Panasonic TH-42PE55E User manual

ORDERNO.PCZ0509087C2
Digital Progressive Wide Plasma Television
TH-42PE55E / TH-37PE55E
GP8DEChassis
SPECIFICATIONS
Specifications
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Power
Source AC 220-240 V, 50 / 60 Hz
Power
Consumption Averageuse : 253 W(TH-37PE55E)
Averageuse : 323 W(TH-42PE55E)
Standbycondition : 0.3W(Without Tuner Lock On)
Standbycondition : 16 W(WithTuner Lock On)
Plasma
Displaypanel
Drivemethod AC type
Aspect Ratio 16:9
Contrast Ratio 4000:1
Visiblescreensize
(No.of pixels) 818 mm (W) × 461 mm (H) × 939 mm (diagonal) (37-inch)
920 mm (W) × 518 mm (H) × 1,056 mm (diagonal) (42-inch)
408,960 (852 (W) × 480 (H)) [2,556 × 480 dots]
Sound
Speaker 12 cm × 6cm × 2pcs, 6
AudioOutput 16 W(8W+ 8W), 10%THD
Scanning
format 480i(60Hz), 480p(60Hz), 576i(50Hz), 576p(50Hz), 720p(50Hz), 720p(60Hz), 1080i(50Hz), 1080i(60Hz)
Receiving
Systems
/
Band name PALB, G
VHFE2- E12 UHFE21 - E69
CATV (S01 - S05) CATV S1- S10 (M1- M10)
CATV S11 - S20 (U1- U10) CATV S21 - S41 (Hyperband)
PAL525/60
Playback of NTSC tapefromsome PALVideorecorders (VCR)
DVB
Digital terrestrial services viaVHF/ UHFaerial input.
M.NTSC
Playback fromM. NTSC Videorecorders (VCR)
NTSC (AV input only)
Playback fromNTSC Videorecorders (VCR)
Aerial
- Rear UHF/ VHF
Operating
Conditions Temperature : 0°C - 40 °C
Humidity: 20 %- 80 %RH (non-condensing)
Connection
Terminals
AV1(Scart connector) 21 Pinterminal (Audio/Videoin, Audio/Videoout, RGB in)
AV2(Scart connector) 21 Pinterminal (Audio/Videoin, Audio/Videoout, S-Videoin, Q-Link)
AV3(Scart connector) 21 Pinterminal (Audio/Videoin, Audio/Videoout, RGB in, S-Videoin, Q-Link)
Other Inputs
COMPONENT Y 1.0Vp-p(including synchronization)
PB, PR±0.35 Vp-p
HDMI TYPE AConnector
AUDIO L- R RCAPIN Type× 2 0.5Vrms
Output
AUDIO L- R RCAPIN Type× 2 0.5Vrms (high impedance)
Dimensions
( W× H × D ) 968 mm × 641 mm × 96.5mm (37-inch)
1,068 mm × 701 mm × 96.5mm (42-inch)
Weight
28.5kgNet (37-inch)
33 kgNet (42-inch)
Notes
:
-Design and Specifi cationsaresubject to changewithoutnotice. Weightand Dimensionsshown areapproximate.
-Thisequipmentcomplies with theEMC standardslisted below.
EN55013, EN61000-3-2, EN61000-3-3, EN55020
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2005 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. Applicable signals
2. Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
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installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect ameasuring network for touch currents between each
exposed metallicpart on the set and agood earth ground such as
awater pipe, as shownin Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to
measure the potential across the measuring network.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reserve the AC plug inthe AC outlet and repeat each of the above
measure.
6. The potential at anypoint (TOUGHCURRENT) expressed as
voltage U1and U2, does not exceed the following values:
For a. c.:U1= 35 V(peak) and U2= 0.35 V(peak);
For d. c.:U1= 1.0V,
Note:
The limit value of U2= 0.35 V (peak) fora. c. and U1= 1.0 V ford. c. correspond tothe values 0.7
mA (peak) a. c. and 2.0 mA d. c.
The limit value U1= 35 V (peak) fora. c. correspond tothe value 70 mA (peak) a. c. for
frequencies greaterthan100 kHz.
7. Incase ameasurement isout of the limits specified, there isa
possibilityof ashock hazard, and the equipment shouldbe
repaired and rechecked before itisreturned to the customer.
Figure 1
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3. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistors and semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist strap, which
shouldbe removed for potential shock reasons prior to applying
power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
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electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or comparable
conductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient to
damage an ES device).
4. About lead free solder (PbF)
Note: Leadis listedas (Pb) inthe periodic table of elements.
Inthe information below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).
That is Tin(Sn), Silver(Ag) and Copper(Cu) although othertypes are available.
This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.
Forservice and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder
maybe used.
PCBs manufacturedusing leadfree solderwill have the PbF withina leaf Symbol
stampedon the back of PCB.
Caution
-Pb free solder has ahigher melting point than standard solder.
Typicallythe melting point is50 ~ 70 °F (30~40 °C)higher. Please
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use ahigh temperature soldering iron and set itto 700 ± 20 °F (370
± 10 °C).
-Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C).
Ifyou must use Pb solder, please completelyremove all of the Pb
free solder on the pins or solder area before applying Pb solder. If
thisisnot practical, be sure to heat the Pb free solder until it
melts, before applying Pb solder.
-After applying PbF solder to doublelayered boards, please check
the component side for excess solder which mayflow onto the
opposite side. (see figure below)
SuggestedPbfree solder
There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu
(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder
canalsobe used.
5. Service Hint
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BoardName Function BoardName Function
PPowerSupply D Format Converter, Plasma AI
Processor
PA DC-DC Converter, PowerSOS Z SpeakerAMP
PB AudioPower C1 Data Driver(Left)
H AV Terminal, AV Switch, MSP C2 Data Driver(Right)
TA Tuner SC ScanDrive
DV HDMI Interface
None serviceable
DV-Boardshouldbe exchanged
forservice.
SU Scanout (Upper)
SD Scanout (Lower)
SS SustainDrive
XV D-TV Interface K Remote receiver, Keyscan
DG Digital Signal Processor S PowerSwitch
6. Plasma panel replacement method
6.1. Remove the Back cover.
1. See Service Hint (Section 5).
6.2. Remove the P-Board.
Caution:
To remove P.C.B., wait1minute after power was off for discharge
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from electrolisiscapacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23 and P25).
2. Remove the screws(×5 )and remove the P-Board.
6.3. Remove the PB-Board
1. Unlock the cableclampers to free the cable.
2. Disconnect the couplers (PB5and PB7).
3. Remove the screws(×3 )and remove the PB-Board metal frame.
4. Remove the screws(× 4 )and remove the PB-Board.
6.4. Remove the D-Board
1. Remove the PB-Board.
2. Disconnect the couplers (D3, D5, D20 and D25).
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3. Disconnect the flexiblecables (D33 and D34).
4. Remove the screws(×4 )and remove the D-Board.
6.5. Remove the rear terminal cover
1. Remove the screws(×4 , ×7 , ×2 ).
2. Remove the rear terminal cover.
6.6. Remove the metal frame
1. Unlock the cableclampers to free the cable.
2. Disconnect the couplers (D3, D5, H7, P10 and PB7) and relay
connector (SP-R, SP-L).
3. Remove the screws(×5 )remove the metal frame.
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