Panasonic BB-HCM547A User manual

© 2008 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.
Order No.KMS0808505CE
F15
Network Camera
Model No. BB-HCM547A
(for U.S.A.)

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BB-HCM547A
TABLE OF CONTENTS
PAGE PAGE
1Warning--------------------------------------------------------------3
1.1. Battery Caution ---------------------------------------------3
1.2. About Lead Free Solder (PbF: Pb free) --------------3
1.2.1. Suggested PbF Solder -------------------------------4
1.3. For Service Technicians ----------------------------------4
1.4. Trademarks --------------------------------------------------4
2 Specifications ------------------------------------------------------5
3Features--------------------------------------------------------------7
4 Technical Descriptions------------------------------------------8
4.1. CPU Peripheral Block-------------------------------------8
4.2. Camera Block(Image signal processing,
LENS control) --------------------------------------------- 10
4.3. Image Compression Block----------------------------- 13
4.4. Audio Block ------------------------------------------------ 14
4.5. LAN Block -------------------------------------------------- 15
4.6. Pan and Tilt Motor Control Circuit-------------------- 16
4.7. Power Supply Block ------------------------------------- 17
4.8. PoE Block -------------------------------------------------- 18
4.9. Others------------------------------------------------------- 19
5 Location of Controls and Components------------------ 20
6 Installation Instructions--------------------------------------- 21
6.1. Installation Guide----------------------------------------- 21
6.2. Setup Guide ----------------------------------------------- 26
7 Troubleshooting Guide---------------------------------------- 28
7.1. Basic Operation------------------------------------------- 28
7.2. Other Function Check---------------------------------- 29
7.3. Power Supply Block Check---------------------------- 30
7.4. CPU Peripheral Block Check ------------------------- 31
7.5. LVDS Block Check--------------------------------------- 32
7.6. Image Block Check -------------------------------------- 33
7.7. Audio Block Check--------------------------------------- 34
7.8. LAN Block Check----------------------------------------- 35
7.9. Motor Block Check--------------------------------------- 36
7.10. Lens Block Check---------------------------------------- 37
7.11. I/O Terminal Check -------------------------------------- 39
7.12. SD Card Block Check----------------------------------- 40
7.13. RTC Circuit Check --------------------------------------- 41
7.14. LED Circuit Check --------------------------------------- 42
7.15. Diagnosis NG Check ------------------------------------ 43
7.16. Version Upgrade Check -------------------------------- 44
7.17. Resetting the Camera----------------------------------- 45
7.17.1. Resetting the camera using the FACTORY
DEFAULT RESET button-------------------------- 45
7.18. Updating the Camera’s Firmware -------------------- 46
7.19. Restoring Settings from a Configuration File------ 46
7.20. How to Change MAC Address Label---------------- 47
7.21. How to Replace a Flat Package IC ------------------ 48
7.21.1. Preparation-------------------------------------------- 48
7.21.2. Procedure --------------------------------------------- 48
7.21.3. Removing Solder from Between Pins ---------- 48
8 Disassembly and Assembly Instructions--------------- 49
8.1. Disassembly Instructions------------------------------- 49
8.1.1. How To Remove Main Board, IO Board
and LED Board. ------------------------------------- 49
8.1.2. How To Remove Tilt Board------------------------ 50
8.1.3. How To Remove Lens Block---------------------- 54
9 Block Diagram --------------------------------------------------- 55
10 Schematic Diagram--------------------------------------------- 56
10.1. For The Schematic Diagram-------------------------- 56
10.2. Schematic Diagram ------------------------------------- 57
10.2.1. Main Board ------------------------------------------- 57
10.2.2. Video Board ------------------------------------------ 64
10.2.3. Lens Board ------------------------------------------- 66
10.2.4. Tilt Board ---------------------------------------------- 67
10.2.5. IO Board----------------------------------------------- 68
10.2.6. LED Board -------------------------------------------- 72
10.3. Waveform-------------------------------------------------- 73
11 Printed Circuit Board------------------------------------------ 79
11.1. Main Board (Component View) ---------------------- 79
11.2. Main Board (Bottom View) ---------------------------- 80
11.3. Video Board (Component View) -------------------- 81
11.4. Video Board (Bottom View) -------------------------- 81
11.5. Lens Board (Component View)---------------------- 82
11.6. Lens Board (Bottom View)---------------------------- 82
11.7. Tilt Board (Component View) ------------------------ 83
11.8. Tilt Board (Bottom View) ------------------------------ 83
11.9. IO Board (Component View)------------------------- 84
11.10. IO Board (Bottom View) ------------------------------- 85
11.11. LED Board (Component View) ---------------------- 86
11.12. LED Board (Bottom View) ---------------------------- 86
12 Appendix Information of Schematic Diagram -------- 87
12.1. Terminal Guide of ICS, Transistors and
Diodes ------------------------------------------------------ 87
13 Exploded View and Replacement Parts List----------- 89
13.1. Cabinet and Electrical Parts Location -------------- 89
13.2. Accessories and Packing Materials ---------------- 90
13.3. Replacement Parts List -------------------------------- 91
13.3.1. Cabinet and Electrical Parts---------------------- 91
13.3.2. Accessories and Packing Materials ------------ 91
13.3.3. MAIN Board Parts ---------------------------------- 92
13.3.4. Lens Board Parts and Video Board Parts----- 94
13.3.5. Tilt Board Parts -------------------------------------- 96
13.3.6. IO Board Parts--------------------------------------- 96
13.3.7. LED Board Parts ------------------------------------ 98

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BB-HCM547A
1Warning
1.1. Battery Caution
Danger of explosion if the battery is replaced incorrectly. Replace only with the same or equivalent type recommended by the
manufacturer. Discard used batteries according to following caution:
Disposal or transportation of lithium batteries should be performed by permitted, in accordance with federal, state and local
guidelines.
A battery continues to have no transportation limitations as long as it is separated to prevent short circuits and packed in strong
packaging.
Commercial firms that dispose of any quantity of lithium cells should have a mechanism in place to account for their ultimate dis-
position. This is a good practice for all types of commercial or industrial waste.
When the lithium battery is exchanged, the clock settings are cleared. In this case, make clock settings again.
Recommend Type Number:
CR2032/H9B (BAT601) Manufactured by MATSUSHITA
CR Coin Cell Lithium Battery Information:
This product contains a CR Coin Cell Lithium Battery which contains Perchlorate Material - special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate
1.2. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with tem-
perature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).

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BB-HCM547A
1.2.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. The fol-
lowing lead free (PbF) solder wire gauge are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
1.3. For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-
vent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
1.4. Trademarks
• Adobe and Acrobat are either registered trademarks or trademarks of Adobe Systems Incorporated in the United States and/or
other countries.
• Ethernet is a registered trademark of Xerox Corporation in the United States and/or other countries.
• Microsoft, Windows and Active X are either registered trademarks or trademarks of Microsoft Corporation in the United States
and/or other countries.
• Pentium is a registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
• Screen shots reprinted with permission from Microsoft Corporation.
All other trademarks identified herein are the property of their respective owners.

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BB-HCM547A
2 Specifications
Camera Specifications
Other Specifications
Items Specifications
Zoom 4.6×zoom (2.3×optical zoom, 2×digital zoom)
Pan/Tilt Angle Pan: -175 °to +175 °
Tilt: 0 °to +82 °
Number of Pixels 1/3.6 inch MOS sensor, 370,000 pixels
Illuminance 2-100,000 lx (0.2-100,000 lx when in Color Night View mode)
White Balance Auto/Manual/Hold
Lens Brightness 9 levels
Focus Fixed, 0.75 m-Infinity
Minimum Object Distance 0.75 m (2 feet 6 inches)
Aperture (F No.) Wide: F1.9
Tele: F2.8
Horizontal Viewing Angle Wide: 73 °
Tele: 32 °(2.3×optical zoom); 16 °(4.6×zoom)
Vertical Viewing Angle Wide: 55 °
Tele: 24 °(2.3×optical zoom); 12 °(4.6×zoom)
Exposure Auto
Items Specifications
Splash Resistant Standard IPX4*1
Image Compression JPEG (3 levels), MPEG-4
Image Resolution 640 ×480, 320 ×240, 192 ×144
Buffered Images About 970 frames (320 ×240, standard image quality) with time display(when SD memory card is not
inserted)
Audio Communication 2-way Half Duplex
Audio Compression Format ADPCM 32 kbps
Audio Bandwidth 300 Hz-3.4 KHz
Audio Reception Method ActiveX
Audio Reception Decoding ActiveX
Audio Input Built-in microphone, external microphone input terminal
External Microphone Input Termi-
nal*2
3.5 mm jack
Audio Output Audio line output terminal for external speaker
Audio Output Terminal*2 3.5 mm stereo jack (output is mono)
Video Output Analog composite (NTSC/PAL)
Video Output Terminal*2 3.5 mm jack
External Input/Output Interface External sensor input x 2
External output x 1
SD Card Slot Full size
Frame Rate*3 Max. 30 frames/second (640 x 480*4, 320 x 240, 192 x 144)
Communication Protocols IPv4/IPv6 Dual-Stack
IPv4:
TCP, UDP, IP, HTTP, FTP, SMTP, DHCP, DNS, ARP, ICMP, POP3, NTP, UPnP™, SMTP Authentication,
RTP, RTSP, RTCP, HTTPS, SSL,TLS
IPv6:
TCP, UDP, IP, HTTP, FTP, SMTP, DNS, ICMPv6, POP3, NDP, NTP, RTP, RTSP, RTCP, HTTPS,
SSL,TLS
Image Buffer/Transfer Triggers Timer, Alarm 1, Alarm 2, Motion Detection
Image Transfer Method SMTP*5, FTP, HTTP
LAN Interface 10Base-T/100Base-TX Ethernet RJ-45 connector
Indicator Display Power
Camera Operation
Ethernet Link
Dimensions (WxHxD) 115 mm ×153 mm ×153 mm
(4 1/2 inches ×6 inches ×6 inches)
Weight (Main Unit Only) 690 g (1.52 lb)

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*1When the camera is installed according to the instructions provided in the included documentation, and the camera has been
properly waterproofed.
*2 A customer-provided audio/video cable is needed to connect an external microphone, speaker, or TV.
*3 Frame rate may slow down depending on the network environment, PC performance, image quality, SD memory recording,
when viewing dark images, etc.
*4 30 frames/second is not possible when viewing MJPEG images at 640 ×480 resolution.
*5 The camera supports POP Before SMTP Authentication and SMTP Authentication. PLAIN, LOGIN, and CRAM-MD5 SMTP
Authentication are supported.
Power Supply Optional AC adaptor (Model No. BB-HCA3A)
Input 100-120 V AC, 50/60 Hz
Output 12 V DC, 750 mA
PoE
PoE standard IEEE802.3af-2003
Power Consumption When Using an Optional AC Adaptor (Model No. BB-HCA3A)
About 4.4 W (8.5 W during pan/tilt scan)
When Using PoE
About 4.4 W (7.9 W during pan/tilt scan)
Operating Temperature Operation: -20 °C (-4 °F) to +50 °C (+122 °F)
Storage: -25 °C (-13 °F) to +60 °C (+140 °F)
Operating Humidity Operation: 20 %-90 % (no condensation)
Storage: 20 %-90 % (no condensation)
Items Specifications

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BB-HCM547A
3 Features
Splash-resistant body
The BB-HCM547 features an IPX4-compliant*1 splash-resistant body that allows the camera to be used both indoors and out-
doors. (See the Installation Guide and Mounting Guide for proper outdoor installation instructions.)
Zoom features
The camera features an optical zoom that allows you to magnify images by up to 2.3 ×and a digital zoom that allows you to fur-
ther magnify images by up to 2 ×, for a total zoom range of 4.6 ×.
On-site and remote camera monitoring
Camera images can be monitored from a PC, both on-site and over the Internet. You can even use your mobile phone to view
still images when you’re out of the house.
MPEG-4 and Motion JPEG (MJPEG) support
Live camera images can be viewed and buffered (i.e., stored in memory) in both MPEG-4 and JPEG (MJPEG) formats, allowing
you to select the video format that best suits your needs.
Backlight Correction feature
When this feature is enabled, the camera can automatically correct the brightness of the camera image. This means even when
there is backlight in the image, the camera can correct the image to provide a more consistent, natural image.
Audio features
The camera features a built-in microphone that allows you to monitor the audio while viewing live camera images using your PC.
You can connect a user-supplied microphone if desired. Additionally, by connecting a user-supplied external powered speaker,
you can talk to someone while seeing their image on your PC.
Motion detection feature
The camera’s motion detection feature allows you to buffer or transfer camera images when the camera detects motion in the
camera image.
Camera image buffering and playback
Camera images can be automatically buffered at specific times, when the camera’s external sensors (customer-provided) are
triggered, or when the camera detects motion. You can program the camera to buffer these camera images, and then you can
play back these images later while accessing the camera or save them to your PC. You can also program the camera to transfer
images by E-mail or upload them to an FTP or HTTP server as they are being buffered.
PoE (Power over Ethernet) ready
The camera is compliant with PoE (IEEE 802.3af) standards, and contains a power receiving device that enables it to receive
power from the same Ethernet cable used for network connection. This allows you to mount the camera in locations where there
is no power outlet nearby, saving you the cost of installing a new power outlet. In addition, power can be supplied to the camera
using an Ethernet cable of up to 100 m (about 328 feet) long, allowing you more freedom to install the camera wherever you
want. PoE connection requires a PoE compliant hub or similar device. An optional AC adaptor can be used instead of a PoE
connection if you want to connect the camera to a standard AC outlet.
SD/SDHC memory card support
Camera images can be recorded to an optional SD/SDHC memory card in addition to the camera’s internal memory. The cam-
era supports Panasonic SD memory cards from 64 MB to 2 GB in capacity, as well as Panasonic SDHC memory cards. Addi-
tionally, the Stand-alone SD Memory Card Recording feature allows you to configure the camera to record images without using
a PC.
UPnP™ support
When connecting the camera to a UPnP™ compatible router, the camera’s network settings can be automatically configured,
making setup quick and easy.
Viewnetcam.com support
After registering your camera with the Viewnetcam.com service, you can access the camera while away from home using an
easy to remember Internet address of your choosing, such as ***.viewnetcam.com.
Multi-language support
All camera pages can be displayed in English, French, German, Italian, Spanish, Russian, Simplified Chinese, and Japanese.
The most commonly used camera pages can be displayed in Korean.
*1 When the camera is installed according to the instructions provided in the included documentation, and the camera has been
properly waterproofed

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BB-HCM547A
4 Technical Descriptions
4.1. CPU Peripheral Block

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[IC 101 peripheral]
• The function of the IC101 is a system LSI for a network camera containing the CPU
• The power supply voltages are +3.3 V (IO) and +1.2 V (inside) and there are two power supply.
• The function of the CPU is hardware control, TCP/IP protocol processing and applications performance such as HTTP and FTP.
• The clock setting is 27 MHz, 48 MHz, 54 MHz and 108 MHz by inside, which multiply 48 MHz oscillation in the X101 by PLL.
• There are two types of external bus: the General-purpose bus and the bus for SDRAM only.
• The General bus is connected to a Flash Memory for program storage.
• The capacity of the Flash Memory (IC102) is 64Mbit (4 M x 16 bit); the program, the setting information for the network camera
and the MAC address are stored.
• Two SDRAMs (IC103/104) of 128 Mbit (8 M x 16 bit) are used, which are connected to CPU with bus width of 32bit, and are
available for CPU processing work, storage of communication data, and storage of audio/image data.
• The RESET IC (IC106) monitors the power supply voltage, detects the rising edge of +3.3 V and generates the Hardware Reset
Signal.
• IC602 is RTC (Real Time Clock), and is used for time setting of image transfer, etc. This is backed up by a lithium battery
(BAT601) even at the time of power OFF. I2C Bus is used as I/F with CPU.
• There is an RTC block inside IC101, and this inside RTC block operates during the existence of electricity by importing the clock
data from IC602 at the time of power ON.
• IC101 is equipped with the GPIO terminal, which is used for input and output signal of motor control and IO terminal control, etc.
• An SD memory card control block is included on IC101, and used by connecting an SD card slot (CN602).
• There is a green LED (LED101) near the SD card slot, and it lights while the SD card is being accessed.
• When the FUNCTION switch(SW102) is pressed, since LED(LED 601) is turned off and the SD card access stop, and it can be
safely pulled out.
[Power LED control]
Red and green LEDs are used in the Power LED (LED901) indicator on the LED board. LEDs are turned on, blinked or turned
off by turning ON/OFF the transistors (Q901 and Q902) that are connected to the LEDs. The transistors are turned ON/OFF
from the output port of the CPU (IC101) on the Main board.
LED_R LED_G Q901 Q902 LED COLOR
H H ON ON Orange
HLONOFFRed
L H OFF ON Green
L L OFF OFF OFF the light

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4.2. Camera Block(Image signal processing, LENS control)
[VIDEO Board]
• IC201 is a MOS type image sensor of approximately 370 thousand pixels, which outputs the image signal (M_OUT) of an VGA
(640x480) size.
• IC202: This IC is to remove noise in the M_OUT signal, adjust the gain and output the 12-bit data (D_OUT[11:0]).
IC202 includes TG (Timing Generator) generation function of the MOS image sensor (IC201), synchronizing signals genera-
tion function (PCLK, VD and HD), noise removal (CDS: correlative double sampling) function of image signal (M_OUT) and
12-bits A/D conversion function.
The pixel clock (PCLK), synchronizing signal (VD and HD) and 12-bit data (D_OUT [11:0]) that are output from the IC202 are
input into the LVDS Transmitter IC on IC203, and after being parallel-serial converted, they are converted into the two-wire
differential signals. Then the signals are transmitted to the LVDS Receiver IC (IC604) on the Main board. In the LVDS
Receiver IC (IC604), the signals are then serial-parallel converted to recover the pixel clock and the 12-bit data, which are
output to the CPU (IC101). (Refer to Fig. 1.)
• Oscillation frequency of the IC202 is 17.172MHz and the clock signal is generated with the use of the crystal oscillator (X201).
• The IC202 is controlled by the serial signals (CS_AFE, SDI, and SCL) in the CPU (IC101).
The SDI and SCL signals in the serial signals are shared and used in the DA converter (IC903) mounted on the LENS board.
(Refer to Fig. 2.)
• Hard reset (RESET) of IC202 is controlled by GPIO of IC101 on the Main board.
• The power supplies used in the camera block are made +5.6V into +5.0V by the IC206 and are made +5.0V into +3.1V by the
IC204 supplied from the main board.
Figure 1 Video Signal Transmission via LVDS

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Figure 2 Sharing of Serial Signals (SDI and SCL)
[Main Board]
• Pixel clock (PCLK: 17.172MHz), 12-bit RAW (AFE_D[11:0]) and synchronizing signal (AFE_VD and AFE_HD) that are output
from the IC202 are transmitted to the LVDS Receiver IC (IC604) on the Main board via the LVDS Transmitter. They are serial-
parallel converted in the LVDS Receiver IC (IC604) and are output recovered the pixel clock (CCDCLK), 12-bit RAW data (CCD
[11:0]) and synchronizing signal (CCDCLK and CCDHD) into the CPU (IC101).
• In the VIDEO SIGNAL Processor block incorporated in IC101, the RAW data is subjected to such signal processing as OB
clamping, white balancing, and γprocessing, then the RAW data is temporary recorded in the external SDRAM. The RAW data
is subjected to the three-step processing that is composed of pixel correction, YC generation and scaling, and the data after the
processing is recorded in the same external SDRAM as the image data.
• The serial control signals (SDI, SCL and CS_AFE) from the CPU (IC101) on the main board are sent to the AFE/TG IC (IC202)
on the VIDEO board via CN651.
[LENS Board]
Camera has 2.3 X optical zoom lens. This lens unit has the ZOOM lens drive motor and the IRIS unit. These components are

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controlled from the CPU (IC101) on the main board.
[ZOOM drive motor control]
The CPU controls the ZOOM motor drive driver (IC303) mounted on the LENS board by drive timing signal (Z_1, Z_2 and
Z_END) of the ZOOM motor. The output current, pulse period, and the number of pulses are also set up by the driver. This
ZOOM motor drive driver (IC303) controls phase two excitation for the ZOOM lens drive motor. The power supply for motor drive
is used +3.3 V supplied via the Reg. IC (IC208) from +5.6 V supplied via the VIDEO board.
[IRIS drive control]
The IRIS has been adjusted in the factory and the adjusted values are saved in the EEPROM memory (IC204) on the video
board. The adjusted values and the control values are written in the DA converter (IC302) on the LENS board in the initialization
process when the power is turned ON and each V cycle. No subsequent process to write the data into the DA converter will be
carried out. Once the adjusted values are written in the DA converter, the output voltage from the DA converter can be con-
trolled. The DA output is applied in the IRIS control circuit.

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4.3. Image Compression Block
• Image compression (JPEG/MPEG-4 encode) function, memory control unit (MCU), ETHERNET MAC and SD card controller are
built into IC101.
• Picture data input from the camera block is captured in SDRAM (1).
• Captured image data is input to the ZOM block, where the scaling of the image size is done, (an image size of 640 x 480, 320 x
240, or 192 x 177 is generated from the one with the size of 1280 x 1024, or an image size of 320 x 240 or 192 x 177 from the
one with the size of 640 x 480), and is stored in SDRAM again (2).
• The scaled image data is input to the JPEG/MPEG-4 encode section of IC101, and the image is compressed. The compressed
image data is stored in SDRAM again (3).
• After CPU processed the compressed image data for a communication protocol, the data is forwarded to the network via ETH-
ERNET MAC and ETHERNET PHY. And the image data of post-compression is processed for a file and is recorded on the SD
card.
• As for the video output, the captured image data is scaled to a size of NTSC or PAL at the ZOM block, and then it is output from
VIDEO OUT and DAC sections as an analog video signal.
• This analog video signal is amplified by the video amplifier (IC601) and output from CN506 on the IO board with the output
impedance of 75Ω.

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4.4. Audio Block
The audio circuit is mounted on the IO board, and included the internal MIC terminal (MIC901) and the external MIC terminal
(CN504) as the audio input and included the SP terminal (CN505) as the audio output, and supports one channel respectively
for audio input of the microphone and audio output from the camera. The internal MIC (MIC901) audio signal is mounted on the
LED board, and is connected with the PCM codec (IC531) via CN901→CN505.
When the audio is output from the camera, the audio output become possible that external speaker is connected with the SP
terminal.
ALC Amplifier (IC532/533)
Power Supply: 3.3 V
Amplifier for Auto Level Control
PCM Codec (IC531)
Power Supply Voltage: 3.3 V
Clock Frequency: Contains a built-in PLL function and generates a clock from the BCLK (256 KHz).
That contains an amplifier, LPF, gain adjustment, AD/DA converter, host I/F, PCM serial I/F and speaker output function.
Flow of audio Signal
[Microphone audio]
1. Ordinarily microphone audio is selected internal MIC audio, the audio signal, after being amplified by the amplifier in the PCM
codec (IC531) and by the ALC (IC532), is applied to the PCM codec (IC531) again. When the input audio signal level exceeds
a certain level, the ALC (IC532) changes the gain to keep the output signal level constant and to constrain the distortion in the
voice.
On the other hand, when the external microphone connect with CN504, the audio signal, after being amplified by the amplifier
in the PCM codec (IC531) and by the ALC (IC533), is applied to the PCM codec (IC531) again. And the MIC changeover
detection signal send the CPU, is switched the audio signal from the internal MIC to the external MIC in CPU codec (IC531).
2. In the PCM Codec (IC531), by a register setting from the host, amplification, AD conversion and gain adjustment are per-
formed.
The sampling frequency of the A/D conversion is 8kHz and it is converted to the PCM in the format of 8bit and µlaw. Then,
64kbps data are output to the IC101 on the Main board through the Serial I/F.
The data transfer of the Serial I/F is BCLK (256 kHz).
3. The data compression of 32 kbps is performed in the ADPCM Block inside of the IC101 and the data transferred as audio
data.
[Speaker audio]
1. The ADPCM audio data are sent from the PC and, after data decompression in the ADPCM block of the CPU (IC101), the
data are transferred as the audio data of 64 kbps to the PCM Codec (IC601) through the Serial I/F.

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2. After the µlaw to linear conversion, amplification and DA conversion, they are output as audio output signal in the PCM
Codec (IC531).
4.5. LAN Block
Composed of ETHERNET MAC Block inside of the IC101 and the IC171 (ETHER-PHY) on the Main board, and the T531
(Transformer) and the CN502 (RJ45 jack) on the IO Board.
The T531 (Transformer) obtains isolation between the Set and the Ethernet.
ETHERNET MAC and the IC171 (ETHER-PHY) are connected by a signal called MIIBus and it makes Ether net data sending
and receiving possible.
[Sending]
The communication data sent from the IC101 is converted to Ethernet signal (100Base-Tx, 10Base-T) at the IC171 and sent
from the CN502 through the T531.
[Receiving]
The Ethernet signal received from the CN502 is converted to the communication data at the IC171 and received to the IC101.

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4.6. Pan and Tilt Motor Control Circuit
PAN drive motor and TILT drive motor are driven under the control from the CPU (IC101).
[PAN drive control]
PAN drive control circuit is mounted on the Main board.
For the PAN drive control, the CPU (IC101) generates a variety of pulses that are applied to the PAN motor diver (IC608) to con-
trol the speed and direction of the rotation of the motor. In addition, the reference voltage is exchanged and it is generated the
PAN motor diver (IC608) by CPU(IC101) output port and the current to the PAN motor is used to control the torque of the PAN
motor and to the W1-2 control drive of the motor.
The W1-2 control drive is the method to increase the rotational resolution of the motor, and with this method of the W1-2 control
drive the accuracy of 1.875°(7.5°/4) has been achieved for the PAN motor minimum step angle of 7.5°. The motor control signal
from the motor driver (IC608) for the PAN drive is applied to the PAN drive motor via the 4-pin connector (CN653)
In the position control, the home position for the PAN control is detected by the PAN sensor (IC606; photo coupler) when the
power is turned on, and then the position is open-loop controlled by the software. In order to remove variations among products,
the output from the PAN sensor (IC606) is input into the comparator (IC607) and the output (PAN_S) from the comparator is
detected in the CPU (IC101).
The motor drive power supply (VM voltage) for the PAN drive motor driver (IC608) is +12 V that is supplied from the IO board.
[TILT drive control]
The TILT motor driver (IC403) and TILT sensor (IC401) which are The TILT drive control circuit are mounted on the TILT board.
For the TILT drive control, the CPU (IC101) on the Main board generates a variety of pulses that are applied to the TILT motor
driver (IC403) to control the speed and direction of the rotation of the motor. Since the TILT drive control does not require such
rotational resolution as required in the PAN drive control, but the “W1-2” control method is used. In the TILT drive unit, the accu-
racy of 1.875°(7.5°/4) has been achieved for the TILT motor minimum step angle of 7.5°. The motor control signal from the
motor driver (IC403) for the TILT drive is applied to the TILT drive motor via the 4-pin connector (CN403).
In the position control, the home position for the TILT control is detected by the TILT sensor (IC401; photo coupler) when the
power is turned on, and then the position is open-loop controlled by the software. In order to remove variations among products,
the output from the TILT sensor (IC401) is input into the comparator (IC607) on the CPU board and the output (TILT_S) from the
comparator is detected in the CPU (IC101).
The motor drive power supply (VM voltage) for the TILT drive motor driver (IC403) is +12 V that is supplied from the IO board via
the Main board.

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BB-HCM547A
4.7. Power Supply Block
The above figure shows the flow to supply power.
There are two ways to supply power to the camera. One is the POE power feed via the LAN cable and the other is the power feed
from the AC adaptor.
The POE power feed is described in SECTION 4.8.
[Power supply circuit on the IO board]
• The DC powers of +12 V and +3.3 V are generated on the IO board.
• The +12 V power is supplied by the AC adaptor or POE circuit mounted on the IO board. This +12 V power is used on the follow-
ing boards:
- IO board : +3.3 V DC-DC converter circuit and output terminal of the IO terminal (CN507) .
- Main board : Power supply to drive the PAN motor drive driver, and DC-DC converter circuit for +5.6 V that is supplied to the
camera unit.
- TILT board : Power supply to drive the TILT motor drive driver.
• The +3.3 V power is generated from the +12 V power in the DC-DC converter circuit (IC504). It is used on the following boards:
- IO board : Audio circuit and IO terminal unit
- Main board : All of the +3.3 V power supply
[Power supply circuit on the Main board]
• On the CPU board, the +1.2 V power used in the circuits internal to the CPU (IC101) is generated in the regulator (IC603). The
+5.6V power is generated from the +12 V power in the DC-DC converter circuit (IC609) and it is supplied to the Video board via
the TILT board.
[Power supply circuit on the TILT board]
• On the TILT board, the +12 V power which is supplied from the IO board via the Main board is used on the following boards:
- TILT board : Power supply to the TILT motor drive driver
[Power supply circuit on the VIDEO board]
On the VIDEO board, +5.0V in the regulator (IC206) and +3.1 V in the DC-DC converter circuit (IC204) are generated from the
+5.6 V power supplied from the Main board.
+5.0 V and +3.1 V on the Video board is supplied to the Lens board,.
• The +3.1 V power is used on the following boards:
- VIDEO board: All IC of the +3 V
- LENS board : Power supply to the DC converter (IC302) of the IRIS control
• The +5.0V powers are used on the following boards:
- VIDEO board: Power supply to the MOS SENSOR (IC201) and the TG/SG/CDS (IC 202)
[Power supply circuit on the Lens board]
• On the Lens board, +3.3 V in the regulator (IC208) is generated from the +5.6 V power supplied from the VIDEO board. The +12
V power is used on the following boards:
The +3.3 V power is used on the following boards used on the following boards:
- Lens board : Power supply to the ZOOM motor driver (IC303)

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BB-HCM547A
4.8. PoE Block
[Power receive]
The power supplied from a LAN cable receives voltage (+48 V) via a diode bridge from a RJ-45 connector (CN502) on the IO
Board.
There are 2 types of PoE receiving methods; a type using unused pins (4, 5, 7 and 8 pin) for LAN data transmission and a type
using the mid point of data lines (1, 2, 3 and 6 pin). This product is compatible with both types because it is equipped with 2 lines
(D501 and D502) of diode bridge circuits
The outputs of the 2 diode bridges described above are connected to the same poles and supply the subsequent circuits + and -
powers.
[PD certification circuit]
The voltage obtained from the diode bridges is supplied to the PD control IC (IC501) of PoE.
The PD control IC (IC501) performs the following operations with the applied voltage from the supply side of power.
For applied voltage of 2.8 - 10 V from the supply side, it returns the internal resistance value of PD control IC (IC604) (25 kΩ).
For applied voltage of 15.5 - 20.5 V from the supply side, it returns the current value by the resistor connected to the Pin (5) of
IC501. (This product is resistance value (45.3 Ω) and it is designed with Class 3 specification.)
When 48 V is applied as the certification progresses, it conducts between the Pins (7) and (10).
[Voltage drop section]
When the power of 48V is supplied to the following DC/DC converter section based on the PD authentication, voltage is con-
verted by PD control IC (IC501), output FET (IC502), switching transformer (T501), rectification diode (D517 and D518), and
capacitor (C513), which results in output of +12 V.
[Switching with AC adaptor]
There is a DC jack (CN601), to which an AC adaptor is connected when POE is not used, and +12 V is input from the AC adap-
tor. Switching of +12 V from the PoE circuit is conducted by using diodes (D521 and D519).

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BB-HCM547A
4.9. Others
[I/O Terminal]
• The Input terminal has two systems; both of them are connected to the Input Port of the IC101 GPIO.
• Due to Internal Pull-up Resistance, the PNP Transistor (Q532, Q533) on the following level is usually in the OFF state and the
Input Port connected to the collector is at L level.
• If the terminal is short-circuited with the GND or the signal of L level is input, the PNP Transistor goes ON and the Input Port
goes to H level.
• The CPU checks the state of this port regularly to detect a change in this signal.
• The Output terminal is controlled by the Output Port of the IC101. When the Port output is L, the transistor (Q534) on the follow-
ing level is OFF and, when the output is H, the transistor is ON. This transistor has open collector output and it controls external
equipment via external pull-up.
[RESET SW (SW103)]
• The RESET SW (SW103) mounted on the Main board is connected to the output of the RESET IC (IC106). It is usually at H level
and goes to L level, when the SW is pressed. It becomes the same movements as the hardware reset.
[CLEAR SETTING SW (SW101)]
• The Clear Setting SW (SW101) mounted on the Main board is connected to the Input Port of the GPIO. It is usually at H level and
goes to L level, when the SW is pressed.
• The CPU(IC101) monitors this Input Port periodically and, if it detects that this SW is pressed longer than a specified period, the
setting values other than the RTC are returned to factory settings.

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BB-HCM547A
5 Location of Controls and Components
*1 Understanding the Camera Indicator
The camera’s indicator lights as follows according to the status of the camera. Understanding how and when the indicator lights
can help you troubleshoot problems with the camera.
Camera Status or Operation Indicator Color and Pattern
Normal Operation Green
When power is turned on (camera is starting up) Orange→Flashing orange
Obtaining IP address via DHCP Flashing green
LAN cable not connected or no LAN connection Orange
Automatic Setup In progress Flashing green
Completed Green
Updating firmware Flashing orange
Factory reset (by software or by pressing the FACTORY DEFAULT
RESET button)
Flashing orange→Off→(The camera restarts)
UPnP™ port forwarding error Flashing orange (2-second intervals)
SD memory card is damaged, write-protected, or not formatted prop-
erly
Red
Camera failure Flashing red