Panasonic AG-DV2500P User manual

ORDERNO. BSD0303M901
D21
DVVIDEO CASSETTERECORDER
AG-DV2500P/ AG-DV2500E
Please refer to theOperating Instructionsin theappendix
folder. / (Go to Appendix List)
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SAFETYPRECAUTIONS
GENERALGUIDELINES
1. Whenservicing, observetheoriginal leaddress. Ifashort/ circuit
isfound, replace all parts whichhavebeenover-heatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
LEAKAGE CURRENTCOLDCHECK
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Theresistance valuemust bemorethan5M .
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Figure1
LEAKAGE CURRENTHOTCHECK (See Figure1)
1. Plug theACcorddirectlyintotheACoutlet. / Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10Wresistor, inparallel witha0.15 F
capacitor, betweeneachexposedmetallicparton theset ana
good earthground suchas awaterpipe, as showninFigure1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverses theACplug intheACoutlet repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.15 volts RMS. A
leakagecurrenttester(Simpson Model 229 equivalent) maybe
usedtomake thehotchecks, leakagecurrentmust notexceed0.1
milliamp. Incase ameasurementisoutsideofthelimits specified,
thereisapossibilityofashock hazard, and theequipmentshould
berepairedand checkedbeforeitisreturnedtothecustomer.
ABOUTLEADFREE SOLDER(PbF)
Distinction ofPbfPCB:
PCBs(manufactured)using leadfree solderwill have aPbF stampon thePCB.
Caution:
1. Pbfree solderhas ahighermelting pointthanstandardsolder;
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Typicallythemelting pointis50-70°F(30-40°C)higher. Please use
ahigh temperaturesoldering iron. Incase ofthesoldering iron
withtemperaturecontrol, please set itto700±20°F(370±10°C).
2. Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100°F/600°C).
ELECTROSTATICALLYSENSITIVE (ES)DEVICES
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticallysensitive (ED) Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor “chip”
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbystaticelectricity.
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyelectrostatic
chargeon yourbodybytouching aknownearthground. /
Alternatively, obtainand wearacommerciallyavailable
discharging wrist trapdevice, whichshouldberemovedfor
potential shock reasonspriortoapplying powertotheunitunder
test.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas aluminum
foil, topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagroundedtipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoval device classifiedas “anti-
static”cangenerate electrical charges sufficienttodamageES
devices.
5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. / (most
replacementES devices arepackagewithleadselectrically
shortedtogetherbyconductivefoam, aluminumfoil orcomparable
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conductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed. / CAUTION:Besureno powerisappliedtothechassis
orcircuit, and observeall othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackedreplacementES
devices. (Otherwise harmless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricitysufficienttodamage
anES device).
X-RADIATION
WARNING
1. Thepotential source ofX-radiation inEVFsets istheHigh Voltage
section and thepicturetube.
2. Whenusing apicturetubetest jigforservice, ensurethat jigis
capableofhandling 10kVwithoutcausing x-radiation.
Note:
Itisimportanttouse anaccurateperiodicallycalibratedhigh voltagemeter.
3. MeasuretheHigh Voltage. Themeter(electrictype) reading should
indicate 2.5kV, 0.15kV. Ifthemeterindication isoutoftolerance,
immediate service and correction isrequiredtopreventthe
possibilityofprematurecomponentfailure. To preventanx-
radiation possibility, itisessential touse thespecifiedpicturetube.
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1. Service Information
2. Mechanical Adjustments
3. Electrical Adjustments
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4. Technical Description
5. Block Diagrams/SchematicDiagrams/Circuit Board
Diagrams
NOTE
BE SURE TOMAKE YOUR ORDERS OFREPLACEMENTPARTS ACCORDINGTOPARTS LIST.
CAUTION
THE MARK INDICATES THE PRIMARYCIRCUITTODISTINGUISHTHE PRIMARYFROMTHE
SECONDARYCIRCUIT. / PAYATTENTIONNOTTORECEIVE ANELECTRICSHOCK DURING
REPAIR
SERVICE OFTHE PRODUCTS.
IMPORTANTSAFETYNOTICE:
COMPONENTS IDENTIFIEDWITHTHE MARK HAVE THE SPECIALCHARACTERISTICS FOR
SAFETY. / WHENREPLACINGANYOFTHESE COMPONENTS, USE ONLYTHE SAME TYPE.
5.1. INDEX TO PAGES OFMAINBOARDSAND CIRCUITBOARD
LOCTION
5.1.1. Circuitboard location
5.2. SYSTEMCONTROLBLOCK DIAGRAM
5.3. VIDEO BLOCK DIAGRAM
5.4. AUDIO BLOCK DIAGRAM
5.5. OVERALL WIRING DIAGRAM
5.6. DVUNITOVERALL WIRING DIAGRAM
5.7. MAINSCHEMATICDIAGRAM
5.8. MAINCIRCUITBOARD
5.9. DV/CPUSCHEMATICDIAGRAM
5.10. DV/CPUCIRCUITBOARD
5.11. MDA/DC CIRCUITBOARD
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5.12. MDA/DC SCHEMATICDIAGRAM
5.13. FDM(FRONT, DVCONN &MIC)SCHEMATICDIAGRAMS
5.14. FDM(FRONT, DVCONN &MIC)CIRCUITBOARDS
5.15. MECHA&MECHACONN SCHEMATICDIAGRAMS
5.16. MECHA&MECHACONN CIRCUITBOARDS
5.17. ICBLOCK DIAGRAMS
6. Mechanical Replacement PartsList &Exploded
Views
NOTE:
1. Besuretomake your ordersofreplacementpartsaccording tothislist.
2. Unless otherwise specified, all resistorsareinOHMS, K=1,000 OHMS, all capacitorsarein
MICROFARADS
( F), P= F.
3. TheP.C. Board unitmarkedwith" " shownbelowthemainassembledparts.
4. Thepartsmarkedwith on theexplodedviewshowtheelectricparts.
5. IMPORTANTSAFETYNOTICE
Componentsidentifiedwiththemarkhave thespecial characteristics for safety. When
replacing
anyofthese components, use onlythesametype.
6. Themarking (RTL)indicates theretention timeislimitedfor thisitem. / Afterthe
discontinuation
assemblyinproduction, itwill no longerbeavailable.
7. “(M)”inRemarkcolumnindicates neededintheperiodical maintenance.
7. Electrical Replacement PartsList
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