Panasonic SA-AK630E User manual

ORDERNO. MD0503064C2
CD Stereo System
SA-AK630E / SA-AK630EB / SA-AK630EG
Colour
(S)... Silver Type

AMPLIFIER SECTION
RMS output power
THD 10%, bothchannelsdriven
1kHz
(Lowchannel) 75 Wper channel (5)
10 kHz
(High channel) 70 Wper channel (5)
80 Hz
(Subwoofer channel) 160 W(8)
Total power output 450 W
FM/AM TUNER, TERMINALS SECTION
Preset station FM 15 stations
AM 15 stations
FrequencyModulation (FM)
Frequencyrange
87.50 - 108.00 MHz (50 kHz steps)
Sensitivity 1.8V (IHF)
S/N 26 dB 1.5V
Antennaterminal(s) 75 (unbalanced)
AmplitudeModulation (AM)
Frequencyrange 522 - 1629 kHz (9kHz steps)
Sensitivity
S/N 20 dB (at 999 kHz) 560 V/m
Audioperformance (Amplifier)
Input sensitivity/Input
impedance
Aux 250 mV,14.7k
Phonejack
Terminal Stereo, 3.5mm jack
CASSETTE DECK SECTION
Track system 4 track, 2channel
Heads
Record/playback Solidpermalloyhead
Erasure Doublegapferritehead
Motor DC servomotor
Recording system AC bias 100 kHz
Erasing system AC erase 100 kHz
Tapespeed 4.8cm/s
Overall frequencyresponse (+3dB, -6dB at DECK OUT)
NORMAL 35 Hz - 14 kHz
S/N ratio 50 dB (Aweighted)
Wowand flutter 0.18 %(WRMS)
Fast forwardand rewind time Approx. 120 secondswith
C-60 cassettetape
DISC SECTION
Discs played[8cm or12 cm]
(1) CD-Audio(CD-DA)
(2) CD-R/RW(CD-DA, MP3formatteddiscs)
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(3) MP3
Bit rate
MP3 32 kbps- 320 kbps
Sampling frequency
MP3 32 kHz, 44.1kHz, 48 kHz
CD 44.1kHz
Decoding 16 bit linear
Digital filter 8 fs
D/Aconverter MASH (1bit DAC)
Pickup
Wavelength 780 nm
Beam Source Semiconductorlaser
Audiooutput (Disc)
Number of channels 2(Stereo) (FL,FR)
GENERAL
Power Supply
ForE & EG only AC 230 V, 50Hz
ForEB only AC 230 -240 V, 50Hz
Power consumption 260 W
Power consumption instandby
mode 0.7W
Dimensions(WxH xD) 250 x330 x341 mm
Mass 7.1kg
Operating temperature range +5to+35°C
Operating humidityrange 5to90%RH (no condensation)
SYSTEM
SC-AK630 (E) Musiccenter: SA-AK630 (E)
Speaker: SB-AK630 (GC)
Subwoofer: SB-WAK630 (GC)
SC-AK630 (EB) Musiccenter: SA-AK630 (EB)
Speaker: SB-AK630 (GC)
Subwoofer: SB-WAK630 (GC)
SC-AK630 (EG) Musiccenter: SA-AK630 (EG)
Speaker: SB-AK630 (GC)
Subwoofer: SB-WAK630 (GC)
Notes:
1. Specificationsaresubject to changewithoutnotice. Mass and
dimensionsareapproximate.
2. Total harmonicdistortion ismeasured bythedigital spectrum analyzer.
2005 Matsushita ElectricIndustrial Co. Ltd.. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
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1. Caution for AC Mains Lead
2. Before Repair and Adjustment
Disconnect AC power, discharge PowerSupplyCapacitors C5820 and C5840 through a 10 ,
5W resistortoground.
DO NOTSHORT-CIRCUITDIRECTLY (witha screwdriverblade, forinstance), as this may
destroysolidstate devices.
Afterrepairs are completed, restore powergraduallyusing a variac, toavoidovercurrent.
Current consumption at AC 230V, 50 Hz inNO SIGNALmode (volume minat CD mode) should
be ~ 350mA (E/EG only).
Current consumption at AC 230-240V, 50 Hz inNO SIGNALmode (volume minat CD mode)
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shouldbe ~ 350mA (EB only).
3. Protection Circuitry
The protection circuitrymayhave operatedif eitherof the following conditions are noticed:
-Nosound isheard when the power isturned on.
-Sound stops during aperformance.
The function of this circuitryis toprevent circuitrydamage if, forexample, the positive and
negative speakerconnection wires are
“shorted”, orif speakersystems withanimpedance less thanthe indicatedratedimpedance of
the amplifierare used.
If this occurs, followthe procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once againafter one minute.
Note :
Whenthe protection circuitryfunctions, the unit will not operate unless the poweris first turned
off and thenon again.
4. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor(solidstate) devices canbe damagedeasilybyelectricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistors and semiconductor“chip”
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist strap, which
shouldbe removed for potential shock reasons prior to applying
power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as aluminium
foil, to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder remover device. Some solder
removal devices not classified as “anti-static(ESDprotected)”
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can generate electrical charge to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, aluminium foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodymotions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient to
damage an ES device).
5. Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using leadfree solderwill have a PbF stampon the P.C.B.
Caution:
-Pb free solder has ahigher melting point than standard solder;
Typicallythe melting point is50 -70°F (30 -40°C)higher. Please
use ahigh temperature soldering iron. Incase of soldering iron
with temperature control, please set itto 700 ± 20°F (370 ± 10°C).
-Pb free solder will tend to splash when heated too high (about
1100°F/600°C).
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-When soldering or unsoldering, please completelyremove all of
the solder on the pins or solder area, and be sure to heat the
soldering points with the Pb free solder until itmelts enough.
6. Handling Precautions For Traverse Deck
The laserdiode inthe traverse deck (optical pickup) maybreak downdue topotential difference
causedbystatic electricityof clothes orhumanbody.
So, be careful of electrostatic breakdownduring repairof the traverse deck (optical pickup).
-Handling of traverse deck (optical pickup)
1. Donot subject the traverse deck (optical pickup) to static
electricityas itisextremelysensitive to electrical shock.
2. To prevent the breakdownof the laser diode, an antistatic
shorting pinisinserted into the flexibleboard (FFCboard).
3. Take care not to applyexcessive stress to the flexibleboard (FFC
board). When removing or connecting the short pin, finish the job
inas short time as possible.
4. Donot turn the variableresistor (laser power adjustment). Ithas
alreadybeen adjusted.
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Grounding forelectrostatic breakdownprevention
1. Human bodygrounding
Use the anti-staticwrist strap to discharge the staticelectricity
from your body.
2. Work tablegrounding
Put aconductive material (sheet) or steel sheet on the area where
the traverse deck (optical pickup) isplace, and ground the sheet.
Caution :
The static electricityof yourclothes will not be groundedthrough the wrist strap. So, take care
not tolet yourclothes touchthe traverse deck (optical pickup).
Caution whenreplacing the Traverse Deck
The traverse deck has a short point shortedwithsoldertoprotect the laserdiode against
electrostatics breakdown. Be sure toremove the solderfromthe short point before making
connections.
7. Precaution of Laser Diode
Caution :
Thisproduct utilizes alaser diode with the unitturned "ON",
invisiblelaser radiation isemitted from the pick up lens. /
Wavelength :780 nm / Maximum output radiation power from pick
up :100 W/VDE/ Laser radiation from pick up unitissafetylevel,
but be sure the followings:
1. Donot disassemblethe optical pick up unit, since radiation from
exposed laser diode isdangerous.
2. Donot adjust the variableresistor on the pick up unit. Itwas
alreadyadjusted.
3. Donot look at the focus lens using optical instruments.
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4. Recommend not to look at pick up lens for along time.
ACHTUNG :
Dieses Produkt enthälteine Laserdiode. Imeingeschalteten
Zustand wird unsichtbare Laserstrahlung von der Lasereinheit
abgestrahlt. / Wellenlänge :780nm / MaximaleStrahlungsleistung
der Lasereinheit:100 W/VDE/ DieStrahlung an der Lasereinheit
ist ungefährlich, wenn folgende Punkte beachtet werden:
1. DieLasereinheitnicht zerlegen, da dieStrahlung an der
freigelegten Laserdiode gefährlich ist.
2. Den werkseitigjustierten Einstellregler der Lasereinhitnicht
verstellen.
3. Nicht mitoptischen Instrumenten indieFokussierlinse blicken.
4. Nicht über längere ZeitindieFokussierlinse blicken.
ADVARSEL: I dette a apparat anvendes laser.
CAUTION!
THIS PRODUCTUTILIZES A LASER.
USE OFCONTROLS OR ADJUSTMENTS OR PERFORMANCE OFPROCEDURES OTHER THAN
THOSE
SPECIFIED HEREIN MAY RESULT IN HAZARDOUS RADIATION EXPOSURE.
Use of caution label
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8. Accessories Remote Control
FM Antenna
AC Cord(ForE & EG only)
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AC Cord(ForEB ony)
AM Loop Antenna
Antenna Plug Adapter(ForEB only)
9. Operation Procedures
10. Disassembly and Assembly of Main Component
“ATTENTION SERVICER”
Some chassis components mayhave sharpedges. Be careful whendisassembling and
servicing.
1. Thissection describes procedures for checking the operation of
the major printed circuitboards and replacing the main
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components.
2. For reassemblyafter operation checks or replacement, reverse
the respective procedures. / Special reassemblyprocedures are
described onlywhen required.
3. Select items from the following index when checks or
replacement are required.
4. Refer to the Parts No. on the page of “Parts Location and
Replacement Parts List” (Section 23), ifnecessary.
10.1. Disassemblyflow chart
The following chart is the procedure fordisassembling the casing and inside parts forinternal
inspection whencarrying out the servicing.
To assemble the unit, reverse the steps showninthe chart as below.
10.2. Gear for servicing (jig) Information
1. Thisunithas agear which isused for checking items (Open/Close
of disc tray, up/downoperation of traverse unitbymanually)when
servicing.
2. For preparation of gear (for servicing), perform the procedures as
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follows.
3. Incase of re-servicing the same set, the “gear for servicing” may
has been taken off because ithas been used. The “gear for
servicing” must be stored.
-Remove the gear provided with mecha cover as shownbelow.
-Insert the hexagonal screwdriver (2mm) into the gear, and then
project the tipof screwdriver for 1~ 2mm inlength.
10.3. Disassemblyof Top Cabinet
Step1 Remove 2 screws at eachside and 5 screws at rearpanel.
Step2 Lift up bothsides of the top cabinet, pushthe top cabinet towards the rearand remove
the top cabinet.
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10.4. Disassemblyof CD Lid
(The CD changerunit canbe removedafterthe CD Lidis removed)
-Follow the (Step 1) -(Step 2) of Item 10.3-Disassemblyof Top
Cabinet
-Opening the disc trayautomatically(Using Power Supply)
Step1 Connect the AC powercord.
Step2 Press the POWER button topowerup the mainunit.
Step3 Press the OPEN/CLOSE button, the disc traywill openautomatically.
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Step4 Release the 2 claws, and thenremove the CD Lid.
Step5 Press the OPEN/CLOSE button, the disc traywill close.
Step6 Press the POWER button toturnthe poweroff.
-[Opening the disc traymanually(Using service tools)]
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Step1 Insert the geartool intothe hole on the underside of CD chassis and thenrotate inthe
direction of arrow. The disc traywill be opened.
Step2 Release the 2 claws, and thenremove the CD lidcover.
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Step3 Repeat Step2 but rotate the geartools inanti-clockwise direction.
Step4 The disc traywill be closed.
10.5. Disassemblyof Rear Panel
-Follow the (Step 1) -(Step 2) of Item 10.3-Disassemblyof Top
Cabinet
Step1 Remove 7 screws and disconnect wire CN2810 (Fan) at rearcabinet as shown.
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10.6. Disassemblyof CD Mechanism Unit
-Follow the (Step 1) -(Step 2) of Item 10.3-Disassemblyof Top
Cabinet
Step1 Remove one screwat rearpanel.
Step2 Detachthe FFC wires (CN2801 & CN2805).
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Step3 Release the claws of bothends, and thenlift up the CD MechanismUnit.
Step4 Remove 4 screws.
Step5 Remove the CD chassis.
Step6 Laythe CD mechanismunit as shown.
-For disassemblyof CD mechanism unit, please refer to Section
10.13 of thismanual.
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10.7. Disassemblyof MainP.C.B.
-Follow the (Step 1) -(Step 2) of Item 10.3-Disassemblyof Top
Cabinet
-Follow the (Step 1) -(Step 6) of Item 10.4-Disassemblyof CD Lid
-Follow the (Step 1) of Item 10.5-Disassemblyof Rear Panel
-Follow the (Step 1) -(Step 3) of Item 10.6-Disassemblyof CD
Mechanism Unit
Step1 Disconnect FFC wires CN2803 & CN2806 fromMainP.C.B.
Step2 Lift up MainP.C.B. bydisconnecting connectors CN5800 & CN5801 as arrowshown
above.
10.8. Disassemblyof Sub-Power P.C.B.
-Follow the (Step 1) -(Step 2) of Item 10.3-Disassemblyof Top
Cabinet
-Follow the (Step 1) -(Step 6) of Item 10.4-Disassemblyof CD Lid
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