Panasonic Viera TH-50PV700P User manual

© 2007 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
GPH10DE Chassis
Plasma Television
Specifications
Powe
r
Source
A
C 220-240 V, 50
/
60 Hz
Powe
r
Consumption
Aver
a
ge use 370 W (PX700B/E)
364 W (PV700F/P)
Standby condition 0.5 W (Without DVB recording)
20 W (With DVB recording)
Displa
y
panel
Aspect Ratio 16 : 9
V
isible screen size 127 cm (diagonal)
1,106 mm (W) × 622 mm (H)
Numbe
r
o
f
pixels 1,049,088 (1,366 (W) × 768 (H)) [4,098 × 768 dots]
Sound
Speake
r
Woofe
r
( 80 mm) × 2 pcs, Tweeter (23 mm × 100 mm) × 2 pcs
Audio Output 31 W [15.5 W + 15.5 W], 10 % THD
Headphones M3 (3.5 mm) stereo mini Jack × 1
PC signals VGA, SVGA, XGA
SXGA ...... (compressed)
Horizontal scanning frequency 31 - 69 kHz
Vertical scanning frequency 59 - 86 Hz
Receiving Systems/Band name
Except B model PAL B, G, H, I, SEC
A
M B, G, SEC
A
ML
/
L’
VHF E2 - E12 VHF H1 - H2 (ITALY)
VHF A - H (ITALY) UHF E21 - E69
CATV (S01 - S05) CATV S1 - S10 (M1 - M10)
CATV S11 - S20 (U1 - U10) CATV S21 - S41 (Hyperband)
PAL D, K, SEC
A
MD,
K
VHF R1 - R2 VHF R3 - R5
VHF R6 - R12 UHF E21 - E69
ORDER NO. PCZ0703018CE

PAL 525/60 Playback of NTSC tape from some PAL Video recorders
(VCR)
DVB (PX700E only) Digital terrestrial services via VHF / UHF aerial input.
M.NTSC Playback from M. NTSC Video recorders (VCR)
NTSC (A
V
input only) Playback from NTSC Video recorders (VCR)
·
· ·
· TV signals ma
y
not be received in some areas.
B model PAL I :UHF E21 - 68
PAL 525/60 Playback of NTSC tape from some PAL Video recorders
(VCR) or NTSC disc playback from DVD player and
recorder.
DVB Digital terrestrial services via UHF aerial input.
M.NTSC Playback from M.NTSC Video recorders (VCR).
NTSC (A
V
input only) Playback from NTSC Video recorders (VCR).
Aerial - Rea
r
VHF / UHF (Except B model), UHF (B model)
Operating Conditions Temperatu
r
e: 0 °C - 40 °C
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 (Sca
r
t terminal) 21 Pin terminal (Audio
/
Video in, Audio
/
Video out, RGB in)
AV2 (Sca
r
t terminal) 21 Pin terminal (Audio
/
Video in, Audio
/
Video out, S-Video in, Q-Link)
AV3 (Sca
r
t terminal) 21 Pin terminal (Audio
/
Video in, Audio
/
Video out, RGB in, S-Video in, Q-Link)
AV
4
V
IDEO RCA PIN Type × 1 1.0 V [p-p] (75 ohm)
S-
V
IDEO Mini DIN 4-pin Y: 1.0 V [p-p] (75 ohm) C: 0286V [p-p] (75 ohm)
AUDIO L-R RCA PIN Type × 2 0.5 V [rms]
COMPONENT
V
IDEO
Y
1.0 V [p-p] (including synchronization)
PB,P
R± 0.35 V [p-p]
AUDIO L-R RCA PIN Type × 2 0.5 V [rms]
Others
HDMI 1/2/3 TYPE A Connectors
· · ·
· This TV supports “HDAVI Cont
r
ol 2” function
PC HIGH-DENSITY D-SUB 15PIN R,G,B
/
0.7 V [p-p] (75 ohm)
Card slot SD CARD slot × 1 HD, VD/TTL Level 2.0 - 5.0 V [p-p] (high impedance)
Output
AUDIO L-R RCA PIN Type × 2 0.5 V [rms] (high impedance)
DIGT
A
L AUDIO OUT PCM/Dolb
y
Digtal, Fibe
r
optic
Dimensions (W × H × D)
With Pedestal 1,266 mm × 850 mm × 369 mm
TV only 1,266 mm × 802 mm × 138 mm
Mass
With Pedestal 50.0 kg Net
TV only 42.0 kg Net
Note:
·
· ·
· Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
·
· ·
· This equipment complies with the EMC standards listed below.
EN55013, EN61000-3-2, EN61000-3-3, EN55020, EN55022, EN55024.
2
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
2.2. Touch-Current Check 6
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 Service Hint 9
6 Plasma panel replacement method 10
6.1. Remove the rear cover 10
6.2. Remove the rear terminal cover 10
6.3. Remove the Speaker box assy (left) 10
6.4. Remove the Speaker box assy (right) 10
6.5. Remove the P-Board 10
6.6. Remove the PA-Board 11
6.7. Remove the Tuner unit 12
6.8. Remove the DG-Board 12
6.9. Remove the H-Board 12
6.10. Remove the D-Board 13
6.11. Remove the SU-Board 13
6.12. Remove the SD-Board 13
6.13. Remove the SC-Board 14
6.14. Remove the SS2-Board 14
6.15. Remove the SS3-Board 14
6.16. Remove the SS-Board 14
6.17. Remove the stand brackets 15
6.18. Remove the C1-Board 15
6.19. Remove the C2-Board 15
6.20. Remove the C3-Board 15
6.21. Remove the front bracket and the front shield case cover
15
6.22. Remove the G-Board and GH-Board 16
6.23. Remove the GS-Board 16
6.24. Remove the S-Board 16
6.25. Remove the K-Board 16
6.26. Remove the Plasma panel section from the Cabinet assy
(glass) 17
6.27. Remove the squawker speaker 18
6.28. Replace the plasma panel (finished) 18
7 Caution statement 19
7.1. Caution statement. 19
8 Location of Lead Wiring 20
8.1. Lead of Wiring (1) 20
8.2. Lead of Wiring (2) 21
9 Self-check Function 22
9.1. Check of the IIC bus lines 22
9.2. Power LED Blinking timing chart 23
9.3. No Power 24
9.4. No Picture 25
9.5. Local screen failure 26
10 Service Mode 27
10.1. How to enter into Service Mode 27
10.2. Service tool mode 29
11 Adjustment Procedure 30
11.1. Driver Set-up 30
11.2. Initialization Pulse Adjust 31
11.3. P.C.B. (Printed Circuit Board) exchange 31
11.4. Adjustment Volume Location 32
11.5. Test Point Location 32
12 Adjustment 33
12.1. Sub-Contrast adjustment 33
12.2. PAL panel white balance adjustment 34
12.3. HD white balance adjustment 35
13 Hotel mode 36
14 Conductor Views 37
14.1. P-Board 37
14.2. PA-Board 40
14.3. H-Board 41
14.4. DG-Board 43
14.5. D-Board 46
14.6. C1-Board 48
14.7. C2-Board 49
14.8. C3-Board 50
14.9. SC-Board 51
14.10. SU-Board 54
14.11. SD-Board 55
14.12. SS-Board 56
14.13. SS2 and SS3-Board 58
14.14. K and S-Board 59
14.15. G-Board 60
14.16. GH and GS-Board 61
15 Schematic and Block Diagram 63
15.1. Schematic Diagram Note 63
15.2. Main Block Diagram 64
15.3. P-Board Block Diagram 65
15.4. P-Board (1 of 2) Schematic Diagram 66
15.5. P-Board (2 of 2) Schematic Diagram 67
15.6. PA-Board Block Diagram 68
15.7. PA-Board Schematic Diagram 69
15.8. H-Board (1 of 2) Block Diagram 70
15.9. H-Board (2 of 2) Block Diagram 71
15.10. H-Board (1 of 5) Schematic Diagram 72
15.11. H-Board (2 of 5) Schematic Diagram 73
15.12. H-Board (3 of 5) Schematic Diagram 74
15.13. H-Board (4 of 5) Schematic Diagram 75
15.14. H-Board (5 of 5) Schematic Diagram 76
15.15. DG-Board (1 of 3) Block Diagram 77
15.16. DG-Board (2 of 3) Block Diagram 78
15.17. DG-Board (3 of 3) Block Diagram 79
15.18. DG-Board (1 of 11) Schematic Diagram 80
15.19. DG-Board (2 of 11) Schematic Diagram 81
15.20. DG-Board (3 of 11) Schematic Diagram 82
CONTENTS
Page Page
3
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

15.21. DG-Board (4 of 11) Schematic Diagram 83
15.22. DG-Board (5 of 11) Schematic Diagram 84
15.23. DG-Board (6 of 11) Schematic Diagram 85
15.24. DG-Board (7 of 11) Schematic Diagram 86
15.25. DG-Board (8 of 11) Schematic Diagram 87
15.26. DG-Board (9 of 11) Schematic Diagram 88
15.27. DG-Board (10 of 11) Schematic Diagram 89
15.28. DG-Board (11 of 11) Schematic Diagram 90
15.29. D-Board Block Diagram 91
15.30. D-Board (1 of 6) Schematic Diagram 92
15.31. D-Board (2 of 6) Schematic Diagram 93
15.32. D-Board (3 of 6) Schematic Diagram 94
15.33. D-Board (4 of 6) Schematic Diagram 95
15.34. D-Board (5 of 6) Schematic Diagram 96
15.35. D-Board (6 of 6) Schematic Diagram 97
15.36. C1, C2 and C3-Board Block Diagram 98
15.37. C1-Board (1 of 3) Schematic Diagram 99
15.38. C1-Board (2 of 3) Schematic Diagram 100
15.39. C1-Board (3 of 3) Schematic Diagram 101
15.40. C2-Board (1 of 2) Schematic Diagram 102
15.41. C2-Board (2 of 2) Schematic Diagram 103
15.42. C3-Board (1 of 2) Schematic Diagram 104
15.43. C3-Board (2 of 2) Schematic Diagram 105
15.44. SC, SU and SD-Board Block Diagram 106
15.45. SC-Board (1 of 3) Schematic Diagram 107
15.46. SC-Board (2 of 3) Schematic Diagram 108
15.47. SC-Board (3 of 3) Schematic Diagram 109
15.48. SU-Board (1 of 2) Schematic Diagram 110
15.49. SU-Board (2 of 2) Schematic Diagram 111
15.50. SD-Board (1 of 2) Schematic Diagram 112
15.51. SD-Board (2 of 2) Schematic Diagram 113
15.52. SS, SS2 and SS3-Board Block Diagram 114
15.53. SS-Board (1 of 2) Schematic Diagram 115
15.54. SS-Board (2 of 2), SS2 and SS3-Board Schematic
Diagram 116
15.55. G, GS, and S-Board Block and Schematic Diagram 117
15.56. GH and K-Board Block and Schematic Diagram 118
16 Exploded Views & Replacement Parts List 119
16.1. Exploded Views 119
16.2. Packing Exploded Views (1) 120
16.3. Packing Exploded Views (2) 121
16.4. Packing Exploded Views (PX700B Only) 122
16.5. Packing Exploded Views (Except PX700B) 123
16.6. Packing Exploded Views (Stand) 124
16.7. Replacement Parts List Notes 125
16.8. Mechanical Replacement Parts List (PDP TV) 126
16.9. Mechanical Replacement Parts List (Stand) 128
16.10. Electrical Replacement Parts List 129
4
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

1 Applicable signals
5
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3.Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reserve the AC plug in the AC outlet and repeat each of the above measure.
6.The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1= 1.0 V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7.In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1
6
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
8
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

Remove the Rear Cover
5 Service Hint
Board Name Function Board Name Function
P Power Supply D Format Converter, Plasma AI, Sub-Field Processor
DG Digital Signal Processor, MCU, HDMI Interface
Peaks Lite 2 C1 Data Driver (Lower Right)
C2 Data Driver (Lower center)
K Remote receiver, Power LED C3 Data Driver (Lower Left)
S Power Switch SC Scan Drive
H Speaker out, Sound Processor
AV Terminal, AV Switch SU Scan out (Upper)
SD Scan out (Lower)
PA DC-DC Converter SS Sustain Drive
G Key Switch, Front Terminal SS2 Sustain out (Upper)
GH HDMI 3 IN SS3 Sustain out (Lower)
GS SD Card slot
9
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

6.1. Remove the rear cover
1.See Service Hint (Section 5)
6.2. Remove the rear terminal
cover
1.Remove the screws (×11 ,×6 ,×2 ).
2.Remove the rear terminal cover.
6.3. Remove the Speaker box assy
(left)
1.Unlock the cable clampers to free the cable.
2.Disconnect the relay coupler.
3.Remove the screw( ) and remove the Speaker box assy
(left).
6.4. Remove the Speaker box assy
(right)
1.Unlock the cable clampers to free the cable.
2.Disconnect the relay coupler.
3.Remove the screw( ) and remove the Speaker box assy
(right).
6.5. Remove the P-Board
Caution:
To remove P.C.B. wait 1 minute after power was off for
discharge from electrolysis capacitors.
1.Disconnect the connectors (P2, P6, P7, P9, P11, P12 and
P25).
2.Remove the screws (×6 ) and remove the P-Board unit.
3.Remove the screws (×20 ) on the back side.
6 Plasma panel replacement method
10
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

4.Remove the screws (×5 ).
5.Remove the molding props (×9 ).
6.Remove the P-Board.
Note:
When assembling the P-Board, the position of each hole of
the insulation sheets (A and B) is set to the position of each
hole of the P-Board, then assemble them. ( marks
indicate setting positions.)
6.6. Remove the PA-Board
1.Unlock the cable clampers to free the cable.
2.Disconnect the connectors (PA3, PA4, and PA5).
3.Remove the screws (×3 ) and remove the PA-Board.
11
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

6.7. Remove the Tuner unit
1.Unlock the cable clampers to free the cable.
2.Disconnect the connectors (H3, H4, H11, H12, H51, DG1,
DG5, DG9 and DG52).
3.Remove the screws (×4 ) and remove the tuner unit.
6.8. Remove the DG-Board
1.Remove the tuner unit. (See section 6.7.)
2.Disconnect the connectors (DG2 and DG6)
3.Remove the screws (×6 ) and remove the DG-Board.
6.9. Remove the H-Board
1.Remove the tuner unit (See section 6.7.)
2.Remove the screw (×1 ) and remove the tuner fixing
metal with screw cover.
3.Remove the screw (×7 ) and remove the H-Board.
12
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

6.10. Remove the D-Board
1.Remove the tuner unit. (See section 6.7.)
2.Disconnect the connectors (D5 and D25).
3.Disconnect the flexible cables (D20, D31 and D32).
4.Remove the screws (×4 ) and remove the D-Board.
6.11. Remove the SU-Board
1.Remove the screws (×3 ).
2.Remove the flexible cables (SU1, SU2, SU3 and SU4)
connected to the SU-Board and remove the connector
(SC45-SU45).
3.Slide the SU-Board to the left to disconnect from a
connector (SC41-SU41) on the SC-Board and remove the
SU-Board.
6.12. Remove the SD-Board
1.Remove the screws (×3 ).
2.Remove the flexible cables (SD1, SD2, SD3 and SD4)
connected to the SD-Board and remove the connector
(SC46-SD46).
3.Slide the SD-Board to the left to disconnect from a
connector (SC42-SD42) on the SC-Board and remove the
SD-Board.
13
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

6.13. Remove the SC-Board
1.Remove the SU-Board and SD-Board. (See section 6.11.
and 6.12.)
2.Unlock the cable clampers to free the cable.
3.Disconnect the connector (SC2).
4.Disconnect the flexible cable (SC20).
5.Remove the screws (×9 ) and remove the SC-Board.
6.14. Remove the SS2-Board
1.Disconnect the connector (SS23) and disconnect the
flexible cable (SS52).
2.Remove the screws (×2 ) and remove the SS2-Board.
6.15. Remove the SS3-Board
1.Disconnect the connector (SS24) and disconnect the
flexible cable (SS57).
2.Remove the screws (×2 ) and remove the SS3-Board.
6.16. Remove the SS-Board
1.Disconnect the connectors (SS11, SS12 SS23, SS24,
SS33, SS34 and SS35).
2.Disconnect the flexible cables (SS54 and SS55).
3.Remove the screws (×7 ) and remove the SS-Board.
14
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

6.17. Remove the stand brackets
1.Remove the plasma panel section from the servicing stand
and lay on a flat surface such as a table (covered) with the
plasma panel surface facing downward.
2.Remove the stand brackets (left, right) fastening screws (×5
each) and remove the stand brackets (left, right).
6.18. Remove the C1-Board
1.Remove the tuner unit. (See section 6.7.)
2.Remove the stand bracket (L). (See section 6.17.)
3.Remove the flexible cables holder fastening screws (×10
).
4.Disconnect the flexible cables (CB1, CB2, CB3, CB4 and
CB5).
5.Disconnect the flexible cables (C10 and C11).
6.Remove the screws (×5 ) and remove the C1-Board.
6.19. Remove the C2-Board
1.Remove the tuner unit. (See section 6.7.)
2.Remove the flexible cables holder fastening screws (×6
).
3.Disconnect the flexible cables (CB6, CB7 and CB8).
4.Disconnect the flexible cables (C20, C21 and C22).
5.Remove the screws (×4 ) and remove the C2-Board.
6.20. Remove the C3-Board
1.Remove the tuner unit. (See section 6.7.)
2.Remove the stand bracket (R). (See section 6.17.)
3.Remove the flexible cables holder fastening screws (×6
).
4.Disconnect the flexible cables (CB9, CB10 and CB11).
5.Disconnect the flexible cable (C32).
6.Disconnect the connectors (C33 and C35).
7.Remove the screws (×4 ) and remove the C3-Board.
6.21. Remove the front bracket and
the front shield case cover
1.Remove the screws (×2 ,×1 ) and remove the front
shield case.
15
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

6.22. Remove the G-Board and GH-
Board
1.Remove the front bracket and the front shield case cover.
(See section 6.21.)
2.Remove the screws (×4 ) and remove the front shield
case (front).
3.Remove the screws (×4 ) and disconnect the connector
(G51 and GH11).
4.Remove the G-Board and GH-Board.
6.23. Remove the GS-Board
1.Remove the screws (×2 ) and remove the GS-unit.
2.Disconnect the connector (CN701).
3.Remove the screw ( ) and remove the GS-Board.
6.24. Remove the S-Board
1.Remove the screws (×2 ) and remove the S-Board metal
frame.
2.Disconnect the connector (S1).
3.Remove the screws (×2 ) and remove the S-Board.
6.25. Remove the K-Board
1.Unlock the cable clampers to free the cable.
2.Disconnect the connector (DG1). (See section 6.8.)
3.Remove the screws (×2 ) and remove the K-Board.
4.Disconnect the connectors (K1) and remove the K-Board.
16
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

6.26. Remove the Plasma panel
section from the Cabinet assy
(glass)
1.Remove the stand brackets (left, right) fastening screw (×1
each).
2.Remove the cabinet assy and the plasma panel fastening
screws (×6 ).
3.For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
4.Remove the spacers and spacer rings (×6 ).
17
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

6.27. Remove the squawker speaker
1.Remove the cabinet assy. (See section 6.26.).
2.Remove the screws (×12 ).
3.Remove the glass holder R and L.
4.Remove the screws (×2 ).
5.Remove the squawker speaker.
6.28. Replace the plasma panel
(finished)
1.Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2.Attach the C1-Board, C2-Board and the C3-Board, connect
the flexible cables (×22) from the plasma panel to the C1-
Board, C2-Board and the C3-Board, and fit the flexible
cable holders.
3.Attach the Hooks (left, right) and fit the stand brackets (L,
R) to the new plasma panel.
4.Place the plasma panel section on the servicing stand.
5.Attach the cabinet assy and each P.C.Board and so on, to
the new plasma panel.
*When fitting the cabinet assy, be careful not to allow any
debris, dust or handling residue to remain between the
front glass and plasma panel.
18
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

7 Caution statement
7.1. Caution statement.
Caution:
Please confirm that all flexible cables are assembled correctly.
Also make sure that they are locked in the connectors.
Verify by giving the flexible cables a very slight pull.
19
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E

8 Location of Lead Wiring
8.1. Lead of Wiring (1)
20
TH-50PV700F / TH-50PV700P / TH-50PX700B / TH-50PX700E