Panasonic TH-42PW5 User manual

ORDERNO. ITD0207019C0
D10 Canada:B07
WidePlasmaDisplay
TH-42PW5/ TH-42PWD5 / TH-37PW5/ TH-37PWD5
GP5DChassis
SPECIFICATIONS
Specifications
PowerSource: AC120V50/60Hz(UY/UZversion)
AC220-240V50/60Hz
(ExceptUY/UZversion model)
PowerConsumption: 225 W (37 inch), 295 W (42 inch)
2.4W (stand-bycondition)
(UY/UZversion)
2.8W (stand-bycondition)
(ExceptUY/UZversion model)
0.9W (Poweroff condition)
(UY/UZversion model)
1.5W (Poweroff condition)
(ExceptUY/UZversion model)
Plasma Displaypanel:Drivemethod ACtype
16:9aspectratio
ContrastRatio 3000:1
Screen size: 818 mm (W)×461 mm (H)
939 mm (diagonal)(37 inch)
920 mm (W)×518 mm (H)
1,056 mm (diagonal)(42 inch)
No. ofpixels
408,960 (852 (W)×480 (H))
[2,556 ×480 dots]
Operating condition:
Temperature 34 °F -104 °F (0°C-40 °C)
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Humidity 20 %-80 %
Horizontal scanning frequency15.6-
110kHz
Vertical scanning frequency48 -120Hz
Connection terminals:
AV
Video in 1.0Vp-p (75-ohm)
S-VIDEOIN/ (MINI DIN
4PIN) Y:1Vp-p (75-ohm), C:0.286 Vp-p (75-ohm)
AUDIOIN/ (RCAPIN
JACK ×2) 0.5Vrms (high impedance)
COMPONENT/RGB
Y/G 1.0Vp-p/composite(75-ohm)
0.7Vp-p/non-composite(75-ohm)
PB/B 0.7Vp-p (75-ohm)
PR/R 0.7Vp-p (75-ohm)
HD 1.0-5.0Vp-p (high impedance)
VD 1.0-5.0Vp-p (high impedance)
AUDIOIN
(RCAPINJACK×2) 0.5Vrms (high impedance)
PC
(HIGH-DENSITY
D-SUB15PIN) R,G,B/0.7Vp-p (75-ohm)
HD, VD/1.0-5.0Vp-p (high
impedance)
AUDIOIN(M3JACK) 0.5Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMINAL (D-SUB9PIN) RS-232CCOMPATIBLE
SPEAKERS(External
speakers)(6 ) 16W [8W+8W](10%THD)
Dimensions(W×H×D):920 mm ×550 mm 89 mm)(37 inch)
1,020 mm ×610 mm 89 mm)(42 inch)
Weight(Mass) approx. 24.0kg net(main unitonly)(37
inch)
approx. 28.2kg net(with speakers)(37
inch)
approx. 28.0kg net(main unitonly)(42
inch)
approx. 32.2kg net(with speakers)
(42inch)
2002 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.
2

1. Applicablesignals
2. SafetyPrecautions
2.1. General Guidelines
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
2.1.1. LeakageCurrentColdCheck
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
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jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturnpathtothechassis,
thereading shouldbebetween1M and 5.2M . / Whenthe
exposedmetal does nothaveareturnpathtothechassis, the
reading must be . Figure1
2.1.2. LeakageCurrentHotCheck (See Figure 1 .)
1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitors, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as shownin Figure1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 orequivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed1/2
milliamp. Incase ameasurementisoutsideofthelimits specified,
thereisapossibilityofashock hazard, and theequipmentshould
berepairedand recheckedbeforeitisreturnedtothecustomer.
3. Prevention of ElectroStaticDischarge (ESD) to
ElectrostaticallySensitive(ES) Devices
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
4

componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap,
whichshouldberemovedforpotential shock reasonspriorto
applying powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas alminumfoil,
topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"can
generate electrical chargesufficienttodamageES devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, alminumfoil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
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togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficient
todamageanES device).
4. About lead free solder(PbF)
Note:Leadislistedas (Pb)intheperiodictableofelements.
Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).
ThatisTin(Sn), Silver(Ag)and (Cu)although othertypes areavailable.
Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.
For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder
may beused.
PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol
stampedon theback ofPCB.
Caution
-Pbfree solderhas ahighermelting pointthanstandardsolder.
Typicallythemelting pointis50 ~70 °F(30~40 °C)higher. Please
use ahigh temperaturesoldering iron and set itto700 ±20 °F(370
±10 °C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100
°For600 °C).
Ifyou must use Pbsolder, please completelyremoveall ofthePb
free solderon thepinsorsolderarea beforeapplying Pbsolder. If
thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,
beforeapplying Pbsolder.
-Afterapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess solderwhichmayflow ontothe
opposite side. (see figurebelow)
6

SuggestedPbfree solder
Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu
(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan
alsobeused.
5. PCB Structuresheet of GP5Dchassis
7

Board Name Function Remarks
D1 FormatConverter 1
D2 PlasmaAISub-FieldProcessor 1
ZAudioout
SS SustainOut 1
SC Scanout 1
SU Sustainconnection (Upper) 1
SD Sustainconnection (Lower) 1
C1 DataDrive (LowerRight)
C2 DataDrive (LowerLeft)
H3 Speakerterminal
S1 Powerswitch
SS2 Sustainconnection (Upper)
SS3 Sustainconnection (Lower)
V1 FrontSW. &Remotereceiver
FLinefilter
PPowersupply 1
HX PC_type_Inputterminal
HY BNC_type_Inputterminal 2
HZ RCAtype_Inputterminal 3
Remarks
1. Recommend PCB'sforinitial service forGP5Dchassis.
2. ForSystemmodel exceptBX, EX version
3. ForConsumermodel exceptBX, EX version
6. Service Hint
8

7. Location of Lead Wiring
9

8. Adjustment Procedure
8.1. +B Set-up
8.1.1. Item/ Preparation
1. InputaGreyscalesignal.
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2. Set thepicturecontrols:-
Picturemode:Normal
White balance:Normal
8.1.2. Adjustments
Adjustand confirm indicatedtestpointfor thespecifiedvoltage.
Adjust
Name Volume Voltage Test
Point Remarks
Vsus R621 170V ±
1V P1pin3 UY/UZ
R540 ExceptUY/UZ
Vda R646 67V ±
0.5V P12 pin 1UY/UZ
R537 ExceptUY/UZ
Confirm
Name Voltage TestPoint Remarks
15V 15.3V ±0.5V P23 pin2
13V 13.3V ±0.5V P25 pin5
15V 15.2V ±0.5V P25 pin1
Audio13V 12.5V ±0.8V P6pin1
Audio-13V -12.5V ±0.8V P6pin3
5V 5.2V ±0.3V P25 pin7
STB5V 5.0V ±0.3V P27 pin4
Fan15V 15.0V ±0.5V P10 pin1
Fan5V 5.2V ±0.3V P10 pin4
PFC 380V ±15V C447(+) ExceptUY/
UZ
8.2. DriverSet-up
8.2.1. Item/ Preparation
1. InputanAPL100 %white signal.
2. Set thepicturecontrols:-
Picturemode:Normal
White balance:Cool
Aspect:16:9
8.2.2. Adjustments
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Adjustdriversection voltages referring thepanel dataon thepanel datalabel.
Name Test
Point Voltage Volume Remarks
Vsus TPVSUS
(SS) 170V ±1V R540 (P) Except UY/UZ
R621 (P) UY/UZ
Vbk TPVBK
(SC) 155V ±5V R6443 (SC)
Ve TPVE
(SS) 150V ±1V R6774 (SS) 42inch Models
153V ±1V 37inch
Models
Vset TPVSET
(SC) 218V ±6V ---
Vad TPVAD
(SC) -90V ±1V R6477 (SC)
Vscn TPVSCN
(SC) Vad*+118V ±2V ---
Vda TPVDA
(SS) 67V ±1V R537 (P) Except UY/UZ
R646 (P) UY/UZ
*See thePanel label.
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8.3. Initialization Pulse Adjust
1. InputaCross hatchsignal.
2. Set thepicturecontrols:-
Picturemode:Normal
White balance:Cool
Adjusttheindicatedtestpointfor thespecifiedwave form.
Testpoint Volume Level
T1 TPSC1(SC) R6523 (SC) 20 ±15 Sec
T2 TPSS1(SS) R6557 (SC) 170 ±20 Sec
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8.4. P.C.B. (PrintedCircuitBoard)exchange
8.4.1. Caution
1. To removeP.C.B. , wait1minute afterpowerwas off fordischarge
fromelectrolysiscapacitors.
8.4.2. Quick adjustmentafterP.C.B. exchange
P.C.B. Name TestPoint Voltage Volume Remarks
P Board Vsus TPVSUS (SS) 170V ±1V R540 (P) ExceptUY/
UZ
R621 (P) UY/UZ
Vda TPVDA(SS) 67V ±1V R537 (P) ExceptUY/
UZ
R646 (P) UY/UZ
SCBoard Vbk TPVBK (SC) 155V ±5V R6443 (SC)
Vad TPVAD(SC) -90V ±1V R6477 (SC)
SS Board Ve TPVE (SS) 150V ±1V R6774 (SS) 42inch
Models
37inch
Models
153V ±1V
D1, D2Board Whiteblance, Pedestal and Sub brightness for NTSC, PAL, HD, PCand 625i
signals
*See thePanel label.
8.5. AdjustmentVolumeLocation
8.6. Test PointLocation
14

9. Service mode
9.1. CAT(computerAidedTest) mode
ToexittheCATmode, access theIDmodeand switchoff themainpower.
15

9.1.1. IICmode
SelecttheIICmodebyUp/Downbutton on theremotecontrol atthefrontpageofCATmodethen
press theAction button on theremotecontrol.
Subjectand item arementionedon page14.
ToexittheIICmode, press theRbutton on theremotecontrol.
9.1.2. CD mode
SelecttheCD modebyUp/Downbutton on theremotecontrol atthefrontpageofCATmode
thenpress theMutebutton on theremotecontrol morethan5sec.
Micom softwareversion (IC9354), thisversion canbeupgradeby
1. replace ofnew version IC
2. Loading thenew version softwarefromloadertool, TZSC07036.
Memorydatachange
ToexittheCD mode, press theRbutton on theremotecontrol.
9.1.3. SDmode
SelecttheSDmodebyUp/Downbutton on theremotecontrol atthefrontpageofCATmodethen
press theAction button on theremotecontrol.
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ToexittheSDmode, press theRbutton on theremotecontrol.
9.2. IICmodestructure(following itemsvalueissampledata.)
10. Alignment
10.1. Pedestal setting
17

Note:
OSDisthedifference betweenUY/UZmodel and ExceptUY/UZmodel. / Picture:Normal (Except
UY/UZ)/Standard (UY/UZmodel)/ Whitebalance (ExceptUY/UZ)/Color Temp(UY/UZmodel)
10.2. NTSCpanel white balance
10.3. PAL/SECAMpanel white balance
10.4. PC/RGBpanel white balance
10.5. HD/ 525i /525ppanel white balance
10.6. 625i panel balance
10.7. Sub brightness setting
11. Troubleshooting guide
11.1. SelfCheck
11.1.1. Display Indication
1. Self-check isusedtoautomaticallycheck thebuslinecontrolled
circuitofthePlasmadisplay.
2. To get intotheSelf-check mode, press thevolumedownbutton on
thecustomercontrolsat thefrontoftheset, at thesametime
pressing theOFF-TIMERbutton on theremote control, and the
screenwill show :-
IftheCCU portshave beencheckedand found tobeincorrect
Ornotlocatedthen" --" will appearinplace of" OK"
Note:
Incase ofdisconnectedofH/HY/HZ“IC3699 --”isdisplayed.
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11.1.2. PowerLEDBlinking timing chart
1. Subject
Information ofLEDFlashing timing chart.
2. Contents
Whenanabnormalityhas occurredtheunit, theprotection circuit
operates and reset tothestand bymode. Atthistime, thedefective
block canbeidentifiedbythenumberofblinkes ofthePowerLED
on thefrontpanel oftheunit.
3. Remarks
AboveFanfunction isoperatedduring thefansareinstalled.
11.2. NoPower
[Firstcheck point]
Therearefollowing 3states ofNoPowerindication bypowerLED.
1. Nolit
2. Greenislitthenturnsredblinking afew secondslater.
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3. Onlyredislit.
1. Nolit
11.3. NoPicture
11.4. Local screenfailure
Plasmadisplay may have local area failureon thescreen. Fig - 1 isthepossibledefectP.C.B. for
eachlocal area.
Fig-1
20