PDR X410 User manual

www.pdr-rework.com version : 2.01
PDR IR REWORK SYSTEMS
OPERATORS MANUAL
SOFTWARE CONTROLLED SYSTEMS
X410/XT3/XT5/D2/D3/D35/E2/E3/E6

www.pdr-rework.com

www.pdr-rework.com
Worldwide Technical Support
This product was manufactured by PDR, UK and is supplied by a worldwide network of professional distributors who
provide a full range of sales, local service and support services.
For latest information on Technical Support, new products, upgrades or who to call for assistance contact us at PDR
Europe, Asia, Africa, Middle-East and South America –PDR
Email: [email protected]
Website: www.pdr-rework.com
Phone: [phone]
Fax: [phone]
North and Central America –PDR America
Email: [e-mail]
Website: www.pdr-rework.com
Phone: USA [phone]
Fax: USA [phone]
Introduction
Firstly, prior to use, we recommend that the system be professionally installed and commissioned by a
certified PDR representative. This manual is structured to assist a technician with the operation and maintenance
of the PDR equipment. It contains a technical description to enable the reader to understand the design features of
the equipment. The safety section of the manual explains the inherent dangers presented by any type of desoldering
soldering equipment, and warnings to minimise the risk of injury through ignorance.
Terminology
The following lists terms and abbreviations used in this manual, which may need explanation:
Term Explanation
AC Alternating current as found in ‘mains’ supplies
IR Infra-red
Low Voltage Voltage below 24 volts
PCB Printed circuit board
RF Radio Frequency
SMT Surface Mount Technology
SMD Surface Mount Device

www.pdr-rework.com
Safety
Health and Safety at Work
It is vital that PDR users familiarise themselves with the requirements of local health and safety legislation prior to
using the system.
Warnings and Cautions
For the purposes of this manual a warning refers to a danger of injury to the operator whereas a caution refers to a
danger of damage to the equipment. The warnings and cautions detailed below are basic safety requirements and
are intended to ensure operator awareness of the dangers of the equipment.
Warnings
Do not allow the Infra-Red spot from the lens unit (either directly or via mirror) to come into contact with the
eyes as serious eye damage may occur.
Do not allow the Infra-Red spot from the lens unit to contact exposed skin other than for a very short period,
since tissue damage may result.
Do not place parts of the body near the bottom of the lamp or near the back heater, since there is a risk of
burning or tissue damage.
When placing work under the lens, ensure the Infra-Red spot is switched off, to prevent unwanted localised
heating.
Death or serious injury may result from electric shock. It is therefore essential to isolate the equipment from the
mains before commencing repairs.
To eliminate the possibility of burns, allow time for the equipment to cool before commencing maintenance.
Cautions
Damage due to overheating may result from the equipment being left in any state other than idling or shutdown
for any period when the equipment is not in continuous use.
To eliminate the possibility of accidental operation of the footswitch ensure that it is located in a position where
nothing can rest or fall on it.
When using any selected lens attachment ensure that the minimum spot size used conforms to that stated in the
relevant text. Failure to comply with this instruction may result in damage to the iris.
Do not allow the spillage of any liquid to fall on the quartz emitter (back heater) as damage may result.
Due to the use of glass optical components the lens unit and all lens attachments should be handled with care.

www.pdr-rework.com
PDR Focused IR Safety Statement
Extensive tests have been conducted covering both Electrical and Infra-Red safety aspects on all of PDR's products.
The IR tests were administered in 1986 by a National Physical Laboratory approved establishment: ERA based at
Leatherhead, Surrey, England.
Optical
The Infra-Red system was tested for its maximum emission produced during working operation and the following
results obtained:
On a non reflective surface, i.e. FR4 substrate, if one's eye is placed 150mm away looking down at an angle
one could be subjected to approximately 0.9mW/cm2 at full power.
On a reflective surface, i.e. polished aluminium at a normal distance of 300mm, one would be subjected to
approximately 0.9mW/cm2.
These measurements were deemed to be safe and about 10% of the allowable exposure limit.
Electrical
The equipment is operator safe, tested for electrical safety in all aspects and complies with the relevant European
regulations.

www.pdr-rework.com
Installation
This section is not intended to be a step by step guide to installing the PDR, the systems are complicated instruments
and need to be installed by PDR approved technicians, however, this section includes key points to consider before
commencing installation.
The PDR IR BGA Rework Systems were introduced early 2000s and have been developed to be able to be upgraded
from a basic system without BGA alignment to the full system as seen below.
Typical Configuration includes:
Focused IR Component Heating
750-3000W Quartz IR PCB Preheater
Precision XY PCB Table
Precision Pick-up System, with Macro-Micro Z-movement and Rotation
CCTV/Prism BGA Alignment
Advanced Software Control with PDR T5 Controller and PDR ThermoActive V4/V5 Software Suite.
CCTV/Prism BGA Alignment
Pick-up System
Focused IR Component Heating
System

www.pdr-rework.com
Precision XY PCB Table
Quartz IR PCB Preheater
Advanced Software Control

www.pdr-rework.com
Installation (continued)
Key Points to consider before the Installation
Professional Installation - The PDR System is a sophisticated instrument and should always be installed by
personnel trained by PDR, or by a PDR Distributor. All PDR systems are robust and forgiving but installing
them incorrectly will result in a loss of performance and dissatisfaction with the products.
Bench Size - The equipment must be sited on a firm surface at least 1.5m x 0.75m and at a height to suit the
operator. The location should be chosen to suit the flow of work.
Draught Free - The immediate areas must be free from draughts (air-conditioning draughts are often a
problem) that may reduce the heating efficiency.
Lighting - The lighting should not be so bright as to prevent the operator from viewing the IR spot or the
digital controller's L.E.D. displays.
Fume Extraction –depending on the process, it may be necessary to install an integrated fume extraction
system to comply with operator safety
Electricity - The electrical supply should be of the specified voltage, sufficient current capacity for the
stated power, free from R.F. interference, other noise, glitches etc. and be fully earthed/grounded compliant.
General Arrangement - The general bench top arrangement of the system should be as in the image above
Main System –place in centre of bench
Controller - Place the T5 controller go to the back-right of the system
PC Monitor - Place the PC monitor on the right of the main system
CCTV Monitor - Place the CCTV monitor on the left of the system.
Prism Control - Place the Prism LED controller on the left of the system

www.pdr-rework.com
Understanding and Using the PDR Rework system
This section has 4 main parts
Reference Information –The Science in SMT Rework
Principles of Operation
Control and Settings
Operating Procedures –Preparation, Soldering and Desoldering
Reference Information
There are Four sections here - The Science in SMT Rework, General Principles, Control and Settings, Alignment
The Science in SMT Rework
A lot of time, money and intellect is employed in developing a successful SMT production process. More needs to be
directed towards rework. Why, because post production soldering/rework is a fact of life for many reasons. The cause
of 80% of field failures is down to 'reworked' joints and you either scrap a lot more product, or sort out the
'soldering/rework' process by introducing industry standard, best practices. This article explains some of the science
involved.
The metallurgical bonding process of Soldering
Soldering is a metallurgical bonding process where two metal surfaces (e.g. copper pcb pads, and copper component
leads) are joined together by bonds formed with a 'bonding/filler' material (a suitable metal alloy i.e. tin/lead or a
lead-free solder), which is heated above its melting point and below the melting points of the metals being joined.
The bonds are formed by the formation of intermetallic compounds (an irreversible chemical process), and/or by
diffusion or absorption (a physical process).
When joining eutectic tin/lead solder (63Sn/37Pb) and other high tin alloys (including lead-free alloys) with copper,
various intermetallic compounds are formed - on the copper side and on the solder side.
The intermetallic compounds of copper and tin form crystalline grains (in layers), whose structures are determined by
the length and intensity of the thermal interaction. Short reaction times form fine grains, which promote good
solderability and solder joint strength. Long reaction times can result in coarse grains, and a thick intermetallic layer.
A thick intermetallic layer creates poor solderability and joint strength, affecting the mechanical strength and long-
term reliability.
Although the integrity of a solder joint is normally considered to be dependent on the thermal process during
assembly, metallurgical reactions can also take place during storage. Intermetallic layers continue to grow
coarser/thicker even at ambient temperatures. Therefore, when parts or boards are solder coated or pre-tinned,
prolonged or improper storage cause these layers to grow, severely affecting the solderability. Alternative lead
finishes and passivated copper pads can be used to combat these problems.

www.pdr-rework.com
Reference Information (continued)
The function of Flux
The soldering process cannot happen unless clean, un-contaminated metal surfaces are present.
Lead finishes are normally covered by thin films of tarnish, which can be described as two layers, differentiated by the
way they are bound to a surface. Chemically bound are the layers of oxide, sulphide and carbonate, as well as
products from any preceding production steps. On top of these layers are a physically bound residues including water,
gases and residues from preceding reactions.
This is where flux plays its part. The main requirements for a flux are the:
removal of the outer residues.
displacement of the chemically bound oxides etc.
exposure of pure substrate molecules to enable the formation of intermetallic compounds during soldering.
protection of the freshly cleaned surfaces from re-oxidation prior to reflow.
Flux starts to work at about 130/150°C and needs to be present throughout the process.
Typically low solids fluxes react in around 7 seconds. They have evaporated before you need them. This is why
gel/paste type fluxes (which can react for several minutes) are excellent for 'high end' rework applications.
The Reflow Process
In a soldering/rework operation, the objective of the 'reflow' process is to achieve high quality solder joints on all of
the components' leads on a particular assembly, and do to this consistently.
The reflow process involves heating the component leads, PCB pads and solder/solder paste above the melting point
of the 'bonding' alloy (solder) so that the solder melts, bonds and forms a homogeneous fillet connecting the leads to
the pads. As well as controlling solderability parameters (materials, contamination, moisture, ESD, mechanical
handing), consistency in the reflow process also depends on the ability to control the application and variation of
heat. This controlled heating is called the 'profile', or 'thermal profile'.
A typical profile in production includes several preheat, preheat soak, reflow (spike), reflow soak and cooling zones.
In a good rework operation it is becoming more important to develop a sophisticated profile very similar to the
original used in production. There are slight differences in the requirements, mainly in that you are normally only
trying to 'solder/de-solder' a single component with all the particular solderability and thermal considerations that
may affect it, however the basic principles still apply.
The preheat zones gently raise the temperature of the component/PCB from ambient to about 130-170°C, generally
at a ramp rate of 0.5-1.5°C/second or less. This will minimize the potential for thermal shock on the components due
to varying heat capacities. The preheat zone also begins the volatilization of some of the solvents added to the
cream for printing and releasing.

www.pdr-rework.com
Reference Information (continued)
The Preheat Soak zone holds the component/PCB temperature at 130-170°C for 30-60 seconds, continuing the
drying process to prevent out-gassing and possible spattering of the solder paste (if used). This zone is also where the
flux begins to remove the oxides from the surfaces of the leads, pads and the powder itself. The resins and/or higher
boiling solvents remain as a cover to prevent the re-oxidation that would readily occur at the elevated temperatures.
Rework operations do not always include a soak zone, but theoretically they should do.
Reflow Zone - In the reflow, or spike zone, the temperature is more quickly raised 25-40°C above the melting point of
the bonding alloy. Known as the point at which reflow occurs, or 'reflow', the melting point is normally between
183°C and 188°C for standard solders (Lead-free solders may have melting points normally 217°C to 228°C). It is
above reflow that the solder wets the surfaces and forms the intermetallic bonds. The maximum temperature to be
reached is normally 220-230°C for tin/lead based solders, 240-250°C for typical Lead free applications. The maximum
ramp rate in this zone is typically 2-4°C/second.
Reflow Soak Zone - The Reflow Soak time (the period of dwell time at the peak reflow temperature, typically 20-60
seconds) should be long enough to allow for all of the joints to reach temperature and form the bonds. Too long a
soak time can lead to excessive intermetallic formation. Typically, intermetallics are brittle, and if they make up a large
portion of the fillet, can lead to premature failure of the joint.
The optimum profile is not the same for all PCB assemblies. In the real world, almost every assembly has different
thermal characteristics across the board due to different components or component densities. Variations in the board
itself can lead to large differences in thermal mass. However, it is easily possible to establish a pattern and develop a
range of profiles to take into account all the factors.
Summary - It is perfectly possible to establish a cost effective post production, soldering/rework process. A range of
equipment is often needed. Consideration of the basic science is vital. As well as the method of heating, it is as
important to conduct extensive research, testing to get the ability to control a process in a repeatable manner.

www.pdr-rework.com
Principles of Operation
Overview
The principle of operation of the PDR IR Rework system is that whilst being heated from above and below, a single
SMD is subjected to similar temperature/time profile during rework, as it experiences during reflow in the original
production process.
Temperature Profile
In operation the component is put through a full ‘reflow’ procedure. The PDR Rework system uses a software
controlled system 5 or 6-stage process including 2 preheat stages, a soak zone, followed by reflow, final soak and
cooling stages. All parameters such as temperature levels and ramp rates are precisely controllable, as recommended
by board and component manufacturers.
750-3000w Quartz IR
PCB Preheater

www.pdr-rework.com
Principles of Operation (continued)
The PDR Rework system is designed for rework single/double sided and mixed technology PCB assemblies. The top
heat/component heating is derived from a 150 Watt short wave IR lamp focused through a lens system. The bottom
heat/PCB preheater delivers 750-3000 Watts medium wave IR. In normal use, approximately 30-40% of the energy is
provided by the top heat, and 60-70% of the energy is provided by the back heat. The above diagrams show how the
energy is applied to a component and PCB, how the component temperature is measured and also a typical thermal
profile.
The Key Parts of the PDR System
Infra-Red Lamp/Lens System
The IR lamp/lens system comprises an Infra-Red lamp, an upper lens assembly, an iris assembly and a lens
attachment.

www.pdr-rework.com
Infra-Red Lamp
The 150 Watt Infra-Red (IR) Lamp is located in the lamp housing at the top of the unit. The lamp emits short wave IR
radiation at approximately 1.0um
Upper Lens Assembly
The purpose of the upper lens assembly is to collimate the radiation from the IR Lamp into a formatted beam before
projection through the iris assembly.

www.pdr-rework.com
Principles of Operation (continued)
Iris Assembly
The iris assembly is located between the upper lens assembly and the lens attachment, and serves in conjunction with
the lens attachment, to vary the diameter of the I.R. beam spot size to suit the component to be removed.
Lens Attachments
The lens attachment focuses the beam into a spot. The spot size is determined by the divergence angle of the lens
attachment. A range of interchangeable lens attachments are available to cater for different sizes of component.
The selection of the lens and spot size should allow for approximately a 5-10mm overlap of the component. The
minimum and maximum spot size of the lens attachments are as follows:
A frequency selective filter is fitted to the underside of the lens attachment to reduce the amount of visible light
passed. The remaining red light is at a level which is comfortable for operator viewing and allows the user to view the
spot.
Back Heat (PCB Preheater)
The back heat is applied by a 750 –3000w medium-wave Quartz IR emitter controlled by the software/digital
controller and performs three functions:
1. It preheats the PCB and also helps avoid overheating the component.
2. It reduces the risk of thermal shock and PCB de-lamination (PCB blistering)
3. It counteracts the heat sink effect of heavy tracking in the PCB.
The PCB preheater consist of quartz IR heaters preheating the PCB and the heat conducts through the PCB and
preheats the component, so when you introduce the Top Heat there is no chance of thermal shock. The balance of
heat energy supplied should be approximately 75 % from the Back Heater and 25 % from the Top Heat.
Thermocouples (T/C)
Up to four thermocouples (T/Cs) can be used and displayed. Only T/C 1 and 2 are used for control. T/C 3 and 4, if
selected are only used for additional temperature information.
(Note: To use PCB Preheat/backheat T/C #2 must be plugged into its socket even if it is not used. If it is not plugged in
the controller will sense a sensor ‘break’ and will switch off the backheater)

www.pdr-rework.com
Principles of Operation (continued)
Control System
The PDR Rework systems use the PDR T5 controllers which are PC controlled using PDR software. The main PDR Type
5 control box is used to provide electrical power to the various functions…top heat, back heat, vacuum, thermocouple
inputs etc.
Detailed operating instructions are described later in the next section ‘Control and Settings'. Typical software control
screens look like those below.

www.pdr-rework.com
Control and Settings
The PDR Rework System is controlled by PDR ThermoActive V4 or V5 software. This section illustrates different
screens and features. There are 3 main screens (Run Mode, Settings and Logging).
There are two channels used for control - T/C#1 for component temperature, T/C#2 for PCB temperature.
The principle is that you set a temperature/ramp-rate target...the system will monitor the component temperature
with non-contact IR sensor (T/C#1)....and then follow the temperature target, controlling the component
temperature and ramp-rate by increasing or decreasing the topheat power.
In ‘Auto Mode’ the component temperature will always closely follow the target automatically.
In addition, PCB temperature is also monitored and controlled. T/C#2 is used to monitor PCB temperature and the
software will control PCB temp so that it does not greatly exceed desired temperature limits.
The results are logged and can be analysed, printed out or also stored for reference.

www.pdr-rework.com
Control and Settings (continued)
Selected Profile - The software indicates what PCB and component have been selected. The folder name = the PCB
indent. The file name = the profile = component type, ident, location etc.
Folder Name = Topline 967001 (PCB ident)
File name = BGA 225-U1-F700-01.lmd
Starting and Stopping
‘Start’ begins the cycle.
‘Stop’ stops the cycle.
Vacuum and Align
Turn Align On/Off

www.pdr-rework.com
Control and Settings (continued)
PDR ThermoActive V4.03/V5+ - Control Settings
Auto Profiling Software
The general principle of the PDR V4/V5 software is that there is a component/PCB temperature target ‘glide-slope’
and the system will use thermocouple information to control the process as desired. There are 3 modes to choose
from to use the software:
Auto Profile Mode - Default Mode - that adds automatic proportional control of component heating
Manual Profile Mode - the original on/off control mode
Fixed Power Mode - mode for odd applications (not normally used)
Auto Profile Mode - In 'Auto Profile Mode' we have introduced automatic component temperature/ramp rate control
and also simultaneous PCB temperature control. The system now automatically adjusts the intensity of the
component heating to follow a desired maximum ramp rate and also controlling maximum PCB temperature limit. It
can also pause to wait for a minimum PCB temperature to be achieved and only steps through to the next phase
when temperature targets are reached.
Profiling is a lot easier. A mixture of ramp rate, temp and time targets can be used. In this example, there are 6 zones:
1 - B/H Preheat (PCB preheater only up to 90°C), 2 - Preheat (Topheat/backheat up to 150°C at a controlled ramp
rate), 3 - soak 1 (time based soak), 4 - reflow (Component up to 225°C at a controlled ramp rate, PCB upto
160°C), 5 - soak 2 (time based soak), 6 - cool down (at a controlled ramp rate). The system is set to be gentle during
preheats and more aggressive during reflow.
Manual Profile Mode - The original 'Manual Profile Mode' consisted of a temperature/time based target. The
Temperature/Time profile is set up and the system will follow the target during rework cycle. See examples below:

www.pdr-rework.com
The system steps through the stages/zones (preheat/reflow/soak etc) based on a time, i.e. there is a clock ticking and
the cycle progresses through the profile irrespective of the temperature reached.
Control and Settings (continued)
Default Profiles
To help, we have included various default profiles to try out with the software control. We strongly recommend you
open a default profile... Auto Mode...and practice rework on dummy boards and components before launching into
action on your live PCBs.
Profiles that you develop will probably not vary very much from original defaults and they generate better
understanding of reworking with the PDR Rework system. For more detailed technical information contact your PDR
representative for help.
Settings Screen
Control Mode
Settings Screen Tab
Wait for PCB Temp
Preheater Zone 2 on/off
Software Lock/Unlock