Panasonic ITD0810090CE User manual

© Panasonic Corporation 2008.
Unauthorized copying and distribution is a violation
of law.
ORDER NO. ITD0810090CE
Plasma Television
Model No. TH-65PY850D
TH-65PY850H
TH-65PY850M
TH-65PY850MR
TH-65PY850MS
GPF11DA Chassis

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1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground
such as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1

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2Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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3 Service Navigation
3.1. Service Hint
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Upper Right)
A DC-DC Converter
Speaker out, Sound Processor
AV Terminal, AV Switch, Ethernet LAN
Digital Signal Processor, Micom, HDMI Interface
Peaks PRO, GC6
C2 Data Driver (Upper Center)
C3 Data Driver (Upper Left)
C4 Data Driver (Lower Left)
C5 Data Driver (Lower Center)
C6 Data Driver (Lower Right)
D Format Converter, Plasma AI, Sub-Field Processor SC Scan Drive
K Remote receiver, Power LED SU Scan out (Upper)
S Power Switch SD Scan out (Lower)
GS SD Card Slot SS Sustain Drive
GL SD Blue LED SS2 Sustain connector (Upper)
GH HDMI4 in SS3 Sustain connector (Lower)
G Front Terminal, Key Switch PA Fan control
HC PC in, Audio out

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3.2. Applicable signals

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4 Specifications
Power Source AC 220 - 240 V, 50/60 Hz (D/H/M/MR)
AC 110 - 240 V, 50/60 Hz (MS)
Power Consumption
Average use 725W
Standby condition 0.4 W
Plasma Display panel
Aspect Ratio 16:9
Visible screen size 165 cm (diagonal)
1,434 mm (W) ×807 mm (H)
Number of pixels 2,073,600 (1,920 (W) ×1,080 (H))
Sound
Speaker Woofer ( 80mm) ×2pcs, Tweeter (23mm ×100mm) ×2pcs
Audio Output 31 W (15.5 W + 15.5 W), 10% THD
Headphones M3 (3.5 mm) stereo mini Jack ×1
PC signals VGA, SVGA, XGA, SXGA
Horizontal scanning frequency 31 - 69 kHz
Vertical scanning frequency 59 - 86 Hz
Receiving Systems / Band name
Receiving Channels
(Regular TV)
VHF BAND
2-12 (PAL/SECAM B, K1)
0-12 (PAL B AUST.)
1-9 (PAL B N.Z.)
1-12 (PAL/SECAM D)
1-12 (NTSC M Japan)
2-13 (NTSC M USA)
UHF BAND
21-69 (PAL G, H, I/SECAM G, K, K1)
28-69 (PAL B AUST.)
13-57 (PAL D, K)
13-62 (NTSC M Japan)
14-69 (NTSC M USA)
CATV
S1-S20 (OSCAR)
1-125 (USA CATV)
C13-C49 (JAPAN)
S21-S41 (HYPER)
Z1-Z37 (CHINA)
5A, 9A (AUST.)
Aerial - Rear VHF/UHF
Operating Conditions
Temperature: 0 °C - 40 °C
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 Input
AUDIO L - R RCA PIN Type ×2 0.5 V[rms]
VIDEO RCA PIN Type ×1 1.0 V[p-p] (75 Ω)
COMPONENT Y
PB/CB, PR/CR
1.0 V[p-p] (including synchronization)
±0.35 V[p-p]
AV2 Input
AUDIO L - R RCA PIN Type ×2 0.5 V[rms]
VIDEO RCA PIN Type ×1 1.0 V[p-p] (75 Ω)
COMPONENT Y
PB/CB, PR/CR
1.0 V[p-p] (including synchronization)
±0.35 V[p-p]
AV3 Input
AUDIO L - R RCA PIN Type ×2 0.5 V[rms]
VIDEO RCA PIN Type ×1 1.0 V[p-p] (75 Ω)
S VIDEO Mini DIN 4-pin Y:1.0 V[p-p] (75 Ω) C:0.286 V[p-p] (75 Ω)
AV4 Input
AUDIO L - R RCA PIN Type ×2 0.5 V[rms]
VIDEO RCA PIN Type ×1 1.0 V[p-p] (75 Ω)
S VIDEO Mini DIN 4-pin Y:1.0 V[p-p] (75 Ω) C:0.286 V[p-p] (75 Ω)

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Note
• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.
Monitor Output
AUDIO L - R RCA PIN Type ×2 0.5 V [rms] (high impedance)
VIDEO RCA PIN Type ×1 1.0 V[p-p] (75 Ω)
Others
HDMI 1-4 Input TYPE A Connectors This TV supports “HDAVI Control 3” function.
PC Input HIGH-DENSITY D-SUB 15PIN R, G, B/ 0.7 V [p-p] (75 Ω)
HD, VD/TTL Level 2.0 - 5.0 V [p-p] (high impedance)
DIGITAL AUDIO OUT PCM / Dolby Digital, Fiber optic
Card slot SD Card slot ×1
Dimensions (W ×H ×D) 1,599 mm ×993 mm ×109 mm
Mass 73.0 kg Net

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5 Service Mode
5.1. How to enter into Service Mode
While pressing [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 2 seconds.
5.1.1. Key command
[1] button...Main items Selection in forward direction
[2] button...Main items Selection in reverse direction
[3] button...Sub items Selection in forward direction
[4] button...Sub items Selection in reverse direction
[RED] button...All Sub items Selection in forward direction
[GREEN] button...All Sub items Selection in reverse direction
[VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

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5.1.2. Contents of adjustment mode
• Value is shown as a hexadecimal number.
• Preset value differs depending on models.
• After entering the adjustment mode, take note of the value in each item before starting adjustment.
5.1.3. How to exit
Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.