Philips TDA1556Q User manual

DATA SHEET
Product specification
File under Integrated Circuits, IC01 July 1994
INTEGRATED CIRCUITS
TDA1556Q
2 x 22 W stereo BTL differential
amplifier with speaker protection
and dynamic distortion detector

July 1994 2
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential
amplifier with speaker protection and TDA1556Q
FEATURES
•Few peripheral components
•High output power
•Low output offset voltage
•Fixed gain
•Loudspeaker protection (with diagnostic facility)
•Differential inputs
•Dynamic Distortion Detector (DDD)
•High common mode input signal
•Very high CMRR
•Good ripple rejection
•Mute/stand-by switch
•Load dump protection
•Short-circuit safe
•Thermally protected
•Reverse polarity safe
•High energy handling capability at the outputs (VP= 0 V)
•Electrostatic discharge protection
•No switch-on/switch-off plop
•Flexible leads
•Low thermal resistance
GENERAL DESCRIPTION
TDA1556Q is a monolithic integrated class-B output
amplifier containing two 22 Watt amplifiers in a BTL
configuration. The device is contained in a 17-lead
single-in-line (SIL) plastic power package. It has two
differential inputs and is primarily intended for car booster
applications.
QUICK REFERENCE DATA
ORDERING INFORMATION
Note
1. SOT243-1; 1996 August 19.
SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT
VPpositive supply voltage operating 6.0 14.4 18 V
non-operating −−30 V
load dump −−45 V
IORM repetitive peak output current −−4A
I
Ptotal quiescent current −80 −mA
Isb stand-by current −0.1 100 µA
Isw switch-on current −−60 µA
Ziinput impedance 50 −−kΩ
T
vj virtual junction temperature −−150 °C
POoutput power 4 Ω; THD = 10% −22 −W
SVRR supply voltage ripple rejection RS= 0 Ω; f = 100 Hz to 10 kHz 48 −−dB
Vos DC output offset voltage −−100 mV
αchannel separation 40 −−dB
∆Gvchannel unbalance −−1dB
CMRR rejection ratio −72 −dB
EXTENDED TYPE NUMBER PACKAGE
PINS PIN POSITION MATERIAL CODE
TDA1556Q(1) 17 SIL plastic SOT243R

July 1994 3
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic TDA1556Q
handbook, full pagewidth
mute/stand-by
MLA383-2
output 1A
x1
stand-by
switch
mute
switch
stand-by
reference
voltage
513
mute switch
VA
mute switch
VA
6
8
14
powerground
output 1B
input 1A 1
TDA1556Q
2
input 1B
output 2A
mute switch
VA
mute switch
VA
10
12 output 2B
input 2A 16
17
input 2B
n.c. 3
11 7
4
15
DDD
LSP VA
n.c. 9
VP
Fig.1 Block diagram.

July 1994 4
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic TDA1556Q
PINNING
SYMBOL PIN DESCRIPTION
IN1A 1 input signal 1A
IN1B 2 input signal 1B
n.c. 3 not connected
DDD 4 dynamic distortion detector
Vp1 5 positive supply voltage 1
OUT1A 6 output signal 1A
GND1 7 power ground 1
OUT1B 8 output signal 1B
n.c. 9 not connected
OUT2A 10 output signal 2A
GND2 11 power ground 2
OUT2B 12 output signal 2B
VP2 13 positive supply voltage 2
M/SB 14 mute/stand-by switch
LSP 15 loudspeaker protection
IN2A 16 input signal 2B
IN2B 17 input signal 2A
Fig.2 Pin configuration.
handbook, halfpage
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
IN 1A
IN 1B
n.c.
DDD
OUT 1A
GND 1
OUT 1B
n.c.
GND 2
OUT 2B
M/SB
LSP
IN 2A
IN 2B
MLA381 - 1
TDA1556Q
OUT 2A
VP2
VP1
THERMAL RESISTANCE
SYMBOL PARAMETER THERMAL
RESISTANCE
Rth j-a from junction to ambient
in free air 40 K/W
Rth j-c from junction to case
(see Figs 3 and 4) 1.5 K/W
Fig.3 Thermal resistance.
handbook, halfpage
2.8 
K/W
0.1 
K/W
2.8 
K/W
virtual 
junction
output 1 output 2
case
MLA382

July 1994 5
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic TDA1556Q
FUNCTIONAL DESCRIPTION
TheTDA1556Qcontainstwoidenticalamplifierseachwith
a fixed gain of 26 dB and differential input stages.
The device can be used for bridge-tied-load applications.
The circuit has the following features:
•low stand-by current (< 100 µA)
•low mute/stand-by switching current (low cost supply
switch)
•mute facility
Loudspeaker protection
Should a short circuit to ground occur, thereby forcing a
DC voltage ≥1 V across the loudspeaker, a built-in
protection circuit is activated to limit the DC voltage across
the speaker to ≤1 V. The delay time of the protection
circuit can be influenced by the external capacitor
connected to pin 15.
A dynamic distortion detector (DDD) is activated when
clipping occurs at one or both output stages. Its
information may be used to operate a sound processor or
DC volume control to attenuate the input signal, thereby
minimizing the distortion.
LIMITING VALUES
In accordance with the absolute maximum system (IEC 134)
DC CHARACTERISTICS
VP= 14.4 V; Tamb = 25 °C; unless otherwise specified
SYMBOL PARAMETER CONDITION MIN. MAX. UNIT
VPpositive supply voltage operating −18 V
non-operating −30 V
during 50 ms (load
dump protection);
rise time ≥2.5 ms
−45 V
IOSM non-repetitive peak output current −6A
I
ORM repetitive peak output current −4A
T
stg storage temperature range −55 +150 °C
Tvj virtual junction temperature −+150 °C
Vpsc AC and DC short-circuit safe voltage −18 V
energy handling capability at outputs VP= 0 −200 mJ
Vpr reverse polarity −6V
P
tot total power dissipation −60 W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VPpositive supply voltage note 1 6.0 14.4 18 V
IPquiescent current −80 160 mA
VODC output voltage note 2 −6.9 −V
Vos DC output offset voltage operating −−100 mV
Mute/stand-by
VON switch-on voltage level 8.5 −−V

July 1994 6
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic TDA1556Q
Notes to the characteristics
1. The circuit is DC adjusted at VP= 6 to 18 V and AC operating at VP= 8.5 to 18 V
2. At 18 V < VP< 30 V the DC output voltage ≤VP/2
3. Conditions: V14 = 0 V; short circuit to ground; switch V14 to MUTE or ON condition, rise time at V14 =≥10 µs
4. Frequency response externally fixed
5. Ripple rejection measured at the output with a source-impedance of 0 Ω(maximum ripple amplitude of 2 V) and a
frequency between 100 Hz and 10 kHz
6. Mismatching is given by the following equation:
7. Noise measured in a bandwidth of 20 Hz to 20 kHz
8. Noise output voltage independent of RS(VI= 0 V)
9. Common mode rejection ratio measured at the output with both inputs tied together. VI(RMS) < 3.5 V;
f = 100 Hz - 10 kHz
MUTE CONDITION
Vmute mute voltage 3.3 −6.4 V
VOoutput signal in mute position VI max = 1 V; f = 1 kHz −−2mV
V
os DC output offset voltage −−100 mV
STANDBY CONDITION
Vsb stand-by voltage 0 −2V
I
sb DC standby current V14 < 0.5 V −−100 µA
0.5 V ≤V14 ≤2.0 V −−500 µA
Isw switch-on current −25 60 µA
IPSC supply current short-circuit to ground;
note 3 −10 - mA
Loudspeaker protection
∆V6-8, 10-12DC voltage across RL−−1.0 V
tddelay time −0.5 −s
Protection active (∆V4-6or ∆V7-9≤1.0 V
I15 current information −25 −µA
V
15 voltage information 3.6 −−V
Protection inactive (∆V6-8and ∆V10-12≤0.1 V)
V15 voltage information −−0.3 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Zi ∆Zi1 Zi2
–
Zi1
--------------------- 100°°
⁄×=
Zi ∆Zi3 Zi4
–
Zi3
--------------------- 100°°
⁄×=

July 1994 7
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic TDA1556Q
AC CHARACTERISTICS
Vp= 14.4 V; RL= 4 Ω; f = 1 kHz; Tamb = 25 °C; unless otherwise specified
SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT
POoutput power THD = 0.5% 15 17 −W
THD = 10% 20 22 −W
THD = 0.5%;
VP= 13.2 V −12 −W
THD = 10%;
VP= 13.2 V −17 −W
THD total harmonic distortion PO= 1 W −0.1 −%
B power bandwidth THD = 0.5%;
PO= −1 dB; with
respect to 15 W
−20 to
15000 −Hz
fllow frequency roll-off −1 dB; note 4 −25 −Hz
fhhigh frequency roll-off −1 dB 20 −−kHz
Gvclosed loop voltage gain 25 26 27 dB
SVRR supply voltage ripple rejection note 5
ON condition 48 −−dB
MUTE condition 48 −−dB
stand-by condition 80 −−dB
Ziinput impedance 100 120 150 kΩ
∆Ziinput impedance note 6 −4−%
Vno noise output voltage ON: Rs= 0 Ω; note 7 −70 120 µV
ON: Rs= 10 kΩ;
note 7 −100 −µV
MUTE: Rs= 10 kΩ;
notes 7 and 8 −60 −µV
αchannel separation Rs= 10 kΩ40 −−dB
∆Gvchannel unbalance −−1dB
CMRR common mode rejection ratio note 9 64 72 −dB
THD total harmonic distortion IDDD = 50 µA (peak) −3.5 −%

July 1994 8
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic TDA1556Q
Fig.4 Stereo BTL test diagram.
handbook, full pagewidth
100
nF
DDD mute/stand-by
414513
15
Vref
9
3
n.c.
n.c.
audio
source
1/2 Rs220 nF
220 µF
1
2
Zi1
Zi2
6
8
R load
1/2 Rs
audio
source
1/2 Rs220 nF
220 µF
16
17
Zi3
Zi4
10
12
R load
1/2 Rs
711
MLA380-2
VP
TDA1556Q
2200
µF
4.7 
µF

July 1994 9
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic TDA1556Q
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC EIAJ
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT243-1
0 5 10 mm
scale
D
L
E
A
c
A2
L3
Q
wM
bp
1
d
D
Ze
e
xh
117
j
E
h
non-concave
92-11-17
95-03-11
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
view B: mounting base side
m2
evM
B
UNIT A e1 A2bpcD
(1) E(1) Z(1)
deD
hLL 3m
mm 17.0
15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54
v
0.8
12.2
11.8 1.27
e2
5.08 2.4
1.6
Eh
62.00
1.45
2.1
1.8
3.4
3.1 4.3
12.4
11.0
Qj
0.4
w
0.03
x

July 1994 10
Philips Semiconductors Product specification
2 x 22 W stereo BTL differential amplifier
with speaker protection and dynamic TDA1556Q
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Thistextgivesaverybriefinsighttoacomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.