Panasonic TH-50PV500A User manual

© 2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-50PV500A
TH-50PV500H
TH-50PV500M
GP8DA Chassis
High Definition Plasma Television
Power Source
A
C 220-240 V, 50 / 60 Hz
Power Consumption
A
verage use: 461 W
Standby condition: 0.3 W
Plasma Display panel
Drive method
A
C type
Aspect Ratio 16:9
Contrast Ratio 3000:1
Screen size 50-inch (127 cmV)
(Number of pixels) 1,106 mm (W) × 622 mm (H) × 1,269 mm (diagonal)
1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
Sound
Speaker Woofer (Ø 80 mm) × 2 pcs, Tweeter (16 mm × 73 mm) × 4 pcs
Audio Output 26 W (13 W + 13 W), 10 % THD
Headphones M3 (3.5 mm) Jack × 1
Applicable signals
Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 480i (60Hz), 480p (60Hz), 576i (50Hz), 576p (50Hz), 720p (50Hz), 720p (60Hz), 1080i (50Hz), 1080i (60Hz)
PC signals XGA display
VGA, SVGA, XGA
SXGA (compressed)
Horizontal scanning frequency 31 - 69 kHZ
Vertical scanning frequency 59 - 86 Hz
Receiving Systems/
Band name (PV500H/M)
ORDER NO.ITD0508045CE

Receiving Systems/
Band name (PV500A)
Receiving Channels VHF BAND UHF BAND CATV
(Regular TV) (PV500H/M) 2-12 (PAL/SECAM B, K1) 21-69 (PAL G, H, I/SECAM G, K, K1) S1-S20 (OSCAR)
0-12 (PAL B AUST.) 28-69 (PAL B AUST.) 1-125 (USA CATV)
1-9 (PAL B N.Z.) 13-57 (PAL D, K) C13-C49 (JAPAN)
1-12 (PAL/SECAM D) 13-62 (NTSC M Japan) S21-S41 (HYPER)
1-12 (NTSC M Japan) 14-69 (NTSC M USA) Z1-Z37 (CHINA)
2-13 (NTSC M USA) 5A, 9A (AUST.)
Receiving Channels VHF 0 to 12 PAL B
(PV500A) UHF 21 to 69 PAL G
S’1 to S’3 HYPER TUNER
S1 to S41 (One tuner)
Aerial-Rear UHF / VHF
Operating Conditions Temperature: 0 °C - 40 °C
Humidity: 20 % - 80% RH (non-condensing)
Connection Terminals
AV1 AUDIO L-R RCA PIN Type × 2 0.5 Vrms
Input VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
S VIDEO MINI DIN 4-Pin Y: 1.0 Vp-p (75 W) C: 0.286 Vp-p (75 W)
AV2 AUDIO L-R RCA PIN Type × 2 0.5 Vrms
Input VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
COMPONENT Y 1.0 Vp-p (including synchronization)
PB/CB,P
R/CR±0.35 Vp-p
AV3 AUDIO L-R RCA PIN Type × 2 0.5 Vrms
Input VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
S VIDEO MINI DIN 4-Pin Y: 1.0 Vp-p (75 W) C: 0.286 Vp-p (75 W)
AV4 AUDIO L-R RCA PIN Type × 2 0.5 Vrms
Input VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
COMPONENT Y 1.0 Vp-p (including synchronization)
PB/CB,P
R/CR±0.35 Vp-p
Others HDMI Input TYPE A Connecter
PC Input HIGH-DENSITY D-SUB 15PIN R, G, B/0.7 Vp-p (75 W)
HD, VD/TTL Level 2.0 - 5.0 Vp-p (high impedance)
Audio Input RCA PIN Type × 2 0.5 Vrms
Card slot SD CARD slot × 1, PC CARD slot × 1
Output AUDIO L-R RCA PIN Type × 2 0.5 Vrms (high impedance)
VIDEO RCA PIN Type × 1 1.0 Vp-p (75 W)
Dimensions (W × H × D) 1,327 mm × 843 mm × 138 mm
Weight 52.0 kg Net
Note:
·
· ·
· Design and Specifi cations are subject to change without notice. Weight and Dimensions shown are approximate.
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TH-50PV500A / TH-50PV500H / TH-50PV500M

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 Service Hint 9
6 Plasma panel replacement method 10
6.1. Remove the Back cover. 10
6.2. Remove the P-Board. 10
6.3. Remove the PB-Board 10
6.4. Remove the D-Board 10
6.5. Remove the rear terminal cover 11
6.6. Remove the metal frame 11
6.7. Remove the DV-Board 11
6.8. Remove the DG-Board 11
6.9. Remove the H-Board and TA/TB-Board 12
6.10. Remove the PA-Board 12
6.11. Remove the Z-Board 12
6.12. Remove the SU-Board 12
6.13. Remove the SD-Board 13
6.14. Remove the SC-Board 13
6.15. Remove the SS2-Board 14
6.16. Remove the SS3-Board 14
6.17. Remove the SS-Board 14
6.18. Remove the Fan 14
6.19. Remove the C1-Board 15
6.20. Remove the C2-Board 15
6.21. Remove the C3-Board 15
6.22. Remove the Speaker L, R 15
6.23. Remove the stand brackets. 16
6.24. Remove the C4-Board 16
6.25. Remove the C5-Board 17
6.26. Remove the C6-Board 17
6.27. Remove the front bracket 17
6.28. Remove the G-Board 17
6.29. Remove the GK-Board 18
6.30. Remove the GS-Board and SD-Module 18
6.31. Remove the K-Board 18
6.32. Remove the S-Board 19
6.33. Remove the Plasma panel section from the Front frame
(glass) 19
6.34. Replace the plasma panel (finished). 19
7 Location of Lead Wiring 20
7.1. Lead of Wiring (1) 20
7.2. Lead of Wiring (2) 21
7.3. Lead of Wiring (3) 22
7.4. Lead of Wiring (4) 23
7.5. Lead of Wiring (5) 24
7.6. Lead of Wiring (6) 25
7.7. Lead of Wiring (7) 26
8 Self Check 27
8.1. Power LED Blinking timing chart 28
8.2. No Power 28
8.3. No Picture 29
8.4. Local screen failure 30
9 Service Mode Function 31
9.1. How to enter SERVICE 1 31
9.2. How to enter SERVICE 2 31
9.3. Option Description 33
9.4. Option Code 35
10 Adjustment Procedure 36
10.1. Driver Set-up 36
10.2. Initialization Pulse Adjust 37
10.3. P.C.B. (Printed Circuit Board) exchange 38
10.4. Adjustment Volume Location 38
10.5. Test Point Location 38
11 Adjustment 39
11.1. PAL panel white balance adjustment 39
11.2. 1080i white balance adjustment 40
11.3. Sub bright adjustment 40
11.4. ABL adjustment 41
11.5. TEXT Vref Auto Adjustment 42
12 Hotel mode 43
13 Conductor View 45
13.1. P-Board 45
13.2. PA-Board 48
13.3. PB-Board 49
13.4. H-Board 50
13.5. DG-Board 52
13.6. TA-Board 54
13.7. TB-Board 55
13.8. DV-Board 56
13.9. Z-Board 57
13.10. D-Board 58
13.11. C1-Board 61
13.12. C2-Board 62
13.13. C3-Board 63
13.14. C4-Board 64
13.15. C5-Board 65
13.16. C6-Board 66
13.17. SC-Board 67
13.18. SU-Board 70
13.19. SD-Board 71
13.20. SS-Board 72
13.21. G-Board 74
13.22. GK, GS, K and S-Board 75
14 Block and Schematic Diagram 77
14.1. Schematic Diagram Notes 77
14.2. Main Block Diagram 78
14.3. P-Board Block Diagram 79
14.4. P-Board (1 of 2) Schematic Diagram 80
CONTENTS
Page Page
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TH-50PV500A / TH-50PV500H / TH-50PV500M

14.5. P-Board (2 of 2) Schematic Diagram 81
14.6. PA and PB-Board Block Diagram 82
14.7. PA-Board Schematic Diagram 83
14.8. PB-Board Schematic Diagram 84
14.9. H, TA and TB-Board Block Diagram 85
14.10. TA and TB-Board Schematic Diagram 86
14.11. H-Board (1 of 3) Schematic Diagram 87
14.12. H-Board (2 of 3) Schematic Diagram 88
14.13. H-Board (3 of 3) Schematic Diagram 89
14.14. G, GK, GS, K and S-Board Block Diagram 90
14.15. G-Board Schematic Diagram 91
14.16. GK, K and S-Board Schematic Diagram 92
14.17. GS-Board Schematic Diagram 93
14.18. DG-Board (1 of 2) Block Diagram 94
14.19. DG-Board (2 of 2) Block Diagram 95
14.20. DG-Board (1 of 6) Schematic Diagram 96
14.21. DG-Board (2 of 6) Schematic Diagram 97
14.22. DG-Board (3 of 6) Schematic Diagram 98
14.23. DG-Board (4 of 6) Schematic Diagram 99
14.24. DG-Board (5 of 6) Schematic Diagram 100
14.25. DG-Board (6 of 6) Schematic Diagram 101
14.26. DV-Board Block Diagram 102
14.27. DV-Board Schematic Diagram 103
14.28. Z-Board Block Diagram 104
14.29. Z-Board (1 of 2) Schematic Diagram 105
14.30. Z-Board (2 of 2) Schematic Diagram 106
14.31. D-Board Block Diagram 107
14.32. D-Board (1 of 6) Schematic Diagram 108
14.33. D-Board (2 of 6) Schematic Diagram 109
14.34. D-Board (3 of 6) Schematic Diagram 110
14.35. D-Board (4 of 6) Schematic Diagram 111
14.36. D-Board (5 of 6) Schematic Diagram 112
14.37. D-Board (6 of 6) Schematic Diagram 113
14.38. C1, C2, C5 and C6-Board Block Diagram 114
14.39. C3 and C4-Board Block Diagram 115
14.40. C1-Board (1 of 2) Schematic Diagram 116
14.41. C1-Board (2 of 2) Schematic Diagram 117
14.42. C2-Board (1 of 2) Schematic Diagram 118
14.43. C2-Board (2 of 2) Schematic Diagram 119
14.44. C3-Board (1 of 2) Schematic Diagram 120
14.45. C3-Board (2 of 2) Schematic Diagram 121
14.46. C4-Board (1 of 2) Schematic Diagram 122
14.47. C4-Board (2 of 2) Schematic Diagram 123
14.48. C5-Board (1 of 2) Schematic Diagram 124
14.49. C5-Board (2 of 2) Schematic Diagram 125
14.50. C6-Board (1 of 2) Schematic Diagram 126
14.51. C6-Board (2 of 2) Schematic Diagram 127
14.52. SC-Board Block Diagram 128
14.53. SC-Board (1 of 2) Schematic Diagram 129
14.54. SC-Board (2 of 2) Schematic Diagram 130
14.55. SU-Board Block Diagram 131
14.56. SU-Board (1 of 2) Schematic Diagram 132
14.57. SU-Board (2 of 2) Schematic Diagram 133
14.58. SD-Board Block Diagram 134
14.59. SD-Board (1 of 2) Schematic Diagram 135
14.60. SD-Board (2 of 2) Schematic Diagram 136
14.61. SS, SS2 and SS3-Board Block Diagram 137
14.62. SS-Board (1 of 2), SS2 and SS3-Board Schematic
Diagram 138
14.63. SS-Board (2 of 2) Schematic Diagram 139
15 Parts Location & Mechanical Replacement Parts List 141
15.1. Parts Location 141
15.2. Packing Exploded Views (1) 142
15.3. Packing Exploded Views (2) 143
15.4. Packing Exploded Views (3) 144
15.5. Mechanical Replacement Parts List 145
16 Electrical Replacement Parts List 147
16.1. Replacement Parts List Notes 147
16.2. Electrical Replacement Parts List 148
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TH-50PV500A / TH-50PV500H / TH-50PV500M

1 Applicable signals
5
TH-50PV500A / TH-50PV500H / TH-50PV500M

2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MWand 5.2MW.
When the exposed metal does not have a return path to the
chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
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TH-50PV500A / TH-50PV500H / TH-50PV500M

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
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TH-50PV500A / TH-50PV500H / TH-50PV500M

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
8
TH-50PV500A / TH-50PV500H / TH-50PV500M

5 Service Hint
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Up Right)
PA DC-DC Converter, Power SOS C2 Data Driver (Up Center)
PB Audio Power, Fan control C3 Data Driver (Up Left)
H AV Terminal, AV Switch C4 Data Driver (Down Left)
TA/TB Tuner C5 Data Driver (Down Center)
DV HDMI Interface C6 Data Driver (Down Right)
DG Digital Signal Processor SC Scan Drive
Z Speaker out, Audio AMP SU Scan out (Up)
D Format Converter, Plasma Ai Processor SD Scan out (Down)
K Remote receiver, OPT SS Sustain Drive
S Power Switch SS2 Sustain Connector (Up)
SD-M SD Module (MPEG4/PHOTO view, SD recording)
None serviceable.
SD Module should be exchanged for service.
SS3 Sustain Connector (Down)
G PC Card Slot, Front Terminal
GS SD Card Slot
GK Key Switch
9
TH-50PV500A / TH-50PV500H / TH-50PV500M

6.1. Remove the Back cover.
1. See Service Hint (Section 5).
6.2. Remove the P-Board.
Caution:
To remove P.C.B., wait 1 minute after power was off for
discharge from electrolisis capacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23,
P25 and P30).
2. Remove the screws (×6 ) and remove the P-Board.
6.3. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PB5, PB7, PB30, PB31, PB32,
PB33 and PB34).
3. Remove the screws (×3 ) and remove the PB-Board
metal frame.
4. Remove the screws (× 4 ) and remove the PB-Board.
6.4. Remove the D-Board
1. Remove the PB-Board.
2. Disconnect the couplers (D3, D5, D20 and D25) and
3. Disconnect the flexible cables (D31, D32, D33 and D34).
4. Remove the screws (×4 ) and remove the D-Board.
6 Plasma panel replacement method
10
TH-50PV500A / TH-50PV500H / TH-50PV500M

6.5. Remove the rear terminal
cover
1. Remove the screws (×4 ), and rhe screw (×7 ).
2. Remove the rear terminal cover.
6.6. Remove the metal frame
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (D3, D5, H7, P10 and PB7) and
relay connector (SP-R, SP-L).
3. Remove the screws (×4 ) remove the metal frame.
6.7. Remove the DV-Board
1. Remove the screws (×1 ).
2. Disconnect the coupler (DV15).
3. Remove the screws (×1 ) and remove the DV-Board.
6.8. Remove the DG-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (DG3 and DG5).
3. Disconnect the flexible cables (DG1, DG2 and DG20).
4. Remove the screws (×2 ) and remove the DG-Board.
11
TH-50PV500A / TH-50PV500H / TH-50PV500M

6.9. Remove the H-Board and
TA/TB-Board
1. Unlock the cable clampers to free the cable.
2. Remove the screws (×2 ) and remove the TA/TB-Board.
3. Disconnect the couplers (H52 and H53).
4. Disconnect the flexible ables (H1, H2, H30 and H50).
5. Remove the screws (×3 ) and remove the H-Board.
6.10. Remove the PA-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PA7 and PA10).
3. Disconnect the flexible cables (PA20 and PA30).
4. Remove the screws (×4 ) and remove the PA-Board.
6.11. Remove the Z-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (Z1 and Z2).
3. Disconnect the flexible cable (Z50).
4. Remove the screws (×2 ) and remove the Z-Board.
6.12. Remove the SU-Board
1. Remove the screws (×3 ).
2. Slide the SU-Board to the left to disconnect from a coupler
(SC41 - SU41) on the SC-Board and remove a coupler
(SU45 or SC45).
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TH-50PV500A / TH-50PV500H / TH-50PV500M

3. Remove the flexible cables (SU1, SU2, SU3 and SU4)
connected to the SU-Board, and remove the SU-Board.
6.13. Remove the SD-Board
1. Remove the screws (×3 ).
2. Slide the SD-Board to the left to disconnect from a coupler
(SC42 - SD42) on the SC-Board and remove a coupler
(SD46 or SC46).
3. Remove the flexible cables (SD1, SD2, SD3 and SD4)
connected to the SD-Board, and remove the SD-Board.
6.14. Remove the SC-Board
1. Disconnect the couplers (SC2, SC20 and SC23)
2. Remove the screws (×9 ) and remove the SC-Board.
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TH-50PV500A / TH-50PV500H / TH-50PV500M

6.15. Remove the SS2-Board
1. Disconnect the coupler (SS23) and disconnect the flexible
cable (SS55).
2. Remove the screws (×2 ) and remove the SS2-Board.
6.16. Remove the SS3-Board
1. Disconnect the coupler (SS22) and disconnect the flexible
cable (SS56).
2. Remove the screws (×2 ) and remove the SS3-Board.
6.17. Remove the SS-Board
1. Remove the SS2-Board and SS3-Board.
2. Disconnect the couplers (SS11, SS12, SS34, SS35, SS42
and SS44).
3. Disconnect the flexible cables (SS51, SS52, SS53 and
SS54).
4. Remove the screws (×7 ) and remove the SS-Board.
6.18. Remove the Fan
1. Remove the screws (×3 each) remove the fan and
disconnect the relay coupler.
14
TH-50PV500A / TH-50PV500H / TH-50PV500M

6.19. Remove the C1-Board
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×6
) and disconnect the flexible cables (CA1, CA2 and
CA3).
3. Disconnect the flexible cable (C10) and disconnect the
coupler (C11).
4. Remove the screw (×5 ) and remove the C1-Board.
6.20. Remove the C2-Board
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×8
) and disconnect the flexible cables (CA4, CA5, CA6
and CA7).
3. Disconnect the Flexible cables (C20, C21, C24 and C25)
and disconnect the couplers (C22 and C23).
4. Remove the screws (×5 ) and remove the C2-Board.
6.21. Remove the C3-Board
1. Remove the fan.
2. Remove the flexible cables holder fastening screws (×8
) and disconnect the flexible cables (CA8, CA9, CA10
and CA11).
3. Disconnect the flexible cable (C31) and disconnect the
couplers (C33 and C35).
4. Remove the screws (×5 ) and remove the C3-Board.
6.22. Remove the Speaker L, R
1. Remove the screws (×4 ) and remove the Speaker cover
L, R.
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TH-50PV500A / TH-50PV500H / TH-50PV500M

2. Disconnect the relay connector L, R.
3. Remove the Speaker L, R.
6.23. Remove the stand brackets.
1. Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered), with the
plasma panel surface facing downward.
Spread a soft cloth or similar on the table for protection, so
the panel surface is not scratched.
2. Remove the stand bracket (left, right) fastening screws (×4
each) and remove the stand brackets (left, right).
6.24. Remove the C4-Board
1. Remove the flexible cables holder fastening screws (×8
) and disconnct the flexible cables (CB8, CB9, CB10
and CB11).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C41) and disconnect the
couplers (C42, C43 and C44).
4. Remove the screws (×5 ) and remove the C4-Board.
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TH-50PV500A / TH-50PV500H / TH-50PV500M

6.25. Remove the C5-Board
1. Remove the flexible cables holder fastening screws (×8
) and disconnect hte flexible cables (CB4, CB5, CB6
and CB7).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C50, C51, C54 and C55)
and disconnect the couplers (C52 and C53).
4. Remove the screws (×5 ) and remove the C5-Board.
6.26. Remove the C6-Board
1. Remove the flexible cables holder fastening screws (×6
) and disconnect the flexible cables (CB1, CB2 and
CB3).
2. Release the speaker cables from clampers.
3. Disconnect the flexible cables (C60) and disconnect the
coupler (C61).
4. Remove the screws (×5 ) and remove the C6-Board.
6.27. Remove the front bracket
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (G2) and the flexible cables (G11
and G51).
3. Remove the screws (×7 ) and remove the front bracket.
6.28. Remove the G-Board
1. Remove the front bracket.
2. Disconnect the coupler (G3).
3. Remove the screws (×3 ) and remove the G-Board
cover.
4. Remove the screws (×5 ) and remove the G-Board unit.
5. Remove the screws (×3 ) and remove the G-Board.
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TH-50PV500A / TH-50PV500H / TH-50PV500M

6.29. Remove the GK-Board
1. Remove the G-Board.
2. Remove the GK-Board.
6.30. Remove the GS-Board and SD-
Module
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (H52) and the flexible cable (G11).
3. Remove the screws (×2 ) and remove the grommets
(×2).
4. Remove the SD-Unit.
5. Remove the screw (×1 ).
6. Remove the SD-Metal.
7. Remove the screw (×1 ).
8. Remove the SD-Module cover.
9. Disconnect the coupler (GS52) and the flexible cable
(GS12).
10. Remove the screws (×2 ).
11. Remove the GS-Board and SD-Module.
6.31. Remove the K-Board
1. Disconnect the couplers (K1).
2. Remove the screws (×2 ) and remove the grommet (×1).
3. Remove the K-Board.
18
TH-50PV500A / TH-50PV500H / TH-50PV500M

6.32. Remove the S-Board
1. Remove the screw (×2 ).
2. Disconnect the couplers (S1).
3. Remove the screws (×2 ) and remove the S-Board.
6.33. Remove the Plasma panel
section from the Front frame
(glass)
1. Remove the front frame and the plasma panel fastening
screw (×8 ).
2. Remove the front frame and the stand brackets fastening
screw (×6 ).
3. For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
6.34. Replace the plasma panel
(finished).
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1, C2, C3, C4, C5-Board and the C6-Board,
connect the flexible cables (×7) from the Plasma panel to
the C1, C2, C3, C4, C5-Board and C6-Board, and fix the
flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (left,
right) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the front frame and the each P.C.Board and so on,
to the new plasma panel.
* When fitting the front frame, be careful not to allow
any debris, dust or handling residues to remain
between the front glass and plasma panel.
19
TH-50PV500A / TH-50PV500H / TH-50PV500M

7 Location of Lead Wiring
7.1. Lead of Wiring (1)
MAKE WIRE DRESSING AS IF ILLUSTRATED BELOW.
NOTES:
1. CONNECT CONNECTORS SURELY.
2. KEEP MODERATE SLACK IN WIRES NOT TO GIVE ANY STRESS TO CONNECTORS.
3. MANAGE THE WIRES THAT ARE AROUND ELECTRIC FAN FAN ASSEMBLIES NOT TO TOUCH A BLADE OF
ELECTRIC FAN NOR EDGE OF FAN MOUNT METAL.
4. MANAGE P2 WIRE AND P23 WIRE SO THAT THEY PASS THE TOP SIDE OF P-PCB.
20
TH-50PV500A / TH-50PV500H / TH-50PV500M