Panasonic TH-37PA30E User manual

ORDERNO. ITD0403002C2
Progressive Plasma Television
TH-37PA30E / TH-42PA30E
GP6DEChassis
SPECIFICATIONS
Specifications
Power
Source 220 V -240 V 50 Hz /60 Hz A.C.
Power
Consumption 245 W(TH-37PA30E)
Normal use 315 W(TH-42PA30E)
Standby 1.8W
Power-OFF 1.0W
Plasma
Displaypanel
Drivemethod AC type
Aspect Ratio 16:9
Contrast Ratio 4000:1
Screensize(No.of pixels) 37-inch(TH-37PA30E)
818 mm (W) × 461 mm (H) × 939 mm (diagonal)
42-inch(TH-42PA30E)
920 mm (W) × 518 mm (H) × 1,056 mm (diagonal)
408,960 (852 (W) × 480 (H)) [2,556 × 480 dots]
Sound
Speaker Woofer 80 mm × 2, Tweeter 16 mm × 73 mm × 8
AudioOutput 26 W[ 8W+8W, 5W+5W] ((10 %THD)
Headphone M3(3.5mm) Jack × 1
Applicable
signals
ColourSystem NTSC, PAL, PAL60, SECAM, ModifiedNTSC
Scanning format 525 (480) /60i 60p, 625 (575) /50i 50p
PC signals VGAdisplay
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VGA
SVGA, XGA, SXGA, UXGA..... (compressed)
Horizontal scanning frequency15 - 110 kHz
Vertical scanning frequency48 - 120 Hz
Receiving
Systems/Band
name
PALB, G, H, I, SECAM B, G SECAM L/ L’
VHFE2-E12 VHFH1-H2(ITALY)
VHFA-H (ITALY) UHFE21 -E69
CATV (S01 -S05) CATV S1-S10 (M1-M10)
CATV S11 -S20 (U1-U10) CATV S21 -S41 (Hyperband)
PALD, K, SECAM D, K
VHFR1-R2 VHFR3-R5
VHFR6-R12 UHFE21 -E69
PAL525/60 Playback of NTSC tapefromsome PALVideorecorders (
VCR)
M.NTSC Playback fromM.NTSC Videorecorders (VCR)
NTSC (AV INPUTONLY) Playback fromNTSC Videorecorders (VCR)
OUTPUT
AUDIO OUT AUDIO L-R (RCAPinType× 2) 0.5Vrms
INPUT
AV3-Front VIDEO (RCAPinType× 2) 1.0Vp-p(75 )
S-VIDEO (MINI DIN 4-pin) Y: 1.0Vp-p(75 ) C:0.286 Vp-p(75 )
AUDIO L-R (RCAPinType× 2) 0.5Vrms
AV4C-Rear Y 1.0Vp-p(including synchronization)
PB/PR±0.35 Vp-p
PC (HIGH-DENSITY D-SUB 15PIN) R, G, B/ 0.7Vp-p(75 )
HD, VD / 1.0- 5.0Vp-p(high impedance)
Others SD Cardslot × 1, PC Cardslot × 1
INPUT
/OUTPUT
AV1-Rear 21 Pinterminal (Audio/Videoin, TV out, RGB in)
AV2-Rear 21 Pinterminal (Audio/Videoin, Audio/Videoout, S-Videoin, Q-Link)
AV4-Rear 21 Pinterminal (Audio/Videoin, Audio/Videoout, S-Videoin, RGB in, Q-Link)
ANT
-Rear UHF/ VHF
Operating
Conditions Temperature :0° - 40 °C
Humidity:20 %- 80 %RH (non-condensing)
Accessories
Supplied
RemoteControl
Transmitter EUR7635020
Batteries 2 × R6Size
Clamper TMME206 × 2
Ferritecore Largesize× 2, Small size× 5
Dimensions
( W× H × D ) 1,040 mm × 697 mm × 139 mm (TH-37PA30E)
1,140 mm × 757 mm × 139 mm (TH-42PA30E)
Mass
(Weight) 34.5kg(TH-37PA30E)
41.0kg(TH-42PA30E)
Notes
:
-
Design and specificationsare subject tochangewithout notice.Mass and dimensionsshownare approximate.
-
Thisequipment complies withtheEMC standardslistedbelow.
EN55013,EN61000-3-2,EN61000-3-3,EN55020.
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2004 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. Applicable signals
2. Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, see to itthat all the protective devices such as
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insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to
prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect ameasuring network for touch currents between each
exposed metallicpart on the set and agood earth ground such as
awater pipe, as showninFigure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to
measure the potential across the measuring network.
4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reserve the AC plug inthe AC outlet and repeat each of the above
measure.
6. The potential at anypoint (TOUGHCURRENT) expressed as
voltage U1and U2, does not exceed the following values:
For a. c.:U1= 35 V(peak) and U2= 0.35 V(peak);
For d. c.:U1= 1.0V,
Note:
The limit value of U2= 0.35 V (peak) fora. c. and U1= 1.0 V ford. c. correspond tothe values 0.7
mA (peak) a. c. and 2.0 mA d. c.
The limit value U1= 35 V (peak) fora. c. correspond tothe value 70 mA (peak) a. c. for
frequencies greaterthan100 kHz.
7. Incase ameasurement isout of the limits specified, there isa
possibilityof ashock hazard, and the equipment shouldbe
repaired and rechecked before itisreturned to the customer.
Figure 1
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3. Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischarging ESDwrist strap,
whichshouldbe removed for potential shock reasons prior to
applying power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5. Donot use freon-propelled chemicals. These can generate
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electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient
todamage an ES device).
4. About lead free solder (PbF)
Note: Leadis listedas (Pb) inthe periodic table of elements.
Inthe information below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
The LeadFree Solderusedinourmanufacturing process and discussedbelowis (Sn+Ag+Cu).
That is Tin(Sn), Silver(Ag) and Copper(Cu) although othertypes are available.
This model uses PbFree solderinit’s manufacture due toenvironmental conservation issues.
Forservice and repairwork, we’dsuggest the use of Pbfree solderas well, although Pbsolder
maybe used.
PCBs manufacturedusing leadfree solderwill have the PbF withina leaf Symbol
stampedon the back of PCB.
Caution
-Pb free solder has ahigher melting point than standard solder.
Typicallythe melting point is50 ~ 70 °F (30~40 °C)higher. Please
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use ahigh temperature soldering iron and set itto 700 ± 20 °F (370
± 10 °C).
-Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C).
Ifyou must use Pb solder, please completelyremove all of the Pb
free solder on the pins or solder area before applying Pb solder. If
thisisnot practical, be sure to heat the Pb free solder until it
melts, before applying Pb solder.
-After applying PbF solder to doublelayered boards, please check
the component side for excess solder which mayflow onto the
opposite side. (see figure below)
SuggestedPbfree solder
There are several kinds of Pbfree solderavailable forpurchase. This product uses Sn+Ag+Cu
(tin, silver, copper) solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder
canalsobeused.
5. Service Hint
Stand the unit usedforpedestal.
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Remove the RearCover.
Remove the AV ConnectorCover.
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Service position.
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Board
Name Function
C1 DATA DRIVER (RIGHT)
C2 DATA DRIVER (LEFT)
DDIGTALSIGNALPROCESS
DG DIGTALCORE, MICOM
GFRONTTERMINAL, SWITCH
H REAR TERMINAL
JG SD CARD/PC CARD, JPEG I/FD/A
KLED, REMOTE, POWER SWITCH
P POWER SUPPLY
PA DC/DC, AUDIO
PF LINE FILTER
S POWER SWITCH
SC SCAN DRIVE
SD SCAN OUT(DOWN)
SS SUSTAIN DRIVE
SS2 SUSTAIN CONNECTION (UP)
SS3 SUSTAIN CONNECTION (DOWN)
SU SCAN OUT(UP)
TTUNER
6. P.C.Board and Plasma panel replacement method
To replace the plasma panel (finished), place the unit on the servicing stand, remove the
front frame (finished), and replace the panel, being careful not toscratchthe plasma panel
surface.
1. Remove the rear cover and the AVconnector cover.
2. Remove the P-Board.
A. Remove the couplers (P2, P5, P7, P9, P11, P12, P23, P25, P27).
B. Remove the screws(×5) and remove the P-Board.
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3. Remove the PA-Board.
A. Remove the couplers (PA1, PA2, PA3, PA4, PA5, PA6, PA7,
PA8, PA10A, PA12).
B. Remove the screws(×4 ) and remove the PA-Board with the
PA-Board Bracket.
C. Remove the screws(×6 ) and remove the PA-Board.
4. Remove the D-Board.
A. Disconnect the couplers (D3, D4, D6, D12, D22, D25) and the
flexiblecables (D31, D32).
B. Remove the screws(×7) and remove the D-Board with the
bracket.
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5. Remove the DG-Board, the H-Board and the T-Board.
A. Remove the couplers (DG2, DG3, DG6, DG8, DG10, DG12, H9), a
flexiblecable(DG7), and the screws(×5 ).
B. Remove the DG-Board, the H-Board and the T-Board with the
bracket.
C. Remove the bridge connectors (DG1-H1, DG4-H4) and remove
the screws(×3 ) on the DG-Board.
D. Remove the DG-Board.
E. Remove the screws(×6 ) on the H-Board and the screws(×2 )
on the T-Board bracket.
F. Remove the coupler (H10) and the antenna cable, remove the T-
Board with the T-Board bracket.
G. Remove the H-Board.
H. Remove the screws(×2) and remove the T-Board.
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6. Remove the PF-Board.
A. Remove the couplers (PF2, PF10).
B. Remove the screws(×5 ), and remove the PF-Board with the
Bracket.
C. Remove the coupler (PF1) and remove the screws(×5 ).
D. Remove the PF-Board.
7. Remove the SU-Board.
A. Remove the screws(×2).
B. Slide the SU-Board to the left and disconnect from the couplers
(SC41, SC42) on the SC-Board.
C. Remove the flexiblecables (SU1, SU2, SU3) connected to the
SU-Board, and remove the SU-Board.
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8. Remove the SD-Board.
A. Remove the screws(×2).
B. Slide the SD-Board to the left and disconnect from the couplers
(SC43, SC44) on the SC-Board.
C. Remove the flexiblecables (SD1, SD2, SD3) connected to the
SD-Board, and remove the SD-Board.
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9. Remove the SC-Board.
A. Remove the couplers (SC2, SC20, SC23), the screws(×9) and
remove the SC-Board.
10. Remove the SS2-Board.
A. Remove the coupler (SS47), and remove the flexiblecable
(SS45).
B. Remove the screws(×2), and remove the SS2-Board.
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11. Remove the SS3-Board.
A. Remove the coupler (SS40) and the flexiblecable(SS46).
B. Remove the screws(×2), and remove the SS3-Board.
12. Remove the SS-Board.
A. Remove the couplers (SS11, SS12, SS23, SS34), and remove
the flexiblecables (SS40, SS47) on the SS3-Board and SS2-
Board.
B. Remove the flexiblecables (SS41, SS42, SS43, SS44).
C. Remove the screws(×6), and remove the SS-Board.
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13. Remove the C1-Board.
A. Remove the flexiblecableholder fastening screws(×6) and
remove the flexiblecables (CB1, CB2, CB3).
B. Remove the flexiblecables (C11, C12) release the speaker
cables from the clampers (×2) on the C1-Board.
C. Remove the screws(×4), and remove the C1-Board.
14. Remove the C2-Board.
A. Remove the flexiblecableholder fastening screws(×8), and
remove the flexiblecables (CB4, CB5, CB6, CB7).
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B. Remove the couplers (C23, C24), aflexiblecable(C21) and
release the speaker cables from the clamper on the C2-Board.
C. Remove the screws(×4), and remove the C2-Board.
15. Remove the JG-Board and G-Board.
A. Remove the screws(×7) fixing the woofer speakers, the
interconnecting couplers (×4, to woofer and tweeter) and
remove the woofer speakers (right and left).
B. Disconnect acoupler (DG10), aflexiblecable(DG7) and the
couplers of interconnecting connector (from DG18 to G18 and
H9to G5).
C. Remove the screws(×5 ) and remove the JG-Board and G-
Board with the Bracket.
D. Remove the screws(×7 ) and remove the JG-Board with
Bracket.
E. Remove the screws(×2 ) and remove the Shieldcase of JG-
Board.
F. Remove the screws(×5) and remove the JG-Board.
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G. Remove the screws(×2) and remove the G-Board.
16. Remove the Front frame (glass).
A. Remove the front frame and the plasma panel fastening screws
(×10 ), and remove the front frame and the stand braket
fastening screws(×6 ).
B. Release all cables from the clamper on the bracket of the front
frame.
C. For leaving the the plasma panel from the front frame, pull the
bottom of the front frame forward, lift, and remove.
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17. Remove stand brackets.
A. Remove the plasma panel section from the servicing stand and
layon asurface such as atable(covered), with the plasma
panel surface facing downward.
Spread asoft cloth or similar on the tablefor protection, so the
panel surface isnot scratched.
B. Remove the stand bracket (left, right) fastening screws(×4
each) and remove the stand brackets (left, right).
18. Replace the plasma panel (finished).
A. Place the new plasma panel (finished) on the flat surface of the
table(covered byasoft cloth), with the plasma panel surface
facing downward.
B. Fitthe stand brackets (left, right) to the new plasma panel.
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