Panasonic TH42PD50U - 42" EDTV PLASMA TV User manual

©2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-42PD50U
GP8DU Chassis
Digital Progressive Wide Plasma Television
Specifications
Powe
r
Source
A
C 120 V, 50/60 Hz
Powe
r
Consumption Maximum : 390 W
Stand-b
y
condition : 0.6 W
Plasma Displa
y
panel Drive method : AC type 42-in
c
h, 16 : 9 aspe
c
t ratio
Screen Size
A
pprox. 36
7
/32 " (920mm) (W) × 20
2
5
/
64 “ (518 mm) (H) × 41
3
7
/
64 “ (1056 mm) (diagonal)
Dimensions ( W × H × D )
A
pprox. 42
3
/64 “ (1068 mm) × 27
3
9
/
64 “ (701 mm) × 3
5
1
/
64 “ (96.5 mm)
Mass (Weight) 72.8 lb. (33.0 kg) Net
Channel Capability-
ATSC/NTSC
VHF/ UHF : 2-69, CATV:1-135
Sound
Speake
r
4
2
3
/32 “ (120 mm) × 2
2
3
/
64 “ (60 mm) × 2 pcs 6 W
Audio Output 16 W [ 8 W + 8 W ] ( 10 % THD )
FEATURES 3D Y/C FILTER HDMI
CLOSED CAPTION V-Chip
Accessories Supplied Remote control: EUR7627Z60
F-type antenna adap
t
e
r
(5C-2V × 1)
A
A Batter
y
×2
A
C Cord
Pedestal
Cable clampe
r
×2
Operating Conditions Temperatu
r
e : 34 °F - 104 °F (0 ° - 40 °C)
Humidit
y
: 20 % - 80 % (non-condensing)
Connection Terminals
A
V INPUT 1- 2 VIDEO 1.0 Vp-p (75 W)
(Phono Jack Type)
S-VIDEO
Y
: 1.0 Vp-p (75 W), C : 0.286 Vp-p (75 W)
(Mini DIN 4-pin)
A
UDIO L-R 0.5 Vrms
(Phono Jack Type × 2)
A
V PROG. OUT VIDEO 1.0 Vp-p (75 W)
(Phono Jack Type)
ORDER NO. ITD0503007CE
B19 Canada: B07

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Plasma panel replacement method 9
6.1. Remove the Back cover. 9
6.2. Remove the P-Board. 9
6.3. Remove the PB-Board 9
6.4. Remove the D-Board 9
6.5. Remove the rear terminal cover 10
6.6. Remove the metal frame 10
6.7. Remove the DT-Board and DV-Board 10
6.8. Remove the DG-Board 11
6.9. Remove the H-Board 11
6.10. Remove the PA-Board 11
6.11. Remove the Z-Board 11
6.12. Remove the SU-Board 12
6.13. Remove the SD-Board 12
6.14. Remove the SC-Board 12
6.15. Remove the SS-Board 13
6.16. Remove the C1-Board 13
6.17. Remove the C2-Board 13
6.18. Remove the K-Board 14
6.19. Remove the S-Board 14
6.20. Remove the Speaker L, R 14
6.21. Remove the Plasma panel section from the Front frame
(glass) 15
6.22. Replace the plasma panel (finished). 15
7 Location of Lead Wiring 16
7.1. Lead of Wiring (1) 16
7.2. Lead of Wiring (2) 17
7.3. Lead of Wiring (3) 18
8 Self-check Function 19
8.1. How to access 19
8.2. Power LED Blinking timing chart 20
8.3. No Power 21
8.4. No Picture 22
8.5. Local screen failure 23
9 Serviceman Mode 24
9.1. How to enter into Serviceman Mode 24
9.2. Cancellation 24
9.3. Contents of adjustment mode 24
9.4. Option 25
10 Adjustment Procedure 26
10.1. Driver Set-up 26
10.2. Initialization Pulse Adjust 27
10.3. P.C.B. (Printed Circuit Board) exchange 28
10.4. Adjustment Volume Location 28
10.5. Test Point Location 28
11 Hotel mode 29
12 Conductor View 31
12.1. P-Board 31
12.2. PA-Board 34
12.3. PB-Board 35
12.4. H-Board 36
12.5. DT-Board 38
12.6. DV-Board 40
12.7. DG-Board 41
12.8. Z-Board 43
12.9. D-Board 44
12.10. C1-Board 47
A
UDIO L-R 0.5 Vrms
(Phono Jack Type × 2)
COMPONENT VIDEO
Y
1.0 Vp-p (including synchronization)
INPUT1-2 PB
/
PR± 0.35 Vp-p
A
UDIO L-R 0.5 Vrms
(Phono Jack Type × 2)
HDMI HDMI type A Connecto
r
A
UDIO L-R 0.5 Vrms
(Phono Jack Type × 2)
DIGITAL AUDIO OUT PCM
/
Dolb
y
Digital, Fibe
r
Optic
Note:
Design and Specifications are subject to change without notice. Weight and Dimensions shown are approximate.
CONTENTS
Page Page
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12.11. C2-Board 48
12.12. SC-Board 49
12.13. SU-Board 52
12.14. SD-Board 53
12.15. SS-Board 54
12.16. K and S-Board 56
13 Block and Schematic Diagram 57
13.1. Schematic Diagram Notes 57
13.2. Main Block Diagram 58
13.3. P-Board Block Diagram 59
13.4. P-Board (1 of 6) Schematic Diagram 60
13.5. P-Board (2 of 6) Schematic Diagram 61
13.6. P-Board (3 of 6) Schematic Diagram 62
13.7. P-Board (4 of 6) Schematic Diagram 63
13.8. P-Board (5 of 6) Schematic Diagram 64
13.9. P-Board (6 of 6) Schematic Diagram 65
13.10. PA and PB-Board Block Diagram 66
13.11. PA-Board Schematic Diagram 67
13.12. PB-Board Schematic Diagram 68
13.13. H, K, S and Z-Board Block Diagram 69
13.14. H Board (1 of 3) Schematic Diagram 70
13.15. H-Board (2 of 3) Schematic Diagram 71
13.16. H-Board (3 of 3) Schematic Diagram 72
13.17. Z-Board Schematic Diagram 73
13.18. K and S-Board Schematic Diagram 74
13.19. DT-Board Block Diagram 75
13.20. DT-Board (1 of 4) Schematic Diagram 76
13.21. DT-Board (2 of 4) Schematic Diagram 77
13.22. DT-Board (3 of 4) Schematic Diagram 78
13.23. DT-Board (4 of 4) Schematic Diagram 79
13.24. DV-Board Block Diagram 80
13.25. DV-Board Schematic Diagram 81
13.26. DG-Board (1 of 2) Block Diagram 82
13.27. DG-Board (2 of 2) Block Diagram 83
13.28. DG-Board (1 of 11) Schematic Diagram 84
13.29. DG-Board (2 of 11) Schematic Diagram 85
13.30. DG-Board (3 of 11) Schematic Diagram 86
13.31. DG-Board (4 of 11) Schematic Diagram 87
13.32. DG-Board (5 of 11) Schematic Diagram 88
13.33. DG-Board (6 of 11) Schematic Diagram 89
13.34. DG-Board (7 of 11) Schematic Diagram 90
13.35. DG-Board (8 of 11) Schematic Diagram 91
13.36. DG-Board (9 of 11) Schematic Diagram 92
13.37. DG-Board (10 of 11) Schematic Diagram 93
13.38. DG-Board (11 of 11) Schematic Diagram 94
13.39. D-Board Block Diagram 95
13.40. D-Board (1 of 6) Schematic Diagram 96
13.41. D-Board (2 of 6) Schematic Diagram 97
13.42. D-Board (3 of 6) Schematic Diagram 98
13.43. D-Board (4 of 6) Schematic Diagram 99
13.44. D-Board (5 of 6) Schematic Diagram 100
13.45. D-Board (6 of 6) Schematic Diagram 101
13.46. C1 and C2-Board Block Diagram 102
13.47. C1-Board (1 of 2) Schematic Diagram 103
13.48. C1-Board (2 of 2) Schematic Diagram 104
13.49. C2-Board (1 of 2) Schematic Diagram 105
13.50. C2-Board (2 of 2) Schematic Diagram 106
13.51. SC-Board Block Diagram 107
13.52. SC-Board (1 of 2) Schematic Diagram 108
13.53. SC-Board (2 of 2) Schematic Diagram 109
13.54. SU-Board Block Diagram 110
13.55. SU-Board Schematic Diagram 111
13.56. SD-Board Block Diagram 112
13.57. SD-Board Schematic Diagram 113
13.58. SS-Board Block Diagram 114
13.59. SS-Board Schematic Diagram 115
14 Parts Location & Mechanical Replacement Parts List 117
14.1. Parts Location 117
14.2. Pcaking Exploded Views (1) 118
14.3. Pcaking Exploded Views (2) 119
14.4. Pcaking Exploded Views (3) 120
14.5. Mechanical Replacement Parts List 121
15 Replacement Parts List 122
15.1. Replacement Parts List Notes 122
15.2. Electrical Replacement Parts List 123
3
TH-42PD50U

1 Applicable signals
4
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2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MWand 5.2MW.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
5
TH-42PD50U

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TH-42PD50U

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
TH-42PD50U

5 Service Hint
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Left)
PA DC-DC Converter, Power SOS C2 Data Driver (Right)
PB Audio Power SC Scan Drive
H AV Terminal, AV Switch SU Scan out (Upper)
DT ATSC Interface SD Scan out (Lower)
DV HDMI Interface
None serviceable.
DV-Board should be exchanged for service.
SS Sustain Drive
K Remote receiver, Keyscan
S Power Switch
DG Digital Signal Processor
Z Speaker out, Audio AMP
D Format Converter, Plasma AI Processor
8
TH-42PD50U

6.1. Remove the Back cover.
1. See Service hint (Section 5).
6.2. Remove the P-Board.
Caution:
To remove P.C.B., wait 1 minute after power was off for
discharge from electrolisis capacitors.
1. Disconnect the couplers (P2, P5, P9, P10, P11, P12, P23,
P25 and P30).
2. Remove the screws (×5 ) and remove the P-Board.
6.3. Remove the PB-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PB5, PB7, PB30, PB33 and
PB34).
3. Remove the screws (×3 ) and remove the PB-Board
metal frame.
4. Remove the screws (× 4 ) and remove the PB-Board.
6.4. Remove the D-Board
1. Remove the PB-Board.
2. Disconnect the couplers (D3, D5, D20 and D25) and
3. Disconnect the flexible cables (D33 and D34).
4. Remove the screws (×4 ) and remove the D-Board.
6 Plasma panel replacement method
9
TH-42PD50U

6.5. Remove the rear terminal
cover
1. Remove the screws (×4 ).
2. Remove the rear terminal cover.
6.6. Remove the metal frame
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (D3, D5, H7, P10 and PB7) and
relay connector (SP-L and SP-R).
3. Remove the screws (×4 ) remove the metal frame.
6.7. Remove the DT-Board and DV-
Board
1. Unlock the cable clampers to free the cable.
2. Remove the screws (×5 ).
3. Remove the DT-Board and DV-Board unit.
(Be careful the couplers (DV15 and DT22) when remove
the DT-Board and DV-Board unit.)
4. Remove the screws (×1 ) and remove the DV-Board.
5. Remove the screws (×2 ) and Remove the screws (×5
).
6. Remove the DT-Board metal cover and remove the DT-
Board.
10
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6.8. Remove the DG-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (DG3 and DG5).
3. Disconnect the flexible cables (DG1, DG2 and DG20).
4. Remove the screws (×2 ) and remove the DG-Board.
6.9. Remove the H-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (H7).
3. Disconnect the flexible cables (H1, H2, H30 and H50).
4. Remove the screws (×4 ) and remove the H-Board.
6.10. Remove the PA-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (PA7 and PA10).
3. Disconnect the flexible cables (PA20 and PA30).
4. Remove the screws (×4 ) and remove the PA-Board.
6.11. Remove the Z-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the coupler (Z2).
3. Disconnect the flexible cable (Z50).
4. Remove the screws (×2 ) and remove the Z-Board.
11
TH-42PD50U

6.12. Remove the SU-Board
1. Remove the screws (×2 )
2. Slide the SU-Board to the left to disconnect from a coupler
(SC41 - SU41) on the SC-Board and disconnect a coupler
(SU45 or SC45).
3. Disconnect the flexible cables (SU1, SU2, SU3) connected
to the SU-Board, and remove the SU-Board.
6.13. Remove the SD-Board
1. Remove the screws (×2 )
2. Slide the SD-Board to the left to disconnect from a coupler
(SC42 - SD42) on the SC-Board and disconnect a coupler
(SD46 or SC46).
3. Disconnect the flexible cables (SD1, SD2, SD3) connected
to the SU-Board, and remove the SD-Board.
6.14. Remove the SC-Board
1. Disconnect the couplers (SC2, SC20, SC23).
2. Remove the screws (×6 ) and remove the SC-Board.
12
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6.15. Remove the SS-Board
1. Disconnect the couplers (SS11, SS12, SS23 and SS34).
2. Disconnect the flexible cables (SS41, SS42, SS43 and
SS44).
3. Remove the screws (×6 ) and remove the SS-Board.
6.16. Remove the C1-Board
1. Remove the flexible cables holder fastening screws (×6
).
2. Disconnect the flexible cables (CB1, CB2 and CB3).
3. Disconnect the flexible cable (C11).
4. Disconnect the coupler (C12).
5. Remove the screws (×3 ) and remove the C1-Board.
6.17. Remove the C2-Board
1. Remove the flexible cables holder fastening screws (×8
).
2. Disconnect the flexible cables (CB4, CB5, CB6 and CB7).
3. Disconnect the flexible cable (C21).
4. Disconnect the couplers (C22 and C23).
5. Remove the screws (×3 ) and slide the C2-Board to the
left and remove the C2-Board.
13
TH-42PD50U

6.18. Remove the K-Board
1. Unlock the cable clampers to free the cable.
2. Disconnect the couplers (H7 and SS34).
3. Remove the screws (×3 ) and remove the K-Board.
6.19. Remove the S-Board
1. Remove the screw (×2 ) and remove the S-Board unit.
2. Unlock the cable clampers to free the cable.
3. Disconnect the couplers (S1 and S2).
4. Remove the screws (×2 ) and remove the S-Board.
6.20. Remove the Speaker L, R
1. Remove the screw (×8 ) and remove the Speaker L, R.
14
TH-42PD50U

6.21. Remove the Plasma panel
section from the Front frame
(glass)
1. Remove the front frame and the plasma panel fastening
screw (×8 ).
2. Remove the front frame and the stand brackets fastening
screw (×6 ).
3. For leaving the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
6.22. Replace the plasma panel
(finished).
1. Place the new plasma panel (finished) on the flat surface of
the table (covered by a soft cloth), with the plasma panel
surface facing downward.
2. Attach the C1-Board and the C2-Board, connect the flexible
cables (×7) from the Plasma panel to the C1-Board and C2-
Board, and fix the flexible cable holders.
3. Attach the Hooks (left, right) and fit the stand brackets (left,
right) to the new plasma panel.
4. Place the plasma panel section on the servicing stand.
5. Attach the front frame and the each P.C.Board and so on,
to the new plasma panel.
* When fitting the front frame, be careful not to allow
any debris, dust or handling residues to remain
between the front glass and plasma panel.
15
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7 Location of Lead Wiring
7.1. Lead of Wiring (1)
16
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7.2. Lead of Wiring (2)
17
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7.3. Lead of Wiring (3)
18
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8 Self-check Function
When symptoms like “the power fails sometimes” or “sometimes there is no picture and/or sound” can not be confirmed at the
time of servicing, the self-check function can be used to confirm the occurrence and to find the defective circuit.
In case of “power failure”, flashing of the “POWER” indication (red) at the front of the unit can be used to narrow down the +B
line.
8.1. How to access
8.1.1. Access
Produce TV reception screen and, while pressing [VOLUME-] button on the main unit, press [SLEEP] button on the remote
controller unit simultaneously.
8.1.2. Exit
When one of the buttons for channel selection etc. is pressed, the display returns to the normal screen.
8.1.3. Screen display
Display Ref.No. Description Board
H10UV TU3000 TV Tuner DT-Board
H11BSD IC8211 Front Processor DT-Board
H12BSD IC8240 HDMSL PEAKS_Lite DT-Board
H21SND IC2608 BBE Viva H-Board
H30AVSW IC2602 Video SW H-Board
H31AVSW IC2605 Audio SW H-Board
H34DG IC4026 GC4PRO DG-Board
H36DG IC4018 10Bits A/D DG-Board
H49HDMI IC5003 HDMI I/F Reciever DV-Board
H90MEM IC4008 EEPROM DG-Board
H95RTC IC9007 Ex. I/O D-Board
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8.2. Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
3. Remarks
Above Fan function is operated during the fans are installed.
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