Panasonic Viera TH-42PHD5 User manual

ORDER NO. ITD0207017C0
D10 Canada:B07
Wide Plasma Display
TH-42PHD5 / TH-42PHW5
GPH5D Chassis
SPECIFICATIONS
Specifications
Power Source: AC120V 50/60Hz (UY/UZ version)
AC220-240V 50/60Hz
(Except UY/UZ version) model)
Power Consumption: 375 W
2.4W (stand-by condition)
(UY/UZ version)
3.0W (stand-by condition)
(Except UY/UZ version model)
0.9W (Power off condition)
(UY/UZ version model)
1.7W (Power off condition)
(Except UY/UZ version model)
Plasma Display panel: Drive method AC type
50-inch, 16:9 aspect ratio
Contrast Ratio 3000:1
Screen size: 920 mm (W)×518 mm (H)
1,056 mm (diagonal)
No. of pixels
786,432 (1,024 (W)×768 (H))
[3,072×768 dots]
Operating condition:
Temperature 34 °F - 104 °F (0 °C - 40 °C)
Humidity 20 % - 80 %
1

Wide Plasma Display 1
Specifications 1
1. Applicable signals 2
2. Safety Precautions 3
2.1. General Guidelines 3
2.1.1. Leakage Current Cold Check 3
2.1.2. Leakage Current Hot Check (See Figure 1 .) 4
3. Prevention of Electro Static Discharge (ESD) to Electrostatically Sensitive (ES) Devices 4
4. About lead free solder (PbF) 5
5. PCB Structure sheet of GPH5D chassis 7
6. Service Hint 8
7. Location of Lead Wiring 8
8. Adjustment Procedure 9
8.1. +B Set-up 9
8.1.1. Item / Preparation 10
8.1.2. Adjustments 10
8.2. Driver Set-up 10
8.2.1. Item / Preparation 10
8.2.2. Adjustments 10
8.3. Initialization Pulse Adjust 12
8.4. P.C.B. (Printed Circuit Board) exchange 12
8.4.1. Caution 13
8.4.2. Quick adjustment after P.C.B. exchange 13
8.5. Adjustment Volume Location 13
8.6. Test Point Location 13
9. Service mode 14
9.1. CAT (computer Aided Test) mode 14
9.1.1. IIC mode 14
9.1.2. CD mode 15
9.1.3. SD mode 15
9.2. IIC mode structure (following items value is sample data.) 16
10. Alignment 16
10.1. Pedestal setting 16
10.2. NTSC panel white balance 17
10.3. PAL/SECAM panel white balance 17
10.4. PC/RGB panel white balance 17
10.5. HD/ 525i /525p panel white balance 17
10.6. 625i panel balance 17
10.7. Sub brightness setting 17
11. Troubleshooting guide 17
11.1. Self Check 17
11.1.1. Display Indication 17
11.1.2. Power LED Blinking timing chart 18
11.2. No Power 18
11.3. No Picture 19
11.4. Local screen failure 19
12. Option Setting 20
13. Conductor Views 21
13.1. F-Board 21
13.2. P1-Board 21
13.3. P3, P5, P6, P7 and P8-Board 21
svcdoc
I

13.4. HX-Board 21
13.5. HY-Board 21
13.6. HZ-Board 21
13.7. D1-Board 21
13.8. D2-Board 21
13.9. C1-Board 21
13.10. C2-Board 21
13.11. C3-Board 21
13.12. C4-Board 21
13.13. SC-Board 21
13.14. SU-Board 21
13.15. SD-Board 21
13.16. SS-Board 22
13.17. SS2 and SS3-Board 22
13.18. Z-Board 22
13.19. H3, S1 and V1-Board 22
14. Block and Schematic Diagrams 22
14.1. Schematic Diagram Notes 22
14.2. Main Block Diagram 22
14.3. Power Block Diagram 22
14.4. P1-Board Schematic Diagram 22
14.5. F, P3, P5, P6, P7 and P8-Board Schematic Diagram 22
14.6. HX-Board Block Diagram 22
14.7. HX-Board Schematic Diagram 22
14.8. HY and HZ-Board Block Diagram 22
14.9. HY-Board (1 of 2) Schematic Diagram 22
14.10. HY-Board (2 of 2) Schematic Diagram 22
14.11. HZ-Board (1 of 2) Schematic Diagram 22
14.12. HZ-Board (2 of 2) Schematic Diagram 22
14.13. D1-Board Block Diagram 22
14.14. D1-Board (1 of 6) Schematic Diagram 22
14.15. D1-Board (2 of 6) Schematic Diagram 22
14.16. D1-Board (3 of 6) Schematic Diagram 22
14.17. D1-Board (4 of 6) Schematic Diagram 22
14.18. D1-Board (5 of 6) Schematic Diagram 22
14.19. D1-Board (6 of 6) Schematic Diagram 22
14.20. D2-Board Block Diagram 22
14.21. D2-Board (1 of 8) Schematic Diagram 22
14.22. D2-Board (2 of 8) Schematic Diagram 23
14.23. D2-Board (3 of 8) Schematic Diagram 23
14.24. D2-Board (4 of 8) Schematic Diagram 23
14.25. D2-Board (5 of 8) Schematic Diagram 23
14.26. D2-Board (6 of 8) Schematic Diagram 23
14.27. D2-Board (7 of 8) Schematic Diagram 23
14.28. D2-Board (8 of 8) Schematic Diagram 23
14.29. C1, C2, C3, and C4-Board Block Diagram 23
14.30. C1-Board Schematic Diagram 23
14.31. C2-Board Schematic Diagram 23
14.32. C3-Board Schematic Diagram 23
14.33. C4-Board Schematic Diagram 23
14.34. SC-Board Block Diagram 23
svcdoc
II

14.35. SC-Board (1 of 2) Schematic Diagram 23
14.36. SC-Board (2 of 2) Schematic Diagram 23
14.37. SU-Board Block Diagram 23
14.38. SU-Board (1 of 2) Schematic Diagram 23
14.39. SU-Board (2 of 2) Schematic Diagram 23
14.40. SD-Board Block Diagram 23
14.41. SD-Board (1 of 2) Schematic Diagram 23
14.42. SD-Board (2 of 2) Schematic Diagram 23
14.43. SS-Board Block Diagram 23
14.44. SS, SS2, SS3 and S1-Board Schematic Diagram 23
14.45. Z-Board Block Diagram 23
14.46. H3 and Z-Board Schematic Diagram 23
15. Parts Location 23
15.1. Parts Location1 24
15.2. Parts Location2 25
15.3. Parts Location3 26
16. Mechanical Replacement Parts List 27
17. Replacement Parts List 31
17.1. Relpacement Parts List Notes 31
17.2. Electrical Replacement Parts List 31
18. Schematic Diagram for printing with A4 107
svcdoc
III

Horizontal scanning frequency 15.6 -
110kHz
Vertical scanning frequency 48 - 120Hz
Connection terminals:
AV
Video in 1.0 Vp-p (75-ohm)
S-VIDEO IN / (MINI DIN
4PIN)
Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p
(75-ohm)
AUDIO IN / (RCA PIN
JACK × 2)
0.5 Vrms (high impedance)
COMPONENT/RGB
Y/G 1.0 Vp-p/composite (75-ohm)
0.7 Vp-p/non-composite (75-ohm)
PB/B 0.7 Vp-p (75-ohm)
PR/R 0.7 Vp-p (75-ohm)
HD 1.0 - 5.0 Vp-p (high impedance)
VD 1.0 - 5.0 Vp-p (high impedance)
AUDIO IN
(RCA PIN JACK×2)
0.5 Vrms (high impedance)
PC
(HIGH-DENSITY
D-SUB15PIN)
R,G,B/0.7 Vp-p (75-ohm)
HD, VD/1.0 - 5.0 Vp-p (high
impedance)
AUDIO IN (M3 JACK) 0.5Vrms (high impedance)
SERIAL
EXTERNAL CONTROL
TERMINAL (D-SUB9PIN)
RS-232C COMPATIBLE
SPEAKERS (External
speakers)
6 16W [8W+8W] (10% THD)
Dimensions (W×H×D): 40.2” (1,020 mm)×24” (610mm)×3.5” (89
mm)
Weight (Mass) approx. 66.1 Ibs (29.5 kg) (main unit only)
approx. 75.4 Ibs (33.7kg) (with speakers)
1. Applicable signals
2

2. Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is
found, replace all parts which have been overheated or damaged by
the short circuit.
2. After servicing, see to it that all the protective devices such as
insulation barriers, insulation papers shields are properly installed.
3. After servicing, make the following leakage current checks to prevent
the customer from being exposed to shock hazards.
2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two prongs on
the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metallic cabinet part on the
equipment such as screwheads, connectors, control shafts, etc. When
3

the exposed metallic part has a return path to thechassis, the reading
should be between 1M and 5.2M . / When the exposed metal does
not have a return path to the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See Figure 1 .)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation
transformer for this check.
2. Connect a 1.5k , 10 watts resistor, in parallel with a 0.15 F
capacitors, between each exposed metallic part on the set and a good
earth ground such as a water pipe, as shown in Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each
point.
5. Reverse the AC plug in the AC outlet and repeat each of the above
measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) may be used
to make the hot checks, leakage current must not exceed 1/2 milliamp.
In case a measurement is outsideof the limits specified, there is a
possibility of a shock hazard, and the equipment should be repaired
and rechecked before it is returned to the customer.
3. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such
components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistorsand semiconductor "chip"
components. The following techniques should be used to help reduce the incidence of component
damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or
4

semiconductor-equipped assembly, drain off any ESD on your body by
touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging ESD wrist strap, whichshould be
removed for potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES devices, place
the assembly on a conductive surface such as alminum foil, to prevent
electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static solder removal device. Some solder removal
devices not classified as "anti-static (ESD protected)" can generate
electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical
charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package
until immediately before you are ready to install it. (Most replacement
ES devices are packaged with leads electrically shorted together by
conductive foam, alminum foil or comparableconductive material).
7. Immediately before removing the protective material from the leads of
a replacement ES device, touch the protective material to the chassis
or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all
other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES
devices. (Otherwise hamless motion such as the brushing together of
your clothes fabric or the lifting of your foot from a carpeted floor can
generate static electricity (ESD) sufficient todamage an ES device).
4. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
5

The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For
service and repair work, we’d suggest the use of Pb free solder as well, although Pb solder may be
used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
stamped on the back of PCB.
Caution
- Pb free solder has a higher melting point than standard solder.
Typically the melting point is 50 ~ 70 °F (30 ~ 40°C) higher. Please use
a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
- Pb free solder will tend to splash when heated too high (about 1100 °F
or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free
solder on the pins or solder area before applying Pb solder. If this is
not practical, be sure to heat the Pb free solder until it melts, before
applying Pb solder.
- After applying PbF solder to double layered boards, please check the
component side for excess solder which may flow onto the opposite
side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin,
silver, copper) solder. However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also
beused.
6

5. PCB Structure sheet of GPH5D chassis
Board Name Function Remarks
D1 Format Converter 1
D2 Plasma AI Sub-Field
Processor
1
ZAudio out
SS Sustain out 1
SC Scan out 1
SU Sustain connection (Upper) 1
SD Sustain connection (Lower) 1
C1 Data Drive (Upper Left)
C2 Data Drive (Upper Right)
C3 Data Drive (Lower Right)
C4 Data Drive (Lower Left)
H3 Speaker terminal
S1 Power switch
SS2 Sustain connection (Upper)
SS3 Sustain connection (Lower)
V1 Front SW. & Remote receiver
FLine filter
PPower supply 1
P3 Drive voltage oscillator
P5 Primary oscillator
P6 PFC oscillator
P7 Drive voltage protection
P8 Process voltage protection
HX PC_type_Input terminal
HY BNC_type_Input terminal 2
HZ RCA type_Input terminal 3
Remarks
1. Recommend PCB's for initial service for GPH5D chassis.
7