Panasonic TX-PR50VT20 User manual

ORDER NO.PCZ1004046CE
Plasma Television
Model No. TX-PR50VT20
GPF13DE hassis
A WARNING
This service information is desi ned for experienced repair technicians only and is not desi ned for use by the eneral public.
It does not contain warnin s or cautions to advise non-technical individuals of potential dan ers in attemptin to service a product.
Products powered by electricity should be serviced or repaired only by experienced professional technicians. Any attempt to service
or repair the product or products dealt with in this service information by anyone else could result in serious injury or death.
IMPORTANT SAFETY NOTI E
There are special components used in this equipment which are important for safety. These parts are marked by A in the Schematic
Dia rams, Circuit Board Dia rams, Exploded Views and Replacement Parts List. It is essential that these critical parts should be replaced
with manufacturer's specified parts to prevent shock, fire or other hazards. Do not modify the ori inal desi n without permission of
manufacturer.
Panasonic © Panasonic Corporation 2010.
Unauthorized copyin and distribution is a violation
of law.

TABLE OF ONTENTS PAGE
1 Safety Precautions...................................................................3
1.1. General Guidelines..........................................................3
1.2. Touch-Current Check.......................................................3
2 Warnin ...................................................................................4
2.1. Prevention of Electrostatic Dischar e (ESD) to
Electrostatically Sensitive (ES) Devices..............................4
2.2. About lead free solder (PbF) ............................................. 5
3 Service Navi ation...................................................................6
3.1. PCB Layout ....................................................................6
3.2. Applicable si nals...........................................................7
4 Specifications.......................................................................... 8
5 Technical Descriptions...........................................................10
5.1. Service port (M3 mini Jack) Specifications.........................10
6 Service Mode..........................................................................13
6.1. How to enter into Service Mode.......................................13
6.2. Option - Mirror..............................................................15
6.3. Service tool mode.........................................................15
6.4. Hotel mode..................................................................16
6.5. Data Copy by SD Card...................................................17
7 Troubleshootin Guide...........................................................20
7.1. Check of the IIC bus lines..............................................20
7.2. Power LED Blinkin timin chart ...................................... 21
7.3. No Power....................................................................22
7.4. No Picture....................................................................23
7.5. Local screen failure.......................................................24
8 Service Fixture & Tools...........................................................25
8.1. SC ji .......................................................................... 25
9 Disassembly and Assembly Instructions.................................26
9.1. Remove the Rear cover................................................26
9.2. Remove the AC inlet.................................................... 26
9.3. Remove the P-Board...................................................26
9.4. Remove the Side terminal cover and the Side shield
metal ------------------------------------------------------------- 26
9.5. Remove the Tuner unit.................................................26
9.6. Remove the A-Board...................................................27
9.7. Remove the Speakers..................................................27
9.8. Remove the Woofer..................................................... 27
9.9. Remove the Fan..........................................................28
9.10. Remove the SU-Board.................................................28
9.11. Remove the SD-Board.................................................28
9.12. Remove the SC-Board.................................................28
9.13. Remove the SS2-Board................................................29
9.14. Remove the SS-Board.................................................29
9.15. Remove the Han er metals and the One le bracket ------- 29
9.16. Remove the Cabinet mount metals.................................30
9.17. Remove the D-Board ................................................... 30
9.18. Remove the C1-Board .................................................. 30
9.19. Remove the C2-Board .................................................. 30
9.20. Remove the C3-Board ----------------------------------------- 30
9.21. Remove the C4-Board...................................................31
9.22. Remove the C5-Board...................................................31
9.23. Remove the C6-Board...................................................31
9.24. Remove the Plasma panel section from the Cabinet
assy --------------------------------------------------------------- 31
9.25. Remove the Contact metals ...........................................32
9.26. Remove the K-Board................................................... 32
9.27. Remove the V-Board.....................................................32
9.28. Replace the plasma panel.............................................32
10 Measurements and Adjustments............................................33
10.1. Adjustment------------------------------------------------------- 33
11 Block Dia ram ----------------------------------------------------------- 37
11.1. Main Block Dia ram......................................................37
11.2. Block (1/5) Dia ram......................................................38
11.3. Block (2/5) Dia ram......................................................39
11.4. Block (3/5) Dia ram......................................................40
11.5. Block (4/5) Dia ram...................................................... 41
11.6. Block (5/5) Dia ram......................................................42
12 Wirin Connection Dia ram ------------------------------------------ 43
12.1. Caution statement.........................................................43
12.2. Wirin (1).....................................................................43
12.3. Wirin (2).....................................................................44
12.4. Wirin (3).....................................................................44
12.5. Wirin (4).....................................................................45
12.6. Wirin (5).....................................................................46
13 Schematic Dia ram ----------------------------------------------------- 47
13.1. Schematic Dia ram Note --------------------------------------- 47
13.2. P-Board (1/3) Schematic Dia ram..................................48
13.3. P-Board (2/3) Schematic Dia ram..................................49
13.4. P-Board (3/3) Schematic Dia ram..................................50
PAGE
13.5. A-Board (1/25) Schematic Dia ram..................................51
13.6. A-Board (2/25) Schematic Dia ram..................................52
13.7. A-Board (3/25) Schematic Dia ram..................................53
13.8. A-Board (4/25) Schematic Dia ram..................................54
13.9. A-Board (5/25) Schematic Dia ram..................................55
13.10. A-Board (6/25) Schematic Dia ram..................................56
13.11. A-Board (7/25) Schematic Dia ram..................................57
13.12. A-Board (8/25) Schematic Dia ram..................................58
13.13. A-Board (9/25) Schematic Dia ram..................................59
13.14. A-Board (10/25) Schematic Dia ram ............................... 60
13.15. A-Board (11/25) Schematic Dia ram ................................61
13.16. A-Board (12/25) Schematic Dia ram ............................... 62
13.17. A-Board (13/25) Schematic Dia ram ............................... 63
13.18. A-Board (14/25) Schematic Dia ram ............................... 64
13.19. A-Board (15/25) Schematic Dia ram ............................... 65
13.20. A-Board (16/25) Schematic Dia ram ............................... 66
13.21. A-Board (17/25) Schematic Dia ram ............................... 67
13.22. A-Board (18/25) and V-Board Schematic Dia ram ..............68
13.23. A-Board (19/25) Schematic Dia ram ............................... 69
13.24. A-Board (20/25) Schematic Dia ram................................70
13.25. A-Board (21/25) and K-Board Schematic Dia ram .............. 71
13.26. A-Board (22/25) Schematic Dia ram................................72
13.27. A-Board (23/25) Schematic Dia ram................................73
13.28. A-Board (24/25) Schematic Dia ram................................74
13.29. A-Board (25/25) Schematic Dia ram................................75
13.30. D-Board (1/5) Schematic Dia ram...................................76
13.31. D-Board (2/5) Schematic Dia ram...................................77
13.32. D-Board (3/5) Schematic Dia ram ---------------------------- 78
13.33. D-Board (4/5) Schematic Dia ram...................................79
13.34. D-Board (5/5) Schematic Dia ram...................................80
13.35. C1-Board Schematic Dia ram ......................................... 81
13.36. C2-Board (1/2) Schematic Dia ram..................................82
13.37. C2-Board (2/2) Schematic Dia ram..................................83
13.38. C3-Board (1/2) Schematic Dia ram..................................84
13.39. C3-Board (2/2) Schematic Dia ram..................................85
13.40. C4-Board Schematic Dia ram .........................................86
13.41. C5-Board (1/2) Schematic Dia ram..................................87
13.42. C5-Board (2/2) Schematic Dia ram
--------------------------- 88
13.43. C6-Board (1/2) Schematic Dia ram..................................89
13.44. C6-Board (2/2) Schematic Dia ram..................................90
13.45. SC-Board (1/4) Schematic Dia ram ................................. 91
13.46. SC-Board (2/4) Schematic Dia ram.................................92
13.47. SC-Board (3/4) Schematic Dia ram.................................93
13.48. SC-Board (4/4) Schematic Dia ram.................................94
13.49. SS-Board (1/2) Schematic Dia ram..................................95
13.50. SS-Board (2/2) and SS2-Board Schematic Dia ram...........96
14 Printed Circuit Board..............................................................97
14.1. P-Board ....................................................................... 97
14.2. K, V and SS2-Board.................................................. 100
14.3. A-Board......................................................................101
14.4. D-Board....................................................................103
14.5. C1-Board...................................................................105
14.6. C2-Board...................................................................106
14.7. C3-Board...................................................................107
14.8. C4-Board...................................................................108
14.9. C5-Board...................................................................109
14.10. C6-Board....................................................................110
14.11. SC-Board...................................................................111
14.12. SS-Board....................................................................113
15 Exploded View and Replacement Parts List............................115
15.1. Exploded View and Mechanical Replacement Parts List —115
15.2. Electrical Replacement Parts List...................................123
2

1 Safety Precautions
1.1. General Guidelines
6
1.2.
1. When conductin repairs and servicin , do not attempt to modify the equipment, its parts or its materials.
2. When wirin units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wirin unit instead.
3. When conductin repairs and servicin , do not twist the Fasten connectors but plu them strai ht in or unplu them strai ht
out.
4. When servicin , observe the ori inal lead dress. If a short circuit is found, replace all parts which have been overheated or
dama ed by the short circuit.
5. After servicin , see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
After servicin , make the followin leaka e current checks to prevent the customer from bein exposed to shock hazards.
Touch- urrent heck
1. Plu the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measurin network for touch currents between each exposed metallic part on the set and a ood earth round
such as a water pipe, as shown in Fi ure 1.
3. Use Leaka e Current Tester (Simpson 228 or equivalent) to measure the potential across the measurin network.
4. Check each exposed metallic part, and measure the volta e at each point.
5. Reserve the AC plu in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUCH CURRENT) expressed as volta e U1 and U2, does not exceed the followin values:
For a. c.: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For d. c.: U1 = 1.0 V,
Note:
The limit value of U2 = 0.35 V (peak) for a. c. and U1 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies reater than 100 kHz.
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Measuring network for TOU H URRENTS
COLD
WATER PIPE
(EARTH GROUND)
Rs=
1500Q_L Cs= 0.22|jF
10kQ
-1 k 1
----- 1
Ro=
----------------
J 500Q'U1 =
r= 0.022|jF (V)
JQ LjJ JUUii U1 —|— и.и^гфГ ^ V J | U2 (V)
APPLIANCES
EXPOSED
METAL PARTS
Resistance values in ohms (Q)
V: Voltmeter or oscilloscope
(r.m.s. or peak readin )
Input resistance: > 1 MQ
Input capacitance: < 200 pF
Frequency ran e: 15 Hz to 1 MHz and d.c. respectively
NOTE - Appropriate measures should be taken to obtain the correct value in case of non-sinusoidal waveforms.
Fi ure 1
3

2 Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically
Sensitive (ES) Devices
Some semiconductor (solid state) devices can be dama ed easily by static electricity. Such components commonly are called Elec
trostatically Sensitive (ES) Devices. Examples of typical ES devices are inte rated circuits and some field-effect transistors and
semiconductor [chip] components. The followin techniques should be used to help reduce the incidence of component dama e
caused by electrostatic dischar e (ESD).
1. Immediately before handlin any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touchin a known earth round. Alternatively, obtain and wear a commercially available dischar in ESD wrist strap,
which should be removed for potential shock reasons prior to applyin power to the unit under test.
2. After removin an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi
num foil, to prevent electrostatic char e buildup or exposure of the assembly.
3. Use only a rounded-tip solderin iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
enerate electrical char e sufficient to dama e ES devices.
5. Do not use freon-propelled chemicals. These can enerate electrical char es sufficient to dama e ES devices.
6. Do not remove a replacement ES device from its protective packa e until immediately before you are ready to install it. (Most
replacement ES devices are packa ed with leads electrically shorted to ether by conductive foam, aluminum foil or compara
ble conductive material).
7. Immediately before removin the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handlin unpacka ed replacement ES devices. (Otherwise ham less motion such as the brush
in to ether of your clothes fabric or the liftin of your foot from a carpeted floor can enerate static electricity (ESD) sufficient
to dama e an ES device).
4

Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturin process and discussed below is (Sn+A +Cu).
That is Tin (Sn), Silver (A ) and Copper (Cu) althou h other types are available.
This model uses Pb Free solder in it's manufacture due to environmental conservation issues. For service and repair work, we'd
su est the use of Pb free solder as well, althou h Pb solder may be used.
PCBs manufactured usin lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a hi her meltin point than standard solder. Typically the meltin point is 50 ~ 70 °F (30~40 °C) hi her. Please
use a hi h temperature solderin iron and set it to 700 ± 20 °F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too hi h (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applyin Pb sol
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applyin Pb solder.
• After applyin PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see fi ure below)
component component
remove all of the ^1П\
excess solder
2.2. About lead free solder (PbF)
slice
\
solder
Su ested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+A +Cu (tin, silver, copper) solder. How
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
5

3 Service Navigation
3.1. P B Layout
Board Name Function
P Power Supply
A DC-DC Converter, Tuner
Speaker out, AV Terminal, HDMI in, SD Card, PC in
Di ital Si nal Processor, PEAKS-LDA2
Power Switch, Key Switch
K Remote receiver, Power LED, C.A.T.S sensor
V 3D Eyewear transmitter
D Format Converter, Plasma AI, Sub-Field Processor
Board Name Function
C1 Data Driver (Lower Ri ht)
C2 Data Driver (Lower Center)
C3 Data Driver (Lower Left)
C4 Data Driver (Upper Ri ht)
C5 Data Driver (Upper Center)
C6 Data Driver (Upper Left)
SC Scan Drive
SS Sustain Drive
SS2 Sustain out (Lower)
SU Scan out (Upper)
Non serviceable.
SU-Board should be exchan ed for service.
SD Scan out (Lower)
Non serviceable.
SD-Board should be exchan ed for service.
6

3.2. Applicable signals
COMPONENT (Y, PB, PR), HDMI
* Mark: Applicable input si nal for Component (Y, PB, PR) and HDMI
Si nal name COMPONENT HDMI
525 (480) / 60i * *
525 (480) / 60p * *
625 (576) / 50i * *
625 (576) / 50p * *
750 (720) / 60p * *
750 (720) / 50p * *
1,125 (1,080) / 60i * *
1,125 (1,080) / 50i * *
1,125 (1,080) / 60p *
1,125 (1,080) / 50p *
1,125 (1,080) / 24p *
PC (from D-sub 15P)
Applicable input si nal for PC is basically compatible to VESA standard timin .
Si nal name Horizontal frequency (kHz) Vertical frequency (Hz)
640 x 400 @70 Hz 31.47 70.07
640 x 480 @60 Hz 31.47 59.94
640 x 480 @75 Hz 37.50 75.00
800 x 600 @60 Hz 37.88 60.32
800 x 600 @75 Hz 46.88 75.00
800 x 600 @85 Hz 53.67 85.06
852 x 480 @60 Hz 31.44 59.89
1,024 x 768 @60 Hz 48.36 60.00
1,024 x 768 @70 Hz 56.48 70.07
1,024 x 768 @75 Hz 60.02 75.03
1,024 x 768 @85 Hz 68.68 85.00
1,280 x 768 @60 Hz 47.70 60.00
1,280 x 1,024 @60 Hz 63.98 60.02
1,366 x 768 @60 Hz 48.39 60.04
Macintosh13” (640 x 480) 35.00 66.67
Macintosh16” (832 x 624) 49.73 74.55
Macintosh21” (1,152 x 870) 68.68 75.06
PC (from HDMI terminal)
Applicable input si nal for PC is basically compatible to HDMI standard timin .
Si nal name Horizontal frequency (kHz) Vertical frequency (Hz)
640 x 480 @60 Hz 31.47 60.00
750 (720) / 60p 45.00 60.00
1,125 (1,080) / 60p 67.50 60.00
Note
• Si nals other than above may not be displayed properly.
• The above si nals are reformatted for optimal viewin on your display.
• PC si nal is ma nified or compressed for display, so that it may not be possible to show fine detail with sufficient clarity.
7

4 Specifications
■ TV
Power Source
Power onsumption
Standby Power onsumption
Display panel
Aspect Ratio
Visible screen size
Number of pixels
Sound Speaker
Audio Output
Headphones
P signals
Receiving Systems / Band name
Aerial - input
Operating onditions
onnection Terminals
AV1 (Scart terminal)
AV2 (Scart terminal)
AV3 VIDEO
AUDIO L - R
OMPONENT
VIDEO
AUDIO L - R
Others
HDMI1 / 2 / 3 / 4
P
ard slot
ETHERNET
USB1 / 2
Output
AUDIO L - R
DIGITAL AUDIO OUT
Dimensions (W x H x D)
Mass
■ 3D Eyewear
Lens type
AC 220-240 V, 50 / 60 Hz
495 W
0.4 W
19.0 W (With monitor out recordin )
16:9
127 cm (dia onal)
1,105 mm (W) x 622 mm (H)
2,073,600 (1,920 (W) x 1,080 (H)) [5,760 x 1,080 dots]
Full ran e (160 mm x 40 mm) x 2 pcs, Woofer (Ф 100 mm) x 1 pcs
30W( 10 Wx 2 + 10 W)
M3 (3.5 mm) stereo mini Jack x 1
VGA, SVGA, WVGA, XGA
SXGA, W XGA ..... (compressed)
Horizontal scannin frequency 31 - 69 kHz
Vertical scannin frequency 59 - 86 Hz
PAL D, K, SE AM D, K
VHF R1 - R2
VHF R6 - R12
PAL 525/60
M.NTS
NTS (AV input only)
DVB-T
VHF R3 - R5
UHF E21 - E69
Playback of NTSC tape from some PAL Video recorders (VCR)
Playback from M. NTSC Video recorders (VCR)
Playback from NTSC Video recorders (VCR)
Di ital terrestrial services (MPEG2 and MPEG4-AVC(H.264))
• Check the latest information on the available services at the followin website. (En lish only)
http://panasonic.jp/support/ lobal/cs/tv/
VHF/ UHF
Temperature:
Humidity: 0 °C - 35 °C 20 % - 80 % RH (non-condensin )
21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, Q-Link)
21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, S-Video in, Q-Link)
RCA PIN Type x 1
RCA PIN Type x 2 1.0 V [p-p] (75 Q) 0.5 V [rms]
Y
PB, PR
RCA PIN Type x 2
1.0 V [p-p] (includin synchronization)
± 0.35 V [p-p]
0.5 V [rms]
TYPE A Connectors
HDMI1 / 3 / 4 : HDMI (Version 1.4 with 3D, Content Type), Deep Colour,
x.v.Colour™
HDMI2 : HDMI (Version 1.4 with 3D Content Type, Audio Return Chan
nel, Deep Colour, x.v.Colour™
• This TV supports [ HDAVI Control 5 ] function.
HIGH-DENSITY D-SUB 15PIN R,G,B/0.7 V [p-p] (75 Q)
HD, VD/TTL Level 2.0 - 5.0 V [p-p] (hi h impedance)
SD Card slot x 1
Common Interface slot x 1
RJ45, IEEE802.3 10BASE-T / 100BASE-TX
USB2.0 DC 5 V, Max 500 mA
RCA PIN Type x 2 0.5 V [rms] (hi h impedance)
PCM / Dolby Di ital, Fiber optic
1.224 mm x 810 mm x 335 mm (With Pedestal)
1.224 mm x 771 mm x 90 mm (TV only)
30.5 k Net (With Pedestal)
27.5 k Net (TV only)
Liquid Crystal Shutter
Frame sequential type
8

Battery (Duration)
Materials
Viewing range
Operating onditions
Dimensions (W x H x D)
Mass (including battery)
I Wireless LAN Adaptor
Antenna
Interface
Standard ompliance
Transmission system
Frequency Range
Transfer rate (standard)*
Access Mode
Security
Dimensions (W x H x D)
Mass
Coin-shaped lithium battery CR2032
(approx. 75 hours in continuous use of the battery made by Panasonic)
Main body: Resin
Lens: Liquid crystal lass
within approx. 3.2 m from the front of the TV
0 °C - 40 °C
177 mm x 46 mm x 174 mm
63.0 Net
Tx 1, Rx 2
USB 2.0
IEEE802.11n / IEEE802.11a / IEEE802.11 / IEEE802.11b
MISO-OFDM system, OFDM system, DSSS system
IEEE802.11n / IEEE802.11a:
5.15 GHz - 5.35 GHz
5.47 GHz - 5.725 GHz
IEEE802.11 / IEEE802.11b / IEEE802.11n:
2.4 GHz - 2.4835 GHz
IEEE802.11n:
IEEE802.11 / IEEE802.11a:
IEEE802.11b:
Infrastructure mode
WPA2-PSK (TKIP/AES)
WPA-PSK (TKIP/AES)
WEP (64 bit / 128 bit)
44 mm x 27 mm x 72 mm
29.0 Net
Tx Max. 150 Mbps, Rx Max. 300 Mbps
Max. 54 Mbps
Max. 11 Mbps
This device supports WPA and WPA2 encryption.
MAC address and Product Identification Markin are located on the bottom of the Wireless LAN Adaptor.
‘Transfer rates are theoretical values; however, actual communication rate will vary accordin to communication environment or
connected equipment.
Note
• Desi n and Specifications are subject to chan e without notice. Mass and Dimensions shown are approximate.
9

5 Technical Descriptions
5.1. Service port (M3 mini Jack) Specifications
The Service port (M3 mini Jack) on the followin TVs can use as the RS232C terminal which is a standard computer SERIAL inter
face.
*This operation system should be used by the certified professional dealer.
PC Control of the TV
• The TV can be controlled by a personal computer when connected throu h an RS232C/ M3 mini jack conversion cable (not sup
plied).
• The computer will require software which allows sendin and receivin of control data throu h its SERIAL port.
Please see required parameters and commands below.
Communication parameters
Si nal level RS-232C compliant
Synchronization method Asynchronous
Baud rate 9600 bps
Parity None
Character len th 8 bits
Stop bit 1 bit
Flow control -
Basic format for control data
The transmission of control data from the PC starts with a STX si nal, followed by the command, the parameters, and lastly an
EXT si nal in that order. If there are no parameters, then the parameter si nal does not need to be sent.
*Please see other side re ardin Commands and Parameters.
Connection
STYX
Command: 3 byte (fixed) Colon and Parameter are only sent when necessary End (03 h): 1 byte
C1 I C2 I C3 ] Ш [ P1 | P2 I РЗ I P4 I P5 I I EX I
Start (02 h): 1 byte Colon: 1 byte Parameter: 5 bytes maximum
(Len th depends on Command)
Notes:
• With standby mode, this TV responds to "PON” and “QPW” commands only.
• Wait for the response of the first command to come from this unit before sendin the next command.
• If multiple commands are transmitted, be sure to keep intervals of 250 m sec.
Send the command a ain when the call back command is unusual.
• If an incorrect command is sent by mistake, this TV will send an “ER401 ” or “ER402” command back to the computer.
• This TV does not respond for 15 seconds when “PON” or “POF” commands are transmitted.
• Send “EXT” commands before sendin “IMS:**” commands.
10

• MUTE commands ("AMT: 0" and "AMT: 1") and "AVL: ***" command are invalid in case of HDMI (CECIL) cooperation.
However AMT, AUK, AUDI commands is effective. (MUTE rotation (to le), VOLUME UP and VOLUME DOWN controls are
possible.)
Main, Input & Picture Control Command
Control
Command Inquiry Command Call back Command Parameter note
STANDARD
CONTROL POWER ON PON QPW QPW : * "0"(OFF)/ "1"(ON)
POWER OFF POF
VOL (level) AVL: *** QAV QAV : *** "000" - "100"
(up) AUU
(down) AUD
MUTE AMT (To le) QAM QAM : * "0"(NO MUTED)
/ "1"(MUTED)
AMT: *
ASPECT DAM: **** QAS QAS : **** "ZOOM"/"FULL"/
"JUST"/"NORM"/
"SELF"/"ZOM2"/
"ZOM3"/"SFUL"/
"14:9"
Except SD mode
DAM (To 
le)
INPUT CH UP CHU -- -- --
SELECT CH DOWN CHD -- -- --
TV IMS : TV QMI QMI : ** "TV" TV network (To le)
Analo ue TV IMS : TVA "TVA"
DVB-T IMS : TVD "TVD"
DVB-S/Other Sat IMS : BS1 "BS1"
Freesat IMS : BS2 "BS2"
DVB-C IMS : CAB "CAB"
Component 1 IMS : C1 "C1"
Component2 IMS : C2 "C2"
Video 1 IMS : V1 "V1"
Video 2 IMS : V2 "V2"
Video 3 IMS : V3 "V3"
S-Video 1 IMS : S1 "S1" SCART Cable
S-Video 2 IMS : S2 "S2" SCART Cable
HDMI 1 IMS : H1 "H1"
HDMI 2 IMS : H2 "H2"
HDMI 3 IMS : H3 "H3"
HDMI 4 IMS : H4 "H4"
PC IMS : PC "PC"
SD (photo viewer) IMS : SP "SP"
VIERA CAST IMS : VC "VC"
PICTURE Vivid (Dynamic) VPC : VVT QPC QPC : *** "VVT"
MODE Standard VPC : STD "STD"
THX/ True Cinema VPC : THX "THX" THX : Except PC, JPEG, MOVIE & VIERA CAST
Cinema VPC : CNM "CNM"
Game VPC : GAM "GAM"
Photo VPC : CST "CST" Only HDMI, JPEG, MOVIE & VIERA CAST
Pro1 VPC : PR1 "PR1" When Advance (isfccc) menu is On.
Pro2 VPC : PR2 "PR2" Except VIERA CAST
11

Else & Remote Controller Key Command
Control
Command Inquiry Command Call back Command Parameter note
Information INF QIF QIF : ***** 480i
480p
576i
576p
720p
1080i
1080p
DIRECT CH
INPUT 0 ICH : 0 - - -
1 ICH : 1 - - -
2 ICH : 2 - - -
3 ICH : 3 - - -
4 ICH : 4 - - -
5 ICH : 5 - - -
6 ICH : 6 - - -
7 ICH : 7 - - -
8 ICH : 8 - - -
9 ICH : 9 - - -
MENU
FUNCTION MENU MEN - - -
SELECT SEL - - -
RETURN RTN - - -
EXIT EXT - - -
ARROW LEFT ARL - - -
ARROW RIGHT ARR - - -
ARROW UP ARU - - -
ARROW DOWN ARD - - -
OPTION (SUB MENU) SUB - - -
RED RED - - -
GREEN GRN - - -
YELLOW YEL - - -
BLUE BLU - - -
VIERA TOOLS VTL - - -
12

6 Service Mode
6.1. How to enter into Service Mode
While pressin [VOLUME ( - )] button of the main unit, press [0] button of the remote control three times within 2 seconds.
Note:
Service Mode can not be entered when 3D si nal input.
Input 2D si nal to enter Service Mode.
Software version-------------------------------------------------------------------- 1
SERVICE
White balance adjustment -► WB-ADJ
SRV-TOOL
PEAKS SOFT * .* * * OPTION 1 * *
PEAKS EEP * * * * * * * * OPTION 2 * *
LSI PACKAGE * .* * * OPTION 3 * *
LSI DATA * * * * * OPTION 4 * *
STBY SOFT * * * * * Model ID * *
STBYEEP * * * * * * * * * * * * * * *
STBY ROMCOR
PDPSOFT * * * * ** R/E Cnt * * * / * * *
PDPEEP
PDP DCC CMS data .. . .. .
PDP PDPOM * * * *
FRC EEP * * * * * * * *
MIFO SOFT * * * * * * * *
Ajax_CE
I Sub Item
+ I
Ia dj u st " i ’
'CONTRAST ' 'OOOOi
YMAX
6.1.1. Key command
[1] button...Main items Selection in forward direction
[2] button...Main items Selection in reverse direction
[3] button...Sub items Selection in forward direction
[4] button...Sub items Selection in reverse direction
[RED] button...All Sub items Selection in forward direction
[GREEN] button...All Sub items Selection in reverse direction
[VOL] button...Value of sub items chan e in forward direction ( + ), in reverse direction ( - )
13

6.1.2. ontents of adjustment mode
• Value is shown as a hexadecimal number.
• Preset value differs dependin on models.
• After enterin the adjustment mode, take note of the value in each item before startin adjustment.
Main item Sub item Sample data Remark
ADJUST CONTRAST 23A
COLOR 2B
TINT 00
Video-Gain 2 199
SUB-BRT 80C
H-POS 0
H-AMP 0
V-POS 0
V-AMP 0
WB-ADJ R-CUT 80
G-CUT 80
B-CUT 80
R-DRV F1
G-DRV FC
B-DRV DO
ALL-CUT 80
ALL-DRV FC
OPTION Panel-Type 50FHD Factory
Boot ROM Preset
STBY-SET 00
EMERGENCY ON
Y/C Delay 0
OPT 1 00111100
OPT 2 11101111
OPT 3 00000001
OPT 4 01000000
EDID-CLK HIGH
MIRROR 00 (See next)
VSUS
AGING ALL WHITE Built-in test patterns can
Al ALL BLUE + WHITE FRAME be displayed.
Al ALL GREEN
Al ALL RED
LOW STEP WHITE
LOW STEP BLUE
LOW STEP GREEN
LOW STEP RED
RAMP WHITE
RAMP RED
RAMP GREEN
RAMP BLUE
A-ZONE B-ZONE
1% WINDOW
COLOR BAR
9 POINT BRIGHTNESS
WHITE FRAME
AlA LL BLUE
TWICE FIXATION 1% WINDOW
SCROLL
ON/OFF OR WHITE
R/G/B/W AGING MODE
0.5 TIME FIXATION ALL WHITE
ALL WHITE WITH COUNT
SRV-TOOL see next
Destination Russia
Check sum 9610
EDID d3 b6a69686
6.1.3. How to exit
Switch off the power with the [POWER] button on the main unit or the [POWER] button on the remote control.
14

6.2. Option - Mirror
Picture can be reversed left and ri ht or up and down.
00
01
02
Default (Normal picture is displayed)
Picture is reversed left and ri ht.
Picture is reversed up and down.
Hint : If the defective symptom (e. . Vertical bar or Horizontal bar) is moved by selection of this mirror, the possible cause is in
A-board.
6.3. Service tool mode
6.3.1. How to access
1. Select [SRV-TOOL] in Service Mode.
2. Press [OK] button on the remote control.
Display of TD2Microcode version —
Display of Flash ROM maker code -
Display of SOS History --------------
SRV-TOOL
TD2Microcode:00500910
Flash ROM : 1 - 227E
PTCT : 00 . 00 . 00 . 00 . 00 Time 00000:40 On/Off 0000022 . POWER ON TIME/COUNT
Press [MUTE] button (3sec)
6.3.2. Display of SOS History
SOS History (Number of LED blinkin ) indication.
From left side; Last SOS, before Last, three occurrence before, 2nd occurrence after shipment, 1 st occurrence after shipment.
This indication will be cleared by [Self-check indication and forced to factory shipment settin ].
6.3.3. POWER ON Time, On/Off
Note : To display TIME/COUNT menu, hi hli ht position, then press MUTE for 3 sec.
Time : Cumulative power on time, indicated hour : minute by decimal
On/Off : Number of On/Off switchin by decimal
Note : This indication will not be cleared by either of the self-checks or any other command.
6.3.4. Exit
1. Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.
15

6.4. Hotel mode
1. Purpose
Restrict a function for hotels.
2. Access command to the Hotel mode setup menu
In order to display the Hotel mode setup menu, please
enter the followin command (within 2 second).
[TV] : Vol. [Down] + [REMOTE] : AV (3 times)
Then, the Hotel mode setup menu is displayed.
Hotel Mode
Hotel Mode
1 Off______________________|
Initial INPUT
1 Off 1
Intial POS
1 Off 1
Intial VOL Level
Г о т |
Maximum Vol Level 1 100 I
Button Lock
Г о т |
Remote Lock
Г Ш |
Select
^oE X IT
(< ой- Chan e
~ °RETURN
3. To exit the Hotel mode setup menu
Disconnect AC power cord from wall outlet.
4. Explain the Hotel mode setup menu
item Function
Hotel Mode Select hotel mode ON/OFF
Initial INPUT Select input si nal modes.
Set the input, when each time power is switched
on.
Selection :
Off/Analo /DVB/AV1/AV2/AV2S/AV3/COMPO-
NENT/PC/HDMI1/HDMI2/HDMI3/HDMI4
• Off: ive priority to a last memory. However,
Euro model is compulsorily set to TV.
• AVnS/AVnC: only Euro model selectable
• PC: selectable with VGA option
Initial POS Select pro ramme number.
Selection :
Off/0 to 99
• Off: ive priority to a last memory
Initial VOL level Adjust the volume when each time power is
switched on.
Selection/Ran e :
Off/0 to 100
• Off: ive priority to a last memory
Maximum VOL
level Adjust maximum volume. Ran e :
0 to 100
Button lock Select local key conditions.
Selection :
Off/SETUP/MENU/ALL
• Off: alto ether valid
• SETUP: only F-key is invalid
(Tunin uide (menu) can not be selected.)
• MENU: only F-key is invalid
(only Volume/Mute can be selected.)
• ALL: alto ether invalid.
Remote lock Select remote control key conditions.
Selection :
Off/SETUP/MENU
• Off: alto ether valid
• SETUP: only Setup menu is invalid
• MENU: Picture/Sound/Setup menu are invalid
16

6.5. Data opy by SD ard
6.5.1. Purpose
(a) Board replacement (Copy the data when exchan in A-board):
When exchan in A-board, the data in ori inal A-board can be copied to SD card and then copy to new A-board.
TV (Before exchan in )
Copy to SD card
Ap. SD
'Ч (After exchan in )
Followin data can be copied.
User settin data
(incl. Hotel mode settin data)
Channel scan data
Adjustment and factory preset data
Copy back from SD card
(b) Hotel (Copy the data when installin a number of units in hotel or any facility):
When installin a number of units in hotel or any facility, the data in master TV can be copied to SD card and then copy to other
TVs.
6.5.2. Preparation
Make pwd file as startup file for (a) or (b) in a empty SD card.
1. Insert a empty SD card to your PC.
2. Ri ht-click a blank area in a SD card window, point to New, and then click text document. A new file is created by default
(New Text Document.txt).
3. Ri ht-click the new text document that you just created and select rename, and then chan e the name and extension of the
file to the followin file name for (a) or (b) and press ENTER.
File name:
(a) For Board replacement : boardreplace.pwd
(b) For Hotel : hotel.pwd
Note:
Please make only one file to prevent the operation error.
No any other file should not be in SD card.
17

6.5.3. Data copy from TV set to SD ard
1. Turn on the TV set.
2. Insert SD card with a startup file (pwd file) to SD slot.
On-screen Display will be appeared accordin to the startup file automatically.
3. Input a followin password for (a) or (b) by usin remote control.
(a) For Board replacement : 2770
(b) For Hotel : 4850
Data will be copied from TV set to SD card.
It takes around 2 to 6 minutes maximum for copyin .
4. After the completion of copyin to SD card, remove SD card from TV set.
5. Turn off the TV set.
Note:
Followin new folder will be created in SD card for data from TV set.
(a) For Board replacement : user_setup
(b) For Hotel : hotel
18

6.5.4. Data copy from SD ard to TV set
1. Turn on the TV set.
2. Insert SD card with Data to SD slot.
On-screen Display will be appeared accordin to the Data folder automatically.
3. Input a followin password for (a) or (b) by usin remote control.
(a) For Board replacement : 2771
(b) For Hotel : 4851
Data will be copied from SD card to TV set.
4. After the completion of copyin to SD card, remove SD card from TV set.
(a) For Board replacement : Data will be deleted after copyin (Limited one copy).
(b) For Hotel : Data will not be deleted and can be used for other TVs.
5. Turn off the TV set.
1. Dependin on the failure of boards, function of Data copy for board replacement does not work.
2. This function can be effective amon the same model numbers.
Note:
(e. . For exchan in
repair board)
Performin
Completion
19

7 Troubleshooting Guide
Use the self-check function to test the unit.
1. Checkin the IIC bus lines
2. Power LED Blinkin timin
7.1. heck of the II bus lines
7.1.1. How to access
7.1.1.1. Self-check indication only:
Produce TV reception screen, and while pressin [VOLUME ( - )] button on the main unit, press [OK] button on the remote control
for more than 3 seconds.
7.1.1.2. Self-check indication and forced to factory shipment setting:
Caution:
New key will be enerated and previous TV pro rammes recorded in USB HDD will not be viewed. (See Chap.5)
Produce TV reception screen, and while pressin [VOLUME ( - )] button on the main unit, press [MENU] button on the remote con
trol for more than 3 seconds.
7.1.2. Screen display
7.1.3. heck Point
Confirm the followin parts if NG was displayed.
Display Ref. No. Description P.C.B.
TUN TU2901 TUNER A-Board
STBY IC1100 MPU A-Board
MEM1 IC1101 EEPROM (MPU) A-Board
MEM2 IC8950 EEPROM (PEAKS-LDA2) A-Board
ADAM IC8000 А-Chip (PEAKS-LDA2) A-Board
AVSW IC3001 Audio/Video SW A-Board
PANEL IC9003 PANEL MPU D-Board
OFDM IC8300 Di ital demodulator A-Board
TEMP IC1000 Temp Sensor A-Board
FRC IC4200 FRC-S A-Board
MIHO IC5800 MIHO A-Board
VIF TU2901 TUNER A-Board
LAN IC8703 Ethernet IF A-Board
ID A-Board
7.1.4. Exit
Disconnect the AC cord from wall outlet or switch off the power with [ Power ] button on the main unit.
20