Panasonic TH-42PX20U/P Operating User manual

ORDERNO. ITD0309035C1
B19 Canada: B07
High Definition Plasma Television
TH-42PX20U-P
GPH6DU Chassis
SPECIFICATIONS
Specifications
Power
Source AC 120 V, 50 / 60 Hz
Power
Consumption Maximum:595 W
Stand-bycondition :0.9W
Plasma
Displaypanel Drivemethod :AC type42-inch, 16 :9aspect ratio
Screen
Size 36.22 “ (920 mm) (W) × 20.39 “ (518 mm) (H) × 41.57 “ (1056 mm) (diagonal)
Dimensions
W
× H × D ) 44.88 “ (1140mm) × 29.8“ (757 mm) × 5.47 “ (139 mm)
Mass
(Weight) 90.4lb.(41 kg)Net
Channel
Capability-181 VHF-12 :UHF-56 :Cable-125
Sound
Speaker Woofer 80mm × 2, Tweeter 16mm × 73mm × 8
AudioOutput 26 W[ 5W+ 5W, 8W+ 8W] (10 %THD )
Headphone M3(3.5mm) Jack × 1
FEATURES
Twoscreendisplayfuctions 3D Y / C FILTER
BBE VIVA LINEAR PIP
CLOSED CAPTION V-Chip
Accessories
Supplied Remotecontrol Transmitter EUR7603ZB0
AA Battery× 2 Ferritecores (large× 5, small × 5)
AC Cord F typeAntennaAdaptor(3C-2V × 2, 5C-2V × 2)
Pedestal
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Operating
Conditions Temperature : 34 ° F- 104 ° F(0° - 40 ° C)
Humidity: 20 %- 80 %(non-condensing)
Connection
Terminals RGB input D-SUB 15pin R, G, B / 0.7Vp-p(75 )
HD, VD / 1.0-5.0Vp-p(high
impedance)
AV INPUT1-3 VIDEO
(Phono Jack Type) 1.0Vp-p(75 )
S-VIDEO
(Mini DIN 4-pin) Y :1.0Vp-p(75 ), C : 0.286
Vp
(75 )
AUDIO L-R
(Phono Jack Type× 2) 0.5Vrms
AV PROG.OUT VIDEO
(Phono Jack Type) 1.0Vp-p(75 )
AUDIO L-R
(Phono Jack Type× 2) 0.5Vrms
TO AUDIO AMP AUDIO L-R
(Phono Jack Type× 2) 0.5Vrms
COMPONENTVIDEO Y 1.0Vp-p(including
synchronization)
INPUT1-2 PB / PR ±0.35 Vp-p
AUDIO L-R
(Phono Jack Type× 2) 0.5Vrms
HDMI INPUT HDMI typeAconnector
AUDIO L-R
(Phono Jack Type× 2) 0.5Vrms
Note
:
Design
and Specifications are subject tochange without notice.Weight and Dimensions shownare
approximate.
2003 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. Applicable signals
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2. Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
2.1.1. Leakage Current ColdCheck
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
equipment such as screwheads, connectors, control shafts, etc.
When the exposed metallicpart has areturn path to thechassis,
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the reading shouldbe between 1M and 5.2M . / When the
exposed metal does not have areturn path to the chassis, the
reading must be . Figure 1
2.1.2. Leakage Current Hot Check (See Figure 1 .)
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F
capacitors, between each exposed metallicpart on the set and a
good earth ground such as awater pipe, as shownin Figure 1.
3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to
measure the potential across the resistor.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) maybe
used to make the hot checks, leakage current must not exceed 1/2
milliamp. Incase ameasurement isoutsideof the limits specified,
there isapossibilityof ashock hazard, and the equipment should
be repaired and rechecked before itisreturned to the customer.
3. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
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1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist strap,
whichshouldbe removed for potential shock reasons prior to
applying power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient
todamage an ES device).
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4. About lead free solder (PbF)
Note: Leadis listedas (Pb) inthe periodic table of elements.
Inthe information below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).
That is Tin(Sn), Silver(Ag) and Copper(Cu) although othertypes are available.
This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.
Forservice and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder
maybe used.
PCBs manufacturedusing leadfree solderwill have the PbF withina leaf Symbol
stampedon the back of PCB.
Caution
-Pb free solder has ahigher melting point than standard solder.
Typicallythe melting point is50 ~ 70 °F (30~40 °C)higher. Please
use ahigh temperature soldering iron and set itto 700 ± 20 °F (370
± 10 °C).
-Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C).
Ifyou must use Pb solder, please completelyremove all of the Pb
free solder on the pins or solder area before applying Pb solder. If
thisisnot practical, be sure to heat the Pb free solder until it
melts, before applying Pb solder.
-After applying PbF solder to doublelayered boards, please check
the component side for excess solder which mayflow onto the
opposite side. (see figure below)
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SuggestedPbfree solder
There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu
(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder
canalsobeused.
5. Service Hint
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BoardName Function BoardName Function
C1 DATA DRIVER (UPPER
RIGHT) PF LINE FILTER
C2 DATA DRIVER (UPPER
LEFT) SC SCAN DRIVE
D DIGTALSIGINALPROCESS SD SCAN OUT(DOWN)
DG DIGTALCORE MICOM SS SUSTAIN DRIVE
GFRONTTERMINAL, SWITCH SS2 SUSTAIN CONNECTION (UP)
H REAE TERMINAL SS3 SUSTAIN CONNECTION
(DOWN)
KLED, REMOTE, SU SCAN OUT(UP)
P POWER SUPPLY TA MAIN TUNER
PA DC/DC, AUDIO TB SUB TUNER
C3 DATA DRIVER (LOWER
RIGHT) JG PC/SD CARD
C4 DATA DRIVER (LOWER
LEFT) DV HDMI
S POWER SW
6. Location of Lead Wiring
6.1. Lead of Wiring (1)
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6.2. Lead of Wiring (2)
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6.3. Lead of Wiring (3)
10