Panasonic TH-42PV70AZ Viera User manual

©2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-42PV70AZ
TH-42PV70H
TH-42PV70M
TH-42PV70MR
TH-42PV70MT
GPH10DA Chassis
Plasma Television
Specifications
Power Source
A
C 220-240 V, 50 / 60 Hz
Power Consumption
Average use 341 W
Standby condition 0.7 W
Display panel
Aspect Ratio 16 : 9
Visible screen size 106 cm (diagonal)
922 mm (W) × 518 mm (H)
Number of pixels 786,432 (1,024 (W) × 768 (H)) [3,072 × 768 dots]
Sound
Speaker 120 mm × 60 mm × 2 pcs, 8 ohm
Audio Output 20 W [10 W + 10 W] (10 % THD)
Headphones M3 (3.5 mm) stereo mini Jack × 1
PC signals VGA, SVGA, XGA
SXGA ...... (compressed)
Horizontal scanning frequency 31 - 69 kHz
Vertical scanning frequency 59 - 86 Hz
Receiving Systems/Band name
ORDER NO.MD0704001CE

Receiving Channels VHF BAND
(Regular TV) 2-12 (PAL/SECAM B, K1) 0-12 (PAL B AUST.)
1-9 (PAL B N.Z.) 1-12 (PAL/SECAM D)
1-12 (NTSC M Japan) 2-13 (NTSC M USA)
UHF BAND
21-69 (PAL G, H, I/SECAM G, K, K1) 28-69 (PAL B AUST.)
13-57 (PAL D, K) 13-62 (NTSC M Japan)
14-69 (NTSC M USA)
CATV
S1-S20 (OSCAR) 1-125 (USA CATV)
C13-C49 (JAPAN) S21-S41 (HYPER)
Z1-Z37 (CHINA) 5A, 9A (AUST.)
Aerial - Rear VHF / UHF
Operating Conditions Temperature: 0 °C - 40 °C
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 Input
AUDIO L - R RCA PIN Type × 2 0.5 V[rms]
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
S VIDEO Mini DIN 4-pin Y:1.0 V[p-p] (75 ohm) C:0.286 V[p-p] (75 ohm)
AV2 Input
AUDIO L - R RCA PIN Type × 2 0.5 V[rms]
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
COMPONENT Y 1.0 V [p-p] (including synchronization)
PB/CB, PR/CR± 0.35 V [p-p]
AV3 Input
AUDIO L - R RCA PIN Type × 2 0.5 V[rms]
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
COMPONENT Y 1.0 V [p-p] (including synchronization)
PB/CB, PR/CR± 0.35 V [p-p]
AV4 Input
AUDIO L - R RCA PIN Type × 2 0.5 V[rms]
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
S VIDEO Mini DIN 4-pin Y:1.0 V[p-p] (75 ohm) C:0.286 V[p-p] (75 ohm)
Others
HDMI1 / 2 Input TYPE A Connectors
· This TV supports “HDAVI Control 2” function.
PC Input HIGH-DENSITY D-SUB 15PIN R,G,B/0.7 V [p-p] (75 ohm)
HD, VD/TTL Level 2.0 - 5.0 V [p-p] (high impedance)
Audio Input RCA PIN Type × 2 0.5 V[rms]
Monitor Output
AUDIO L-R RCA PIN Type × 2 0.5 V [rms] (high impedance)
VIDEO RCA PIN Type × 1 1.0 V[p-p] (75 ohm)
Dimensions (W × H × D) 1,020 mm × 750 mm × 320 mm (With Pedestal)
1,020 mm × 705 mm × 94 mm (TV only)
Mass 30.0 k Net (With Pedestal)
28.0 k Net (TV only)
Note:
· Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
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1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
2.2. Touch-Current Check 6
3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 Service Hint 9
6 Plasma panel replacement method 10
6.1. Remove the rear cover 10
6.2. Remove the rear terminal cover 10
6.3. Remove the P-Board 10
6.4. Remove the PA-Board 10
6.5. Remove the Tuner unit 10
6.6. Remove the DG-Board 11
6.7. Remove the H-Board 11
6.8. Remove the D-Board 11
6.9. Remove the SU-Board 11
6.10. Remove the SD-Board 12
6.11. Remove the SC-Board 12
6.12. Remove the SS-Board 12
6.13. Remove the stand brackets 12
6.14. Remove the C1-Board 13
6.15. Remove the C2-Board 13
6.16. Remove the front bracket 13
6.17. Remove the G-Board 13
6.18. Remove the speaker L, R 13
6.19. Remove the S-Board 14
6.20. Remove the K-Board 14
6.21. Remove the Plasma panel section from the Cabinet assy
(glass) 14
6.22. Replace the plasma panel (finished) 15
7 Caution statement 16
7.1. Caution statement. 16
8 Location of Lead Wiring 17
8.1. Lead of Wiring (1) 17
8.2. Lead of Wiring (2) 18
9 Self-check Function 19
9.1. Check of the IIC bus lines 19
9.2. Power LED Blinking timing chart 20
9.3. No Power 21
9.4. No Picture 22
9.5. Local screen failure 23
10 Service Mode 24
10.1. How to enter into Service Mode 24
10.2. Service tool mode 26
11 Adjustment Procedure 27
11.1. Driver Set-up 27
11.2. Initialization Pulse Adjust 28
11.3. P.C.B. (Printed Circuit Board) exchange 28
11.4. Adjustment Volume Location 29
11.5. Test Point Location 29
12 Adjustment 30
12.1. Sub-Contrast adjustment 30
12.2. PAL panel white balance adjustment 31
12.3. HD white balance adjustment 32
13 Hotel mode 33
14 Conductor Views 35
14.1. P-Board 35
14.2. PA-Board 38
14.3. H-Board 39
14.4. DG-Board 41
14.5. D-Board 44
14.6. C1-Board 46
14.7. C2-Board 47
14.8. SC-Board 48
14.9. SU-Board 51
14.10. SD-Board 52
14.11. SS-Board 53
14.12. K, and S-Board 55
14.13. G-Board 56
15 Schematic and Block Diagram 57
15.1. Schematic Diagram Note 57
15.2. Main Block Diagram 58
15.3. P-Board Block Diagram 59
15.4. P-Board (1 of 6) Schematic Diagram 60
15.5. P-Board (2 of 6) Schematic Diagram 61
15.6. P-Board (3 of 6) Schematic Diagram 62
15.7. P-Board (4 of 6) Schematic Diagram 63
15.8. P-Board (5 of 6) Schematic Diagram 64
15.9. P-Board (6 of 6) Schematic Diagram 65
15.10. PA-Board Block Diagram 66
15.11. PA-Board Schematic Diagram 67
15.12. H-Board (1 of 2) Block Diagram 68
15.13. H-Board (2 of 2) Block Diagram 69
15.14. H-Board (1 of 5) Schematic Diagram 70
15.15. H-Board (2 of 5) Schematic Diagram 71
15.16. H-Board (3 of 5) Schematic Diagram 72
15.17. H-Board (4 of 5) Schematic Diagram 73
15.18. H-Board (5 of 5) Schematic Diagram 74
15.19. DG-Board (1 of 3) Block Diagram 75
15.20. DG-Board (2 of 3) Block Diagram 76
15.21. DG-Board (3 of 3) Block Diagram 77
15.22. DG-Board (1 of 9) Schematic Diagram 78
15.23. DG-Board (2 of 9) Schematic Diagram 79
15.24. DG-Board (3 of 9) Schematic Diagram 80
15.25. DG-Board (4 of 9) Schematic Diagram 81
15.26. DG-Board (5 of 9) Schematic Diagram 82
15.27. DG-Board (6 of 9) Schematic Diagram 83
15.28. DG-Board (7 of 9) Schematic Diagram 84
15.29. DG-Board (8 of 9) Schematic Diagram 85
15.30. DG-Board (9 of 9) Schematic Diagram 86
CONTENTS
Page Page
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15.31. D-Board Block Diagram 87
15.32. D-Board (1 of 6) Schematic Diagram 88
15.33. D-Board (2 of 6) Schematic Diagram 89
15.34. D-Board (3 of 6) Schematic Diagram 90
15.35. D-Board (4 of 6) Schematic Diagram 91
15.36. D-Board (5 of 6) Schematic Diagram 92
15.37. D-Board (6 of 6) Schematic Diagram 93
15.38. C1 and C2-Board Block Diagram 94
15.39. C1-Board (1 of 2) Schematic Diagram 95
15.40. C1-Board (2 of 2) Schematic Diagram 96
15.41. C2-Board (1 of 2) Schematic Diagram 97
15.42. C2-Board (2 of 2) Schematic Diagram 98
15.43. SC-Board Block Diagram 99
15.44. SC-Board (1 of 2) Schematic Diagram 100
15.45. SC-Board (2 of 2) Schematic Diagram 101
15.46. SU and SD-Board Block Diagram 102
15.47. SU-Board (1 of 2) Schematic Diagram 103
15.48. SU-Board (2 of 2) Schematic Diagram 104
15.49. SD-Board (1 of 2) Schematic Diagram 105
15.50. SD-Board (2 of 2) Schematic Diagram 106
15.51. SS-Board Block Diagram 107
15.52. S and SS-Board (1 of 2) Schematic Diagram 108
15.53. SS-Board (2 of 2) Schematic Diagram 109
15.54. G and K-Board Schematic Diagram 110
16 Exploded Views & Replacement Parts List 111
16.1. Exploded Views 111
16.2. Packing Exploded Views (1) 112
16.3. Packing Exploded Views (2) 113
16.4. Packing Exploded Views (3) 114
16.5. Accessory 115
16.6. Replacement Parts List Notes 116
16.7. Mechanical Replacement Parts List 117
16.8. Electrical Replacement Parts List 118
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1 Applicable signals
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2 Safety Precautions
2.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the wires
have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1
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3 Prevention of Electrostatic Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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Remove the Rear Cover
5 Service Hint
Board Name Function Board Name Function
P Power Supply D Format Converter, Plasma AI, Sub-Field Processor
DG Digital Signal Processor, Micon, HDMI Interface
Peaks Lite 2
C1 Data Driver (Lower Right)
C2 Data Driver (Lower Left)
K Remote receiver, Power LED SC Scan Drive
S Power Switch SU Scan out (Upper)
H Speaker out, Sound Processor
AV Terminal, AV Switch
SD Scan out (Lower)
SS Sustain Drive
PA DC-DC Converter G Key Switch, Front Terminal
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6.1. Remove the rear cover
1. See Service Hint (Section 5)
6.2. Remove the rear terminal
cover
1. Remove the screws (×9 ,×4 ,×2 ,×2 ).
2. Remove the rear terminal cover.
6.3. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for
discharge from electrolysis capacitors.
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (P2, P5, P9, P11, P12 and P25).
3. Remove the screws (×9 ) and remove the P-Board.
6.4. Remove the PA-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (PA3, PA4 and PA5).
3. Remove the screws (×3 ) and remove the PA-Board.
6.5. Remove the Tuner unit
1. Unlock the cable clampers to free the cable.
2. Disconnect the connectors (H3, H4, H12, H51, DG1, and
DG5).
3. Remove the screws (×4 ) and remove the tuner unit.
6 Plasma panel replacement method
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6.6. Remove the DG-Board
1. Remove the tuner unit. (See section 6.5.)
2. Remove the screw (×1 ) and remove the SD card
bracket.
3. Disconnect the connectors (DG2 and DG6)
4. Remove the screws (×6 ) and remove the DG-Board.
6.7. Remove the H-Board
1. Remove the tuner unit (See section 6.5.)
2. Remove the screw (×1 ) and remove the tuner fixing
metal.
3. Remove the screw (×7 ) and remove the H-Board.
6.8. Remove the D-Board
1. Remove the tuner unit. (See section 6.5.)
2. Disconnect the connectors (D5 and D25).
3. Disconnect the flexible cables (D20, D31 and D32).
4. Remove the screws (×4 ) and remove the D-Board.
6.9. Remove the SU-Board
1. Remove the screws (×2 ).
2. Remove the flexible cables (SU1, SU2, SU3 and SU4)
connected to the SU-Board and remove the bridge
connector (SC45-SU45).
3. Slide the SU-Board to the left to disconnect from a
connector (SC41-SU41) on the SC-Board and remove the
SU-Board.
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6.10. Remove the SD-Board
1. Remove the screws (×2 ).
2. Remove the flexible cables (SD1, SD2, SD3 and SD4)
connected to the SD-Board and remove the bridge
connector (SC46-SD46).
3. Slide the SD-Board to the left to disconnect from a
connector (SC42-SD42) on the SC-Board and remove the
SD-Board.
6.11. Remove the SC-Board
1. Remove the SU-Board and SD-Board. (See section 6.9.
and 6.10.)
2. Unlock the cable clampers to free the cable.
3. Disconnect the connector (SC2).
4. Disconnect the flexible cable (SC20).
5. Remove the screws (×6 ) and remove the SC-Board.
6.12. Remove the SS-Board
1. Disconnect the connectors (SS11, SS12, SS23 and SS34).
2. Disconnect the flexible cables (SS53A, SS54A, SS55A and
SS56A).
3. Remove the screws (×6 ) and remove the SS-Board.
6.13. Remove the stand brackets
1. Remove the plasma panel section from the servicing stand
and lay on a fiat surface such as a table (covered) with the
plasma panel surface facing downward.
2. Remove the stand brackets (left, right) fastening screws (×6
each) and remove the stand brackets (left, right).
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6.14. Remove the C1-Board
1. Remove the tuner unit. (See section 6.5.)
2. Unlock the cable clampers to free the cable.
3. Remove the flexible cables holder fastening screws (×8
).
4. Disconnect the flexible cables (CB1, CB2, CB3 and CB4).
5. Disconnect the flexible cables (C10 and C11).
6. Remove the screws (×4 ) and remove the C1-Board.
6.15. Remove the C2-Board
1. Remove the tuner unit. (See section 6.5.)
2. Unlock the cable clampers to free the cable.
3. Remove the flexible cables holder fastening screws (×8
).
4. Disconnect the flexible cables (CB5, CB6, CB7 and CB8).
5. Disconnect the flexible cables (C20 and C21).
6. Disconnect the connector (C23).
7. Remove the screws (×4 ) and remove the C2-Board.
6.16. Remove the front bracket
1. Disconnect the connector (H51). (See section 6.5.)
2. Remove the screws (×5 ) and remove the front bracket.
6.17. Remove the G-Board
1. Remove the front bracket. (See section 6.16.)
2. Remove the screws (×4 ) and remove the front shield
case and the control button.
3. Remove the screws (×2 ) and disconnect the connector
(G51).
4. Remove the G-Board.
6.18. Remove the speaker L, R
1. Disconnect the connector (H12). (See section 6.5.)
2. Remove the screws (×4 each) and remove the speaker
L, R.
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6.19. Remove the S-Board
1. Remove the screws (×2 ) and remove the S-Board metal
frame.
2. Disconnect the connector (S1).
3. Remove the screws (×2 ) and remove the S-Board.
6.20. Remove the K-Board
1. Remove the S-Board. (See section 6.19.)
2. Unlock the cable clampers to free the cable.
3. Disconnect the connectors (DG1). (See section 6.5.)
4. Remove the screws (×2 ) and slide to the right to remove
the K-Board.
5. Disconnect the connectors (K1) and remove the K-Board.
6.21. Remove the Plasma panel
section from the Cabinet assy
(glass)
1. Remove the plasma panel section from the servicing stand
and lay on a fiat surface such as a table (covered) with the
plasma panel surface facing downward.
2. Remove the stand brackets (left, right) fastening screws (×3
each).
3. Replace the servicing stand and stand the set.
4. Remove the cabinet assy and the plasma panel fastening
screws (×7 ).
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5. For leaving the plasma panel from the cabinet assy, pull the
bottom of the front frame forward, lift, and remove.
6. Remove the spacers and spacer rings (×6 ).
6.22. Replace the plasma panel
(finished)
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1-Board and the C2-Board, connect the flexible
cables (×16) from the Plasma panel to the C1-Board and
the C2-Board, and fit the flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (L,
R) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the cabinet assy and each P.C.Board and so on, to
the new plasma panel.
*When fitting the cabnet assy, be careful not to allow any
debris, dust or handling residue to remain between the
front glass and plasma panel.
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7 Caution statement
7.1. Caution statement.
Caution:
Please confirm that all flexible cables are assembled correctly.
Also make sure that they are locked in the connectors.
Verify by giving the flexible cables a very slight pull.
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8 Location of Lead Wiring
8.1. Lead of Wiring (1)
The wire is dressed as shown in figure.
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8.2. Lead of Wiring (2)
The wire is dressed as shown in figure.
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Use the self-check function to test the unit.
9 Self-check Function
1. Checking the IIC bus lines
2. Power LED Blinking timing
9.1. Check of the IIC bus lines
9.1.1. How to access
Self-check indication only:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control
for more than 3 seconds.
Self-check indication and forced to factory shipment setting:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote
control for more than 3 seconds.
9.1.2. Screen display
9.1.3. Check Point
Confirm the following parts if NG was displayed.
9.1.4. Exit
Disconnect the AC cord from wall outlet.
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9.2. Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.
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