Panasonic NV-VP31GL User manual

ORDERNO. MAV0309001C3
DVDPlayer/ Video Cassette Recorder
NV-VP31GL / NV-VP31GC / NV-VP31GCS
R4-MECHANISM
SPECIFICATIONS
1

2003 Matsushita ElectricIndustrial Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
2

1. INTRODUCTION
1.1. INTRODUCTION
This service manual contains technical information whichwill allowservice personnel to
understand and service this model.
If the circuit is changedormodified, this information will be followedbysupplementaryservice
manual tobe filedwithoriginal service manual.
Note:
1. Adjustment procedures, DisassemblyProcedures and Assembly
Procedures for Mechanism Chassisare separate volume from this
service manual.
Please refer to the service manual for R4-Mechanism Chassis.
(Order No. VRD0202010C8)
2. The Model No. isindicated on the SchematicDiagram and Circuit
Board Diagrams as follows.
Model No. Indication Mark
NV-VP31GL (GL)
NV-VP31GC (GC)
NV-VP31GCS (GCS)
1.2. ABOUTLEAD FREE SOLDER(PbF)
Distinction of PbF PCB:
PCBs (manufactured) using leadfree solderwill have a PbF stampon the PCB.
Caution:
-Pb free solder has ahigher melting point than standard solder,
Typicallythe melting point is50-70°F (30-40°C)higher. Please use
ahigh temperature soldering iron. Incase of soldering iron with
temperature control,please set itto 700±20°F (370±10°C)
-Pb free solder will tend to splash when heated too high (about
1100°F/600°C).
Whensoldering orunsoldering, please completelyremove all of the solderon the pins orsolder
area, and be sure toheat the soldering points withthe Pbfree solderuntil it melts enough.
2. SAFETY PRECAUTIONS
3

2.1. GENERALGUIDELINES
1. When servicing, observe the original lead dress. Ifashort circuit
isfound, replace all parts which have been overheated or
damaged bythe short circuit.
2. After servicing, confirm that all the protective devices such as
insulation barriers, insulation papers shields are properly
installed.
3. After servicing, do the following leakage current checks to
prevent the customer from being exposed to shock hazards.
2.1.1. LEAKAGE CURRENTCOLD CHECK
1. Unplug the AC cord and connect ajumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the
jumpered AC plug and each exposed metalliccabinet part on the
equipment such as screwheads, connectors, control shafts, etc.
When the exposed metallicpart has areturn path to thechassis,
the reading shouldbe between 1M and 5.2M .
When the exposed metal does not have areturn path to the
chassis, the reading must be .
Figure 1
2.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)
1. Plug the AC cord directlyinto the AC outlet. Donot use an
isolation transformer for thischeck.
2. Connect a1.5k , 10 watts resistor, inparallel with a0.15 F
capacitors, between each exposed metallicpart on the set and a
good earth ground such as awater pipe, as shownin Figure 1 .
3. Use an AC voltmeter, with 1000 ohms/voltor more sensitivity, to
measure the potential across the resistor.
4

4. Check each exposed metallicpart, and measure the voltage at
each point.
5. Reverse the AC plug inthe AC outlet and repeat each of the above
measurements.
6. The potential at anypoint shouldnot exceed 0.75 volts RMS. A
leakage current tester (Simpson Model 229 or equivalent) maybe
used to do the hot checks, leakage current must not exceed 1/2
milliamp. Incase ameasurement isoutsideof the limits specified,
there isapossibilityof ashock hazard, therefore the equipment
shouldbe repaired and rechecked before itisreturned to the
customer.
3. PREVENTION OF ELECTRO STATIC DISCHARGE
(ESD) TO ELECTROSTATICALLY SENSITIVE (ES)
DEVICES
Some semiconductor(solidstate) devices canbe damagedeasilybystatic electricity. Such
components commonlyare calledElectrostaticallySensitive (ES) Devices. Examples of typical
ES devices are integratedcircuits and some field-effect transistorsand semiconductor"chip"
components. The following techniques shouldbe usedtohelpreduce the incidence of
component damage causedbyelectrostatic discharge (ESD).
1. Immediatelybefore handling anysemiconductor component or
semiconductor-equipped assembly, drainoff anyESDon your
bodybytouching aknownearth ground. Alternatively, obtainand
wear acommerciallyavailabledischargingESDwrist strap, which
shouldbe removed for potential shock reasons prior to applying
power to the unitunder test.
2. After removing an electrical assemblyequipped with ES devices,
place the assemblyon aconductive surface such as alminum foil,
to prevent electrostaticcharge buildup or exposure of the
assembly.
3. Use onlyagrounded-tipsoldering iron to solder or unsolder ES
devices.
4. Use onlyan anti-staticsolder removal device. Some solder
removal devices not classified as "anti-static(ESDprotected)"
can generate electrical charge sufficient to damage ES devices.
5

5. Donot use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Donot remove areplacement ES device from its protective
package until immediatelybefore you are readyto install it. (Most
replacement ES devices are packaged with leads electrically
shorted together byconductive foam, alminum foil or
comparableconductive material).
7. Immediatelybefore removing the protective material from the
leads of areplacement ES device, touch the protective material to
the chassisor circuitassemblyinto which the device will be
installed.
Caution
Besure no power isapplied to the chassisor circuit, and observe
all other safetyprecautions.
8. Minimize bodilymotions when handling unpackaged replacement
ES devices. (Otherwise harmless motion such as the brushing
together of your clothes fabricor the lifting of your foot from a
carpeted floor can generate staticelectricity(ESD)sufficient to
damage an ES device).
4. PRECAUTION OF LASER DIODE
6

7

8

5. PREVENTION OF STATIC ELECTRICITY
DISCHARGE
The laserdiode inthe traverse unit (optical pickup) maybreak downdue tostatic electricityof
clothes orhumanbody. Use due caution toelectrostatic break downwhenservicing and
handling the laserdiode.
9

5.1. Grounding for electrostaticbreakdownprevention
Some devices suchas the DVD playeruse the optical pickup (laserdiode) and the optical
pickup will be damagedbystatic electricityinthe working environment. Proceedservicing
works underthe working environment where grounding works is completed.
5.1.1. Worktablegrounding
1. Put aconductive material (sheet) or iron sheet on the area where
the optical pickup isplaced, and ground the sheet.
5.1.2. Human bodygrounding
1. Use the anti-staticwrist strap to discharge the staticelectricity
form your body.
5.1.3. Handling of optical pickup
1. Inorder to keep the optical pickup ingood quality, during
transporting and before installing, both ends of the laser diode
are to be shortcircuited. After replacing the part with anew one,
remove the short circuitaccording to the correctprocedure. (
Refer to thisService manual )
2. Failure to do so will damage the laser diode due to the external
current surge from the power supplyinthe tester.
5.2. Handling Precautions for Traverse Unit(Optical Pickup)
1. Donot give aconsiderableshock to the traverse unit(optical
pickup) as ithas an extremelyhigh-precise structure.
2. When replacing the optical pickup, install the flexiblecableand
cut its short land with anipper. Refer to the optical pickup
replacement procedure inthisService Manual. Before replacing
the traverse unit, remove the short pinfor preventingstatic
electricityand install anew unit. Connect the connector as soon
as possible.
3. The flexiblecablemaybe cut off ifan excessive force isapplied to
10