Panasonic TH-50PHD8UK - 50" Plasma Panel User manual

©2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-50PHD8UK
GPH8D Chassis
High Definition Plasma Display
Specifications
Power Source 120 V
A
C, 50/60Hz
Power Consumption
Maximum 440 W
Stand-b
y
condition Save OFF 0.6 W, Save ON 0.4 W
Power off condition 0.1W
Plasma Displa
y
panel Drive method:
A
C type 50-inch,
16:9 aspect ratio
Contrast Ratio 3000:1
Screen size 43.5” (1,106 mm) (W) × 24.5” (622 mm) (H) × 50” (1,269 mm) (diagonal)
(No. of pixels) 1,049,088 (1,366 (W) × 768 (H) [4,098 × 768 dots]
Operating condition
Temperature 32 °F - 104 °F (0 °C - 40 °C)
Humidit
y
20 % - 80 %
Applicabl
e
signals
Color System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p 25p
30p 24sF .... SMPTE274M, 1250 (1080) / 50i
PC signals VGA, SVGA, XGA,
SXGA, UXG
A
..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
A
V VIDEO IN / OUT (BNC) 1.0 Vp-p (75-ohm or high impedance)
S VIDEO IN (MINI DIN 4PIN) Y: 1 Vp-p (75-ohm), C: 0.286 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
COMPONENT / RGB
Y
/ G (BNC) 1.0 Vp-p
/
composite (75-ohm)
0.7 Vp-p
/
non-composite (75-ohm)
PB/B (BNC), PR/R (BNC) 0.7 Vp-p (75-ohm)
A
UDIO IN (RCA PIN JACK × 2) 0.5 Vrms (high impedance)
PC (HIGH-DENSIT
Y
Mini-D-SUB 15PIN) R,G,B
/
0.7 Vp-p (75-ohm)
ORDER NO. ITD0508043CE
D10 Canada: B07

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 PCB Structure sheet of GPH8D chassis 8
6 Service Hint 9
7 Disassembly 10
7.1. Removal of the Back Cover 10
7.2. Removal of the HA-Board and the HB-Board 10
7.3. Removal of the Slot Block 10
7.4. Removal of the J-Board 10
7.5. Removal of the HX-Board 11
7.6. Removal of the PB-Board 11
7.7. Removal of the D-Board 11
7.8. Removal of the P-Board 12
7.9. Removal of the H3-Board 12
7.10. Removal of the SU-Board and the SD-Board 12
7.11. Removal of the SC-Board 13
7.12. Removal of the SS2-Board and the SS3-Board 13
7.13. Removal of the SS-Board 13
7.14. Removal of the C1, C2, C3, C4, C5 and the C6-Board 14
7.15. Removal of the S1-Board 15
7.16. Removal of the Fan 16
7.17. Removal of the Escutcheon 16
7.18. Removal of the V1-Board and V2-Board 17
7.19. Removal of the Plasma Panel 17
8 Location of Lead Wiring 21
9 Adjustment Procedure 23
9.1. Driver Set-up 23
9.2. Initialization Pulse Adjust 24
9.3. P.C.B. (Printed Circuit Board) Remove 24
9.4. Adjustment Volume Location 25
9.5. Test Point Location 25
10 Service mode 26
10.1. CAT (computer Aided Test) mode 26
10.2. IIC mode structure (following items value is sample data.)
28
11 Alignment 29
11.1. PC / RGB panel white balance 29
11.2. HD / 525ip / 625ip panel white balance 31
12 Trouble shooting guide 33
12.1. Self Check 33
12.2. No Power 34
12.3. No Picture 34
12.4. Local screen failure 35
13 Option Setting 36
14 Circuit Board Layout 39
14.1. P-Board 39
Component
Y
:1.0 Vp-p (75-ohm : include sync)
PB
/
CB:0.7 Vp-p (75-ohm)
PR
/
CR:0.7 Vp-p (75-ohm)
HD, VD
/
1.0 - 5.0 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms (high impedance)
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
SPEAKERS (6Ω) 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter EUR7636070R
Batteries 2×
AA
Size
Fixing bands (TMME203 or TMME187) × 2
Dimensions (
W
×H×D) 47.6” (1,210 mm) × 28.5” (724 mm) × 3.7” (95 mm)
(exclusive of protruding portion)
Mass (weight)
main unit onl
y
approx. 94.8 lbs
with speakers approx. 103.6 lbs
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
CONTENTS
Page Page
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14.2. PB-Board 42
14.3. HA-Board 43
14.4. HB-Board 44
14.5. HX-Board 45
14.6. J-Board 46
14.7. D-Board 48
14.8. C1-Board 50
14.9. C2-Board 51
14.10. C3-Board 52
14.11. C4-Board 53
14.12. C5-Board 54
14.13. C6-Board 55
14.14. SC-Board 56
14.15. SU-Board 59
14.16. SD-Board 60
14.17. SS, SS2 and SS3-Board 61
14.18. H3, S1, V1 and V2-Board 63
15 Schematic Diagrams 65
15.1. Schematic Diagram Notes 65
15.2. Main Block Diagram 66
15.3. P-Board Block Diagram 67
15.4. P-Board (1 of 2) Schematic Diagram 68
15.5. P-Board (2 of 2) Schematic Diagram 69
15.6. PB-Board Block and Schematic Diagram 70
15.7. HA-Board Block and Schematic Diagram 71
15.8. HB-Board Block Diagram 72
15.9. HB-Board (1 of 2) Schematic Diagram 73
15.10. HB-Board (2 of 2) Schematic Diagram 74
15.11. HX-Board Block and Schematic Diagram 75
15.12. J-Board (1 of 2) and H3-Board Block Diagram 76
15.13. J-Board (2 of 2) Block Diagram 77
15.14. J-Board (1 of 4) and H3-Board Schematic Diagram 78
15.15. J-Board (2 of 4) Schematic Diagram 79
15.16. J-Board (3 of 4) Schematic Diagram 80
15.17. J-Board (4 of 4) Schematic Diagram 81
15.18. D-Board (1 of 2) Block Diagram 82
15.19. D-Board (2 of 2) Block Diagram 83
15.20. D-Board (1 of 12) Schematic Diagram 84
15.21. D-Board (2 of 12) Schematic Diagram 85
15.22. D-Board (3 of 12) Schematic Diagram 86
15.23. D-Board (4 of 12) Schematic Diagram 87
15.24. D-Board (5 of 12) Schematic Diagram 88
15.25. D-Board (6 of 12) Schematic Diagram 89
15.26. D-Board (7 of 12) Schematic Diagram 90
15.27. D-Board (8 of 12) Schematic Diagram 91
15.28. D-Board (9 of 12) Schematic Diagram 92
15.29. D-Board (10 of 12) Schematic Diagram 93
15.30. D-Board (11 of 12) Schematic Diagram 94
15.31. D-Board (12 of 12) Schematic Diagram 95
15.32. C1, C2, C5 and C6-Board Block Diagram 96
15.33. C3 and C4-Board Block Diagram 97
15.34. C1-Board (1 of 2) Schematic Diagram 98
15.35. C1-Board (2 of 2) Schematic Diagram 99
15.36. C2-Board (1 of 2) Schematic Diagram 100
15.37. C2-Board (2 of 2) Schematic Diagram 101
15.38. C3-Board (1 of 2) Schematic Diagram 102
15.39. C3-Board (2 of 2) Schematic Diagram 103
15.40. C4-Board (1 of 2) Schematic Diagram 104
15.41. C4-Board (2 of 2) Schematic Diagram 105
15.42. C5-Board (1 of 2) Schematic Diagram 106
15.43. C5-Board (2 of 2) Schematic Diagram 107
15.44. C6-Board (1 of 2) Schematic Diagram 108
15.45. C6-Board (2 of 2) Schematic Diagram 109
15.46. SC-Board Block Diagram 110
15.47. SC-Board (1 of 2) Schematic Diagram 111
15.48. SC-Board (2 of 2) Schematic Diagram 112
15.49. SU-Board Block Diagram 113
15.50. SU-Board (1 of 2) Schematic Diagram 114
15.51. SU-Board (2 of 2) Schematic Diagram 115
15.52. SD-Board Block Diagram 116
15.53. SD-Board (1 of 2) Schematic Diagram 117
15.54. SD-Board (2 of 2) Schematic Diagram 118
15.55. SS, SS2 and SS3-Board Block Diagram 119
15.56. SS-Board (1 of 2), SS2 and SS3-Board Schematic
Diagram 120
15.57. SS-Board (2 of 2) Schematic Diagram 121
15.58. S1, V1 and V2-Board Block and Schematic Diagram 122
16 Parts Location 123
16.1. Exploded View 123
16.2. Cable relation 125
16.3. Packing summary 126
17 Mechanical Replacement Parts List 128
18 Replacement Parts List 129
18.1. Relpacement Parts List Notes 129
18.2. Electrical Replacement Parts List 130
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1 Applicable signals
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2.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1 .)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1 .
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
5
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3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistorsand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder Remove device. Some solder Remove devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
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5 PCB Structure sheet of GPH8D chassis
Board Name Function Remarks
D Digital Signal Processor,
Format Coverter,
Plasma Ai Processor
1
J Slot Interface (Audio/Video/Sync input Switch),
SYNC processor, Audio processor,
Speaker out amplifier,
DC-DC converter
1
SS Sustain drive 1
SC Scan drive 1
SU Scan out (Upper) 1
SD Scan out (Lower) 1
C1 Data Drive (Upper Right)
C2 Data Drive (Upper Center)
C3 Data Drive (Upper Left)
C4 Data Drive (Lower Left)
C5 Data Drive (Lower Center)
C6 Data Drive (Lower Right)
H3 Speaker terminal
S1 Power switch
SS2 Sustain out (Upper)
SS3 Sustain out (Lower)
V1 LED (stand-by / Power on) & Remote receiver 1
V2 Key switch 1
PB Fan control 1
P Line filter, Power supply 1
HX PC / RS-232C
HB BNC Composite Video
HA BNC Component Video
Remarks
1: Recommend PCB´s for initial service for GPH8D chassis.
8
TH-50PHD8UK

6 Service Hint
Note:
Extension cable kit for Slot Board is supplied as service fixtures and tools.
(Part No. TZSC07040)
9
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7 Disassembly
· To Remove P.C.B. , wait for 1 minute after power was off
for discharge from electrolysis capacitors.
· and marks indicate screw positions.
7.1. Removal of the Back Cover
1.Remove the screws (×19 ,×6 ,×4 ) and then remove
the Back Cover.
7.2. Removal of the HA-Board and
the HB-Board
· Removal of the HB-Board
1.Remove the 4 screws(A) of the HB Terminal Block and then
remove the HB Terminal Block.
2.Remove the 4 screws(B).
3.Remove the 2 screws(C) and then remove the HB-Board.
· Removal of the HA-Board
1.Remove the 4 screws(D) of the HA Terminal Block and then
remove the HA Terminal Block.
2.Remove the 4 screws(E).
3.Remove the 2 screws(F) and then remove the HA-Board.
7.3. Removal of the Slot Block
1.Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15).
2.Remove the 4 screws and then remove the Slot Block.
7.4. Removal of the J-Board
1.Remove the HA Terminal Block and the HB Terminal Block.
(Reference to remove of the HA-Board and remove of the
HB-Board)
2.Remove the Slot Block.
(Reference to remove of the Slot Block)
3.Remove the 8 screws and then remove the J-Board.
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7.5. Removal of the HX-Board
1.Remove the HA Terminal Block and the HB Terminal Block.
(Reference to remove of the HA-Board and remove of the
HB-Board)
2.Remove the Slot Block.
(Reference to remove of the Slot Block)
3.Remove the J-Board.
(Reference to remove of the J-Board)
4.Remove the 6 screws and then remove the Slot Case.
5.Remove the 4 Hexagonal-Head screws and the screw of
the HX-Board and then remove the HX-Board.
7.6. Removal of the PB-Board
1.Disconnect the couplers(PB30, PB31, PB33, PB35).
2.Remove the screw and then remove the PB-Board.
7.7. Removal of the D-Board
1.Disconnect the couplers(PB30, PB31, PB33, PB35).
2.Remove the 3 screws and then remove the PB-Board
Block.
3.Disconnect the couplers(D1, D3, D5, D20, D25).
4.Disconnect the flexible cables(D31, D32, D33, D34).
5.Remove the 3 screws and then remove the D-Board.
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7.8. Removal of the P-Board
1.Remove the 4 screws and then remove the Case Cover.
2.Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23,
P25, P30).
3.Remove the 4 screws and then remove the P-Board.
7.9. Removal of the H3-Board
1.Remove the each 1 screw and then remove the Speaker
Terminal Blocks(L, R).
2.Disconnect the coupler (H37).
3.Remove the 3 screws(D) and then remove the H3-Board.
7.10. Removal of the SU-Board and
the SD-Board
1.Remove the Speaker Terminal Block(R).
(Reference to remove of the Speaker Terminal Block(R)).
2.Disconnect the couplers(SU45, SD46).
3.Remove the each 3 screws.
4.Slide the SU-Board and the SD-Board to the left(arrow1).
5.Disconnect the flexible cables(SU1, SU2, SU3, SU4) and
then remove the SU-Board.
6.Disconnect the flexible cables(SD1, SD2, SD3, SD4) and
then remove the SD-Board.
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7.11. Removal of the SC-Board
1.Remove the Speaker Terminal Block(R).
(Reference to remove of the Speaker Terminal Block(R)).
2.Disconnect the couplers(SC45, SC46).
3.Remove the each 3 screws.
4.Slide the SU-Board and the SD-Board to the left(arrow1).
(Reference to remove of the SU-Board and the SD-Board)
5.Disconnect the couplers(SC2, SC20, SC23).
6.Remove the 9 screws and then remove the SC-Board.
7.12. Removal of the SS2-Board and
the SS3-Board
1.Disconnect the couplers(SS22, SS23).
2.Disconnect the flexible cables(SS55, SS56).
3.Remove the each 2 screws and then remove the SS2-
Board and the SS3-Board.
7.13. Removal of the SS-Board
1.Disconnect the couplers(SS11, SS12, SS20, SS21, SS34,
SS35, SS42, SS44).
2.Disconnect the flexible cables(SS51, SS52, SS53, SS54).
3.Remove the 7 screws and then remove the SS-Board.
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7.14. Removal of the C1, C2, C3, C4,
C5 and the C6-Board
1.Remove the Slot Block.
(Reference to remove of the Slot Block).
2.Remove the Speaker Terminal Block(L, R).
(Refernce to remove of the Speaker Terminal Block(L, R).
3.Remove the each 4 screws and then remove the Stand
Blocks(L, R).
4.Remove the each 3 screws and then remove the 3 Fan
Blocks.
5.Remove the 4 screws and then remove the Plate.
7.14.1. Removal of the C1-Board
1.Disconnect the flexible cable(C10).
2.Disconnect the coupler(C11).
3.Remove the 6 screws and then disconnect the flexible
cables(CA1, CA2, CA3).
4.Remove the 5 screws and then remove the C1-Board.
7.14.2. Removal of the C2-Board
1.Disconnect the flexible cables(C20, C21, C24, C25).
2.Disconnect the couplers(C22, C23).
3.Remove the 8 screws and then disconnect the flexible
cables(CA4, CA5, CA6, CA7).
4.Remove the 5 screws and then remove the C2-Board.
7.14.3. Removal of the C3-Board
1.Disconnect the flexible cable(C31).
2.Disconnect the couplers(C33, C35).
3.Remove the 8 screws and then disconnect the flexible
cables(CA8, CA9, CA10, CA11).
4.Remove the 5 screws and then remove the C3-Board.
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7.14.4. Removal of the C4-Board
1.Disconnect the flexible cable(C41).
2.Disconnect the couplers(C42, C43, C44).
3.Remove the 8 screws and then disconnect the flexible
cables(CB8, CB9, CB10,CB11).
4.Remove the 5 screws and then remove the C4-Board.
7.14.5. Removal of the C5-Board
1.Disconnect the flexible cables (C50, C51, C54, C55).
2.Disconnect the couplers(C52,C53).
3.Remove the 8 screws and then disconnect the flexible
cables(CB4, CB5, CB6, CB7).
4.Remove the 5 screws and then remove the C5-Board.
7.14.6. Removal of the C6-Board
1.Disconnect the flexible cable(C60).
2.Disconnect the coupler(C61).
3.Remove the 6 screws and then disconnect the flexible
cables(CB1, CB2, CB3).
4.Remove the 5 screws and then remove the C6-Board.
7.15. Removal of the S1-Board
1.Disconnect the coupler (SS34).
2.Remove the 2 screws(L) and then remove the S1-Board
Block.
3.Disconnect the coupler(S34).
4.Remove the 1 screw(M) and then remove the S1-Board.
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7.16. Removal of the Fan
1.Disconnect the couplers(PB31, PB33, PB35).
2.Remove the each 3 screws and then remove the Fan
Blocks(A, B, C).
3.Remove the each 2 screws(N) and then remove the 3 Fans.
4.Remove the each 4 sponge(Fan Corner) and then remove
the 3 Fans.
5.Reassemble the Fans in reverse order (4-1) and then stick
the Sponge(Fan center) on the central part of the Fan.
Note:
The Sponge(Fan center) is unsuitable to reuse.
Please use a new one at the time of Fan remove.
7.17. Removal of the Escutcheon
1.Remove the S1-Board Block.
(Reference to remove of the S1-Board Block).
2.Disconnect the couplers(V15).
3.Remove the screw and then remove the Angle.
4.Remove the coupler(J2) and then remove the 2 screws.
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5.Pull the bottom of the Escutcheon forward. (arrow1)
6.Lift up the Escutcheon to remove.(arrow2)
7.18. Removal of the V1-Board and
V2-Board
1.Operate procedure 1 to 4 of the Escutcheon remove.
2.Remove the 2 screws(N) and then remove the Angle.
3.Remove the screw(O).
4.Remove the 5key Button.
5.disconnect the coupler(V15) and then remove the V2-
Board.
6.Disconnect the coupler(V2) and then remove the V1-Board.
7.19. Removal of the Plasma Panel
1.Remove the each 4 screws and then remove the Stand
Brackets(L, R).
2.Disconnect the couplers(PB31, PB33, PB35).
3.Remove the each 3 screws and then remove the Fan
Blocks(A, B, C).
4.Remove the Slot Block.
(Reference to remove of the Slot Block).
5.Disconnect the couplers(D20, D25, PB30).
6.Disconnect the flexible cables(D31, D32, D33, D34).
7.Remove the 7 screws and then remove the PB-Board Block
and D-Board.
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8.Remove the 2 screws and then remove the Shield Plate(R).
9.Remove the Shield Plate(L).
10.Remove the 4 screws and then remove the Case Cover.
11.Disconnect the couplers(P2, P9, P11, P12, P23).
12.Remove the 4 screws and then remove the P-Board.
13.Remove the each screw and then remove the Speaker
Terminal Block(L, R).
14.Disconnect the couplers(SC45, SC46).
15.Remove the each 3 screws and then slide the SU-Board
and the SD-Board to the left(arrow1).
16.Disconnect the flexible cables (SU1, SU2, SU3, SU4, SD1,
SD2, SD3, SD4) and then remove the SU-Board and the
SD-Board.
17.Remove the 9 screws and then remove the SC-Board.
18.Remove the SS2-Board and the SS3-Board.
(Reference to remove of the SS2-Board and the SS3-
Board).
19.Disconnect the couplers(SS35, SS42, SS44).
20.Disconnect the flexible cables(SS51, SS52, SS53, SS54).
21.Remove the 7 screws and then remove the SS-Board.
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22.Remove the 22 screws.
23.Disconnect the flexible cables(CA1, CA2, CA3, CA4, CA5,
CA6, CA7, CA8, CA9, CA10, CA11).
24.Disconnect the couplers(C11, C23).
25.Disconnect the flexible cables(C10, C21, C24, C25).
26.Remove the each 5 screws and then remove the C1-Board,
the C2-Board and the C3-Board.
27.Remove the 4 screws and then remove the Plate.
28.Remove the 22 screws.
29.Disconnect the flexible cables(CB1, CB2, CB3, CB4, CB5,
CB6, CB7, CB8, CB9, CB10, CB11).
30.Disconnect the couplers(C43, C52).
31.Disconnect the flexible cables(C41, C50, C54, C55).
32.Remove the each 5 screws and then remove the C4-Board,
the C5-Board and the C6-Board.
33.Remove the 2 screws and then remove the S1-Board.
34.Remove the 2 screws and then remove the AC-Inlet.
35.Remove the 1 screw and then remove the Angle.
36.Disconnect the coupler(V15).
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TH-50PHD8UK

37.Remove the each 3 screws of the Fixed Sheets(A, B) and
then remove the Fixed Sheets(A, B).
38.Remove the 2 screws and then remove the Shield Sheet.
39.Remove the each 3 screws and then remove the Cable
Holders(A, B) and the Flexible cables(A, B).
40.Remove the 2 screws of the Escutcheon.
41.Pull the bottom of the Plasma Panel forward (arrow1).
42.Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
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