Panasonic Viera TC-P65S2 User manual

© Panasonic Corporation 2010.
Unauthorized copying and distribution is a violation
of law.
ORDER NO.MTNC100561CE
B34 Canada: B62
65 inch Class 1080p Plasma HDTV
Model No. TC-P65S2
GPF13DU Chassis

2
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions -----------------------------------------------3
1.1. General Guidelines ----------------------------------------3
2 Warning --------------------------------------------------------------4
2.1. Prevention of Electrostatic Discharge (ESD)
to Electrostatically Sensitive (ES) Devices ----------4
2.2. About lead free solder (PbF) ----------------------------5
3 Service Navigation------------------------------------------------6
3.1. PCB Layout --------------------------------------------------6
3.2. Applicable signals ------------------------------------------7
4 Specifications ------------------------------------------------------8
5 Service Mode -------------------------------------------------------9
5.1. How to enter into Service Mode ------------------------9
5.2. Option - Mirror--------------------------------------------- 11
5.3. Service tool mode ---------------------------------------- 11
5.4. Hotel mode------------------------------------------------- 12
5.5. Data Copy by SD Card --------------------------------- 13
6 Troubleshooting Guide---------------------------------------- 16
6.1. Check of the IIC bus lines------------------------------ 16
6.2. Power LED Blinking timing chart --------------------- 17
6.3. No Power--------------------------------------------------- 18
6.4. No Picture -------------------------------------------------- 19
6.5. Local screen failure -------------------------------------- 20
7 Service Fixture & Tools --------------------------------------- 21
7.1. SC jig -------------------------------------------------------- 21
8 Disassembly and Assembly Instructions --------------- 22
8.1. Remove the Rear cover -------------------------------- 22
8.2. Remove the AC inlet ------------------------------------ 22
8.3. Remove the P-Board ------------------------------------ 22
8.4. Remove the Side terminal cover and the Rear
AV panel ---------------------------------------------------- 22
8.5. Remove the Tuner unit --------------------------------- 23
8.6. Remove the A-Board ------------------------------------ 23
8.7. Remove the Speakers ---------------------------------- 23
8.8. Remove the SU-Board---------------------------------- 23
8.9. Remove the SD-Board---------------------------------- 24
8.10. Remove the SC-Board---------------------------------- 24
8.11. Remove the SS3-Board -------------------------------- 24
8.12. Remove the SS-Board ---------------------------------- 24
8.13. Remove the Support metal ---------------------------- 25
8.14. Remove the Hanger metals --------------------------- 25
8.15. Remove the C1-Board ---------------------------------- 25
8.16. Remove the C2-Board ---------------------------------- 25
8.17. Remove the C3-Board ---------------------------------- 26
8.18. Remove the Plasma panel section from the
Cabinet assy (glass)------------------------------------- 26
8.19. Remove the Glass holders ---------------------------- 27
8.20. Remove the S-Board ------------------------------------ 27
8.21. Remove the K-Board ------------------------------------ 28
8.22. Replace the plasma panel ----------------------------- 28
9 Measurements and Adjustments -------------------------- 29
9.1. Adjustment ------------------------------------------------- 29
10 Block Diagram --------------------------------------------------- 35
10.1. Main Block Diagram ------------------------------------- 35
10.2. Block (1/4) Diagram ------------------------------------- 36
10.3. Block (2/4) Diagram ------------------------------------- 37
10.4. Block (3/4) Diagram ------------------------------------- 38
10.5. Block (4/4) Diagram ------------------------------------- 39
11 Wiring Connection Diagram--------------------------------- 41
11.1. Caution statement. -------------------------------------- 41
11.2. Wiring (1) -------------------------------------------------- 41
11.3. Wiring (2) -------------------------------------------------- 42
11.4. Wiring (3) -------------------------------------------------- 43
11.5. Wiring (4) -------------------------------------------------- 44
12 Schematic Diagram -------------------------------------------- 45
12.1. Schematic Diagram Note ------------------------------ 45
12.2. P(MAIN)-Board (1/3) Schematic Diagram --------- 46
12.3. P(MAIN)-Board (2/3) Schematic Diagram --------- 47
12.4. P(MAIN)-Board (3/3) Schematic Diagram --------- 48
12.5. P(SUB)-Board Schematic Diagram ----------------- 49
12.6. A-Board (1/14) Schematic Diagram----------------- 50
12.7. A-Board (2/14) Schematic Diagram----------------- 51
12.8. A-Board (3/14) Schematic Diagram----------------- 52
12.9. A-Board (4/14) Schematic Diagram----------------- 53
12.10. A-Board (5/14) Schematic Diagram----------------- 54
12.11. A-Board (6/14) Schematic Diagram----------------- 55
12.12. A-Board (7/14) Schematic Diagram----------------- 56
12.13. A-Board (8/14) Schematic Diagram----------------- 57
12.14. A-Board (9/14) Schematic Diagram----------------- 58
12.15. A-Board (10/14), K-Board and S-Board
Schematic Diagram ------------------------------------- 59
12.16. A-Board (11/14) Schematic Diagram --------------- 60
12.17. A-Board (12/14) Schematic Diagram --------------- 61
12.18. A-Board (13/14) Schematic Diagram --------------- 62
12.19. A-Board (14/14) Schematic Diagram --------------- 63
12.20. C1-Board Schematic Diagram ----------------------- 64
12.21. C2-Board (1/2) Schematic Diagram ---------------- 65
12.22. C2-Board (2/2) Schematic Diagram ---------------- 66
12.23. C3-Board (1/2) Schematic Diagram ---------------- 67
12.24. C3-Board (2/2) Schematic Diagram ---------------- 68
12.25. SC-Board (1/4) Schematic Diagram ---------------- 69
12.26. SC-Board (2/4) Schematic Diagram ---------------- 70
12.27. SC-Board (3/4) Schematic Diagram ---------------- 71
12.28. SC-Board (4/4) Schematic Diagram ---------------- 72
12.29. SS-Board (1/2) Schematic Diagram ---------------- 73
12.30. SS-Board (2/2) and SS3-Board Schematic
Diagram ---------------------------------------------------- 74
13 Printed Circuit Board------------------------------------------ 75
13.1. P(MAIN)-Board------------------------------------------- 75
13.2. P(SUB)-Board -------------------------------------------- 78
13.3. K, S and SS3-Board ------------------------------------ 80
13.4. A-Board ---------------------------------------------------- 81
13.5. C1-Board--------------------------------------------------- 83
13.6. C2-Board--------------------------------------------------- 84
13.7. C3-Board--------------------------------------------------- 85
13.8. SC-Board -------------------------------------------------- 86
13.9. SS-Board -------------------------------------------------- 88
14 Exploded View and Replacement Parts List----------- 91
14.1. Exploded View and Mechanical Replacement
Parts List --------------------------------------------------- 91
14.2. Electrical Replacement Parts List ------------------- 97

3
1 Safety Precautions
1.1. General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Fasten connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the
two prongs on the plug.
2. Measure the resistance value, with an ohmmeter,
between the jumpered AC plug and each exposed metal-
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal-
lic part has a return path to the chassis, the reading
should be between 1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to
the chassis, the reading must be .
1.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use
an isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15μF capacitors, between each exposed metallic part
on the set and a good earth ground such as a water pipe,
as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-
tivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the volt-
age at each point.
5. Reverse the AC plug in the AC outlet and repeat each of
the above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a measure-
ment is outside of the limits specified, there is a possibility
of a shock hazard, and the equipment should be repaired
and rechecked before it is returned to the customer.
Figure 1

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2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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2.2. About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

6
3 Service Navigation
3.1. PCB Layout
Board Name Function Board Name Function
P Power Supply C1 Data Driver (Lower Right)
C2 Data Driver (Lower Center)
A DC-DC Converter, Tuner
Speaker out, AV Terminal, HDMI in, SD Card
Digital Signal Processor, Nile-TCON
Format Converter, Plasma AI, Sub-Field Processor
Key Switch
C3 Data Driver (Lower Left)
SC Scan Drive
SS Sustain Drive
SS3 Sustain out (Lower)
SU Scan out (Upper)
Non-serviceable.
SU-Board should be exchanged for service.
SD Scan out (Lower)
Non-serviceable.
SD-Board should be exchanged for service.
K Remote receiver, Power LED, C.A.T.S sensor
SPowerSwitch

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3.2. Applicable signals
* Mark: Applicable input signal for Component (Y, PB, PR) and HDMI
Note
• Signals other than those shown above may not be displayed properly.
• The above signals are reformatted for optimal viewing on your display.
horizontal frequency (kHz) vertical frequency (Hz) COMPONENT HDMI
525 (480) / 60i 15.73 59.94 * *
525 (480) /60p 31.47 59.94 * *
750 (720) /60p 45.00 59.94 * *
1,125 (1,080) /60i 33.75 59.94 * *
1,125 (1,080)/60p 67.43 59.94 *
1,125 (1,080)/60p 67.50 60.00 *
1,125(1,080)/24p 26.97 23.98 *
1,125(1,080)/24p 27.00 24.00 *

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4 Specifications
Power Source AC 120 V, 60 Hz
Power Consumption
Maximum 638 W
Standby condition 0.3 W
Plasma Display panel
Drive method AC type
Aspect Ratio 16:9
Visible screen size 65 inch class (64.7 inches measured diagonally)
(W ×H ×Diagonal) 56.4 inch ×31.7 inch ×64.7 inch (1,434 mm ×806 mm ×1,645 mm)
(No. of pixels) 2,073,600 (1,920 (W) ×1,080 (H))[5,760 ×1,080 dots]
Sound
Audio Output 20 W [ 10 W + 10 W ] ( 10 % THD )
Channel Capability (Digital/Analog) VHF/ UHF: 2 - 69, CATV: 1 - 135
Operating Conditions
Temperature: 32 °F - 104 °F (0 °C - 40 °C)
Humidity: 20 % - 80 % RH (non-condensing)
Connection Terminals
VIDEO IN 1-2 VIDEO: RCA PIN Type ×1 1.0 V [p-p] (75 Ω)
AUDIO L-R: RCA PIN Type ×2 0.5 V [rms]
COMPONENT IN 1-2 Y: 1.0 V [p-p] (including synchronization)
PB, PR: ±0.35 V [p-p]
AUDIO L-R: RCA PIN Type ×2 0.5 V [rms]
HDMI 1-3 TYPE A Connector ×3
This TV supports [HDAVI Control 5] function.
Card slot SD CARD slot ×1
DIGITAL AUDIO OUT PCM / Dolby Digital, Fiber Optic
FEATURES 3D Y/C FILTER
CLOSED CAPTION V-Chip
VIERA IMAGE VIEWER HDAVI Control 5
Dimensions (W ×H ×D)
Including pedestal 62.0 inch ×40.0 inch ×16.4 inch (1,574 mm ×1,016 mm ×415 mm)
TV Set only 62.0 inch ×38.0 inch ×4.2 inch (1,574 mm ×965 mm ×105 mm)
Mass
Including pedestal 136.7 lb. (62.0 kg)
TV Set only 123.5 lb. (56.0 kg)
Note
• Design and Specifications are subject to change without notice. Mass and Dimensions shown are approximate.

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5 Service Mode
5.1. How to enter into Service Mode
While pressing [VOLUME ( - )] button of the main unit, press [INFO] button of the remote control three times within 2 seconds.
5.1.1. Key command
[1] button...Main items Selection in forward direction
[2] button...Main items Selection in reverse direction
[3] button...Sub items Selection in forward direction
[4] button...Sub items Selection in reverse direction
[VOL] button...Value of sub items change in forward direction ( + ), in reverse direction ( - )

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5.1.2. Contents of adjustment mode
• Value is shown as a hexadecimal number.
• Preset value differs depending on models.
• After entering the adjustment mode, take note of the value in each item before starting adjustment.
5.1.3. How to exit
Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.
Main item Sub item Sample Data Remark
ADJUST CONTRAST 46
COLOR 00
TINT 00
SUB-BRT 000
WB-ADJ R-CUT 80
G-CUT 80
B-CUT 80
R-DRV FD
G-DRV FB
B-DRV FF
ALL-DRV FF
OPTION BOOT ROM Factory Preset
STBY-SET - -
EMERGENCY ON
CLK MODE ON
CLOCK OFF
MIRROR 00 (See next)
EDID-CLK HIGH
VSUS
AGING ALL WHITE Built-in test patterns can be
displayed.
ALL BLUE WITH WHITE OUT-
SIDE FRAME
ALL GREEN
ALL RED
LOW STEP WHITE
LOW STEP BLUE
LOW STEP GREEN
LOW STEP RED
WHITE DIAGONAL STRIPE
RED DIAGONAL STRIPE
GREEN DIAGONAL STRIPE
BLUE DIAGONAL STRIPE
A-ZONE & B-ZONE
1% WINDOW
COLOR BAR
9 POINTS BRIGHT MEASURE
2 DOT OUTSIDE FRAME
ALL BLUE
DOUBLE FIXED 1% WINDOW
VERTICAL LINE SCROLL
ON/OFF OR WHITE
R/G/B/W ROTATION
HALF FIXED ALL WHITE
ALL WHITE WITH COUNT DIS-
PLAY
SRV-TOOL - See next

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5.2. Option - Mirror
Picture can be reversed left and right or up and down.
00 : Default (Normal picture is displayed)
01 : Picture is reversed left and right.
02 : Picture is reversed up and down.
Hint : If the defective symptom (e.g. Vertical bar or Horizontal bar) is moved by selection of this mirror, the possible cause is in
A-board.
5.3. Service tool mode
5.3.1. How to access
1. Select [SRV-TOOL] in Service Mode.
2. Press [OK] button on the remote control.
5.3.2. Display of SOS History
SOS History (Number of LED blinking) indication.
From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1st occurrence after shipment.
This indication except 2nd and 1st occurrence after shipment will be cleared by [Self-check indication and forced to factory ship-
ment setting].
5.3.3. POWER ON TIME/COUNT
Note : To display TIME/COUNT menu, highlight position, then press MUTE for (3 sec).
Time : Cumulative power on time, indicated hour : minute by decimal
Count : Number of ON times by decimal
Note : This indication will not be cleared by either of the self-checks or any other command.
5.3.4. Exit
1. Disconnect the AC cord from wall outlet.

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5.4. Hotel mode
1. Purpose
Restrict a function for hotels.
2. Access command to the Hotel mode setup menu
In order to display the Hotel mode setup menu, please
enter the following command (within 2 second).
[TV] : Vol. [Down] + [REMOTE] : INPUT (3 times)
Then, the Hotel mode setup menu is displayed.
3. To exit the Hotel mode setup menu
Disconnect AC power cord from wall outlet.
4. Explain the Hotel mode setup menu
item Function
Mode Select hotel mode ON/OFF
Input Select input signal modes.
Set the input, when each time power is
switched on.
Selection:
---/RF/HDMI1/HDMI2/HDMI3/COMP1/
COMP2/VIDEO1/VIDEO2
• Off: give priority to a last memory.
Channel Select channel when input signal is RF.
Set the channel, each time power is switched
on.
Selection:
Any channel number or [-].
[-] means the channel when turns off.
Volume Adjust the volume when each time power is
switched on.
Range:
0 to 100
Vol. Max Adjust maximum volume.
Range:
0 to 100
OSD Ctrl Restrict the OSD.
Selection:
OFF/PATTERN1
• OFF: No restriction
• PATTERN1: restriction
FP Ctrl Select front key conditions.
Selection:
OFF/ALL/PATTERN1
• OFF: altogether valid.
• ALL: altogether invalid.
• PATTERN: only input key is valid.
Pow Ctrl Select POWER-ON/OFF condition when AC
power cord is disconnected and then con-
nected.
OFF: The same condition when AC power
cord is disconnected.
ON: Forced power ON condition.

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5.5. Data Copy by SD Card
5.5.1. Purpose
(a) Board replacement (Copy the data when exchanging A-board):
When exchanging A-board, the data in original A-board can be copied to SD card and then copy to new A-board.
(b) Hotel (Copy the data when installing a number of units in hotel or any facility):
When installing a number of units in hotel or any facility, the data in master TV can be copied to SD card and then copy to other
TVs.
5.5.2. Preparation
Make pwd file as startup file for (a) or (b) in a empty SD card.
1. Insert a empty SD card to your PC.
2. Right-click a blank area in a SD card window, point to New, and then click text document. A new file is created by default
(New Text Document.txt).
3. Right-click the new text document that you just created and select rename, and then change the name and extension of the
file to the following file name for (a) or (b) and press ENTER.
File name:
(a) For Board replacement : boardreplace.pwd
(b) For Hotel : hotel.pwd
Note:
Please make only one file to prevent the operation error.
No any other file should not be in SD card.

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5.5.3. Data copy from TV set to SD Card
1. Turn on the TV set.
2. Insert SD card with a startup file (pwd file) to SD slot.
On-screen Display will be appeared according to the startup file automatically.
3. Input a following password for (a) or (b) by using remote control.
(a) For Board replacement : 2770
(b) For Hotel : 4850
Data will be copied from TV set to SD card.
It takes around 2 to 6 minutes maximum for copying.
4. After the completion of copying to SD card, remove SD card from TV set.
5. Turn off the TV set.
Note:
Following new folder will be created in SD card for data from TV set.
(a) For Board replacement : user_setup
(b) For Hotel : hotel

15
5.5.4. Data copy from SD Card to TV set
1. Turn on the TV set.
2. Insert SD card with Data to SD slot.
On-screen Display will be appeared according to the Data folder automatically.
3. Input a following password for (a) or (b) by using remote control.
(a) For Board replacement : 2771
(b) For Hotel : 4851
Data will be copied from SD card to TV set.
4. After the completion of copying to SD card, remove SD card from TV set.
(a) For Board replacement : Data will be deleted after copying (Limited one copy).
(b) For Hotel : Data will not be deleted and can be used for other TVs.
5. Turn off the TV set.
Note:
1. Depending on the failure of boards, function of Data copy for board replacement does not work.
2. This function can be effective among the same model numbers.

16
6 Troubleshooting Guide
Use the self-check function to test the unit.
1. Checking the IIC bus lines
2. Power LED Blinking timing
6.1. Check of the IIC bus lines
6.1.1. How to access
6.1.1.1. Self-check indication only:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [OK] button on the remote control
for more than 3 seconds.
6.1.1.2. Self-check indication and forced to factory shipment setting:
Produce TV reception screen, and while pressing [VOLUME ( - )] button on the main unit, press [MENU] button on the remote con-
trol for more than 3 seconds.
6.1.2. Exit
Disconnect the AC cord from wall outlet.
6.1.3. Screen display
6.1.4. Check Point
Confirm the following parts if NG was displayed.

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6.2. Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinks of the Power LED on the front panel of the unit.

18
6.3. No Power
First check point
There are following 2 states of No Power indication by power LED.
1. No lit.
2. Red is lit then turns red blinking a few seconds later. (See 6.2.)

19
6.4. No Picture

20
6.5. Local screen failure
Plasma display may have local area failure on the screen. Fig-1 is the possible defect P.C.B. for each local area.
Fig-1