
thereading shouldbebetween1M and 5.2 . / Whenthe
exposedmetal does nothaveareturnpathtothechassis, the
reading must be . Fig. 1
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4.1.2. LEAKAGE CURRENTHOTCHECK (See Figure1.)
1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitor, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as showninFigure1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 orequivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed1/2
milliamp. Incase ameasurementisoutsideofthelimits specified,
thereisapossibilityofashock hazard, and theequipmentshould
berepairedand recheckedbeforeitisreturnedtothecustomer.
5. Handling the Lead Solder
5.1. Aboutleadfree solder(PbF)
Distinction ofPbF P.C.B. :
P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.
Caution:
-Pbfree solderhas ahighermelting pointthat standardsolder;
Typicallythemelting pointis50 -70°F(30 -40°C)higher. / Please
use ahigh temperaturesoldering iron. Incase ofthesoldering iron
withtemperaturecontrol, please set itto700 ±20°F(370 ±10°C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100°F/600°C).
-Whensoldering orunsoldering, please completelyremoveall ofthe
solderon thepinsorsolderarea, and besuretoheat thesoldering
points withthePbfree solderuntil itmelts enough.
6. Protection Circuitry
Theprotection circuitrymay have operatedifeitherofthefollowing conditionsarenoticed:
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-Nosound isheardwhenthepoweristurnedon.
-Sound stopsduring aperformance.
Thefunction ofthiscircuitryistopreventcircuitrydamageif, for example, thepositive and
negative speakerconnection wires are
“shorted”, or ifspeakersystemswithanimpedance less thantheindicatedratedimpedance of
theamplifierareused.
Ifthisoccurs, followtheprocedureoutlines below:
1. Turnoff thepower.
2. Determinethecause oftheproblemand correct it.
3. Turnon thepoweronce againafteroneminute.
Note:
Whentheprotection circuitryfunctions, theunitwill notoperateunless thepowerisfirstturned
off and thenon again.
7. Prevention of ElectroStaticDischarge (ESD) to
ElectrostaticallySensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybyelectricity. Such
componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor “chip”
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equipedassembly, drainoff anyESDon yourbody
bytouching aknownearthground. Alternatively, obtainand wear
acommerciallyavailabledischarging ESDwrist strap, which
shouldberemovedforpotential shock reasonspriortoapplying
powertotheunitundertest.
2. Afterremoving anelectrical assemblyequipedwithES devices,
place theassemblyon aconductivesurface suchas aluminium
foil, topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoverdevice. Somesolder
removal devices notclassifiedas “anti-static(ESDprotected)”can
generate electrical chargetodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
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6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, aluminiumfoil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise harmless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficientto
damageanES device).
8. Cautions toBeTaken When Handling Optical
Pickup
-Thelaserdiodeusedinsidetheoptical pickup couldbedestroyed
duetostaticelectricity(potential difference iscausedby
electrostaticloaddischargedfromclothes and humanbody).
Handletheparts carefullytoavoidelectrostaticdestruction during
repair&during replacement.
8.1. Handling Optical Pickup
1. Donotcause anystrong impact on optical pickup as theunit
structurallyuses anextremelyprecise technology.
2. Short-circuittheflexiblecableofoptical pickup removedfromthe
circuitboardusing ashort-circuitpinorclipinordertoprevent
laserdiodefromelectrostaticdestruction. (Referto Fig. 8-1 and
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